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REALTIME NEWS
South Korea updates AI safeguards as Microsoft sets shutdown rules
ICT
10min ago
BYD's 2027 triple play could rewrite the EV race
Electric Vehicles
17min ago
China optical transceivers avoid US FCC curbs as NPO, CPO battle for high-speed interconnect supremacy
Communications
19min ago
Sep 15, 15:53
Micron's record Taiwan rewards package fails to defuse union dispute over 15% profit sharing
Sep 15, 15:43
Beyond H100: China's GPU makers chase scale, not just parity
Sep 15, 15:27
DIGITIMES Insight: AI sends the semiconductor market toward US$1.6T, with memory doing the heavy lifting
Sep 15, 14:55
China elevates HBM and HBF in five-year plan, opening a new front in AI memory
Sep 15, 11:30
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
LATEST STORIES
7 days news
China optical transceivers avoid US FCC curbs as NPO, CPO battle for high-speed interconnect supremacy
Sep 15, 16:00
COMMUNICATIONS
China's humanoid robot race, Part 1: Mass production outruns proven demand
Sep 15, 15:16
EAST ASIA
Minebea Mitsumi pauses M&A to chase AI hardware demand
Sep 15, 15:16
ICT
Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM
Sep 15, 14:45
SEMICONDUCTORS
BIS blocks Polestar authorization, forcing new vehicles out of US market from 2027
Global semiconductor revenue hits record US$425B in 2Q26
Samsung, SK Hynix diverge on cell design for sub-10nm DRAM in 2028
GlobalWafers partially resumes Italy plant, restarts EPI production
China's space-computing race moves beyond single satellites: Shanghai's gigawatt-scale AI ambition lands in orbit
OEM/EMS AI servers: August revenue trends, operational outlook
US FCC, White House tighten controls on power systems, raising the trust bar for Taiwanese suppliers
Sivers Semiconductors positions laser arrays as solution to copper's limits
AI server tracker: CCL makers outpace PCB and substrate suppliers as server demand grows
Taiwan's Ministry of Economic Affairs shares power grid experience at APEC Energy Ministerial Meeting
China's EV boom enters a phase of overcapacity cleanup
HS Hyosung joint venture to invest KRW1.2 trillion in Ulsan silicon anode plant
Samsung Display deepens ties with Vivo's iQOO through dedicated OLED line
AI's next bottleneck may be profitability, not compute, SK chair warns
Inside CIOE: takeaways from China's biggest optoelectronics show
OpenAI reportedly acquires AI camera startup Glass Imaging for more than US$300M
2nm capacity crunch may keep smartphone SoC makers on split-node strategy through 2027
Trump calls AI slowdown a conspiracy that helps China, closing off Washington support
Column: When digital trust breaks — quantum risk rewrites supply chain resilience
Panasonic Energy eyes JPY1 trillion yen AI storage revenue by 2028
Tesla sets up Vietnam unit as VinFast dominates
Chinese tech firms deepen open source push amid AI pacing debate
Ainos pushes AI Nose into semiconductor front-end manufacturing
Taiwan's Ministry of Economic Affairs builds flagship Taiwan pavilions at international expos to boost auto parts exports
Chinese chip tools reach 35% of equipment installed at local fabs
South Korean firms hold 80% of the automotive OLED market
More news
BIZ FOCUS
Sep 14, 08:00
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
Friday 11 September 2026
DAS Expands in Taiwan and Unveils World First at SEMICON
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
MOST-READ
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
SK keyfoundry expands 8-inch capacity as China demand strains supply
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
Winstar's AI push gains momentum with some orders extending into 2027
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
CIOE 2026
The 27th China International Optoelectronic Exposition (CIOE 2026) took place September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions.
Inside CIOE: takeaways from China's biggest optoelectronics show
Commentary: CIOE 2026 reveals the harder race behind AI optical interconnects
China optical firms target photonics with mixed high-end, lower-cost push
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Gogoro sees turnaround ahead of schedule as Vietnam rollout gathers pace
Monday 14 September 2026
Blokcert launches Gefjon AI to help Taiwan charging operators improve profitability as EV demand rebounds
Monday 14 September 2026
Hiroca revenue jumps 35% as auto summer slowdown fades
Monday 14 September 2026
TECH
Monday 14 September 2026
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
Micron pays Taiwan fab workers up to 68 months' salary in memory upturn
Friday 11 September 2026
Qualcomm's AWS deal raises stakes for MediaTek and Alchip
Thursday 10 September 2026
Kioxia rules out deeper SK Hynix ties, resists further NAND price hikes
Wednesday 9 September 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
DIGITIMES Insight: China's GaN challengers are no longer playing catch-up
Monday 14 September 2026
Fujitsu's Monaka targets 2027 mass production with TSMC 2nm boost
Monday 14 September 2026
Samsung, SK Hynix reject US$19 billion power prepayment as Korea speeds chip expansion
Monday 14 September 2026
OPINIONS
Monday 14 September 2026
DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker
DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
Monday 14 September 2026
Analysis: China chases EUV as chipmakers move to High-NA
Thursday 10 September 2026
Commentary: Huawei's Kirin comeback, Xiaomi's Xring entry widen China's chipmaking race
Wednesday 9 September 2026
TOPICS
CIOE 2026
5G
TSMC UPDATES
HUAWEI
SPECIAL REPORTS
Tuesday 15 September 2026
AI demand reshapes capital allocation and operating models in telecom sector
Although the global 5G mobile communications market is still growing in 2025, higher 5G user penetration has not necessarily translated into equivalent revenue growth for telecom operators, while annual growth in mobile data traffic has continued to slow.
Monday 14 September 2026
Notebook shipment update, July 2026
DIGITIMES' survey of July 2026 notebook shipments (excluding detachable models) from the world's top five notebook brands (excluding Apple) and the top three notebook ODMs
Thursday 10 September 2026
From cHBM to 3D Stacked SRAM, AI inference drives AI accelerators toward memory architecture innovation
DIGITIMES identifies three main directions for memory development in cloud AI accelerators: processing near memory, 3D Stacked SRAM, and high-bandwidth flash.
Wednesday 2 September 2026
Global smartphone industry, 2Q 2026
According to DIGITIMES, smartphone memory contract prices surged by 50% to 80% in the first half of 2026, prompting most vendors to continue cutting shipments of mid- and low-end models and to raise product prices.
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