Everlight Electronics, a longtime profit leader in Taiwan's LED packaging sector, plans to begin pilot production of SiC components in the second half of 2025. Chairman Robert Yeh said the company is confident it can replicate its LED market success in the competitive SiC space. The initial rollout will target discrete power devices, particularly MOSFETs, where Everlight aims to capitalize on cost efficiencies to stay competitive against aggressive Chinese pricing.

In late April 2025, South Korea's ZDNet Korea reported that China is moving ahead with a major overhaul of its domestic semiconductor equipment sector, aiming to consolidate more than 200 companies into roughly 10 key players. While the announcement drew international attention, industry insiders in China have long seen this as an inevitable, if largely unspoken, challenge.

Taiwan's MPI Corporation, a major producer of probe cards and semiconductor test equipment, said artificial intelligence infrastructure demand is driving capacity utilization to maximum levels, with customers providing order forecasts stretching three years ahead.

Taiwan's test interface supplier Keystone Microtech Corp. expects sustained order momentum through late 2025, fueled by growing demand for chip testing in AI and high-performance computing (HPC) applications. At the company's annual shareholder meeting, Director and President An-hsuan Liu said order visibility remains strong through the fourth quarter and projected minimal impact from reciprocal tariffs on the broader semiconductor market in the second half of the year. Keystone is forecasting sequential revenue increases and targeting double-digit annual growth.

Chinese multilayer ceramic capacitor (MLCC) manufacturers—including Guangdong Fenghua Advanced Technology, Chaozhou Three-Circle Group, and Eyang Technology—have rapidly expanded their global market share, reaching an estimated 10% of total revenue in the second half of 2024. That reflects a four-percentage-point gain from 2019 and signals growing competitive pressure on incumbents such as Samsung Electro-Mechanics (Semco), according to Business Post and Futubull.

IC substrate manufacturer Nan Ya PCB announced that company president Andy Tang will retire and step down on June 16, 2025. The company has yet to announce a successor.

PCB wet process equipment and semiconductor materials agent Ampoc recently announced a strategic technical partnership with South Korean semiconductor materials leader DCT Material. The collaboration aims to expand their presence in the Asian market and capture opportunities in the global advanced semiconductor process high-end materials sector, potentially breaking the long-standing monopoly held by certain major players.

Marking the first anniversary of China's "Eight Measures for the STAR Market"—a landmark reform package aimed at boosting tech innovation and industrial upgrading—the country has recorded its biggest-ever merger in the computing power sector.

Ampoc, a distributor of PCB wet process equipment and semiconductor materials, announced that in response to the growing global demand for high-end materials in advanced semiconductor processes, it will collaborate with South Korean semiconductor material manufacturer DCT Material to establish a joint venture company in Taiwan by the end of 2025. This partnership aims to introduce advanced process material technologies with mass production experience into Taiwan, further strengthening product deployment in the Asian market and providing localized services to key semiconductor customers.

Taiwan-based Yageo Corporation has refiled its foreign investment application under Japan's Foreign Exchange and Foreign Trade Act (FEFTA) as of June 2, in a renewed bid to acquire Shibaura Electronics. The move signals Yageo's growing confidence in clearing regulatory scrutiny—a key barrier that has held back its unsolicited tender offer since February.

Taiwan-based niche PCB maker First Hi-tec Enterprise is riding strong momentum from the AI server sector and expects its 2025 revenue to surpass NT$10 billion (US$307 million), according to CFO Chiu-Hsiung Chang. Fueled by robust AI-related orders in the first quarter of 2025 and continued product mix optimization, the company forecasts sequential quarterly growth throughout the year. Server-related sales are expected to account for over 50% of total revenue in the second half of 2025.

Walsin's PCB business unit, PSA, together with its subsidiary GBM, recently held an investor conference. When the operational benefits from GBM's acquisition of Japan's major PCB manufacturer Lincstech will become apparent was a key focal point.

German laser technology provider LPKF has begun actively asserting its patents related to semiconductor glass substrate technology, signaling a potentially more aggressive posture as competition in the emerging field intensifies. Industry observers see this move as a strategic effort to raise barriers to entry as global interest in glass-based substrates grows.

Samsung Electro-Mechanics (Semco) reportedly has begun building a glass substrate ecosystem to support the development of next-generation semiconductors, with Samsung Electronics serving as a major partner.

As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical giant Asahi Kasei is planning to cut off supplies of its advanced packaging key material, photosensitive polyimide (PSPI), to some customers due to capacity constraints.

Leading Japanese glass cloth manufacturer Nittobo Boseki announced on June 2, 2025, that it will increase the price of certain fiberglass products in its composite materials business by 20% starting August 1, 2025. Products affected include roving, chopped strands, chopped strand mats, roving cloths, cut fibers, and surface mats.

Rising artificial intelligence chip demand has strained supplies of critical materials used in advanced semiconductor packaging, with Japan's Nittobo announcing price increases of as much as 20% starting August 2025 amid persistent shortages.

Flexible printed circuit (FPC) maker Flexium Interconnect is navigating a critical phase of transformation as it shifts its business focus toward next-generation technologies. While the company has made strides in the AI server sector, particularly in liquid cooling sensor modules, it is grappling with yield issues and delayed customer production timelines, which have kept shipment volumes and capacity utilization below previous levels.

Renesas Electronics is reportedly exiting its silicon carbide (SiC) initiative, with Japanese media confirming the company has canceled plans for mass production in early 2025 and dissolved the dedicated development team. Citing Nikkei, Nikkan, and Jiji, industry sources note that Renesas has long focused on automotive logic ICs and insulated-gate bipolar transistors (IGBTs). Its expansion into SiC and gallium nitride (GaN) power components was a response to growing demand from the EV industry.

Wolfspeed, the US leader in silicon carbide (SiC) materials and a key player in the power semiconductor supply chain, has denied recent bankruptcy rumors. However, delays in receiving US$750 million from the CHIPS and Science Act have deepened the company's financial strain.

Applied Materials has entered the semiconductor glass substrate market, reportedly developing the industry's most advanced lithography equipment dedicated to this emerging segment. According to South Korea's ET News, the tools will be first supplied to Absolics, a subsidiary of SKC, for its upcoming facility in Georgia, US.

Samsung Electro-Mechanics announced that preparations for its glass substrate sample production line are nearing completion, with plans to begin supplying samples to two to three major US technology firms in 2025, according to ET News. The company is also deepening strategic collaboration with Samsung Electronics, particularly in areas related to the construction of a glass interposer supply chain.

Wolfspeed, once the dominant supplier of silicon carbide (SiC) materials, is now grappling with financial distress as its market lead continues to erode. Just five years ago, the company was a prized partner in the global semiconductor supply chain, especially during the peak shortage of SiC materials driven by the electric vehicle (EV) boom.