Intel is grappling with an operational crisis as its IDM 2.0 transformation plan has yet to yield results, casting doubt on when its foundry business might finally become profitable. This raises the question of whether Intel should consider abandoning its IDM model and separating its product design and manufacturing divisions—a move with both potential advantages and drawbacks. Industry leaders, including former board members, are offering advice in hopes of helping Intel find a viable path forward. However, the conflicting nature of their advice highlights the complexity of the company's dilemma
Chinese smart home appliance brands have swept across global consumer markets on the strength of youthful, innovative brand images. Analysts point to one defining trait: product iteration cycles so fast that even European and American rivals struggle to match them. That pace, combined with a recent wave of acquisitions targeting Western and Japanese brands, has given Chinese makers growing momentum and an increasingly firm grip on the global home appliance market
As competition in the semiconductor industry intensifies, TSMC maintains its lead while actively supporting the domestic supply chain. In recent years, driven by the need for cost reduction, breaking international monopolies, and the ability to respond rapidly to disruptions, TSMC has taken multiple actions to nurture local suppliers. Notably, TSMC has played a critical role as a "supply chain stabilizer," stepping in during key moments
The global AI industry is shifting into an inference cost war in 2026, with DeepSeek V4 accelerating changes across China's semiconductor supply chain. By positioning Huawei's Ascend chips as viable alternatives to Nvidia GPUs, DeepSeek reframes competition beyond software versus hardware. The shift cuts deeper, reshaping how AI systems are architected from the ground up
For years, the global auto industry has been enveloped in the promise of the software-defined vehicle. But at the 2026 Beijing International Automotive Exhibition, a more grounded reality came into focus: without sufficiently powerful hardware, software ambitions risk remaining just that—ambitions
Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level to panel-level, bringing fan-out panel-level packaging (FOPLP) into the spotlight. At the intersection of these trends, Taiwan's panel manufacturers are actively entering the semiconductor packaging field in search of new growth momentum
Honor's surprise win at this year's Beijing humanoid robot half-marathon has stirred industry debate, not only for its on-track performance but for what the move signals about shifting competitive dynamics. The smartphone maker's cross-sector push into robotics has reignited questions over whether embodied AI and humanoid systems could trigger a new round of market reshuffling
Amid growing geopolitical tensions over the global semiconductor supply chain, what initially appeared to be an internal personnel matter is evolving into a broader case study of the operational risks that foreign equipment vendors face in China
AI-powered navigation platforms such as China's Amap are forcing a rethink of how convenience, competition, and data governance intersect. The debate in Taiwan over Amap's near-real-time traffic light countdown and high-precision navigation reflects a broader shift in how mobility data is collected, processed, and monetized
On December 6, 2022, Tim Cook stood on a construction site in Phoenix, Arizona, alongside President Biden, TSMC founder Morris Chang, and Nvidia CEO Jensen Huang. It was the tool-in ceremony for TSMC's first Arizona fab, a moment that crystallized how central Taiwan's semiconductor industry had become to American technology ambitions. For Cook, it was also the closest he ever got to TSMC's leadership in 15 years as Apple's CEO
The 2026 Beijing International Automotive Exhibition opened on April 24 with a scale that stands in sharp contrast to the contraction of many global auto shows. Spanning roughly 380,000 square meters and drawing more than 2,000 exhibitors, the event has become one of the clearest barometers of where the automotive industry is heading
When DeepSeek unveiled its V4 model, it ended with a line from ancient Chinese thinker Xunzi: ignore applause and criticism, and focus on doing things the right way. In today's AI context, the message reads less like philosophy and more like positioning
For more than a decade, lithium-ion batteries have defined the global power battery market, concentrating technology, capital and supply chains along a single trajectory. That model is now under pressure. Sharp swings in lithium carbonate prices have exposed structural vulnerabilities, forcing the industry to confront a long-ignored question: what happens when the core input cost is no longer predictable
The trajectory of DeepSeek has drawn scrutiny, but its latest move marks a clear inflection point. According to a report by The Information, the company is seeking external funding for the first time, triggering strong interest from China's major tech groups. Four sources familiar with the matter said Tencent and Alibaba are in discussions to invest
Apple has officially confirmed long-rumored news that Tim Cook will step down as CEO in September 2026, handing over leadership of the US$4 trillion tech giant to senior vice president of hardware engineering John Ternus. Unlike Cook, known for his supply chain mastery, Ternus is well-known as a pure "product person" and engineer
Apple has officially announced that John Ternus will succeed Tim Cook as CEO. Given Ternus's deep hardware background, product innovation at the hardware level is widely expected to accelerate under his leadership. As AI development enters the era of embodied intelligence, his prior takeover of Apple's secret robotics team is seen as pivotal to whether Apple can seamlessly integrate its existing AI technologies and software ecosystem with physical hardware
