NXP Semiconductors and TSMC have jointly announced volume production of NXP's S32G2 vehicle network processors and S32R294 radar processor built using TSMC's 16nm FinFET process technology...
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
TSMC at its ongoing technology symposium held online has unveiled its latest innovations in advanced logic technology, specialty technologies, and the additions of its 3DFabric advanced...
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
NXP Semiconductors is another chip vendor which has struck a long-term deal with United Microelectronics (UMC) under which the pure-play foundry will have some of its newly-established...
One of TSMC's employees living in New Taipei City has been tested positive for COVID-19, according to the pure-play foundry. The Taiwan-based foundry has seen two employees infected...
Chip inventory may have returned to reasonable levels in upstream and downstream sectors, thanks in part to a slowdown in demand for chips from the end-market device vendors, according...
TSMC has kicked off production for Apple's next-generation iPhone processor dubbed A15, and will see demand for the chip surpass that for its predecessor last year in scale, according...
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
TSMC and other Taiwan-based pure-play foundries intend to carry out their capacity expansion projects cautiously and progressively to avoid the risk of overcapacity.
Taiwan OASTs are expected to enforce a new round of quote hikes in the third quarter of the year to reflect ever-rising prices for raw materials particularly for QFN wire-bonding...
