To address chip talent shortages, Taiwan has a law in place to promote industry-academia collaboration by establishing semiconductor schools. However, the current financing scheme...

Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply...

Micron is using an externally manufactured base die in NVHBM, a custom high-bandwidth memory (HBM) product it is co-developing with Nvidia, as the company bets that customization can...

National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening...

As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV)...

As China accelerates its push for homegrown AI computing chips, custom ASIC accelerators from domestic tech giants—including Huawei, Cambricon, and Alibaba—are entering...

MediaTek's Google Tensor Processing Unit (TPU) business is still moving steadily higher, but supply-chain sources say the real limit is capacity as chipmakers and cloud service providers...

TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...

Intel CEO Lip-Bu Tan stated that Intel's relationship with TSMC is built on partnership rather than rivalry. He noted that a collaborative mindset guides key industry leaders, including...

Yee-Chia Yeo, vice president for innovation and enterprise at A*STAR, returned to Singapore in 2022 and has since turned years of industry experience into a strategy for advancing...

Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...

Taiwan's semiconductor industry, which originated in the Hsinchu Science Park and later expanded to the Central and Southern Taiwan Science Parks, now encompasses manufacturing bases...

Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center...

Samsung Electronics expects high-performance computing (HPC) to account for 66% of its foundry business by 2029, up from 28% currently, as the company shifts its contract chipmaking...

TSMC is reportedly evaluating whether to build a second US manufacturing hub in Texas, potentially housing up to 6 advanced wafer fabs, as its US footprint continues to expand. The...