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7 days news

TSMC suppliers reportedly plan Taiwan plant for critical chipmaking tubing

Aug 25, 11:45

SEMICONDUCTORS

AI's power crunch hits Taiwan: foundry capacity tightens, chip prices climb into 2H26

Aug 25, 11:35

SEMICONDUCTORS

China opens satellite IoT to private players as Geespace wins two-year commercial trial

Aug 25, 10:49

EAST ASIA

Samsung, SK Hynix step up China NAND upgrades as US tool risks grow

Aug 25, 10:21

SEMICONDUCTORS

AI boom drives Foxconn past 40% of Taiwan-listed firms' China returns, with FII leading the way

Kulicke and Soffa names Raj Talluri as CEO

Energy law amendments lift AIDC storage demand in Taiwan

Kaynes Technology and BOSGAME sign MoU to expand India market presence

OmniVision's CIS business slips, but machine vision and robotics surge 71%

Foxconn scales AI server production in US and Mexico, keeps Asia expansion diversified

Samsung SDI cashes out Samsung Display stake to fund battery expansion

OpenAI narrows gap as Anthropic's Fable 5 loses enterprise momentum

Russia's reusable Amur SPG rocket slips to 2031

Novosense encoder launch highlights China's push into robot joint sensing

AI infrastructure boom drives Taiwan export orders, exposing power bottleneck, net-zero tech needs

Toyota and Honda's US manufacturing push could reshape market share, not just tariffs

Tactical drone market reshapes as startups and incumbents compete

China launches record auto recall over electronic door safety

Infineon buys India-based C2i Semiconductors to bolster AI data center power systems

Taipower pushes 'information flow' strategy to ease northern Taiwan's AI data center power crunch

Nvidia Groq 3 LPX enters full production for faster agentic AI inference

SpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale

IBM unveils dual-architecture mainframe chip to run Arm, z/OS, Linux workloads

Broadcom's debt push signals AI compute is becoming Wall Street asset class

AIDC eyes 2H26 lift from drones, jets

Zhongji Innolight's 1.6T surge shows AI networking is becoming next hyperscaler bottleneck

SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip

Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026

Samsung Display resumes A7 construction as foldable demand rebounds

Inergy server share hits 47% on cooling, BBU demand

More news

BIZ FOCUS

Aug 25, 08:00

Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise

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MULTIMEDIA

Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman

DIGITIMES has observed that Siri AI is built around four core layers - devices, models, reasoning, and applications - and is designed to transform Siri from a voice assistant into an AI agent capable of executing tasks.

In the second quarter of 2026, global server shipments were below prior expectations, growing 3.8% quarter-over-quarter. The main reason was tight supply of key components such as memory, CPU, and IC substrate, which curbed overall system shipment momentu

DIGITIMES notes that BYD Semiconductor's portfolio has expanded from the IGBTs and SiC power chips developed to meet early electric vehicle (EV) demand into high-computing-power smart-driving SoCs.