Lithography Semiconductor Equipment Co. (LSE) officially announced on August 11 that TECO Image Systems Co. (TIS) had completed a strategic...

Passive component distributor Nichidenbo said supply of MLCCs and other products remains tight as AI servers and ASIC applications...

Dynamic said its Thailand plant will not begin mass-producing high-end AI products until the fourth quarter of 2026, a delay that could...

China's silicon wafer industry is entering a new phase of simultaneous capacity expansion and consolidation, with Xi'an Eswin Material...

The UK Semiconductor Centre (UKSC), a leading organization in the UK semiconductor ecosystem, will lead a delegation of British semiconductor...

Co-packaged optics (CPO) remains a key focus in the AI era. Beyond advanced packaging and testing, compound semiconductors, and other...