Under the theme of "3S Open Lab Platform," 3S will present its achievements and advancements at SEMICON Taiwan 2024, showcasing the unique capabilities of the 3S Open Lab Platform.From September 4th to 6th, 3S Silicon Tech will be at Booth S7640 at Hall 2, Nangang Exhibition Center, introducing the cutting-edge developments of its Open Lab Platform tailored for power devices and power module assembly. The platform is designed to bridge the gap between innovative ideas and market-ready products, having already proven successful with global FABS, Fabless companies, OSATS, EMS, and leading IDM enterprises.3S Open Lab Platform: Turning smart ideas into tangible productsThe 3S Open Lab Platform is a pioneering initiative that offers a collaborative environment where opportunities and knowledge converge. Visitors will have the chance to explore how the platform supports the entire journey from concept to production, ensuring time-to-volume, time-to-market, and time-to-investment return for power chip and power module designers. Through a series of rigorous Design of Experiments (DOE), 3S Silicon Tech has mastered the transition from uncertainty to clarity, providing clients with the tools to overcome challenges and succeed in the competitive semiconductor landscape.Meet-the-Expert Session: Showcasing success stories in process optimizationAs part of SEMICON Taiwan's Smart Manufacturing Expo, 3S Silicon Tech will participate in the "Meet-the-Expert" event at the "Smart Manufacturing Arena." During this session, the team will share inspiring success stories from the Open Lab's continuous process optimization efforts and provide insights into the company's commitment to driving innovation through AI tools and data science to empower smart manufacturing.Join us at SEMICON Taiwan 20243S Silicon Tech cordially invites industry professionals to visit Booth S7640 to engage in insightful discussions on the latest technological advancements and explore collaborative opportunities. This event marks a significant milestone for 3S Silicon Tech as it continues to lead in providing cutting-edge solutions that drive the semiconductor industry forward.We look forward to welcoming you to our booth and sharing our journey of innovation and success.3S Silicon Tech Official Website: https://www.sss-tech.com.tw/

In today's fast-growing industry, the accuracy and stability of gas equipment are indispensable to semiconductor manufacturing. As an integrator in the gas field, Reliya Tech. has been vigorously promoting its own brand and has also introduced three leading brands, ASDevices, Simpure, and Tiger Optics, to the local market.In SEMICON 2024, Reliya will display a full range of products together with its technological innovation and top customer service. We sincerely expect a grand expo in the company of other established leaders in the semiconductor industry in Taiwan.During this year's Semiconductor Expo, which will be held from September 4th to 6th, we are glad to display the gas chromatograph Ka8000 and the intelligent gas calibration system (iGCS) of AS Devices, Purifier 7NG, 9NP003, and 9NP050 series of Cipro, as well as the micro oxygen analyzer of Tiger Optics. In addition, our gas particle counter, independently developed by Reliya's lab, will also be presented at the exhibition.Our gas particle counter has been well received by the industry since its launch, with sales in over 80 countries, including Taiwan, China, and Singapore. Besides, Reliya Technology has just acquired the certification of ISO 9001:2015 and ISO 45001:2018 this year, ensuring our accordance with high quality and industrial standard in manufacturing, installation, gas piping design, and construction of the instrument. Our gas particle counter will soon see its overseas sales in cooperation with companies in Europe and the United States.Innovation and Excellence in fechnologyEquipped with advanced sensors and a control system, ASDevices Ka8000 as a top GC solution is capable of regulating the gas flow with a high degree of accuracy to ensure control of each step in the manufacturing process. Also, the iGCS dilution device can operate in different environments with great stability, which endeavors to provide a stabilized gas supply and ensure its continuity and consistency.In a low-temperature setting, Simpure's purifiers allow the removal of impurities of H2 and He down to the ppt level with the feature of purging not only conventional impurities such as H2O, O2, CO, CO2, NMHC but also other impurities such as Ar, N2, CH4, etc. The purifiers are available in different flow rates and pressure ranges, which are trusted by leading gas companies and 12-inch semiconductor wafer factories. Among them, the 9N 120Nm3/h H2 purifier has performed well in a 12-inch semiconductor wafer fab, passing a comprehensive impurity test with all the criteria met. We can therefore proudly say that we definitely meet our client's requirements.Quality Customer SupportRelyea Technology not only provides top-end products but also values our instant and complete support for our customers. We aspire to take the lead in both technology and services to satisfy our customers' needs and assist them in their business goals.Tailor-made Solutions: Our team provides gas supply solutions tailored to each customer's needs. Prioritizing our clients' interests, we provide the best advice and solutions to different requests such as building a whole new plant and upgrading an existing system.Prompt Technical Support: Our team provides timely customer services at any time and in any place. Our technical professionals are dedicated to troubleshooting in the shortest time to ensure that our client's production is not interrupted.Comprehensive Training Program: Covering basic operation to advanced maintenance, we offer a comprehensive training program to assist our clients in maximizing the benefits of our products, which includes all the core knowledge and skills needed to attain the highest productivity.We cordially invite you to visit our booth and learn more about our products and commitment.Exhibition DetailsLocation: Taipei Nangang Exhibition Center, Hall 2, First floor, Booth Q5252Visiting hours: 10:00-17:00 4-6 September (Wed. - Fri)Contact: sales@reliya.com.twUp to date with the most advanced technology and the latest trends, we aim to deepen our exploration and contributions in gas purification equipment and gas analyzers. We are looking forward to your visit on-site.

Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications. Loctite Eccobond UF 9000AE protects large die within flip-chip BGA (FCBGA), high-density fan-out (HD-FO), and 2.5-D advanced packaging devices.HD-FO and 2.5-D wafer-level packaging techniques have seen significant progress in the last ten years, having achieved dramatic increases in I/O, efficiency, and performance, making them a key enabler of AI growth in the data center and at the edge. With high-density thin, large die (>40 mm x 40 mm) and substantial package body sizes (>100 mm x 100 mm), emerging AI and HPC devices for certain applications can contain more than 2,000 fine-pitch (~100 µm), low gap height (~50 µm) interconnects per die. Bump protection and warpage control are critical for device functionality and optimized package performance. However, achieving thorough bump encapsulation at flow rates that deliver coverage efficiency can be challenging, given the cutting-edge architectural complexity.Henkel has developed a brand-new capillary underfill formulation that meets the dimensional demands of highly integrated package designs. Loctite Eccobond UF 9000AE completely envelops fine-pitch, low gap height die interconnects for rigid protection against stress to deliver good electrical, moisture, and thermal reliability performance for high production yields. The material's low shrinkage and toughness provide die and underfill crack resistance, while its low coefficient of thermal expansion (CTE) protects against warpage. Loctite Eccobond UF 9000AE also has low resin bleed out (RBO) and forms narrow fillets, allowing the dense die integration inherent in advanced packaging techniques.Henkel Global Market Segment Head for Semiconductor Packaging Materials, Ramachandran (Ram) Trichur, acknowledges that while thorough, rugged bump protection against thermal cycling strain and mechanical damage is the highest underfill priority, processability is critical to achieving throughput and yield objectives."Loctite Eccobond UF 9000AE delivers no-voiding bump encapsulation of flip-chip BGA, Cu pillar, and other high-density interconnects, which is fundamental to preserving the value and function of these high-performance devices," Trichur says. "Notably, however, this material does so faster than our prior generation underfills, allowing for greater flow efficiency, which is an important feature for complete interconnect coverage and encapsulation across large surface areas."In internal testing versus previous generation capillary underfills, Loctite Eccobond UF 9000AE demonstrated 20% faster flow* on a 40 mm x 40 mm die, indicating that this material is compatible with even larger die sizes. Its edge-to-edge capillary flow efficiency ensures interconnect encapsulation before any material gelation, eliminating the risk of exposed bumps. So far, Loctite Eccobond UF 9000AE's performance has been validated on die as large as 50 mm x 50 mm and within packages up to 110 mm x 110 mm."The rise of AI underscores semiconductor packaging ingenuity and its ability to drive remarkable levels of computing power and cost-effective scaling alternatives to Moore's Law," Trichur says, citing the well-publicized growth of 2.5-D chip-on-wafer and 3-D advanced packages. "Henkel has been at the forefront of enabling these devices with novel semiconductor materials, and our new underfill further demonstrates our contributions to this dynamic market space."Learn more about Henkel's advanced semiconductor packaging materials at www.henkel-adheisves.com.LOCTITE® is a registered trademark of Henkel and/or its affiliates in the USA, Germany, and elsewhere.*Die size dependent. About HenkelWith its brands, innovations, and technologies, Henkel holds leading market positions worldwide in the industrial and consumer businesses. The business unit Adhesive Technologies is the global leader in the market for adhesives, sealants, and functional coatings. With Consumer Brands, the company holds leading positions especially in laundry & home care, and hair in many markets and categories around the world. The company's three strongest brands are Loctite, Persil, and Schwarzkopf. In fiscal 2023, Henkel reported sales of more than 21.5 billion euros and adjusted operating profit of around 2.6 billion euros. Henkel's preferred shares are listed in the German stock index DAX. Sustainability has a long tradition at Henkel, and the company has a clear sustainability strategy with specific targets. Henkel was founded in 1876 and today employs a diverse team of about 48,000 people worldwide – united by a strong corporate culture, shared values, and a common purpose: "Pioneers at heart for the good of generations." More information at www.henkel.comPhoto material is available at www.henkel.com/pressContact Sebastian HinzPhone +49 211 797-85 94Email sebastian.hinz@henkel.comHenkel AG & Co. KGaA