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China's optical supply chain gains ground in smart glasses

Tomorrow's Headlines

Exclusive: China's CAS microelectronics institute unveils DUV-based 3nm GAA development path

Tomorrow's Headlines

Samsung expands SRAM and IP support as memory shortages reshape chip design

Tomorrow's Headlines

AMD shifts China strategy from chips to developer ecosystems as Nvidia retreats

Tomorrow's Headlines

SK Hynix passes new performance bonus plan with cash and stock split evenly

Tomorrow's Headlines

Sep

16

2026

Samsung advances jump 70% amid shift to long-term memory deals

Taiwan, South Korea should stop comparing, says DIGITIMES chairman

DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

India's Eastern state clears SiCSem's SiC unit in SEZ

LEOTEK completes real-world test of AI traffic system at US smart city lab

Nvidia's Jensen Huang expected to attend Trump-Xi Summit as tech and trade take center stage

Why Wiwynn chose El Paso for its first US plant

Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging

BizLink's CPO breakthrough hits the hard part: scaling

AI slowdown calls expose the financial strain of the frontier race

EV batteries cannot simply power humanoid robots, with energy density and costs posing key hurdles

Soaring memory costs threaten Netronix's e-reader growth, even as new display markets stay on track

SK Hynix union approves revised pay deal after 25-vote rejection

TSMC's overseas expansion faces talent management gap, says co-COO Y.J. Mii

SK Hynix, Intel in talks on US production to ease memory crunch

CPO ramp pushes silicon photonics testing upstream to catch defects early

Taiwan CCL makers ride Nvidia's M9 shift as AI servers move to 52-layer PCBs

Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

Samsung Exynos regains share as Galaxy phones test 2nm

Geopolitical shocks add business pressure as CBAM free carbon quotas extend to 2038

Meta globally rolls out Meta One subscription, tops 15 million sign-ups

Physical AI could reshape industrial computing as Ennoconn sees a long growth cycle

Samsung reportedly weighs Micron's newest memory for Galaxy S27

Apple reportedly accepts Samsung's 1Q27 memory hike, raising the 2027 smartphone cost floor

Micron unveils 512GB DDR5 RDIMM for next-gen servers

Samsung backs Dutch AI chip startup Euclyd in US$230M funding round

Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end

Glass substrates, TGV set to reshape 2027 advanced packaging race

Hanmi Semiconductor reportedly lands first back-end foothold at Terafab

Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027

Aleees locks in Tainan plant for 20-year North America order

Kepler bets HBM can scale without EUV — chip giants are buying in

Astera says customers are rethinking HBM needs for AI accelerators

AI efficiency fuels Jevons Paradox debate over HBM demand

Altera confidentially files for US IPO as AI chip demand fuels listing boom

MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions

Sharp opens orders for Foxconn-built Nvidia AI servers, targeting JPY250 billion by fiscal 2030

Huawei reportedly scales back AITO role as Seres takes greater control

Apple, Intel links sharpen focus on Lens Technology's next glass growth markets

US-based Teradyne opens Bengaluru office to support India's semiconductor push

Advanced processes have no ready-made answers, says TSMC's COO

Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec

Novel 2D materials offer quantum breakthroughs as research ecosystem targets sub-1nm era

Commentary: China's US$4.5 trillion electronics target confronts the limits of manufacturing scale

Beyond 2nm: Dimensity 9600 Pro gives MediaTek a bigger role in mobile AI

Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

FSC teams with South Korean maker on TGV equipment for glass substrates

A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors

DIGITIMES Insight: Taiwan can power its AI chip boom — but not with green energy

South Korean NPU startups face validation hurdle in push for global sales

Apple's foldable phone faces durability test as suppliers eye crease risks

Star Shining launches IPO plan as renewable energy assets reach 676MW

ITRI showcases AI robots, drones to push commercialization in southern Taiwan

China's humanoid robot race, Part 2: Upstream profits gather around dexterous hands

AI server tracker: BMC, cable, case suppliers post August 2026 gains

DeepSeek to hire its first CFO as it aims for public listing, expands workforce

Apple exits Musk's AI lawsuit, but the fight over iPhone AI access is only getting bigger

As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics

DIGITIMES Insight: NVHBM is not a memory revolution; Nvidia seeks to platformize cHBM, dominate custom AI architectures

