As Nvidia introduces a new generation of AI chips each year, gains in computing performance are driving increasingly demanding thermal management requirements.
Applications for silicon carbide (SiC) and gallium nitride (GaN) power devices are expanding across the electronics industry, affecting not only component selection but also product...
Samsung Electro-Mechanics (SEMCO) told investors on October 28 that long-term agreements are expected to account for more than 60% of its multilayer ceramic capacitor (MLCC) revenue...
Surging demand for AI computing is driving advanced packaging toward larger form factors, according to Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, speaking...
Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass...
Unimicron Technology is reshaping its global production footprint and steering resources toward Taiwan's higher-margin AI supply chain as surging AI and high-performance computing...
Major package substrate makers, including Samsung Electro-Mechanics (Semco), are concentrating capital spending on large, high-layer-count ABF substrates, while capacity expansion...
South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers...
South Korean semiconductor equipment component maker MiCo Ceramics is set to acquire an idle facility in Gumi, North Gyeongsang Province, from LG Display (LGD) for KRW150 billion (approx...
US materials giant 3M recently entered into a strategic partnership with Taiwanese optical component manufacturer Genius Electronic Optical (GSEO), with plans to acquire a 4.7% stake...
As military conflict in the Middle East cripples global energy infrastructure, the United States is emerging as the critical anchor for the world's high-tech manufacturing sector....
South Korean optics maker Optoelec is seeing growing interest from AI data center customers as it seeks to expand its wafer-level optics (WLO) business into high-speed optical communications,...
As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges...
In the era of AI and high-performance computing (HPC), the once-separate worlds of chip design, packaging, and circuit boards are converging. According to the Global Electronics Association,...
Samsung Electro-Mechanics (Semco) is gaining pricing power as AI server demand extends multilayer ceramic capacitor (MLCC) lead times beyond a year. Shortages now span consumer, automotive...
