News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Thursday 6 August 2026

Machvision July revenue hits record as AI and PCB demand strengthens

Machvision reported consolidated revenue of about NT$359 million (US$11.1 million) in July 2026, a record monthly high that was up 1.28% from June and 31.84% from a year earlier. The...

Thursday 6 August 2026

FOPLP leads production as CoPoS advances glass packaging

AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...

Wednesday 5 August 2026

AI chip demand revives co-investment deals as ABF substrate capacity fills through 2028

AI chip demand is tightening supply of IC substrates, prompting Nvidia, AMD, and hyperscalers to lock in Ajinomoto Build-up Film (ABF) capacity through 2028 and press suppliers to...

Wednesday 5 August 2026

Aurona lifts ABF and CCL shipments, eyes capacity expansion in 3Q26

Aurona said shipments of ABF substrate pads and CCL-related packaging materials both rose, extending its growth momentum in the second...

Tuesday 4 August 2026

Samsung Electro-Mechanics reportedly fast-tracks Philippine MLCC plant in wake of AI-driven price hikes

Samsung Electro-Mechanics (SEMCO) is reportedly pulling forward the start-up of its first overseas multilayer ceramic capacitor (MLCC)...

Tuesday 4 August 2026

Taiwan specialty chemical firm expands Taiwan, China capacity on AI materials boom, eyes 20% revenue gain in 2026

Taiwan-based specialty chemicals supplier Johnson Fine Chemical expects robust growth in electronic materials demand driven by AI, high-performance computing (HPC) and advanced communications...

Tuesday 4 August 2026

Kinsus boosts spending as global IC substrate supply stays tight

Kinsus said stronger second-quarter results and fresh capital spending reflect continued strain in the global IC substrate market, where demand from AI, CPU, GPU, and ASIC customers...

Monday 3 August 2026

AI infrastructure orders extend PCB expansion race

Global demand for AI infrastructure is rising, and as order visibility improves, the PCB supply chain has launched a marathon of factory expansion. Upstream copper-clad laminate (CCL)...

Monday 3 August 2026

India expands chip talent pipeline amid surging global chip demand

India has stepped up efforts to build a larger semiconductor workforce through training, curriculum reform, and industry partnerships. The plan matters beyond India because chip supply...

Monday 3 August 2026

Samsung Electro-Mechanics deepens AI supply-chain bet with new contracts, eyes glass substrate production in 2027

Samsung Electro-Mechanics used its second-quarter earnings call to signal that its bet on AI infrastructure is paying off and about to get bigger, pointing to a run of long-term supply...

Monday 3 August 2026

Flexible PCB maker Flexium sees AI server shipments doubling after 2Q margin turns positive

Flexium Interconnect said its second-quarter operating loss narrowed from the previous quarter as new flexible printed circuit products entered mass production for a US customer's...

Monday 3 August 2026

C.C.P. Contact Probes teams with chipmaker on MEMS probes and test-cleaning sheets

C.C.P. Contact Probes said it has expanded its presence in the AI sector through a joint development project with a major semiconductor company covering microelectromechanical systems...

Monday 3 August 2026

AI server demand revives long-term MLCC supply agreements as shortages intensify

Surging demand for AI servers is tightening global capacity for high-end passive components, prompting customers to once again pursue long-term supply agreements (LTSAs) as they seek...

Saturday 1 August 2026

Elite Material posts record 2Q result on strong AI-related demand

Elite Material Co. said booming demand for advanced materials used in AI hardware kept its factories fully loaded in the second quarter of 2026, lifting revenue and profit to record...

Saturday 1 August 2026

Thintronics wins proposed US CHIPS incentives for advanced substrate technology

Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research...

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Jul 30, 08:00

EDOM Accelerates Edge AI Deployment with NVIDIA Technologies

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