Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the...
Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...
LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks,...
WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...