DIGITIMES Insight: Taiwan's small IC design firms face a weaker second half after rebound

AR glasses target 2 billion myopia users as China supply chain eyes doubling shipments

Chip revenue heads to US$2.4 trillion on price, not volume, Yole says

AI data centers give idle EV battery capacity a second life

DIGITIMES Insight: Google scales TPU systems to 1 million chips as power becomes the bottleneck

Amodei's AI slowdown call is unlikely to dent chip demand, industry sources say

iPhone Duo's identity shapes Apple's foldable strategy

Charts: Memory has held six of the ten fastest-growing spots in Taiwan's chip sector for seven straight months

DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

Sep

15

2026

Astera Labs targets the KV cache bottleneck as agentic AI outgrows GPU memory

Airbus weighs supplier stakes to relieve aerospace parts bottlenecks

The Boring lands US$3 billion from UAE investors, fueling Musk's underground transit dream

Tesla's rare-earth-free Cybercab challenges China's grip on EV magnets

How AI real-world deployment is rewriting IPC business models

Apple's foldable debut set to further widen Samsung Display's OLED lead

High-capacity memory shortages worsen: Team Group reveals edge AI strategy amid rising price pressures

Murata considers bigger MLCC expansion as AI server demand extends beyond 2028

AI servers are eating MLCC capacity, Chinese suppliers are taking what's left

China's Guoxin Micro buys its way into power-chip manufacturing

MediaTek unveils first 2nm chip to run 30 billion AI models on phones arriving this quarter

Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

Wiwynn deepens US AI server footprint with US$1.6 billion Texas manufacturing hub

South Korea updates AI safeguards as Microsoft sets shutdown rules

BYD's 2027 triple play could rewrite the EV race

China optical transceivers avoid US FCC curbs as NPO, CPO battle for high-speed interconnect supremacy

Micron's record Taiwan payout fails to end union demand for 15% of profits

Beyond H100: China's GPU makers chase scale, not just parity

DIGITIMES Insight: AI sends the semiconductor market toward US$1.6T, with memory doing the heavy lifting

China's humanoid robot race, Part 1: Mass production outruns proven demand

Minebea Mitsumi pauses M&A to chase AI hardware demand

China elevates HBM and HBF in five-year plan, opening a new front in AI memory

Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM

BIS blocks Polestar authorization, forcing new vehicles out of US market from 2027

Global semiconductor revenue hits record US$425B in 2Q26

Samsung, SK Hynix diverge on cell design for sub-10nm DRAM in 2028

GlobalWafers partially resumes Italy plant, restarts EPI production

China's space-computing race moves beyond single satellites: Shanghai's gigawatt-scale AI ambition lands in orbit

AI server tracker: OEM/EMS August revenue trends, operational outlook

US FCC, White House tighten controls on power systems, raising the trust bar for Taiwanese suppliers

Sivers Semiconductors positions laser arrays as solution to copper's limits

AI server tracker: CCL makers outpace PCB and substrate suppliers as server demand grows

Column: When digital trust breaks — quantum risk rewrites supply chain resilience

Taiwan's Ministry of Economic Affairs shares power grid experience at APEC Energy Ministerial Meeting

TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity

China's EV boom enters a phase of overcapacity cleanup

HS Hyosung joint venture to invest KRW1.2 trillion in Ulsan silicon anode plant

Panasonic Energy eyes JPY1 trillion yen AI storage revenue by 2028

Tesla sets up Vietnam unit as VinFast dominates

Chinese tech firms deepen open source push amid AI pacing debate

Ainos pushes AI Nose into semiconductor front-end manufacturing

Samsung Display deepens ties with Vivo's iQOO through dedicated OLED line

Taiwan's Ministry of Economic Affairs builds flagship Taiwan pavilions at international expos to boost auto parts exports

Chinese chip tools reach 35% of equipment installed at local fabs

AI's next bottleneck may be profitability, not compute, SK chair warns

Inside CIOE: takeaways from China's biggest optoelectronics show

South Korean firms hold 80% of the automotive OLED market

XPeng's Turing chip expands beyond cars

Taiwan's carbon pricing enters new phase with carbon fee, ETS on parallel tracks

OpenAI reportedly acquires AI camera startup Glass Imaging for more than US$300M

Trump tells Nvidia's Jensen Huang that AI is 'bigger than the internet' and robot fears are a 'hoax'

