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REALTIME NEWS
KYEC signs advanced payment deal with Nvidia for US testing expansion
Semiconductors
1min ago
Samsung integrates AI into daily life as LG showcases smart factories, data-center cooling
ICT
9min ago
Shanghai HiSilicon expands DDI push across all display sizes
Tomorrow's Headlines
Oct 13, 18:14
Applied Materials CEO outlines a trio of innovation priorities for AI chip race
Tomorrow's Headlines
Oct 13, 18:13
AI accelerator growth shifts toward value, not volume
Tomorrow's Headlines
Oct 13, 18:13
Oct 14, 09:05
SEMICON West makes three-year commitment to Phoenix, home to over US$200B in chip investment
Oct 14, 09:01
China's AI chipmakers target 3D packaging, optical interconnects and software ecosystems
Oct 14, 08:58
Applied Materials lifts 2030 margin goals, but a missing industry forecast sends a disappointing signal
Oct 14, 08:56
Analysis: China's EV rebate cut pushes exporters from volume to value
Oct 14, 09:09
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
LATEST STORIES
7 days news
AP Memory completes US$415.5M GDR offering, boosts three product lines
Oct 14, 09:16
SEMICONDUCTORS
Chinese automakers face three hidden barriers in European expansion
Oct 14, 09:16
ELECTRIC VEHICLES
Apple's new home devices tie Siri AI to subscriptions and newer iPhones
Oct 14, 09:15
ICT
LGES diversifies ESS equipment suppliers after Daejin Machinery default, court rehabilitation
Oct 14, 09:14
ICT
Samsung integrates AI into daily life as LG showcases smart factories, data-center cooling
China’s NEV export rebate cut puts budget EV makers under margin pressure
Apple launches HomeView display, rebuilding home lineup around Siri AI
MiTAC spotlights liquid cooling, open platforms for AI infrastructure
Geely enters Canada, plans first vehicles for 2027
TCC wins approval for Europe listing plan
Pegatron showcases rack-scale AI infrastructure at OCP Global Summit
GlobalFoundries revives 7nm-class ambitions with an EUV-free FD-SOI bet on physical AI
Foxconn unveils Vera Rubin AI racks, liquid-cooling systems at OCP Summit
NTT Data, Anthropic negotiate Japan data center with up to 500MW
Apple COO visits Foxconn as iPhone Duo production ramps up
TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM
Former Intel CEO Pat Gelsinger sees hardware renaissance in memory, optical interconnects
Shield AI delivers first V-BAT drone to Taiwan Coast Guard
Starlink moves from satellite overlay to mobile challenger as SpaceX builds hybrid network
AI memory boom pushes smartphone market into premium-first reset
PMIC vendors diverge as PC exposure drives revenue gap
Huawei accelerates ASEAN data center hardware supply as Kunpeng chip exports surge
Smartphone costs surge as brands take divergent action
Taiwan FPCB maker CMI targets flat 2026 revenue despite memory, CPU shortages hitting notebook demand
Linde LienHwa links HaaS ecosystem to drive industrial decarbonization
Y.S. Tech reports liquid-cooling orders secured through early 2028
India's Tessolve raises US$75 million from Vector Line Capital to fund chip-services acquisitions
Amazon's Decart talks point to a broader push from custom silicon to world models
China's wafer-scale graphene breakthrough brings quantum rectifiers closer to semiconductor integration
Engineering salaries deepen Taiwan's doctoral talent shortage
More news
BIZ FOCUS
Oct 13, 16:08
Chenbro unveils AI rack-level solutions at 2026 OCP Summit
Thursday 8 October 2026
Dietary Therapy in Traditional Chinese Medicine and Modern Nutritional Science
Thursday 8 October 2026
Edge-Cloud Computing Blocks Scams Before the Click
Thursday 8 October 2026
Nuvoton, AMI Empower AI Factories Via Arbel NPCM8XX OpenBMC
MOST-READ
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
TSMC locks in 3-6% wafer out price hikes for 2027
Musk's Memphis move puts xAI at the center of his empire
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
TSMC, Intel, and Musk's Terafab
As Elon Musk's Terafab ambitions advance, the realities of modern silicon manufacturing become increasingly apparent.
Analysis: Musk keeps Terafab in-house, shifting execution risk onto his own companies
Musk limits TSMC to possible Terafab sublease; Intel says it will stay involved
TSMC Texas-Terafab buzz drives Taiwan contractors to move fast
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Huawei car brands face trust test: Maextro brakes draw scrutiny, AITO's Europe bid uncertain
Tuesday 13 October 2026
Stellantis rejects brand split, urges EU to reward local carmaking
Tuesday 13 October 2026
SmartSens targets automotive CIS, robot vision growth with US$478M funding
Tuesday 13 October 2026
TECH
Tuesday 13 October 2026
AI Server tracker: Taiwan's AI server chain grew 55% in September, but the growth narrowed to fewer suppliers
TSMC, ASML eye 12-inch photomasks to unlock High-NA EUV's full-field potential
Monday 12 October 2026
Exclusive: Chinese notebook ODMs win HP, Dell orders, pressuring Taiwanese suppliers
Wednesday 7 October 2026
Qualcomm says Huawei patent deal not tied to LogicFolding, rejects net-payer claims
Tuesday 6 October 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
Hua Hong deepens China chip equipment partnerships, targets stronger specialty foundry share by 2030
Tuesday 13 October 2026
SK Hynix unveils low-power processor design for SSDs
Tuesday 13 October 2026
Samsung's US$9B chip expansion faces funding, supply hurdles
Tuesday 13 October 2026
OPINIONS
Tuesday 13 October 2026
Column: From 3D NAND to 3D DRAM — how vertical stacking is reshaping memory chip manufacturing
Podcast highlights: Is Elon Musk using TSMC talks as leverage against Intel and Samsung?
Tuesday 13 October 2026
Analysis: Musk keeps Terafab in-house, shifting execution risk onto his own companies
Thursday 8 October 2026
DIGITIMES Insight: HBM expansion raises the bar for memory offload
Wednesday 7 October 2026
TOPICS
TSMC, INTEL, AND MUSK'S TERAFAB
LG ENERGY SOLUTION
TSMC UPDATES
HUAWEI
SPECIAL REPORTS
Monday 12 October 2026
Chinese government and industry make full push into AI glasses development: AR display integration and lightweighting gain traction
DIGITIMES notes that China continued to advance smart glasses policies from the central government to local governments in 2026, driving both enterprise production and consumer purchase subsidies.
Friday 2 October 2026
Global annual AI server shipments, 2025-2026
Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds, and leading AI labs to accelerate AI data center buildouts in 2026.
Thursday 1 October 2026
SiC substrate market shows signs of recovery, driven by demand from vehicles, energy and AI infrastructure
DIGITIMES has observed that since Tesla equipped the Model 3 with a traction inverter integrated with SiC power modules in 2018, the application of SiC power devices in the electric vehicle (EV) sector has gradually expanded, prompting suppliers to aggres 8_s.jpg
Thursday 17 September 2026
Physical AI drives autonomous driving upgrade; three efficiency factors lift AI accelerator demand
End-to-end autonomous driving has become the mainstream technology path, and the inference demand created by Physical AI in autonomous driving systems is, in turn, reshaping automotive system-on-chip (SoC) design.
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