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Tuesday 6 October 2026
Chinese LCD panel makers tighten supply to lift prices — Taiwan suppliers eye order shifts
Chinese panel makers moved to cut production during the National Day holiday after issuing their first price increase notices in September, combining pricing signals with supply controls to stabilize LCD TV panel prices and profitability.
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Wednesday 7 October 2026
Commentary: Qualcomm patent deal puts spotlight on Huawei's broader IP push
Huawei and Qualcomm announced on Oct. 5 that they had signed a multi-year patent licensing agreement covering technologies including 5G, computing, AI and networking.
Wednesday 7 October 2026
AMD expands Korea push after Taiwan supply talks
AMD CEO Lisa Su moved from supply-chain talks in Taiwan to South Korea this week, broadening the chipmaker's Asia push from efforts to secure more CPU, GPU and advanced-wafer capacity to building an open computing ecosystem around its processors, Korean AI accelerators and software.
Wednesday 7 October 2026
Towa returns strategic chip packaging production to Japan as AI demand accelerates
Towa plans to build a new factory in Kyoto Prefecture to produce assembly and packaging equipment for advanced semiconductors used in artificial intelligence applications.
Wednesday 7 October 2026
Z.ai takes GLM-5.3 global through Amazon Bedrock's enterprise channel
Chinese AI company Z.ai is expanding its overseas commercialisation through Amazon Bedrock, with AWS adding GLM-5.3 on October 6 and sharing revenue with Z.ai based on model usage.
Wednesday 7 October 2026
Starship reaches orbit on 14th test as Chinese rocket makers race toward low-cost reusability
SpaceX's Starship reached Earth orbit for the first time on its 14th test flight and deployed 26 next-generation Starlink V3 satellites. Whereas the previous 13 flights primarily focused on orbital testing, Flight 14 marked a further step into operational orbital missions.
Wednesday 7 October 2026
DeepSeek reportedly set to raise more than US$12B ahead of potential IPO
Chinese AI startup DeepSeek is poised to raise more than CNY80 billion (approx. US$11.9 billion) in its latest funding round, as it builds capital ahead of a potential domestic initial public offering (IPO).
Wednesday 7 October 2026
Huawei's NPO bet challenges CPO's path to AI scale
Huawei is backing near-packaged optics (NPO) rather than co-packaged optics (CPO) for its next-generation AI infrastructure, arguing that NPO offers a better balance of cost, manufacturability, reliability and serviceability as optical interconnects move deeper into large-scale AI clusters.
Wednesday 7 October 2026
BOE chairman expected to meet Samsung executive as LCD panel prices rise
Chinese display makers have raised LCD panel prices as global TV makers head into the holiday season, raising costs for TV makers worldwide. BOE chairman Yanshun Chen is expected to visit South Korea in October 2026 and meet Samsung Electronics president Tae-moon Roh, with supply volumes and pricing set to dominate talks.
Wednesday 7 October 2026
Samsung Electro-Mechanics secures 2027 AI server MLCC demand as supply pressure builds
Samsung Electro-Mechanics (Semco) has secured another major AI server order, signing a KRW290 billion (about US$216 million) contract to supply multilayer ceramic capacitors (MLCCs) to an undisclosed global customer throughout 2027. The deal is its sixth disclosed long-term supply agreement this year.
Wednesday 7 October 2026
Analysis: Kioxia's NAND pedigree meets an AI-era SSD gap

Kioxia helped create the NAND flash industry, but AI is changing what leadership in memory looks like. The Japanese supplier is benefiting from record NAND demand and higher prices, yet rivals are capturing more value from enterprise solid-state drives (SSDs) for AI servers. Kioxia's challenge is therefore less about making advanced NAND than turning it into qualified products, hyperscaler relationships, and committed volumes before today's AI infrastructure boom hardens the supplier hierarchy.

Wednesday 7 October 2026
Smaller batteries, smarter roads: Honda tests different EV cost model
The complexity of vehicle economics surrounding surging battery costs has long put the EV industry in a difficult position, caught between power-delivery constraints and energy-efficiency demands.
Tuesday 6 October 2026
Samsung secures customer backing for US$5B substrate expansion
Samsung Electro-Mechanics is investing KRW6.78 trillion (approx. US$5 billion) to expand FCBGA capacity in South Korea and Vietnam. The projects are backed by customer funding and medium- to long-term volume commitments, as demand for high-performance package substrates pushes Korean production lines toward high utilization.
Tuesday 6 October 2026
Huawei's Kirin 9050 Pro reveals new logic folding chip design
Huawei's Kirin 9050 Pro has been fully broken down by Chinese and overseas researchers, giving the market a closer look at the company's "LogicFolding" approach. Analysis from Geekerwan and die-shot images posted by Kurnal Insights show that the flagship SoC in the Huawei Mate 90 Pro Max uses two vertically stacked dies rather than a traditional single-plane chip design.
Tuesday 6 October 2026
Samsung steps up HBM cooling as TSMC expands CoWoS
Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management challenges.
Tuesday 6 October 2026
MIPS deepens RISC-V ties with China despite US-China tech tensions
Despite intense technology competition between the US and China, cooperation between the two sides on the open-standard RISC-V architecture continues to deepen, with US intellectual property provider MIPS expanding its work with Chinese industry.