CONNECT WITH US
NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Friday 15 August 2025
Minebea Mitsumi raises Shibaura Electronics tender offer, matching Yageo's bid
Minebea Mitsumi has increased its tender offer bid (TOB) for shares of Shibaura Electronics to JPY6,200 (US$41.99) per share, matching the bid made by Taiwanese company Yageo Corporation...
Friday 15 August 2025
Taiwanese firms secure M9-grade CCL certifications as ASIC server demand surges
In response to the global surge in large-scale AI computing power deployment, the usage and value of PCBs for AI servers have significantly increased. High-end copper-clad laminate...
Friday 15 August 2025
Taiwan gains competitive edge as China faces steep US tariffs
On July 31, 2025, US President Donald Trump signed an executive order to adjust reciprocal tariff rates, setting the provisional tariff for Taiwan at 20%, effective from August 7,...
Thursday 14 August 2025
Commentary: Trump's trillion-dollar shakedown and how tariff threats turned into investment windfalls
Following South Korea's shocking announcement to invest US$350 billion in the US, with 90% of the profits staying in the US, Nvidia and AMD reportedly have agreed to pay 15% of their...
Thursday 14 August 2025
Topoint races to meet surging drill bit demand as AI and HPC boom

As artificial intelligence (AI) and high-performance computing (HPC) drive explosive growth in demand for advanced printed circuit boards...

Thursday 14 August 2025
Tongtai Machine & Tool lifts 1H25 revenue 4%, backed by NT$3B order backlog
Tongtai Machine & Tool Co. Ltd. reported first-half 2025 consolidated revenue of NT$2.8 billion (US$93.8 million), a 4% increase from a year earlier, supported by stable operations...
Wednesday 13 August 2025
Zhen Ding bullish on CoWoP despite long road to mass production
Nvidia is reportedly collaborating with its supply chain to develop an advanced packaging architecture called Chip-on-Wafer-on-PCB (CoWoP) for its Rubin GPU platform. This new design...
Wednesday 13 August 2025
India approves four chip projects under ISM
India has approved four additional semiconductor projects under the India Semiconductor Mission (ISM), further strengthening the country's semiconductor manufacturing ecosystem. These...
Wednesday 13 August 2025
Samsung bets big on DRAM overhaul to reclaim HBM crown
Samsung Electronics is doubling down on its bet to regain leadership in high-bandwidth memory (HBM), the ultra-fast chip architecture powering next-generation artificial intelligence...
Tuesday 12 August 2025
Samsung DDR4 EOL uncertainty clears, tariffs threaten 2H25 momentum
Contract prices for memory chips have strengthened in the third quarter of 2025, but rumors have swirled surrounding Samsung Electronics slowing down the end-of-life (EOL) for DDR4...
Tuesday 12 August 2025
Parade sees strong 2H25 with high-speed product growth and USB4 adoption
During its earnings call on August 7, 2025, high-speed interface provider Parade stated that its second-quarter revenue grew steadily, and gross margin improved, mainly due to a better...
Tuesday 12 August 2025
Ichia secures orders from major US firms for optical communication products, eye double-digit revenue share by 2027
Ichia Technologies reported a strong first half of 2025, with revenue climbing 20% above expectations. CEO Eric Tseng noted that while some consumer orders were pulled forward to...
Monday 11 August 2025
WT Microelectronics AI data centers fuel massive growth into 2026
IC distribution giant WT Microelectronics' chairman Eric Cheng stated at the August 6, 2025, investor conference that strong AI demand will become the core growth driver for WT in...
Monday 11 August 2025
Asia Optical profit soars on strong camera and drone lens sales
Asia Optical held an online investor conference on August 6, 2025, where chairman Yi-Jen Lai praised its second quarter performance. He shared that digital cameras and action cameras...
Monday 11 August 2025
Samsung reportedly planning to produce iPhone image sensors in Texas, but keep packaging in Korea
Samsung Electronics will build a CMOS image sensor (CIS) production line at its Austin, Texas, semiconductor facility for Apple's next-generation iPhones, but the chips' back-end...