AUO is tailoring its glass core substrate specifications specifically to semiconductor process requirements rather than competing on panel dimensions with Innolux, according to Chairman...
AI servers are driving demand for power components, transient voltage suppressors (TVS), and electrostatic discharge (ESD) protection devices. Yea Shin Technology, a subsidiary of...
South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor...
AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As...
TPK Holding has completed a pilot production line for glass-substrate through-glass via (TGV) technology at its Zhongli plant and started joint development and validation of early-stage...
Zhen Ding Technology Holding announced that it, Elite Material (EMC), Taliang Technology, and Topoint Technology will jointly invest a total of NT$60 million (approx. US$1.85 million)...
Market reports have recently suggested that MediaTek's tensor processing unit (TPU) v9 project with Google could face delays in volume production as Google reportedly revises the chip's...
Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt...
Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor...
SEMI's latest 12-inch fab outlook projects double-digit annual growth in equipment spending from 2026 through 2029, with forecasts revised upward from its previous edition. However,...
Taiwan-based microcontroller (MCU) manufacturer Holtek Semiconductor unveiled its 2026 product roadmap on October 15, focusing on four core areas: smart protection, green energy and...
Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...
LG Innotek expects to begin supplying glass substrates for advanced semiconductor packaging around 2028 and sees its chip substrate business improving in 2027, as the South Korean...
Nvidia showcased the latest developments in its MGX server platform ecosystem at the OCP Global Summit 2026, unveiling for the first time a switch board sample using polytetrafluoroethylene...
