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    Huawei reportedly shifts AITO partnership to Seres-led model
    10h 20min ago
    China's FAW to become GAC's second-largest shareholder as auto consolidation talk returns
    10h 20min ago
    Column: China tightens rare earth controls, and Taiwan must guard supply chain flexibility
    10h 20min ago
    Analysis: Behind China's CNY30 trillion electronics plan—can AI and robotics outrun a maturing market?
    10h 20min ago
    China’s wafer fabs boost local equipment buying, pressuring South Korean suppliers
    10h 20min ago
    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Saturday 12 September 2026
    AI server boom reshuffles MLCC supply, opening a rare expansion window for Taiwan makers

    Strong demand for AI computing is creating a capacity squeeze across the passive-component industry, opening new opportunities for Taiwanese...

    Saturday 12 September 2026
    Murata targets mass production of its AI power substrate next year
    Murata Manufacturing plans to begin mass production next year of iPaS, the power substrate it has spent several years developing for AI chips, a step that would carry the world's largest...
    Friday 11 September 2026
    Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
    At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward...
    Friday 11 September 2026
    China's DRAM supply chain clears another materials hurdle
    China's semiconductor localisation effort has reached another upstream materials milestone.​ Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products...
    Friday 11 September 2026
    CIOE 2026: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

    At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase...

    Friday 11 September 2026
    AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
    Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
    Friday 11 September 2026
    AI server tracker: Taiwan's August filings say demand is still accelerating
    The clearest read yet on whether the AI build-out is still accelerating arrived this week in a batch of unaudited Taipei filings, and it accelerated. The 49 Taiwan-listed companies...
    Friday 11 September 2026
    Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
    Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end...
    Thursday 10 September 2026
    AUO matching glass substrate size stokes TSMC collab speculation
    AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
    Thursday 10 September 2026
    Spirox TGV inspection capable of scanning entire substrate in 20 minutes
    As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
    Thursday 10 September 2026
    China gets an early shot at the next SiC power-chip cycle

    Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the...

    Thursday 10 September 2026
    Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

    Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

    Thursday 10 September 2026
    Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers
    AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...
    Thursday 10 September 2026
    Europe and US IDM grid-to-core push challenges Taiwan power modules
    Data-center power systems are entering a new phase as operators move toward 800V HVDC and denser DC-DC architectures, raising demand for high-voltage, low-loss, and high-frequency...
    Thursday 10 September 2026
    Yageo's August revenue hits record on AI demand
    Yageo posted year-over-year and month-over-month revenue growth in August, extending its streak of record monthly highs to a sixth straight month. The passive components maker said...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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