China sets first AI-brain-computer interface medical device standard

Hyundai Motor Group bets on data, Nvidia, and in-house AI to speed autonomous driving rollout

Xiaomi-backed Nuclei Sys tests public markets with RISC-V expansion still costly

2nm capacity crunch may keep smartphone SoC makers on split-node strategy through 2027

Trump calls AI slowdown a conspiracy that helps China, closing off Washington support

Memory makers tighten supply as DRAM price rally extends into 2027

SiPh shifts optical module bottleneck upstream: from device manufacturing to laser-grade substrate supply

Phoenix Pioneer Technology AI power substrate order visibility extends to 1Q27

Nvidia, MediaTek deepen 20-year chip ties

Wuliangye skips carmaking, turns liquor waste into silicon-carbon anodes

China reshapes cockpit display race, set to produce 84% of global AR-HUDs by 2031

Robot supply strategies split between US in-house tech and Chinese local ecosystem

Edimax, Comtrend 1H26 operations under pressure from weaker India orders, rising component costs

Commentary: CIOE 2026 reveals the harder race behind AI optical interconnects

Global data center capex could reach US$31.6 trillion by 2050 as AI demand surges

Exclusive: China's 8-inch SiC suppliers turn to pricing discipline after 6-inch price war

Sigmaintell: Memory shortage to ease in 2027 before chip growth hits 2029 wall

CXMT rides AI boom to 80% operating margin

UK backs SaxaVord Spaceport with GBP30M for orbital launches

Swiss drone maker shifts production to Taiwan

eCloudvalley expands enterprise AI Agent portfolio

The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips

Sep

14

2026

Australia sets LNG reserve rules to protect domestic supply and cap prices

Kokusai Electric gains from Hitachi split as AI memory demand surges

LG sells 15 US image patents to Honor as IP monetization expands

UAE commits EUR40B to expand Germany ties in AI, energy and defense

Taiwan drone maker Twoway breaks into US defense supply chain with Oklahoma procurement deal

Yole Group takes outside capital for the first time, selling minority stake to new French fund

Fujitsu's Monaka targets 2027 mass production with TSMC 2nm boost

AI power demand pushes Taiwan to overhaul energy rules

AI demand lifts UMC, VIS, PSMC revenue

Behind the BRICS handshake: How far can the China-India reset go?

Samsung, SK Hynix reject US$19 billion power prepayment as Korea speeds chip expansion

STMicro lead times top 1 year, boosting Taiwan chip makers

DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker

Taiwan eases investment rules for AI center infrastructure projects

DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up

China optical firms target photonics with mixed high-end, lower-cost push

China accelerates e-SIM's leap from wearables to smartphones

Foxconn subsidiary broadens AI interconnect role as 1.6T enters deployment

DIGITIMES Insight: China's GaN challengers are no longer playing catch-up

Beijing municipality bans civilian drones starting mid-November

Sandisk recruits engineers in Korea as memory talent race heats up

South Korea broadens espionage law to counter rising tech leaks

Gogoro sees turnaround ahead of schedule as Vietnam rollout gathers pace

LG Display's AI transformation turns employees into AI builders, yielding 450+ in-house projects

Taiwan taps Amazon Leo for next-generation government satellite network

Z.ai reloads with US$5 billion for China's AI race

Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist

Gritek to take full control of 12-inch silicon wafer venture in major restructuring

iPhone Duo's price opens room for Android rivals

AI's energy demand ignites global nuclear rush, straining Taiwan's restart

Foldable smartphone panel shipments to grow 23% in 2026

Lab self-investigations show AI agents improvising past their own guardrails

China's OLED expansion narrows South Korea's auto, IT panel lead

Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues

India semiconductor deals hit a multi-year high ahead of SEMICON India 2026

Hua Hong Grace completes Huali Micoelectronics acquisition, state parent raises stake

CPO nears mass production — next battle about interfaces, yield and maintenance

US finalizes anti-dumping and anti-subsidy duties on solar imports from India, Indonesia, and Laos

AI server tracker: Taiwan ASIC design houses diverge as AI projects enter different revenue cycles

