While market focus surrounding AI infrastructure has centered primarily on core computing components—such as GPUs, CPUs, high-bandwidth...

Lattice Semiconductor recently unveiled its next-generation secure control field-programmable gate array (FPGA) series, the Mach-N2...

China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...

Major Taiwanese optical lens maker Largan Precision announced on September 17 that it acquired around 7,468.43 square meters of land...

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on...

Taiwan's listed semiconductor equipment, components, and solutions suppliers are growing at nearly twice the pace of the chipmakers...

Semiconductor packaging and testing materials distributor Niching Industrial hosted an investor conference on September 17. chief financial...

Copper-clad laminate (CCL) manufacturer Ventec International Group has approved an expansion budget of NT$1.5 billion (approx. US$47.11...

As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that...

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...