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CONNECT WITH US
Oct 25, 08:42
Texas Instruments sees up to $1,000 in chip content per humanoid robot as analog supply tightens
Oct 25, 08:40
Interview: The story of LEACHIM, a working humanoid robot from the 1970s
Oct 25, 08:44
Chinese automakers capture record 14.6% Europe market share as looming hybrid import curbs spur shipments
Oct 25, 08:41
Tesla-SpaceX merger tests whether Musk's technology empire is worth more together
Oct 25, 08:42
Column: Will general-purpose models overtake Physical AI?
LATEST STORIES
7 days news
Nvidia unveils OOI CPO prototype for post-2028 AI needs
Oct 25, 08:45
SEMICONDUCTORS
Namuga expands beyond Samsung with humanoid robot camera modules
Oct 25, 08:44
ICT
AI data centers drive Taiwan's electrical firms into modular, EPC markets
Oct 25, 08:43
ICT
Meta’s AI commitments surge to US$825 billion, testing financing power
Oct 25, 08:43
ICT
Magnate Technology sees aerospace, semiconductor growth opportunities
Moonshot's Singapore hiring shows how China's open-model labs plan to get paid abroad
China clears DeepSeek, MiniMax for overseas AI deployment
Nvidia rejects near-term memory glut fears, leaves CXMT cooperation open
SpaceX's 80,000-site push turns Starlink from satellite overlay into full mobile challenger
Bosch to spin off automotive business as Asian rivals intensify pressure
AIDC launches Taiwan's largest industrial microgrid with 9MW/54MWh energy storage capacity
LGES Poland plant nears breakeven as utilization rebounds
Doosan Robotics targets automakers, chipmakers as Chinese rivals cut prices
Taiwan's inaugural semiconductor strike pauses as nearly 70% of Micron Taoyuan Union rejects new bonus offer
Semco's 61-week MLCC lead times give suppliers upper hand in AI supply chain
Lenovo mounts AI comeback with Nvidia Vera Rubin NVL72 deliveries and US plant expansion
Chinese luxury carmakers face barriers in Europe's premium market
Japan targets 2nm medical AI chip with IBM design, Rapidus eyed for foundry
Nvidia B300 chips reportedly surface on China Telecom-linked network, raising export-control questions
First chip-level device on the list: US FCC bans two devices with Huawei HiSilicon chips under new rule
Samsung reportedly orders final tools for first Taylor fab as Texas site nears 2nm output cap
Taiwan's top telecom spins off AI surveillance unit, plans global push with local hardware makers
Apple reportedly taps BOE for LCD iMac development, keeps OLED timetable in question
TSMC advances CoPoS packaging at Taoyuan Longtan site
Rapidus courts US AI customers ahead of planned 2H27 2nm mass production
Commentary: How long can the humanoid robot bubble last? Unitree's valuation correction puts physical AI to the test
Chinese phone brands beat Samsung, Apple to high-refresh OLED
FCC grants Intel a waiver to foreign robot ban to prevent chip disruptions
China's weak car market squeezes automakers, suppliers and dealers
Analysis: Nvidia's Vera CPU takes on Intel and AMD with a platform play
More news
BIZ FOCUS
Oct 23, 08:00
AI Wealth Management: MaiCoin Leverages Startup Energy for Next-Gen Fintech
Thursday 22 October 2026
HOYA BIT Explores AI Data Analysis Solutions for Smarter Trading
Wednesday 21 October 2026
Starting with Data Challenges: TS Holdings Explores AI Through Hackathon
Tuesday 20 October 2026
Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency
MOST-READ
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Samsung HBM4E wins NVIDIA nod for AI accelerator push
Musk limits TSMC to possible Terafab sublease; Intel says it will stay involved
AMD's Lisa Su back in Taiwan as AI capacity crunch spreads beyond TSMC
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
4F2 DRAM development
Memory leaders are making progress with the next-generation 4F2 DRAM designs, a part of the industry's move toward vertically stacked 3D architectures to increase performance.
Micron skips 4F² for 3D DRAM as CXMT pushes ahead
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
AI dividend drives Taiwan's memory makers from trough to transformation
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Analysis: Can Tesla's thruster-equipped Roadster hit public roads? US, China, EU regulations pose hurdles
Friday 23 October 2026
Chinese luxury carmakers face barriers in Europe's premium market
Friday 23 October 2026
China's weak car market squeezes automakers, suppliers and dealers
Friday 23 October 2026
TECH
Friday 23 October 2026
Why is TSMC suddenly looking at Texas?
Exclusive: Apple raises iPhone Duo shipment target 44% on strong preorders
Thursday 22 October 2026
Analysis: From rockets to fabs, SpaceX's TeraFab bet pushes vertical integration into the semiconductor era
Wednesday 21 October 2026
Exclusive: Apple's MacBook Neo pressures Microsoft to cut specs for low-cost 12-inch Surface
Tuesday 20 October 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
TSMC reportedly surveys suppliers on rare-earth-free motors as China's export-control pause nears legal expiry
Friday 23 October 2026
First chip-level device on the list: US FCC bans two devices with Huawei HiSilicon chips under new rule
Friday 23 October 2026
Mounting R&D and memory costs push Huawei to borrow US$2.3B from six Chinese banks
Friday 23 October 2026
OPINIONS
Friday 23 October 2026
Interview: TI sees liquid cooling shift to tray-level control in AI data centers
Commentary: How long can the humanoid robot bubble last? Unitree's valuation correction puts physical AI to the test
Friday 23 October 2026
Analysis: Nvidia's Vera CPU takes on Intel and AMD with a platform play
Friday 23 October 2026
DIGITIMES Insight: BCI grasping reaches market; implant stability and chip heat keep advanced uses beyond 2030
Friday 23 October 2026
TOPICS
4F2 DRAM DEVELOPMENT
TRENDS IN INDUSTRIAL COMPUTING
LG ENERGY SOLUTION
HUAWEI
SPECIAL REPORTS
Wednesday 21 October 2026
iPhone Duo finally debuts, but with price increases across models, Apple's 4Q26 shipments will take hit
DIGITIMES says the most closely watched model in Apple's high-end iPhone 18 lineup, launched in September 2026, is the long-anticipated first foldable smartphone, the iPhone Duo.
Monday 19 October 2026
Shipments of high-end cloud AI accelerators, 2027
DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.
Monday 12 October 2026
Chinese government and industry make full push into AI glasses development: AR display integration and lightweighting gain traction
DIGITIMES notes that China continued to advance smart glasses policies from the central government to local governments in 2026, driving both enterprise production and consumer purchase subsidies.
Friday 2 October 2026
Global annual AI server shipments, 2025-2026
Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds, and leading AI labs to accelerate AI data center buildouts in 2026.
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