In 2026, critical semiconductor materials face a perfect storm of rising prices, shortages, and geopolitical disruption. Lead times for multilayer ceramic capacitors (MLCCs) and power...
Brand Cheng, chairman of Foxconn Industrial Internet (FII), a cloud networking business under Foxconn, recently announced ongoing advancements in technologies, including co-packaged...
AI GPUs, CPUs, and ASICs are driving demand for increasingly larger sizes and higher layer counts in substrate technology. The supply-demand gap for high-end ABF substrates continues...
Printed circuit board (PCB) giant Zhen Ding Technology held a board meeting on April 17 and approved plans for its subsidiary, Leading Interconnect Semiconductor Technology (LIST),...
Japanese electronic components maker Taiyo Yuden recently issued a price increase notice, announcing that it will raise prices on some products starting in May, specifically in the...
Glass core substrates, valued for their low dielectric loss and warpage reduction, are key to next-generation advanced semiconductor packaging. In South Korea, traditional glass makers...
AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers...
The 2026 International Symposium on VLSI Technology, Systems and Applications (VLSI TSA) kicked off on April 14, gathering over 800 semiconductor professionals worldwide. The conference...
The surge in AI data center demand is rapidly accelerating the need for high-speed data transmission, prompting LED manufacturers to target opportunities in optical communications...
Global passive component prices are rising, led by Japanese suppliers, with the trend spreading across China and Taiwan. Higher raw material costs and AI-driven demand are tightening...
The surge in AI-grade high-speed computing is pushing printed circuit board manufacturing toward thicker, higher-layer designs, creating a strategic, global shortage of advanced coated...
Passive component manufacturer Yageo held its first-quarter 2026 online earnings call on April 15, reporting strong financial results. Company CEO David Wang said that robust demand...
Taiwanese analog IC companies have recently released their full revenue figures for the first quarter of 2026, revealing mixed performances. Firms with rapidly growing new businesses...
The Chinese government has introduced sweeping regulations that authorize investigations and penalties against foreign companies that decouple from China's supply chain. The new rules...
