DIGITIMES Asia: News and Insight of the Global Supply Chain

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7 days news

Samsung deploys AI across TV lineup to counter Chinese rivals and weather weak demand

Apr 17, 15:57

DISPLAYS

C*Core completes internal testing of RISC-V automotive AI MCU with post-quantum security

Apr 17, 15:54

SEMICONDUCTORS

MLCC, inductor prices climb as AI demand meets cost pressure

Apr 17, 15:49

SEMICONDUCTORS

Samsung's VD division reviews China strategy as local rivals gain ground

Apr 17, 15:41

EAST ASIA

Evalue launches 640kW ultra-fast charger, expanding fast-charging capacity

Samsung accelerates Taylor fab ramp-up amid Tesla AI chip deal

Whetron highlights AI vision and radar safety systems at Taipei AMPA 2026

Memory module maker Apacer beats full-year 2025 profit in first quarter, inventory climbs

Google reportedly in talks with Pentagon over classified use of Gemini AI models

Interview: AI compute startup TBC details biological computing platform linking living neurons and machine learning

Vingroup signs US$6.5 billion India investment framework with Maharashtra

Topoint bond deal signals wider supply risk for global AI hardware makers

Stellantis, Microsoft ink five-year deal to scale AI, cybersecurity

Spanish startup Openchip targets 2028 launch on agentic AI wave

Aurotek launches three AI robots to boost Taiwan's smart automation market

UMC signals 2026 wafer price adjustment amid tightening demand and capacity pressure

OpenAI reportedly to spend over US$20 billion on Cerebras chips, reducing reliance on Nvidia

Foxconn Industrial Internet surpasses Huawei in 2025 revenue, driven by AI servers

China outlines AI-led investment push and industrial upgrading under new five-year plan framework

China wafer maker NSIG lifts revenue on 300mm momentum

TSMC remains top choice for European AI chip startups amid capacity scramble

Sivers and Jabil partner on 1.6T optics to tackle AI power demands

Taiwan's OSAT expansion could tighten global test capacity and raise costs

Apple highlights record progress in recycled materials across products

Intel expands foundry push with Samsung executive hire

Analysis: ASML lifts 2026 guidance on strong EUV demand

ASML extends Low NA EUV to 2031, ramps up High NA production

China automotive AI chipmaker Horizon Robotics targets EV cost cuts with integrated chip

Japan backs Sony image sensor expansion with up to US$380 million subsidy

Tongfu Microelectronics profit jumps on AI chip packaging, AMD demand

BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

MOST-READ

MULTIMEDIA

Post Space-Comm 2026: Insights & Takeaways

According to DIGITIMES, six major AI applications—chatbots, software development, image generation, video generation, enterprise operations automation, and manufacturing process automation—are increasingly being adopted by enterprises. The resulting surge2_s.jpg

Major OSAT providers accelerate 2.5D/3D advanced packaging deployments in US, Japan, South Korea, and Malaysia with non-Taiwan capacity footprint to expand.

Chinese top-3 server exporter, the New H3C, is seeing server export value expand, leveraging two major export routes to target ASEAN and Central Asian markets.