AI server tracker: Taiwan testing suppliers accelerate as AI chip complexity raises interface demand

The case for an AI speed limit collapsed in a weekend

AI labs ask to be slowed, Congress stirs, and Nvidia calls the alarm a sales pitch

A Taiwan PCB maker's China affiliate is worth three times its parent — the parent just bought more of it

India's chip show nearly doubles in two years, with suppliers leading the build-out

CoreIntelligence Holdings posts 6% revenue growth in first 8 months as optical ASP soars and energy-saving products grow

AI infrastructure race shifts to Grid-to-Chip as Foxconn, Delta, Flex converge on the same track

Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout

Blokcert launches Gefjon AI to help Taiwan charging operators improve profitability as EV demand rebounds

Hiroca revenue jumps 35% as auto summer slowdown fades

Lite-On revenue rises in August on cloud power demand

Aurotek posts record August revenue on semiconductor, robot shipments

Renesas readies second price hike amid stronger power-chip demand

India roundup: India says it cannot build electronics without China

Image Match Design wins exclusive fingerprint module role in African ID project

AI agents drive token use 300-600x, Dell Taiwan says

Shihlin Electric eyes orders through 2029 as T4 plant starts in 2027

Sep

13

2026

China's robot champions can run; now they have to prove they can earn

AI, 5G upgrades lift Taiwan's top three telecoms in August

Column: What is SLAM? The first step in Physical AI

China auto exports hold above 1 million as new energy shipments surge

AI server exports to US slow; electronics parts jump 1.5 times in August

AI server tracker: Taiwan optics race beyond 1.6T

Delays trim CAEC August sales, but UPS demand outlook stays firm

Taiwan's BTL builds new plant for high-power AI server testing, eyeing 4Q27 launch

Artery secures spot in Arm ecosystem, pushing high-end MCUs into robotics, physical AI

HannStar to halve panel output as layoffs and a management exit fuel closure talk

Sep

12

2026

Europe buys time in the LEO race as Eutelsat extends OneWeb toward the IRIS² era

Renault sets 2-year car development quality line

Rethinking defense perimeters, supply chain resilience in the AI era

Analysis: Speed built Colossus, yet redundancy may decide whether SpaceX can scale it

Apple foldable plans drive new demand for Japanese smartphone parts makers

Exclusive: ASUS xHIS aims to become digital backbone for AI-ready healthcare

AI server boom reshuffles MLCC supply, opening a rare expansion window for Taiwan makers

Murata targets mass production of its AI power substrate next year

Taiwan sees AI-era power upgrade openings in France

Pegatron's AI server engine starts to outweigh notebook drag, with Apple adding lift

Commentary: Apple sends off Cook with a foldable flourish, but Ternus's trial is still ahead

ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs

Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line

Luxshare eyes AR glasses breakthrough through car HUD model

Charts: Taiwan's AI supply chain growth moves from cooling to rack hardware

Sep

11

2026

Why Chinese automakers' aggressive push only further tightens CATL's grip

ASE to buy AOI, AVI equipment from Machvision for NT$334M

Kioxia eyes US listing amid NAND profit rebound

Apple phones drive premium upgrade wave for carriers

Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment

ficonTEC breaks CPO test bottleneck, teams with Hermes Testing

Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says

Samsung Electro-Mechanics, LG Innotek vie in AI package substrates

Memory makers gain the upper hand as Apple's iPhones pay the price

Enflame enters public markets with Nvidia alternatives in its sights

Huawei stakes out the AI optics rulebook with 7.2Tbps NPO

AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging

CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Beyond Earth's orbit: how Besxar, Space Forge, Varda, BioOrbit, Voyager are industrializing space

Innolux factory shift could reshape InnoCare's supply chain and growth mix

China's DRAM supply chain clears another materials hurdle

CIOE 2026: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

Samsung's Exynos gains ground as Galaxy S26 lifts share to 9%

Taiwan govt boosts EDA R&D to target global gaps

CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030

China's energy storage capacity surges 50-fold in five years, sparking crackdown on lithium battery expansion

AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle

Apple cracks mmWave with C2, weakening Qualcomm's last big iPhone modem edge

Micron pays Taiwan fab workers up to 68 months' salary in memory upturn

Nvidia expands Australian AI factory push as global demand rises

Apple's new chip packaging boosts A20 Pro AI power, pushing MediaTek, Qualcomm to follow suit

CIOE 2026: Smartphone camera market faces deeper slump as Apple draws attention in Shenzhen

Altera eyes $2B IPO, from Intel carve-out to public debut

SK Hynix raises cash portion of bonuses after 25-vote union rejection

Huawei, Xiaomi, Apple take different bets on foldables

Global drone supply chain accelerates de-China shift, Taiwan wins

FCC closes a chip-level loophole while media debate another White House retreat

Taiwan tech minister in Europe to advance semiconductor cooperation

AI server tracker: Taiwan's rack supply chain reveals where the AI buildout is accelerating

ASPEED plans December BMC price hikes to fuel server security footprint

Anthropic disrupts Chinese AI firms' attempts to extract Claude capabilities

Pentagon reportedly weighs US$5B loan to AI infrastructure startup Fluidstack

Jensen Huang bets Nvidia's next leg of growth on turning AI compute into an investable asset

Nvidia's US$13 billion Hugging Face deal bets physical AI can start at US$400, not US$40,000

Oracle's AI cloud build-out is now rewriting its cost structure

Oracle turns its AI build-out into a delivery number, the cost lands where management said it would

AI server tracker: Taiwan's August filings say demand is still accelerating

iPhone Duo leads Apple's new lineup as market stays split

MediaTek August revenue beats expectations, boosts 3Q outlook

Apple's foldable arrives late to a supply chain already moving on

Apple makes the hinge, not the screen, the centerpiece of its first foldable

Rayzher rides semiconductor fab buildout to record revenue

Taiwan startup taps CMOS infrared chips to give robots an electronic 'nose'

China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing

d-Matrix brings Raptor chips to Nvidia racks as falling token prices pressure GPU economics

Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%

ProLogium deepens partnership with Kyushu Electric Power through strategic investment

Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT

Samsung, SK Hynix eye 2028 High-NA DRAM rollout

Academia Sinica to open 8-inch quantum chip platform in September 2026

Nuvoton sees robots driving MCU demand over next decade

Foxconn's global expansion signals a longer-term manufacturing shift

TPK, GIS post mixed August sales as 2H26 demand stays cautious

Quantum computer development is more about national security than profits, says expert

More memory won't fix AI's bottleneck, says Microsoft's Azure hardware chief

Sep

10

2026

ITRI to showcase 3.2T silicon photonics and AI data center cooling

Taiwan pushes smart health care partnerships at Singapore medical trade show

Meta loses key AI researcher after billion-dollar hiring push

Taiwan EV charging operators face profit squeeze despite rapid network expansion

MicroIP lands NT$630 million AI smart-building contract in northern Taiwan

Murata to stop some MLCC lines as AI server demand strains supply

Samsung pushes into display-equipped smart glasses as Meta leads market

STMicroelectronics sets 2027 AI revenue plan with fiber chips at 80%

Taiwan quantum leap expands scope to drug and finance

Nanoprinting lithography shifts from round to square, increasing waveguide output

Huachuang Xinguang sees MicroLED optical interconnects entering data centers in 3 to 5 years

US Justice Department probes Nvidia-Groq deal over antitrust concerns

ASE August revenue tops NT$80 billion record as AI packaging capacity stays sold out

Navigating economies of scale: how South Korea and China are reshaping the OLED market

Foxsemicon hits record 2Q26 revenue on Thailand ramp-up

Shinkong Synthetic Fibers partners with Earthbook, Jedsy to tap Taiwan's medical drone logistics market

Jeter August revenue rises on AI server shipments

Gem Terminal rides China plug rule shift for 8.8% sales growth

AUO matching glass substrate size stokes TSMC collab speculation

Apple added flat US$100 to every iPhone and rebuilt A20 Pro around memory

China's Nvidia rivals raise prices as HBM shortage bites

Taiwan nuclear drill simulates drone attack, drawing on Ukraine war lessons

Intelligo targets double-digit 2027 revenue growth on AI IP, ASICs

TSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth

Enflame to list on Septemper 11 as China's four major domestic GPU makers complete IPOs

India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it

China sets clear limits on payment terms to auto suppliers

Taiwan chipmakers target humanoid robots beyond the 'brain,' focusing on vision, motor control

DeepSeek reportedly advances Shanghai IPO plans as it cuts Flash model API prices

Spirox TGV inspection capable of scanning entire substrate in 20 minutes

Europe's BEV running costs now 33% below ICE

Hermes Testing ships membrane probe cards, targets SiPh and CPO

Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens

AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand

STMicroelectronics ties AI data center carbon cuts to power design, not location

Samsung SDS partners with OpenAI and Anthropic in AI push

Powerlogic revenue rises for 3rd straight month on niche demand

Wistron, Wiwynn hit record August revenue as board approves US$200 Million for US, Vietnam expansion

DeepSeek's next AI test is not the model; it's everything around it

Phison pushes in-house AI solutions as August revenue surges to record high

DB HiTek completes reliability qualification for 8-inch SiC MOSFET process

Firmus, OpenAI strike compute deal for Malaysia AI factories

Compute-in-memory returns to the spotlight with edge AI's power, memory squeeze

Naver pitches a Europe-facing AI factory to France as Brookfield deal moves ahead

Samsung SDS broadens AI push from software to factory robots

JD Cloud plans 100,000-GPU cluster built on Moore Threads chips

SK Hynix says 3D DRAM will borrow from logic foundry playbook

Korea puts KRW250 billion behind free national AI service as frontier-model fund takes shape

China gets an early shot at the next SiC power-chip cycle

Beyond the stage, can XPeng's EV playbook scale humanoid robots?

Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

Samsung trims foundry partner network as remaining DSPs gain momentum

Cheap, energy-dense, difficult to tame: LG Energy Solution pushes LMR closer to EVs

CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

CIOE 2026: Morphotonics draws on display background to break AR waveguide bottlenecks

Apple's iPhone Duo raises the stakes for foldable smartphone cameras

China's 6G race starts before the first 6G phone as satellite links move into the network core

Wiwynn sees AI server shipments to overtake general-purpose servers in 3Q26

Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans

Apple just put a US$700 premium on hinges — seven supply chain takeaways

Apple's John Ternus puts iPhone at AI center stage

Apple's A20 Pro pushes mobile chips into the 2nm era — but AI may be the bigger disruption

Apple's 100-part iPhone Duo hinge puts spotlight on Chinese suppliers

Panasonic Energy unveils high-temperature solid-state battery, targets industrial uses, robotics

Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers

Samsung India reportedly cuts jobs as memory costs squeeze electronics unit

Qualcomm's AWS deal raises stakes for MediaTek and Alchip

Analysis: China chases EUV as chipmakers move to High-NA

Sumitomo, Sakana AI reportedly team up to expand Japan-made AI

Europe and US IDM grid-to-core push challenges Taiwan power modules

Taiwan hardware strength meets open-source gap

STMicro sees AI sales accelerating as factory transfers hold key to margin recovery

Google plans EUR13 billion Finland investment to expand data centers, clean energy

Analog Devices agrees to buy Alif Semiconductor to expand edge AI push

Himax launches eDP TDDI for smart cockpit displays

Yageo's August revenue hits record on AI demand

How AI and global expansion are reshaping semiconductor recruitment to production, tech integration

Arm launches second-generation CSS, targets China's AI smartphone market with C2 CPU

Global PMX sees semiconductor parts shipments strengthen

AI server ODMs face widening component mismatches, with shortages reaching 15–20%

SuperAlloy advances semiconductor aluminum certification

Silicon photonics boom could push InP supply-demand gap above 70%, triggering race for strategic optical resources

Taiwan IC design firms seek government subsidies for advanced chip development

Flex's EPC Power deal points to a broader shift in AI infrastructure

Confidence in Germany's auto repair sector slips, even as demand hits record high

Hiwin supply deal with Semes points to deeper access in South Korea's memory equipment market

Three open source foundations share one stage in Shanghai

Taiwan virtual asset alliance builds next-gen financial infrastructure

Song Chuan rides 800V HVDC upgrade wave, posts record 2Q26 sales

Acer's PC, non-PC businesses drive 13-year revenue high

Chenbro Micom August revenue dips, core projects unchanged

Apple names 2nm node for the first time since 2024 — and raises prices on every iPhone it still sells

Apple bets on new sensors and S11 chip to differentiate its 2026 watches

Apple's first foldable lands at US$1,999, and constraint is the panel