Samsung Electronics has announced that it is adding three TCO-optimized, high-performance...

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Samsung Electronics is mass producing ePoP (embedded package on package) memory, a single...

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Applied Materials has announced a suite of new defect review and classification technologies...

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Cypress Semiconductor has introduced its first USB 3.0 controller, the EZ-USB FX3 targeted...

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Micron Technology's first pico projection engine, the V100, is designed to cater to the microdisplay...

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Fujitsu Semiconductor has announced the release of 44 microcontrollers, the initial offering...

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Samsung Electronics has announced its new 2.5-inch external hard disk drive (HDD), the S2...

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Hynix Semiconductor has announced that it has begun mass producing 64Gb NAND flash chips...

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Altatech Semiconductor has announced silicon wafer maker Siltronic is evaluating its AltaSight...

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KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and...

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Texas Instruments (TI) has introduced a complete LED lighting driver reference board in collaboration...

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Cypress Semiconductor has introduced AC-DC digital power controllers for LED lighting, the...

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Hynix Semiconductor has developed 2-gigabit (2Gb) low-power DDR2 DRAM for mobile applications...

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Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement...

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Hynix Semiconductor has announced its second-generation 1Gb DDR3 chip using 54nm process...

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