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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Friday 29 May 2026
Foxconn to break ground on France chip-packaging plant, pursues Africa sovereign-AI
Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa,...
Friday 29 May 2026
Unimicron targets record 2026 revenue with ABF and AI system-board push
Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that...
Friday 29 May 2026
Winbond pushes 3x-priced AI Si-Cap shipments as Semco order ramps in 2027
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging...
Thursday 28 May 2026
Iteq sees AI data center demand lift M7+ CCL shipments
Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications,...
Thursday 28 May 2026
CXMT cleared for IPO listing; could boost China's memory supply chain
ChangXin Memory Technologies (CXMT), China's top DRAM maker, has been cleared by China's securities regulator for its highly anticipated IPO, which could raise funds worth CNY29.5...
Thursday 28 May 2026
SAS succession complete as founder Mingguang Lu exits board amid diversified growth
Sino-American Silicon Products (SAS) held its shareholders meeting on May 26 and completed a full board overhaul, with founder Mingguang Lu stepping down as a director and Hsiu-lan...
Thursday 28 May 2026
Yageo signals possible price hikes as Japanese and Korean passive component makers raise prices
Passive component manufacturer Yageo held its 2026 annual shareholders meeting on May 27. In a post-meeting interview, chairman Pierre Chen confirmed that the world's two largest multilayer...
Thursday 28 May 2026
Yageo tops Murata in AI-driven passive component orders

Yageo, one of the world's largest passive component suppliers, said demand from AI-related applications has pushed its book-to-bill ratio...

Thursday 28 May 2026
QRT eyes aerospace, defense growth with portable chip radiation tester

South Korean semiconductor testing company QRT is expanding its equipment business with a portable chip radiation reliability testing...

Wednesday 27 May 2026
Sino-American Silicon taps AI to tackle Taiwan's green power crunch
Sino-American Silicon Products (SAS) is turning to AI-based power management as Taiwan's green-power shortage persists, and electricity demand from advanced chipmaking and AI data...
Wednesday 27 May 2026
WinWay weighs Texas shift after AI chip testing surge in North America
US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only...
Wednesday 27 May 2026
Hiwin opens Italy HQ, bridging Europe to global markets
Taiwanese machinery component maker Hiwin has officially opened its new headquarters in Agrate Brianza for its Italian subsidiary, saying the site will serve as a key hub connecting...
Wednesday 27 May 2026
PCB drill bit maker Topoint raises NT$600 million, brings in PCB giants as strategic investors
Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600...
Tuesday 26 May 2026
LED maker Ennostar pivots to optical interconnects after high-value shift agin traction
Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account...
Tuesday 26 May 2026
Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die —...