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    Marvell raises its outlook twice in two quarters as custom silicon, scale-up optics broaden
    14min ago
    Kioxia, Sandisk plan more than US$31 billion in Japan investments
    17min ago
    SK Hynix breaks ground on $4 billion Indiana plant that will package, not make, HBM
    28min ago
    YMTC expands local supply chain
    Aug 27, 18:24
    Insight: Z.ai tests GLM-5.3-Flash anonymously, underscoring shift in benchmarking
    Aug 27, 18:24
    MCE expands auto electronics capacity to defend Malaysia's domestic market
    Aug 27, 18:24
    China took more than 70% of global battery market in 1H26
    Aug 27, 18:24
    Taiwan legislature passes drone bill, tightening oversight after supplier scandals
    Aug 27, 18:24
    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Thursday 20 August 2026
    Chinese SiC substrate maker SICC hits record Q2; 8-inch wafers top 50% of core revenue

    SICC reported stronger first-half 2026 revenue and margins as its 8-inch silicon carbide substrate business gained scale, highlighting...

    Thursday 20 August 2026
    Asia Optical eyes Metalens, CPO, and AI cooling opportunities; digital camera shipments to surpass 4 million units
    Asia Optical delivered strong second-quarter financial results while accelerating its strategic expansion across optical technologies. Key growth drivers include Metalens and Co-Packaged...
    Thursday 20 August 2026
    High-end PCB supply tightens as CCL expansions face delays
    As AI applications demand faster data transmission from PCBs, M8 and higher-grade copper-clad laminate (CCL) materials are becoming increasingly mainstream in server boards. The shift...
    Wednesday 19 August 2026
    Manz Asia targets PLP demand with three lines and three sizes
    Manz Asia is broadening its push into panel-level packaging (PLP) as interest in the technology continues to rise. General manager Robert Lin said the company has shipped more than...
    Wednesday 19 August 2026
    PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
    As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...
    Wednesday 19 August 2026
    Taiwanese firms' China investment returns hit record high on AI boom

    Driven by surging global demand for AI and high-performance computing (HPC), Taiwanese listed companies achieved record combined profits...

    Wednesday 19 August 2026
    Charts: Taiwan's materials suppliers split: wafer giants stall, substrate and lead-frame names run

    The two largest silicon wafer companies are the sector's slowest growers on a cumulative basis. Everything running fast sits downstream...

    Wednesday 19 August 2026
    LG's raw material costs jump by over KRW1 trillion in 1H26, auto components hit hardest

    Rising chip and copper prices are rapidly increasing cost pressure on LG Electronics.

    Wednesday 19 August 2026
    AI drives EISO high-end PCB orders as CCL shortages bite

    Niche printed circuit board (PCB) maker EISO Enterprise said that 2026 industry demand has returned to post-pandemic highs as AI applications...

    Wednesday 19 August 2026
    Hanmi Semiconductor scales up bonding capacity with US$91.4 million plant buy amid AI packaging boom

    Amid a global shortage of AI semiconductor equipment, Hanmi Semiconductor announced on August 18 that it will acquire a factory owned...

    Tuesday 18 August 2026
    Daxin Materials accelerates semiconductor push with 12 products in mass production
    Daxin Materials is expanding its semiconductor footprint, with semiconductor materials accounting for nearly 23% of revenue in the second quarter of 2026. The company expects the segment...
    Tuesday 18 August 2026
    TSC sees semiconductor material prices rise up to 15% as petrochemical costs squeeze supply

    Topco Scientific (TSC) said at its second-quarter 2026 earnings conference that rising upstream petrochemical costs are pushing up...

    Tuesday 18 August 2026
    AI drives power semiconductors into at least a two-year shortage
    The cloud AI data center boom is not close to bursting, according to chip supply-chain players. They say that analog ICs, including power semiconductors, will stay tight for years...
    Tuesday 18 August 2026
    Eiso Enterprise's Guishan plant expansion doubles PCB capacity, eyes AI, aerospace, defense markets

    Niche printed circuit board (PCB) manufacturer Eiso Enterprise has officially opened the second-phase expansion of its new plant in...

    Tuesday 18 August 2026
    AI server demand pushes high-end MLCC lead times toward 40 weeks
    Multilayer ceramic capacitor (MLCC) supply is increasingly diverging by product specification, with mainstream components remaining relatively stable while lead times for some high-capacitance,...
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    BIZ FOCUS
    Aug 27, 08:00
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
    Tuesday 25 August 2026
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
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