Micron Technology, which has fully allocated its HBM production capacity for calendar 2025, indicated that demand for AI will increase as it expands from cloud servers to consumer devices. The company stated that it is maintaining a balance between cost and performance by delaying the use of EUV equipment until its 1γ node.

SK Hynix will announce its financial results for the third quarter of 2024 on October 24. During its previous earnings call, the company indicated that shipments of its HBM3E products would account for over 50% of total high bandwidth memory (HBM) shipments in 2024. The upcoming earnings call will provide insights into the large-scale production and shipment volume of the 12-layer HBM3E and when they are expected to surpass the 8-layer HBM3E products.

Wolfspeed has suspended the construction of its SiC wafer plant in Ensdorf, Germany, as Europe's electric vehicle market faces a slowdown. This comes on the heels of Intel's halted Magdeburg project, delivering another setback to Germany's semiconductor investment ambitions.

As Samsung Electronics (Samsung) faces delays in the mass production of HBM3E, the company is looking to enter Nvidia's supply chain through its competitive GDDR DRAM offerings. Recent reports indicate that issues have arisen in the partnership between Nvidia and TSMC, raising questions regarding whether Samsung could benefit indirectly.

NAND flash device controller specialist Phison Electronics will focus its development efforts on enterprise-level SSDs over the next five years, according to company CEO KS Pua.

The integration of silicon photonics co-packaged optics (CPO) technology into network communication chips has become inevitable**, driven by its ability** to enable high-speed, low-latency data transmission while significantly reducing power consumption. According to Taiwan's Photonics Industry & Technology Development Association (PIDA), silicon photonics heterogeneous integration is expected to become a core technology for next-generation high-speed network communication chips.

Qualcomm's extensive experience in automotive semiconductors positions it firmly ahead of industry rivals, though the impact of MediaTek and Nvidia's collaborative efforts remains uncertain.

Talent development is a key challenge for Japan as it seeks to revitalize its semiconductor industry. In response, the Japanese government has chosen to resurrect the half-inch wafer technology, which was previously utilized as a teaching and introductory tool.

South Korea raises industrial electricity rates by 9.7% on average, marking the seventh adjustment since 2022. This cumulative rise exceeds 60% over three years and is expected to significantly impact energy-intensive sectors like semiconductor and steel manufacturing.

Following ASML's report of declining net bookings and anticipated lower revenue from China, Lam Research refrained from providing updated guidance for its fiscal year. The company noted that its Chinese revenue is expected to fall and identified advanced manufacturing and packaging as its primary growth drivers.

Qualcomm launched its Snapdragon 8 Elite mobile platform at the Snapdragon Summit 2024 in Hawaii, positioning the chip as the fastest and most advanced mobile chip system available. The company promises substantial neural processing capabilities for handling AI-driven tasks on devices equipped with this technology.