News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Wednesday 2 September 2026

Semicon Taiwan 2026 signals a broader race for AI-era semiconductor leadership

Semicon Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...

Wednesday 2 September 2026

Innolux targets advanced packaging with debut of Chip Last tech

Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...

Wednesday 2 September 2026

Panasonic reportedly raises CCL and PP prices again as IC substrate costs jump 30%

Japan's Panasonic has raised PCB material prices for the second time in 2026, broadening the increases to copper-clad laminate (CCL), pre-preg (PP) and other products, including IC...

Wednesday 2 September 2026

Gudeng pursues 'Taiwan Plus One' overseas strategy, says cost is not sole consideration

Gudeng Precision Industrial chairman Bill Chiu said on August 31 that the company has begun building out its global manufacturing footprint. Its Japan plant is expected to complete...

Tuesday 1 September 2026

Samsung Electro-Mechanics discloses major MLCC supply deal tied to AI server demand

Samsung Electro-Mechanics disclosed on September 1 that it has concluded a single sales and supply contract worth KRW1.072 trillion (about US$778.9 million) for MLCCs, equal to 9.5%...

Tuesday 1 September 2026

India expands chip ambitions with full Semicon 2.0 notification

India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...

Tuesday 1 September 2026

Taiwan's G2C+ Alliance members target global markets

Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...

Tuesday 1 September 2026

Semicon Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts

Semicon Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...

Tuesday 1 September 2026

Acme sees years of SiC growth as data center demand builds

Capex by the world's nine largest cloud service providers (CSPs) is expected to rise about 90% year over year in 2026, while AI servers are growing faster than conventional servers,...

Tuesday 1 September 2026

Kaimei sees 2H26 momentum strengthen as AI demand lifts orders and resistor price hikes take effect

Kaimei Electronics, a Yageo Group company, said order visibility remains strong for the second half of 2026 as AI server demand continues to ramp and automotive and industrial-control...

Monday 31 August 2026

Unimicron search puts spotlight on cross-border manufacturing for Taiwan's electronics sector

Unimicron, a major Taiwanese IC substrate maker, came under intense supply chain scrutiny last week after reports that prosecutors and investigators searched the company over a suspected...

Monday 31 August 2026

Unimicron stock prices fall 10% daily limit, says origin probe covers PCBs, not substrates

Unimicron Technology shares plunged to Taiwan's 10% daily downside limit on August 31, the first trading session after prosecutors disclosed...

Monday 31 August 2026

Kingboard Laminates raises prices again as CCL shortages deepen

Kingboard Laminates, a leading Chinese copper-clad laminate (CCL) maker, has issued another price increase notice as shortages of core materials such as fiberglass cloth and copper...

Monday 31 August 2026

South Korea risks 'HBM 2.0' trap in emerging CPO market

Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...

Monday 31 August 2026

China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands

Hangzhou Lion Microelectronics plans to invest about CNY3 billion (approx. US$446 million) in a new 12-inch silicon wafer project in Jiaxing,...

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Sep 2, 08:22

World Diamond Technology accelerates mass production of 300 mm diamond wafers

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