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Monday 23 June 2025
Pixel 10 chip deal goes to TSMC — Samsung enters post-Google overhaul mode
Samsung Electronics has launched an extensive internal review to regain ground in the advanced foundry market, triggered by the loss of Google's custom application processor (AP) contract to rival TSMC. The Pixel 10, set to debut with a 3nm Tensor G5 chip produced by TSMC, has forced a reckoning within Samsung's semiconductor division
Monday 23 June 2025
Renesas enters restructuring support deal with Wolfspeed as the latter deals with ongoing financial struggles
Renesas Electronics has entered a financial restructuring agreement with Wolfspeed, a US-based silicon carbide (SiC) semiconductor manufacturer, amid Wolfspeed's ongoing financial struggles. Renesas anticipates recording a significant impairment loss related to its investment in Wolfspeed, reflecting the deteriorating market conditions and rising competition in the sector
Monday 23 June 2025
Chinese graduates seeking semiconductor jobs targeted by scams
Fresh college graduates in China looking to enter the employment force have their hearts set on major players in the semiconductor industry. However, as they rush to submit resumes, the risk of being scammed has quietly grown
Monday 23 June 2025
Weekly news roundup: Taiwan's Huawei export ban, Nvidia H20 blocked by US, TSMC-Samsung 2nm showdown
Below are the most-read DIGITIMES Asia stories from June 16 to June 22, 2025. Top developments include tighter US chip restrictions on China, updates on the next-gen 2nm race from TSMC and Samsung Electronics, and new disruptions in global supply chains driven by rare earth curbs and AI chip controls
Monday 23 June 2025
NTT faces headwinds in co-packaged optics effort, pins hopes on Rapidus
Japanese telecommunications company NTT is encountering significant challenges in its efforts to mass-produce co-packaged optics (CPO), a next-generation technology increasingly critical for AI-driven data centers. Although the company has invested heavily in photonics integration, its path to large-scale commercialization remains uncertain
Saturday 21 June 2025
What Ren Zhengfei didn’t say—lessons for Taiwan’s tech playbook
In a rare and insightful interview with People's Daily, Huawei founder Ren Zhengfei shared his perspective under the headline "The, Huawei founder Ren Zhengfei shared his perspective under the headline "The More Open a Country Is, the More It Advances."
Saturday 21 June 2025
Beijing sends signal with Huawei: sanctions won’t stop AI ambitions
Just as US and Chinese officials resumed trade negotiations in London, China's state-run People's Daily did something unusual: it ran a rare front-page interview with Huawei's founder, Zhengfei Ren. Although a rather peculiar timing, but not likely a coincidence
Saturday 21 June 2025
Nidec's Takisawa taps China's robot boom with precision tool push
Takisawa Machine Tool, a subsidiary of Japan's Nidec Corp., is leveraging its parent company's extensive sales networks and industrial connections to expand its presence in China's rapidly developing automation and humanoid robotics market. The move is designed to boost sales of Takisawa's high-precision lathes and machining tools in a competitive landscape dominated by both Japanese and Chinese firms
Friday 20 June 2025
China to inject US$19 billion in consumer subsidies as trade-in policy expands
In a continued push to stimulate domestic demand, China is set to release an additional CNY138 billion (approx. US$19 billion) in the second half of 2025 to fund subsidies for its nationwide "old-for-new" consumer trade-in program. The policy covers a wide range of household and consumer electronics, including home appliances, kitchen and bathroom equipment, smartphones, and automobiles
Friday 20 June 2025
South Korea's Dongjin Semichem licenses OLED material patents to Merck and Idemitsu Kosan
South Korea's Dongjin Semichem has licensed its OLED material patents to major companies, including Germany's Merck and Japan's Idemitsu Kosan, highlighting its technological prowess and strong patent portfolio
Friday 20 June 2025
Intel-backed SATAS begins pilot line construction at Sharp's factory in Japan
The Semiconductor Assembly Test Automation and Standardization Research Association (SATAS), spearheaded by Intel Corporation in Japan, announced on June 19, 2025, that it has begun constructing a pilot semiconductor back-end production line at Sharp Corporation's Kameyama facility in Mie Prefecture. In addition to equipment installation, SATAS has initiated environmental preparation work for several buildings within the site
Friday 20 June 2025
NIO spins off chip division, wants slice of Nvidia's AI pie

NIO has launched a new chip design subsidiary — Anhui Shenji Technology — in a strategic move to become a full-stack provider of smart driving technologies. The unit will support NIO's vehicle platforms and expand into supplying chips to external OEMs, while laying the groundwork for future fundraising and strategic investor participation

Friday 20 June 2025
Samsung and SK Hynix reportedly accelerate VCT DRAM development as stepping stone to 3D DRAM
Samsung and SK Hynix are advancing vertical channel transistor (VCT) technology through 4F² DRAM prototypes as a transitional step toward 3D DRAM, while Micron is bypassing VCT entirely to focus directly on true 3D DRAM development, signaling a strategic divergence in next-generation memory architectures
Friday 20 June 2025
Soaring AI electricity demand challenges South Korea's energy policy
The rapid growth of the global generative AI industry has sharply increased electricity demand, straining national power grids and energy security worldwide. South Korea faces particular challenges in maintaining a stable power supply amid rising consumption. President Lee Jae-myung's recent energy policies addressing this issue have drawn significant attention domestically
Friday 20 June 2025
China reportedly races to replace foreign auto chips with domestic tech by 2026
Chinese automakers are moving to align with government directives by planning to mass-produce vehicles equipped exclusively with domestically developed and manufactured automotive chips starting in 2026, as Beijing pushes to reduce its reliance on foreign semiconductor technologies
Research Report Database
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES