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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Monday 4 May 2026
Win Semiconductors: GaAs and InP supply still meets production demand
Rising raw material prices have pushed up gallium arsenide (GaAs) substrate costs, squeezing a key material used in power amplifiers (PA). Win Semiconductors said that its scale gives...
Monday 4 May 2026
AI's 1.6T shift turns InP into optical supply chain bottleneck

The transition from 800G to 1.6T optical modules is no longer an upgrade cycle — it is a physics-driven inflection point.

Monday 4 May 2026
Yageo's Pierre Chen says AI hardware boom is lifting passive component demand

Yageo chairman Pierre Chen said the rise of AI applications is driving stronger demand not only for advanced semiconductors and memory,...

Monday 4 May 2026
BenQ Materials unit Cenefom enters memory supply chain with CMP brush wheels
BenQ Materials is accelerating its expansion into semiconductor materials as its subsidiary Cenefom officially begins operations at its new Guangyuan plant. The facility's chemical...
Monday 4 May 2026
AI chip demand ignites embedded substrate race among Samsung, Ibiden, Unimicron
Samsung Electro-Mechanics (Semco) has moved early to commercialize embedded semiconductor substrates, but the window is rapidly closing as Japan's Ibiden and Taiwan's Unimicron prepare...
Monday 4 May 2026
Zhen Ding expands NTHU partnership with new five-year research program
PCB maker Zhen Ding Technology has launched the second phase of its joint research center with National Tsing Hua University, aiming to deepen collaboration on advanced PCB and IC...
Saturday 2 May 2026
Yageo AI revenue reaches 15% as chair says sector remains early in cycle
Yageo chairman Pierre Chen said the company has undergone a major transformation over the past eight years, driven in part by the rise of AI applications.
Saturday 2 May 2026
Samsung Electro-Mechanics tops US$2 billion quarterly sales, flags ABF substrate shortage
Samsung Electro-Mechanics (Semco) reported its first-ever quarterly revenue exceeding KRW3 trillion (approx. US$2.2 billion), driven by expanding AI infrastructure investment and rising...
Friday 1 May 2026
Samsung Electro-Mechanics weighs MLCC price hike of 5–10% as supply tightens
Samsung Electro-Mechanics is considering raising prices for multilayer ceramic capacitors (MLCCs) by about 5% to 10% as demand from artificial intelligence (AI) infrastructure tightens...
Thursday 30 April 2026
Chang Wah Technology forecasts double-digit growth in the second quarter on EMC LED strength
Packaging leadframe maker Chang Wah Technology Co., Ltd. reported that it achieved NT$3.672 billion (US$116 million) in revenue in the first quarter of 2026, its fourth-highest quarterly...
Wednesday 29 April 2026
Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key
Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level...
Wednesday 29 April 2026
PCB industry urges four policy moves in Thailand expansion
Amid global supply chain restructuring, Asia's PCB industry is moving toward closer regional collaboration. Industry experts say that as southbound expansion in the PCB sector takes...
Tuesday 28 April 2026
AI chip testing complexity lifts probe card and upstream supply chain demand
As AI chips move to advanced process nodes and packaging technologies, semiconductor testing requirements are becoming significantly more complex.
Monday 27 April 2026
Thailand's PCB industry moves upmarket, local supply gaps persist

Thailand is fast emerging as a critical hub for high-end electronics manufacturing, as global supply chains shift and demand for AI computing...

Monday 27 April 2026
TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first,...