GlobalFoundries (GF) is preparing a major global capacity expansion as TSMC is set to gradually exit gallium nitride (GaN) foundry services...
SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...
Cadence Design Systems and Synopsys have achieved certification for key design flows on TSMC's A14 process, expanding the design ecosystem...
TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends...
Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs....
SK Hynix is pushing deeper into logic design as it develops a next-generation 3D DRAM architecture that could separate memory-cell processing...
Taiwan's chipmakers are having their best year in a decade, and the headline number belongs to TSMC. The more interesting one does n...
