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CONNECT WITH US
Sep 5, 07:56
TSMC's 3D packaging roadmap: engineering AI chips to think like the human brain
Sep 5, 07:53
Micron looks to lock in Taiwanese construction capacity with long-term deals
Sep 5, 07:58
Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics
Sep 5, 07:57
Taiwan semiconductor output targets NT$8 trillion
Sep 5, 07:53
Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC
LATEST STORIES
7 days news
Exclusive: South Korea's safety AI boom is being built from the top down, BEXCO says
Sep 5, 08:03
EAST ASIA
Samsung, SK chiefs to meet Nvidia's Huang in New York amid US investment pressure
Sep 5, 08:03
EAST ASIA
Interview: Agility Robotics CTO discusses the future of collaborative humanoid robotics
Sep 5, 07:55
INTERVIEWS
NYCU wins Nobel laureate for Taiwan job card
Sep 5, 08:00
SEMICONDUCTORS
Topco targets optical comms, cooling as copper gives way
Interview: China Tier 1 supplier Jingwei Hirain shares lessons from EV race
Exclusive: Taiwan's first tokamak to begin plasma testing by end of 2026
Samsung SDI nears solid-state battery mass production, eyes China supply chain
SiPh, optical lens demand ignite laser race
Google TPU splits training, inference as CPU becomes next focus
Taiwan auto parts makers face exit-or-overseas dilemma
Jmem Tek's PQC security chip nears mass production
Taiwan satellite ground equipment output grows 13%, nears NT$300B
Marketech profits hit record in 1H26 on overseas orders
Adata expands AI business with TRUSTA, Industrial brands
Cisco targets zero engineers writing code by end-October
CPO testing shifts to mid-stage to avoid costly failures, Chroma says
TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives
From chips to physical AI: Experts urge Taiwan-US push for trusted drone supply chains at Semicon Taiwan 2026
The 'Copper Wall': inside the physical bottlenecks threatening to melt AI supercomputing boom
How agentic AI and 'AI physics' are reshaping chip design
South Korea taps chip windfall for next tech push
Samsung turns to chips, OLED for next phase of Vietnam expansion
MSScorps August revenue hits new high on silicon photonics gains
Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp
SEMICON Taiwan 2026: QuantumDiamonds cracks the hybrid bonding blind spot with new inline metrology
G20 approves guidelines calling for more business-friendly AI regulation
Chunghwa Precision Test sees ASIC revenue overtaking GPU by 2027
Lite-On makes US$170 million strategic investment in DCX for AI cooling push
More news
BIZ FOCUS
Sep 2, 08:22
World Diamond Technology accelerates mass production of 300 mm diamond wafers
Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
Wednesday 2 September 2026
Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains
MOST-READ
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
Interview: Nvidia exec on progress of CPO production and pluggable optics
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Nvidia Feynman pushes TSMC A16 and CPO ramp
Update: ABF substrate maker Unimicron searched in origin-labeling probe
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
The end of the Tim Cook era at Apple
After a 15-year tenure, Apple CEO Tim Cook is stepping down on September 1, 2026, and handing the reins to hardware veteran John Ternus.
Tim Cook concludes 15-year Apple tenure, John Ternus takes over
Apple reshuffles leadership, shifts Schiller out of App Store
John Ternus takes over an Apple with one growth engine, no obvious second
...More
EV
Wednesday 2 September 2026
China moves to curb overseas price wars as automakers accelerate global expansion
Analysis: Physical AI upgrades autonomous driving and lifts Taiwan supply chains
Friday 4 September 2026
Xiaomi Auto maps 2027 Europe entry with German dealer network and four-country vehicle testing
Friday 4 September 2026
Acer broadens lineup with e-paper displays and scooters, ahead of PC industry headwinds
Friday 4 September 2026
TECH
Friday 4 September 2026
TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
Chinese court freezes US$318M in Nexperia assets, further escalating corp rift
Tuesday 1 September 2026
The architect of Apple's China machine also built its hardest problem
Monday 31 August 2026
Apple is only the test: Chinese memory makers CXMT, YMTC target North American cloud market
Wednesday 26 August 2026
ASIA
Thursday 3 September 2026
CXMT's 'Hefei Project' exposed in Samsung DRAM theft case
China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls
Friday 4 September 2026
Samsung turns to chips, OLED for next phase of Vietnam expansion
Friday 4 September 2026
Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
Friday 4 September 2026
OPINIONS
Tuesday 1 September 2026
Commentary: Why America fell behind on Open models — and how Nvidia plans to close the gap
Commentary: DeepSeek out, SMIC in? TIME100 AI maps China's widening AI battleground
Tuesday 1 September 2026
Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
Tuesday 1 September 2026
Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
Tuesday 1 September 2026
TOPICS
THE END OF THE TIM COOK ERA AT APPLE
TSMC UPDATES
5G
GEOWATCH
SPECIAL REPORTS
Wednesday 2 September 2026
Global smartphone industry, 2Q 2026
According to DIGITIMES, smartphone memory contract prices surged by 50% to 80% in the first half of 2026, prompting most vendors to continue cutting shipments of mid- and low-end models and to raise product prices.
Friday 28 August 2026
AI data center 800VDC power architecture takes shape; future hurdles require balancing multiple key factors
DIGITIMES believes that 2026 will be a pivotal year in the stabilization of 800VDC power architectures for AI data centers.
Wednesday 26 August 2026
Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components
DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued to rise.
Tuesday 25 August 2026
Chinese automakers expand to humanoid robotics with technology, supply chain and scenario advantages
DIGITIMES observes that the humanoid robot market is expanding rapidly, supported by global labor shortages and advances in artificial intelligence (AI), and Chinese automakers are also moving aggressively into this emerging field.
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