Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based semiconductor automation and wet process equipment maker Grand...
Rising global uncertainties following Donald Trump's presidential victory have led TSMC to recalibrate its ambitious expansion plans for Chip-on-Wafer-on-Substrate (CoWoS) packaging...
Semiconductor Week in Review (Nov 10 - 16): In a week dominated by seismic shifts in the semiconductor landscape, TSMC's suspension of sub-7nm chip supply to Chinese AI firms and...
Morris Chang, founder of TSMC, recently stated at the company's sports event that free trade has died. This sentiment aligns with Trump's assertion that no trade comes free, foreshadowing...
The U.S. Government has announced that the U.S. Department of Commerce will award up to $6.6 billion in direct funding to TSMC Arizona Corporation (TSMC Arizona), a subsidiary of...
TSMC inaugurated its zero-waste manufacturing center in Taichung on November 13, while signing a memorandum of understanding (MOU) with Taiwan's Environmental Protection Administration...
Recent legal documents reveal that twelve current and former employees from TSMC's California and Arizona facilities have accused the company of racial discrimination in recruitment,...
According to industry sources, the inauguration ceremony for TSMC's new advanced fab site in Arizona, US, has been abruptly put on hold. TSMC has notified the invited guests that...
Following its recent establishment of a wafer fab in Japan, TSMC aims to attract PhD talent in the region to advance its semiconductor research and development.
The global semiconductor shortage that plagued automotive chips from 2020 to 2022 has subsided, as electric vehicle (EV) demand in Europe and the US falls short of projections. While...
Grand Process Technology Company (GPTC), a Taiwan-based semiconductor equipment company involved in the supply chain for TSMC's CoWoS packaging, aims to leverage the rising demand.
Each low-numerical aperture (NA) extreme ultraviolet (EUV) lithography system costs over US$100 million, making it one of the most expensive semiconductor manufacturing tools in history...
TSMC's board of directors has approved capital appropriations of approximately US$15.48 billion for the primary purposes of new fab construction, the installation of fab facility...
Nvidia is gearing up to debut its next-gen "Rubin" GPU in 2025, featuring eight HBM4 chips, with a Rubin Ultra version to follow, packing twelve. In a strategic bid to reclaim HBM...
