News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Thursday 4 June 2026

Taiwan's Walsin Technology gains pricing power from AI demand

Walsin Technology, one of Taiwan's leading manufacturers of multilayer ceramic capacitors (MLCCs), has notified distributors that it will...

Wednesday 3 June 2026

Physical AI must act before it thinks, NXP CEO argues at Computex

As robots and autonomous systems move from factory floors into hospitals, warehouses, and public spaces, NXP Semiconductors CEO Rafael Sotomayor used his Computex 2026 keynote to argue...

Wednesday 3 June 2026

xMEMS sees 2027 debut for cooling chips as AI glasses, SSDs face heat limits

xMEMS Labs is preparing to move its MEMS-based µCooling technology toward commercial production in 2027, with AI glasses and data-center...

Wednesday 3 June 2026

Nvidia and Infineon press supply chain co-design as AI power limits tighten

At the opening day of Computex 2026, Lite-On Technology hosted an AI industry summit under the theme "Powering the AI-driven Future," where DIGITIMES chairman Colley Hwang moderated...

Wednesday 3 June 2026

Middle East war drives LME aluminum to 4-year high, squeezing chip equipment margins

Rising global geopolitical risk and tightening supply in some markets have pushed London Metal Exchange (LME) aluminum prices higher in volatile trading, adding cost pressures to industries...

Tuesday 2 June 2026

Unimicron's new chair refocuses resources on AI substrate bottleneck

Unimicron Technology has completed a full board re-election, with newly appointed chairman SC Chien formally taking charge as the IC substrate supplier prepares for a new phase of...

Tuesday 2 June 2026

Zhen Ding joins Nvidia MGX ecosystem to supply cable-free PCB technology for AI factories

PCB manufacturer Zhen Ding announced it had joined Nvidia's MGX ecosystem to support the deployment of the chipmaker's third-generation MGX modular architecture, which uses a PCB-based...

Tuesday 2 June 2026

Taiwan PCB output could top NT$1 trillion in 2026, but risks remain

Taiwan's printed circuit board (PCB) makers are expected to see domestic and overseas output rise 15.1% year-over-year to NT$1.05 trillion (approx. US$33.5 billion) in 2026, according...

Monday 1 June 2026

Foxconn expands France push with Tessalia chip-packaging venture, Bull AI project

Foxconn is expanding its footprint in France through two projects spanning artificial intelligence infrastructure and semiconductor packaging,...

Monday 1 June 2026

Compeq says AI infrastructure will drive sharp revenue and profit gains in 2027 and 2028

Compeq Manufacturing Co. told shareholders on May 28 that AI infrastructure demand has transformed the printed circuit board industry and will push high-end PCB manufacturing complexity,...

Monday 1 June 2026

Zhen Ding sees AI reshaping PCB's role as demand accelerates

PCB maker Zhen Ding said AI is driving a structural shift in electronics, redefining the role of printed circuit boards from passive signal connections to critical platforms for high-performance...

Monday 1 June 2026

Top memory maker executives gather in Taiwan in preparation for Computex 2026

After Nvidia CEO Jensen Huang wrapped up his "trillion-dollar banquet" for Taiwan AI supply-chain giants, GTC Taipei is set to become a highlight of Computex 2026. Nvidia will also...

Monday 1 June 2026

Nvidia expects AI boom to keep supply tight beyond 2027

Nvidia chief executive Jensen Huang said the artificial intelligence industry is entering a rapid growth phase that could keep revenue rising sharply into 2027, while supply-chain...

Monday 1 June 2026

Actron moves into AI servers and power infrastructure after securing 70%+ global share in auto LLD/ULLD diodes

Taiwan-based Actron Technology expects stronger growth in its automotive semiconductor business as demand for its high-efficiency diode products has exceeded expectations amid tightening...

Monday 1 June 2026

Flexium targets higher-value products and AI applications as turnaround expected in second half of 2026

Flexium Interconnect held its 2026 annual shareholders meeting on May 28 and outlined a strategic shift toward technology upgrades, higher-value products and improved operational efficiency...

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BIZ FOCUS

Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook