South Korean optics maker Optoelec is seeing growing interest from AI data center customers as it seeks to expand its wafer-level optics (WLO) business into high-speed optical communications,...

As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges...

In the era of AI and high-performance computing (HPC), the once-separate worlds of chip design, packaging, and circuit boards are converging. According to the Global Electronics Association,...

Samsung Electro-Mechanics (Semco) is gaining pricing power as AI server demand extends multilayer ceramic capacitor (MLCC) lead times beyond a year. Shortages now span consumer, automotive...

Tesla and Nvidia are reportedly investing a combined KRW3.7 trillion (US$2.8 billion) to help Samsung Electro-Mechanics expand Ajinomoto Build-up Film (ABF) substrate production facilities...

Apple's iPhone Duo has gone on sale, with pre-orders in several key markets reportedly exceeding the company's expectations. Delivery dates have stretched to late 2026 and even early...

UMC and AP Memory announced a technology and manufacturing partnership on October 22 to develop next-generation power delivery solutions for AI data centers, combining UMC's deep trench...

The Advanced Electronic Packaging Technology (ADEPT) committee under the Global Electronics Association continues to expand its presence in Taiwan.

PCB makers are expanding sustainability efforts as artificial intelligence (AI) and high-performance computing (HPC) drive demand for higher-performance boards. Still, the industry...

The Global Electronics Association hosted a panel titled "Component to System Integration Advances" during the IMPACT 2026 symposium, bringing together industry leaders from Unimicron,...

Taiwanese passive-component maker Holy Stone has entered the supply chain of a major South Korean automaker after about two years of market expansion, prompting the company to raise...

Li Auto's chip and domain controller subsidiary, Mahe Xin Technology, has entered a first-round equity financing agreement worth CNY 1.625 billion (approx. US$243.33 million). The...

Japan's Murata Manufacturing has developed the world's smallest NTC thermistor, the 008004 NCU01 series, measuring 0.25mm × 0.125mm. Compared with Murata's previous smallest...

Rapid advances in AI and high-performance computing (HPC) are driving printed circuit boards (PCBs) toward higher layer counts, greater density, and higher-performance materials, triggering...