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Oct 22, 10:51
Exclusive: Apple raises iPhone Duo shipment target 44% on strong preorders
Oct 22, 11:26
Analysis: Why Tesla needs to manufacture Optimus robots before its humanoid AI is ready
Oct 22, 11:53
Inside Nvidia DSX POD: How a factory-built AI data center could go live in 14 days
Oct 22, 11:22
Intel begins Arizona Fab 62 equipment installation, advances Ohio project as AI CPU demand surges
Oct 22, 10:35
Charts: China's smartphone market bounces back from summer lows on new launches
LATEST STORIES
7 days news
Tesla's Megapack boom meets AI power crunch, but margin gains raise questions
Oct 22, 14:20
SUSTAINABILITY
Texas Instruments posts rising Q3 sales across data centers, cars, industry
Oct 22, 13:59
SEMICONDUCTORS
Samsung reportedly overhauls DRAM, NAND R&D incentives to retain talent and accelerate next-gen memory chips
Oct 22, 13:55
SEMICONDUCTORS
Taiwan's Aero Win expands role in next-gen engine programs amid global aircraft backlog
Oct 22, 13:53
AEROSPACE
China's L3 autonomous driving adoption tipped to top 35% by 2030, raising stakes for automakers
Samsung DX division postpones meeting amid bonus tensions
Tesla's Robotaxi test enters harder phase: turning autonomous miles into transport business
Lam Research builds India supplier base to capitalize on Semicon 2.0 localization push
Sibelco to build quartz plant in North Carolina, extending US chip onshoring to raw materials
Unimicron warns of double-booking risks as AI PCB capacity race strains supply chains
Charts: Nvidia's China AI chip lead shrinks 80% as Huawei closes in
Nvidia's AI factory strategy points to a broader shift in computing, industry
Nvidia lines up six suppliers to expand substrate, packaging, and testing capacity
Micron skips 4F² for 3D DRAM as CXMT pushes ahead
China's IC designers expand into AI server memory interconnects beyond DDR5
Jio's record IPO tests global appetite for India's homegrown telecom stack
Why Terafab approached South Korean suppliers first
OpenAI acquires Orchestra Bio to advance AI drug development
Unitree showcases H2-X as China's humanoid robot output tops 100,000
Japan sets execution plan for 17 growth strategies
BOS, LG, and HANA Micron team up on Korean automotive chiplets
Racing Electric Instrument expands across drone systems
Amazon backs 960MW nuclear project for AI power
Amazon spends US$220B on AI as power delays squeeze cash flow
Amazon to invest over EUR160B in Germany for AI, cloud and logistics
Apple, Google push PCB supply chain toward net zero amid challenges
Hyundai rethinks AAM strategy as Tesla Roadster sparks flying-car buzz
Meta says compute, not demand, now limits Muse; pushes shared standard for AI shopping agents
SDC supplies over 70% of major laptop brands' OLED panels
iPhone Duo preorders surge, but sales momentum remains uncertain
More news
BIZ FOCUS
Oct 22, 08:00
HOYA BIT Explores AI Data Analysis Solutions for Smarter Trading
Wednesday 21 October 2026
Starting with Data Challenges: TS Holdings Explores AI Through Hackathon
Tuesday 20 October 2026
CES 2027 Welcomes First-Ever Chilean Global Pavilion
Tuesday 20 October 2026
Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency
MOST-READ
TSMC locks in 3-6% wafer out price hikes for 2027
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Samsung HBM4E wins NVIDIA nod for AI accelerator push
Musk limits TSMC to possible Terafab sublease; Intel says it will stay involved
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
4F2 DRAM development
Memory leaders are making progress with the next-generation 4F2 DRAM designs, a part of the industry's move toward vertically stacked 3D architectures to increase performance.
Micron skips 4F² for 3D DRAM as CXMT pushes ahead
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
AI dividend drives Taiwan's memory makers from trough to transformation
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Huawei-linked Yinwang gives CATL battery swapping a wider route into smart vehicles
Wednesday 21 October 2026
CATL's profit growth slows, sharpening focus on 50% energy-storage revenue target
Wednesday 21 October 2026
Foxconn and Mitsubishi Electric target SDV with L4 autonomy and EV drive systems
Wednesday 21 October 2026
TECH
Wednesday 21 October 2026
Analysis: From rockets to fabs, SpaceX's TeraFab bet pushes vertical integration into the semiconductor era
Exclusive: Apple's MacBook Neo pressures Microsoft to cut specs for low-cost 12-inch Surface
Tuesday 20 October 2026
AUO, Largan Micro LED debate highlights optical communications uncertainty
Monday 19 October 2026
Charts: YMTC bets on premium eSSDs to take on Samsung
Friday 16 October 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
US sanctions five Chinese entities over trade secret theft tied to ex-Google engineer
Wednesday 21 October 2026
Li Auto chip subsidiary Mahe Xin raises CNY1.6 billion in equity financing as automakers aim to become chipmakers
Wednesday 21 October 2026
China launches state-owned data group as market-facing arm of its AI infrastructure push
Wednesday 21 October 2026
OPINIONS
Wednesday 21 October 2026
DIGITIMES Insights: AI server PCB upgrades drive explosive demand for advanced backdrilling equipment
Analysis: China's proposed AI export controls reach beyond chips to design IP, computing infrastructure
Tuesday 20 October 2026
Analysis: China's proposed AI export controls target top-ranked foundation models, advanced agents
Tuesday 20 October 2026
DIGITIMES Insight: AI packaging power reaches kilowatt scale as thermal design moves toward the die
Tuesday 20 October 2026
TOPICS
4F2 DRAM DEVELOPMENT
TSMC 3Q26 EARNINGS CALL
TSMC UPDATES
5G
SPECIAL REPORTS
Wednesday 21 October 2026
iPhone Duo finally debuts, but with price increases across models, Apple's 4Q26 shipments will take hit
DIGITIMES says the most closely watched model in Apple's high-end iPhone 18 lineup, launched in September 2026, is the long-anticipated first foldable smartphone, the iPhone Duo.
Monday 19 October 2026
Shipments of high-end cloud AI accelerators, 2027
DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.
Monday 12 October 2026
Chinese government and industry make full push into AI glasses development: AR display integration and lightweighting gain traction
DIGITIMES notes that China continued to advance smart glasses policies from the central government to local governments in 2026, driving both enterprise production and consumer purchase subsidies.
Friday 2 October 2026
Global annual AI server shipments, 2025-2026
Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds, and leading AI labs to accelerate AI data center buildouts in 2026.
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