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REALTIME NEWS
Hermes-Epitek eyes CPO test revenue in 2027
Tomorrow's Headlines
9h 21min ago
YMTC wins German injunctions against Micron in patent dispute
Tomorrow's Headlines
9h 22min ago
China-made batteries keep US storage costs low as de-risking raises concerns
Tomorrow's Headlines
9h 22min ago
Alibaba’s Qwen speeds up self-improvement as Qwen4 training begins
Tomorrow's Headlines
9h 22min ago
LG Group and Microsoft deepen AI partnership across data centers and physical AI
Tomorrow's Headlines
9h 22min ago
Sep 22, 17:18
SiPearl delivers first homegrown server chips for Europe's exascale supercomputer
Sep 22, 16:56
Anthropic, OpenAI expected to start buying memory directly in 2027
Sep 22, 16:12
China prepares business delegation as Xi seeks steadier US trade ties
Sep 22, 16:31
Tmytek lists on Taiwan Innovation Board, pushes 5G/6G, satellite, defense
Sep 22, 15:59
Meta's AI agent Muse tops app charts, driving AMD's market cap past US$1 trillion
LATEST STORIES
7 days news
Vivo unveils X500 strategy to bolster premium phone push
Sep 22, 16:49
EAST ASIA
DeepSeek bets on Huawei chips for model training as Nvidia's China sales slip
Sep 22, 14:28
SEMICONDUCTORS
Micron Taiwan union heads for strike vote as board, earnings calendar stall profit-sharing talks
Sep 22, 13:39
SEMICONDUCTORS
Samsung weighs 4nm expansion as HBM4 demand strains capacity
Sep 22, 12:28
SEMICONDUCTORS
TSMC, ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung
Changs Ascending eyes AI data center backup power, storage growth
Hermes Testing sees growth opportunity in AI-driven chip demand as OTC debut expands reach
Taiwan's automakers gear up for year-end sales, as exports emerge as new growth engine
Unitree targets humanoid robots' next bottleneck with 22-DoF Dex5-S hand
Acer debuts first Googlebook with 360-degree hinge
Microsoft opens fourth India cloud region, casting Hyderabad as an AI hub for Asia and the Global South
Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging
Alibaba speeds V900 rollout, targeting 20GW of data centers
NASA adds three SpaceX crew missions as Boeing's Starliner lags
Taiwan virtual asset law to help lower supply chain transaction costs
DEEPX targets smart glasses with low-power NPU, eyes 6G AI RAN
Chinese automakers step up battery in-house push to reclaim cost control
Xiaomi open-sources MiMo-V2.6, publishes the bill for scaling reinforcement learning
Alibaba expands full-stack AI push as cloud data centers target 20 GW by 2032
BOE looks beyond displays with glass substrates for AI packaging
Escalating risks, evolving safeguards: a chronological look at OpenAI's safety strategy
Chinese AMOLED material suppliers set for revenue gains as Gen 8 fabs boost localization
Googlebook opens preorders at US$899 for AI laptops
India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout
Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries
MediaTek unveils Dimensity CX C10 Max for premium Googlebook devices
Meta's rumored Luna smart glasses may go camera-free for lighter design
Taiwan advances major science park expansion to support AI, semiconductor growth
Apple's reported AI server push could reshape its role in enterprise infrastructure
Brussels will put a public efficiency grade on Europe's data centers before it decides what to require of them
More news
BIZ FOCUS
Sep 22, 08:00
Macronix Secure Memories Build Hardware Defenses for EU CRA
Tuesday 22 September 2026
AI Drones Advance Industrial Inspection, Suntek Unlocks New Market Opportunities
Tuesday 22 September 2026
AT&S Unveils Strategy to Drive AI Growth
Tuesday 22 September 2026
GUC Announces 2nm 16 Gbps HBM4E IP
MOST-READ
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
Winstar's AI push gains momentum with some orders extending into 2027
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
CIOE 2026
The 27th China International Optoelectronic Exposition (CIOE 2026) took place September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions.
As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
AR glasses target 2 billion myopia users as China supply chain eyes doubling shipments
Sivers Semiconductors positions laser arrays as solution to copper's limits
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
China carmakers lean on exports as domestic sales stall
Tuesday 22 September 2026
Taiwan's automakers gear up for year-end sales, as exports emerge as new growth engine
Tuesday 22 September 2026
Chinese automakers step up battery in-house push to reclaim cost control
Tuesday 22 September 2026
TECH
Tuesday 22 September 2026
China's memory race turns inward — CXMT, YMTC head toward patent showdown
Global chipmakers answer India's pitch with equipment, materials, and R&D — not fabs
Friday 18 September 2026
Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV
Thursday 17 September 2026
Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027
Wednesday 16 September 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries
Tuesday 22 September 2026
China prepares business delegation as Xi seeks steadier US trade ties
Tuesday 22 September 2026
Micron Taiwan union heads for strike vote as board, earnings calendar stall profit-sharing talks
Tuesday 22 September 2026
OPINIONS
Tuesday 22 September 2026
Analysis: Will AI glasses replace the iPhone? —Cook and Ternus see it differently
DIGITIMES Insight: Full-color Micro LED set to exceed 30% of AR glasses shipments in 2027
Tuesday 22 September 2026
Column: AI usage patterns may be shifting the case for self-hosted servers
Monday 21 September 2026
DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
Monday 21 September 2026
TOPICS
TSMC UPDATES
GEOWATCH
HUAWEI
TRENDS IN INDUSTRIAL COMPUTING
SPECIAL REPORTS
Thursday 17 September 2026
Physical AI drives autonomous driving upgrade; three efficiency factors lift AI accelerator demand
End-to-end autonomous driving has become the mainstream technology path, and the inference demand created by Physical AI in autonomous driving systems is, in turn, reshaping automotive system-on-chip (SoC) design.
Wednesday 16 September 2026
Global top-3 memory maker status, 3Q 2026: AI servers drive record memory revenue; SSD, LPDDR upgrades ahead
DIGITIMES observes that major memory suppliers posted record-high revenue in the second quarter of 2026, with yearover-year growth remaining in the triple digits. Driven by AI demand, SSDs and LPDDR are emerging as key competitive
battlegrounds.
Tuesday 15 September 2026
AI demand reshapes capital allocation and operating models in telecom sector
Although the global 5G mobile communications market is still growing in 2025, higher 5G user penetration has not necessarily translated into equivalent revenue growth for telecom operators, while annual growth in mobile data traffic has continued to slow.
Monday 14 September 2026
Notebook shipment update, July 2026
DIGITIMES' survey of July 2026 notebook shipments (excluding detachable models) from the world's top five notebook brands (excluding Apple) and the top three notebook ODMs
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