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Monday 1 December 2025
CXMT narrows DRAM gap; market impact may be smaller than expected?
China's memory manufacturer CXMT, backed by government support, shifted to high-end technology development from 2025 and has introduced multiple next-generation DRAM products within a year, with performance approaching Samsung Electronics and SK Hynix
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Monday 1 December 2025
Beijing’s new frontier for AI computing is 800 kilometers above Earth

As global demand for AI computing power surges, conventional ground-based data centers are increasingly constrained by limits in energy supply and cooling capacity

Monday 1 December 2025
Brightek's Jiangsu plant inaugurated to target smart sensing and AI robotics
Optoelectronic semiconductor integration solution provider Brightek recently officially commissioned its Jiangsu factory, built with an investment of nearly CNY200 million (approx. US$28.3 million). Brightek stated that the new facility will fully support emerging applications such as international automotive manufacturers, smart mobility, intelligent sensing, and AI robotics, laying a critical foundation for growth over the next decade
Monday 1 December 2025
China's Xiangdi Xian unveils Fuxi A0, the first mass-produced IMG DXD GPU
Imagination Technologies made a prominent showing at the 31st ICCAD-Expo 2025 in Chengdu, where strategic partner Xiangdi Xian Computing Technology debuted its next-generation GPU built on the Imagination DXD architecture. Revealed via the company's WeChat account, the Fuxi A0 is confirmed as both the world's only mass-produced IMG DXD product and the first DXD chip to reach tape-out
Monday 1 December 2025
Wingtech appeals to Dutch Supreme Court as Nexperia supply disruptions persist
China's Wingtech has appealed to the Dutch Supreme Court to regain control of chipmaker Nexperia BV, highlighting ongoing tensions despite a temporary truce that allowed some components to resume flowing. The appeal targets an Amsterdam court ruling that transferred Nexperia shares—except for one—to a court-appointed trustee and suspended Wingtech founder Zhang Xuezheng as CEO, actions Wingtech contests in full, according to Bloomberg
Sunday 30 November 2025
Samsung reportedly nears December verdict on Nvidia HBM4 tests
Samsung Electronics is reportedly nearing the final stage of qualification tests for its HBM4 memory chips with Nvidia, with a December decision that could mark one of the company's most significant comebacks in the high-end memory market in recent years, according to South Korean outlet Newdaily. At the same time, reports from ZDNet Korea and The Korea Herald say Samsung has overhauled its memory development organization to stabilize HBM production and challenge SK Hynix's lead
Sunday 30 November 2025
Solvit unveils tools to accelerate search-and-rescue in signal dead zones
South Korea's Solvit System is rolling out new search-and-rescue technologies designed to locate missing people in areas with no mobile coverage. The company introduced two systems honored with CES Innovation Awards that aim to sharply reduce search zones and speed up rescue missions in radio shadow regions where phones cannot connect
Saturday 29 November 2025
CXMT's high-end DRAM push narrows China's gap with South Korea to one year
China's leading DRAM maker CXMT has unveiled new DDR5 and LPDDR5X chips with performance now viewed as comparable to Samsung Electronics and SK Hynix. The launch has unsettled South Korea's memory sector, especially since CXMT reached this level in under a year after pivoting from low-cost DRAM to premium development in early 2025
Saturday 29 November 2025
Chinese AI giants bypass US chip curbs with Southeast Asian compute hubs
China's top technology companies are shifting their LLM training to overseas data centers as Washington tightens controls on advanced AI chips and Beijing orders domestic firms to stop using foreign hardware for model development
Friday 28 November 2025
Samsung races to seal HBM4 deal with Nvidia, targets early 2026 shipments
Samsung Electronics is reportedly nearing a deal with Nvidia on 2026 HBM4 pricing, aiming to match SK Hynix's rates as the company accelerates capacity expansion and reorganizes its DRAM development teams to regain momentum in the premium AI memory market
Friday 28 November 2025
Chinese analog chipmaker 3Peak to acquire Aura Semiconductor in major industry tie-up

3Peak, a leading Chinese analog chipmaker, plans to acquire Ningbo Aura Semiconductor through new share issuance and/or cash. The move advances 3Peak's push to become a global platform-based provider of analog and mixed-signal solutions

Friday 28 November 2025
Baidu reportedly plans biggest layoffs since 2018 as ad revenue slump deepens
Baidu is reportedly preparing its biggest workforce reduction in seven years, trimming staff across key divisions and reshaping its AI model unit by the end of 2025. The overhaul follows a sharp slowdown in advertising sales and rising pressure to shift spending to growth areas
Friday 28 November 2025
DRAM and NAND spike 100%+: triggering 2025's toughest pricing crisis for electronics makers
A global surge in memory prices is disrupting the electronics supply chain, creating what manufacturers describe as 2025's toughest pricing season. DRAM and NAND costs are rising at record speed, pressuring margins across smartphones, PCs, home NAS devices, and industrial touch terminals
Friday 28 November 2025
Meta and Nvidia reportedly push to integrate GPUs into HBM for AI boost
To enhance artificial intelligence (AI) performance, Meta and Nvidia are advancing plans to embed GPU compute cores directly into the base die of high-bandwidth memory (HBM). This innovation blurs the lines between memory and system semiconductors, presenting new opportunities and challenges for South Korea's semiconductor industry
Friday 28 November 2025
Japan plans 600-kilometer quantum communication network by 2027

Following the lead of China, the European Union (EU), and South Korea, Japan has unveiled plans to build its own long-distance quantum communication network. The first phase will link the country's three major cities—Tokyo, Nagoya, and Osaka—covering a distance of 600 kilometers. Construction is expected to be completed by early 2027, with field testing planned later that year. The initial rollout will focus on sectors where confidentiality is critical, such as healthcare and finance, to establish a Japan-specific quantum communication standard by 2030

Friday 28 November 2025
Rapidus reportedly plans second Hokkaido fab for 1.4nm chips as funding gap widens, but company pushes back on timeline

Rapidus plans to begin construction on a second fabrication plant in Chitose, Hokkaido, in fiscal 2027 to produce 1.4nm and eventually 1nm chips, according to reports from Nikkei and Yomiuri Shimbun. The move underscores Japan's push to return to the front of advanced logic manufacturing, even as Rapidus works to complete its 2nm process and secure the funding required to sustain its roadmap. However, the company has since denied this reported timeline