CONNECT WITH US
NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Monday 22 June 2026
FineMat pivots beyond metal masks with AI cooling, semiconductor, and drone push
Amid growing localization efforts across China's supply chain, FineMat Applied Materials has seen its metal mask business continue to shrink and is accelerating its transition into...
Friday 19 June 2026
China chip supply chain feels squeeze from AI server MLCCs to 8-bit MCUs
China's semiconductor supply chain is showing fresh signs of pricing strain, with microcontroller unit (MCU) makers and passive component suppliers facing rising costs, tighter capacity,...
Friday 19 June 2026
AI test demand drives broad recovery among Taiwan's semiconductor equipment suppliers in May

Taiwan's semiconductor equipment, components, and solutions providers posted robust revenue growth through the first five months of...

Thursday 18 June 2026
AI data center boom drives Taiwan passive component makers to record sales
Demand in the passive components market is recovering significantly, lifting operating momentum at Taiwan's two leading suppliers, Yageo and Walsin Technology. Average book-to-bill...
Thursday 18 June 2026
AI chip boom strains probe card supply, Taiwan test interface maker weighs prepayment deals
MPI Corporation, a major probe card supplier, said AI demand is tightening supply across the probe card market and extending order visibility, with the company considering a prepayment...
Thursday 18 June 2026
FOPLP race heats up as Innolux reportedly teams with TSMC
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...
Thursday 18 June 2026
Nichicon raises e-cap prices as supply tightens, costs increase
Japanese capacitor manufacturer Nichicon has announced a broad price hike for aluminum electrolytic capacitors (e-cap), as order volumes for some products have exceeded the company's...
Thursday 18 June 2026
Taiyo Yuden to boost AI server MLCC capacity, resists price hikes

Taiyo Yuden is preparing to accelerate production of multilayer ceramic capacitors, or MLCCs, as AI servers and hyperscale data centers...

Thursday 18 June 2026
WUS and its subsidiary keep complementary AI partnership
A recent open letter from the UK-based fund Palliser Capital called Taiwanese printed circuit board (PCB) maker WUS Printed Circuit one of the most undervalued AI PCB companies in...
Thursday 18 June 2026
Exclusive: Penang moves up value chain; Galatek flags deep-tech, IP hurdles
Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive...
Thursday 18 June 2026
Exclusive: Galatek sees Penang facility driving semiconductor, life sciences ecosystem growth
Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering,...
Wednesday 17 June 2026
China PCB maker DSBJ bets US$1.2 billion on AI optical modules
Suzhou Dongshan Precision Manufacturing (DSBJ) will invest US$1.2 billion to expand optical chip and optical module capacity at Source Photonics, accelerating its shift from PCB manufacturing...
Wednesday 17 June 2026
PCIM 2026: How high-voltage infrastructure is unifying AI and e-mobility sectors
Semiconductor manufacturers, market analysts, and engineering departments have long tracked the clean energy transition through siloed vertical markets. For example, they will calculate...
Wednesday 17 June 2026
Ajinomoto's chip film faces supply test as AI demand climbs

The global appetite for AI chips is putting new strain on materials suppliers, turning one of Ajinomoto's lesser-known products into...

Wednesday 17 June 2026
Samsung Electro-Mechanics expands silicon capacitor push on integration edge

Samsung Electro-Mechanics (Semco) is rapidly gaining ground in the silicon capacitor market as AI infrastructure investment and technology...