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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Friday 22 May 2026
AP Memory IPD enters Intel's EMIB supply chain, shipments set for 2Q26
Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products,...
Friday 22 May 2026
TSMC supply chain material maker AMC rides AI packaging yield boom

Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has...

Friday 22 May 2026
BOE, Corning target glass substrates for AI chip packaging

BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the...

Thursday 21 May 2026
AI chip boom strains ABF substrate supply chain
AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used...
Thursday 21 May 2026
LG Innotek wins long-term substrate deals as Intel and cloud giants secure supply
LG Innotek has secured substrate supply terms with major technology customers that increasingly resemble long-term agreements used in the memory-chip sector, boosting the South Korean...
Thursday 21 May 2026
OSE targets AI server SMT growth as memory demand lifts outlook
Orient Semiconductor Electronics (OSE) said that strong memory market demand is lifting its outlook and expanding its role in the memory supply chain, while also strengthening its...
Thursday 21 May 2026
AI server demand tightens passive component supply, lifting Taiwanese suppliers' share
Demand for artificial intelligence servers and related power systems is pushing lead times higher for high-end multilayer ceramic capacitors, elongated electrolytic capacitors, and...
Thursday 21 May 2026
TSMC's COUPE push puts Samsung's silicon photonics ambitions under pressure
Samsung Electronics has launched silicon photonics foundry services and entered pilot production, signaling during its latest earnings call that optical communication modules will...
Wednesday 20 May 2026
ASML to deliver first High-NA chips within months despite cost concerns
ASML expects its first advanced semiconductors made using next-generation High-Numerical Aperture (High-NA) extreme ultraviolet (EUV) lithography equipment to ship within months.
Wednesday 20 May 2026
China's OSATs chase bigger role as AI chips strain packaging supply

China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging...

Tuesday 19 May 2026
AEM targets semiconductor and AI markets, begins sampling anti-warpage film and PTFE materials
Flexible copper clad laminate (FCCL) manufacturer Asia Electric Material (AEM) said that its long-term investment in new product development has begun to yield results, with the company's...
Tuesday 19 May 2026
TDK expands bonding equipment investment, launches first mass production of nanocomposite materials
Japanese electronic components manufacturer TDK will make its largest-ever capital investment in fiscal 2026, running from April 2026 to March 2027, to address surging demand related...
Tuesday 19 May 2026
Commentary: Sanctions reshaped China's foundry sector — just not in the way markets expected
China's foundry sector is charting a different course as the global semiconductor market remains focused on AI GPUs, the 2nm process node, and advanced packaging. Led by Semiconductor...
Monday 18 May 2026
Prosperity Dielectrics sees AI server power customers chasing MLCC supply
Prosperity Dielectrics' surge in demand for high-end MLCCs, driven by higher-wattage AI server power systems, is extending lead times and prompting major capacity and material investments,...
Monday 18 May 2026
Lianyou Metals rides tungsten, cobalt squeeze to record quarter

Lianyou Metals reported record first-quarter results in 2026, as tightening global supplies of tungsten and cobalt and stronger demand...