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Friday 5 June 2026
Nvidia deepens humanoid robotics role with Unitree and Cosmos 3, secures AI chips
Nvidia is moving deeper into humanoid robotics, combining robot hardware, secure computing, world models and developer platforms as AI shifts from digital workloads to physical AI
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Friday 5 June 2026
OECD data show China-based semiconductor makers receive outsized industrial support
Industrial subsidies reached their highest level since the global financial crisis in 2023 and 2024, according to a June 2026 OECD release based on its new MAGIC database of industrial subsidies. The database tracks support received by 525 of the world's largest manufacturing groups across 15 industrial sectors from 2005 to 2024
Friday 5 June 2026
FADU wins new contracts as AI workloads reshape data storage
As artificial intelligence (AI) workloads place unprecedented demands on data storage systems, South Korean SSD controller designer FADU is betting that next-generation storage architecture will become a critical battleground in the AI infrastructure race
Friday 5 June 2026
Alibaba opens Qwen to KFC, Luckin Coffee, and airlines in AI agent battle
Alibaba is opening its Qwen AI assistant to external brands and third-party agents, turning the consumer app from a chatbot into a transactional platform for food orders, travel planning, and other everyday services
Friday 5 June 2026
Nexchip carves out BGBM assets to back Wuhu wafer project, refocuses on 12-inch foundry business
Nexchip Semiconductor plans to carve out its BGBM business by contributing specialised equipment assets to Anhui Ruijing Semiconductor, a newly established power device wafer-processing venture in Wuhu, Anhui Province, as the Chinese foundry seeks to focus capital and management resources on its core 12-inch wafer foundry platforms
Friday 5 June 2026
US targets China's PCB grip as AI and defense supply risks mount
As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed circuit boards (PCBs), which sit beneath chips and connect critical electronics, are increasingly being viewed by the US government and defense sector as a supply chain risk
Friday 5 June 2026
Jiin Ming debuts Raven remote controller at Japan Drone 2026
Taiwanese firm Jiin Ming Industry unveiled its self-developed JMG flight remote controller — Raven — at the Japan Drone 2026 exhibition, marking the first time the company has showcased an in-house flight remote controller at an international trade show. The debut highlights its technological progress in drone control systems
Friday 5 June 2026
South Korea finalizes US$520 million on-device AI chip budget amid industry doubts
South Korea has finalized the budget for a state-backed on-device AI chip development project at KRW800.23 billion (US$520 million), about KRW200 billion below an earlier proposal, as industry concerns persist over whether the chips developed under the program will reach commercial products, according to The Elec
Friday 5 June 2026
CXMT's South Korean hiring spree puts Samsung, SK Hynix memory lead on alert
More than 200 South Korean engineers are conservatively estimated to be working at CXMT, China's leading DRAM maker, according to industry sources. Chinese semiconductor companies are stepping up talent acquisition, moving from broad outreach to targeted recruitment of core semiconductor R&D personnel in South Korea and the US. Observers say the shift could accelerate the narrowing of the semiconductor technology gap between China and South Korea
Friday 5 June 2026
Local Chinese brands challenge dominant brands in AI glasses innovation; limitations hinder mass adoption
This year's Global Connect Show (GCS) in Shenzhen, China, has become a medium for local tech brands to showcase AI wearable innovation. Two leading brands at GCS, Rokid and INMO, demoed their feature-packed AI glasses. Many companies featured AI translation as their flagship capability, paired with lightweight hardware, hands-free controls, customizable designs, and flexible model support. While on-site demos proved these up-and-coming brands' AI glasses may outperform dominant players such as Meta and Apple, there are still lingering flaws, such as battery life and privacy ethics, that stand in the way of mainstream mass adoption
Friday 5 June 2026
Hanmi Semiconductor eyes record sales in Computex debut as HBM4 demand grows
Hanmi Semiconductor is projecting record annual revenue this year, as rising demand for high-bandwidth memory equipment lifts prospects for the South Korean chip-equipment maker and gives it a prominent stage for its Computex debut
Friday 5 June 2026
South Korea's only SRAM-CIM IP firm Articron targets edge AI
South Korean semiconductor IP startup Articron is challenging the traditional AI chip design bottleneck by using a memory-centric architecture, with its self-developed SRAM-CIM compute chip IP "ART" now in testing and aimed at the power- and area-sensitive edge AI device market. The company says it expects to launch a commercial product in about two years
Thursday 4 June 2026
Foxconn, SK Group eye deeper AI infrastructure ties in Asia

Foxconn chairman Young Liu met SK Group chairman Chey Tae-won on June 3, as the two companies explore broader cooperation in AI servers, data centers, and energy solutions

Thursday 4 June 2026
Samsung's rumored CIS production shift highlights industry debate over fab ownership
Samsung Electronics' decision to place a key image sensor production line under its System LSI division highlights a broader question facing the CMOS image sensor (CIS) industry: whether chip designers should own manufacturing capacity or rely on external foundries as competition intensifies across smartphones, automotive systems, and AI-enabled devices
Thursday 4 June 2026
Nvidia's Jensen Huang courts Korean giants in robotics expansion

Nvidia CEO Jensen Huang is visiting South Korea this week as the company seeks to expand its partnerships with major Korean conglomerates beyond semiconductors and into robotics, autonomous driving, and industrial automation, ETNews reported

Thursday 4 June 2026
LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples to SK Hynix as it tries to move deeper into high-end semiconductor substrates, according to ZDNet Korea