As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation for next-generation HBM4 and NAND flash memory exceeding 400 layers, SK Hynix is reportedly preparing to overhaul its wafer dicing technologies — a foundational step in semiconductor production that is becoming increasingly difficult due to thinning wafers.
As demand surges for AI, HPC, and high-speed communications, the PCB industry is entering a new phase of advanced innovation. Chinese PCB manufacturers are aggressively moving into the AI server and HDI segments, seizing the opportunity through technical breakthroughs, expanded capacity, and ambitious market expansion.