DIGITIMES Asia news

Thursday 26 March 2026

SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die

SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics' performance advantage. However, industry analysts warn that production timing and cost challenges pose significant risks to SK Hynix's 3nm ambitions

Commentary: TSMC chairman exposes three realities behind China's robot FOMO

Thursday 26 March 2026

SEMICON China opens with focus on AI chips and advanced packaging

Thursday 26 March 2026

Samsung and SK Hynix boost China factory investments in 2025 amid memory demand surge

Thursday 26 March 2026

China's Naura and AMEC lead China's push into advanced chip packaging

Thursday 26 March 2026

LATEST STORIES

Thursday 26 March 2026

South Korea freezes 2Q26 electricity rates, amplifying stress on pricing mechanism and future bills

South Korea will keep electricity rates unchanged for the second quarter of 2026 amid geopolitical tensions in the Middle East, which are pushing global energy prices higher, a decision intended to stabilize household costs in the short term. The move, however, exposes mounting contradictions between the country's electricity pricing mechanism and broader energy policy objectives

Thursday 26 March 2026

China's H3C expands server exports to ASEAN and Central Asia as global AI compute demand rises

As countries tighten controls on advanced chips and AI computing demand surges, how China secures compute resources matters globally. DIGITIMES Research reports H3C, a top Chinese server maker, has expanded exports into ASEAN and Central Asia since 2023, reshaping supply chains and offering alternative routes around US trade pressures

Wednesday 25 March 2026

Denso proposes acquisition of Rohm to strengthen automotive and power control

Automotive parts giant Denso, closely linked with Toyota Motor, has officially submitted a proposal to acquire shares in Rohm Semiconductor, signaling its clear intent to pursue a takeover. This move appears to show Denso's intention to strengthen its position in the automotive semiconductor and power control sectors

Wednesday 25 March 2026

With Hua Hong partnership, STMicro builds 'China for China' supply chain

STMicroelectronics said this week that its STM32 microcontrollers, produced in partnership with Hua Hong Semiconductor, have entered volume production in China and are now being shipped to local customers, marking a significant step in the company's "China for China" strategy

Wednesday 25 March 2026

'China Speed': the new benchmark in global auto competition

Through highly centralized supply chains, a software-first development philosophy, and extensive state subsidies, Chinese automakers have compressed traditional vehicle development cycles from five to seven years to less than two. In some cases, development timelines have shrunk to just a few months

Wednesday 25 March 2026

China-South Korea panel war escalates: USPTO rejects Tianma patent challenge

The US Patent and Trademark Office has rejected an attempt by Tianma Microelectronics to challenge a patent held by LG Display, citing concerns that the Chinese company may be under the influence of a foreign government

Wednesday 25 March 2026

SoftBank-backed SAIMEMORY plans post-HBM shift with vertical memory tech

SAIMEMORY, a Japanese startup backed by SoftBank, is positioning its proprietary Z-Angle Memory (ZAM) as a potential successor to high-bandwidth memory (HBM) as physical limits begin to constrain current AI architectures, according to Nikkei and PC Watch

Wednesday 25 March 2026

Samsung reportedly set to begin GaN foundry production, prepare SiC samples

Samsung Electronics is reportedly set to begin mass production at its gallium nitride (GaN) power semiconductor foundry line as early as the second quarter, while also preparing silicon carbide (SiC) samples for production later this year, according to reports from The Elec and ZDNet

Wednesday 25 March 2026

CATL, BYD drive China's next energy frontier with sodium-ion and perovskite solar

As the rest of the world scrambles to catch up with China in lithium-ion batteries, Chinese companies are already pushing into new frontiers — racing to scale up sodium-ion batteries while simultaneously betting big on next-generation solar technology

Tuesday 24 March 2026

Sharp taps BD chief as CEO in post-restructuring shift

Sharp Corporation, a subsidiary of Foxconn, has named its Chief Business Development Officer, Tetsuji Kawamura, as its next president and CEO, placing an executive with deep overseas and new-business experience at the helm as the Japanese electronics maker pivots from restructuring toward growth

Tuesday 24 March 2026

WWDC26: Apple signals AI maturity and 'charm approach' to China amid Tim Cook's visit

Apple officially confirmed on Monday that its annual Worldwide Developers Conference (WWDC) will return from June 8 to June 12, 2026. While the core experience remains online and free for its 34-million-strong developer community, the company is doubling down on a hybrid strategy, hosting a marquee in-person event at Apple Park on opening day

Tuesday 24 March 2026

Insta360 pushes back against DJI in escalating patent dispute

China's leading consumer drone maker, DJI, has formally filed suit against rival Insta360, alleging disputes over ownership of six patents. The case, which also implicates several former core DJI research engineers, has been accepted by the Shenzhen Intermediate People's Court

Tuesday 24 March 2026

Hanwha Semitech's SK Hynix TCB deal draws scrutiny over KRW100 billion guarantee

Hanwha Semitech's supply of thermal compression bonding (TCB) equipment for high-bandwidth memory (HBM) to SK Hynix is drawing scrutiny after the South Korean equipment maker maintained a KRW100 billion (US$66.7 million) performance guarantee since early 2025, raising questions about whether its equipment has fully met the chipmaker's requirements

Tuesday 24 March 2026

SK Hynix reportedly advances M15X ramp, opens second cleanroom ahead of schedule

SK Hynix has brought forward the ramp-up of its M15X DRAM facility in Cheongju, opening a second cleanroom and beginning equipment move-in about two months ahead of schedule amid rising demand for memory tied to artificial intelligence (AI), according to East Asia Daily

Tuesday 24 March 2026

China's AI GPUs face equipment and software constraints, but system-level design boosts self-reliance

Although it may appear that China's AI GPU development is behind the US by one or more generations, a recent Morgan Stanley report reveals the actual gap is smaller than widely perceived

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook