TSMC updates

Foundry house TSMC plays a crucial role in the semiconductor sector, and the world economy in general.

IN THE NEWS

Wednesday 7 January 2026

TSMC names Gina Proctor Treasurer of Arizona subsidiary

TSMC appointed Gina Proctor as treasurer of its TSMC Arizona Corporation subsidiary effective January 6, 2026, according to a regulatory disclosure...

Tuesday 6 January 2026

Ampower secures TSMC backup power supply orders with visibility through 2028

As AI computing power rapidly grows alongside data center and renewable energy developments, global electricity demand is undergoing a swift transformation. Ampower, with over 30 years...

Tuesday 6 January 2026

TSMC reportedly set to build 12 Arizona fabs as Japan, Germany expansions stall

Recent market reports highlight ongoing challenges for TSMC's wafer fabs in Arizona, including high costs and low profits. Industry sources cite supply chain issues, talent shortages,...

Monday 5 January 2026

TSMC 2nm leak probe leads to additional indictments for three people and Tokyo Electron

Taiwan's High Prosecutors' Office has filed a supplementary indictment against three additional suspects and the Japanese chip equipment maker Tokyo...

Monday 5 January 2026

TSMC kicks off 2nm production with Samsung in hot pursuit

The global foundry race has entered a new phase after TSMC announced it has begun volume production of its 2nm process, intensifying competitive pressure on Samsung Electronics as...

Monday 5 January 2026

Weekly news roundup: TSMC widens 2 nm edge as South Korea boosts chip spending; Huawei eyes memory bottlenecks

These are the most-read DIGITIMES Asia stories in the week of Dec 29 - Jan 4.

Monday 5 January 2026

DIGITIMES chair warns against head-on competition with China's strength

As global tech companies navigate increasingly complex geopolitical tensions and shifting supply chains, strategic positioning against Chinese competitors has become a critical question...

Monday 5 January 2026

TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung

As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...

Saturday 3 January 2026

Analysis: Japan targets advanced packaging to crack TSMC's manufacturing edge

Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and...

Friday 2 January 2026

US approval of TSMC equipment exports to China reflects strategy shift

Following reports that the US government had granted annual export licenses to South Korea's Samsung Electronics and SK Hynix, the US Department of Commerce (DOC) has also approved...

Friday 2 January 2026

China demand pushes Nvidia to seek more H200 capacity from TSMC

Nvidia is in talks with TSMC to expand production of its H200 artificial intelligence chips as Chinese technology companies move to secure large orders for 2026, according to Reuters...

Friday 2 January 2026

2026 electronics industry outlook

As 2026 begins, DIGITIMES has conducted in-depth analyses of sectors within the electronics industry. The current landscape theme can be described as "one core, two keys, three drivers."...

Friday 2 January 2026

Intel and Samsung advance 2nm GAA, but yield gaps leave TSMC as the sole external supplier

TSMC has officially commenced volume production of its 2nm (N2) semiconductor process in the fourth quarter of 2025, marking a milestone as the first foundry worldwide to offer chiplet...

Wednesday 31 December 2025

TSMC reportedly speeds up Arizona 3nm fab plans as Samsung woos US clients in Texas

According to South Korean media reports and industry sources, TSMC is moving to pull forward the production schedule at its second Arizona...

Wednesday 31 December 2025

Taiwan OSATs boost spending as CoWoS supply tightens

Taiwan's leading semiconductor assembly and test providers are launching record capital spending programs to expand advanced packaging...

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