中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    AI rack power density surge triggers a new power architecture upgrade cycle
    Jun 9, 18:22
    Global TV shipments rose in 1Q26 as prices stayed stable despite memory increases
    Jun 9, 18:22
    Apple's newly unveiled Siri AI still face China rollout blockage
    Jun 9, 18:22
    Commentary: Why did China's top memory chipmakers landed back on US military list
    Jun 9, 18:22
    Commentary: Nokia and BlackBerry ride Nvidia-led AI infrastructure shift
    Jun 9, 18:22
    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Friday 5 June 2026
    India faces PCB supply squeeze as raw material shocks, AI demand, and import dependence drive costs higher
    India's PCB industry is facing mounting supply constraints and cost pressures, driven by a combination of raw material inflation, logistics disruptions, and a structural reliance on...
    Friday 5 June 2026
    Arm says Taiwan powers its rise as agentic AI lifts PC growth
    Arm CEO Rene Haas told the COMPUTEX keynote on June 2 that Taiwan has been inseparable from Arm's growth over the past 30 years, while Nvidia CEO Jensen Huang said that agentic AI...
    Friday 5 June 2026
    Hiwin targets logistics automation with Dexterity dual-arm robot
    Motion control component maker Hiwin made its first cross-sector appearance at COMPUTEX 2026, showcasing a full technology stack spanning precision transmission, actuator modules,...
    Friday 5 June 2026
    Hanmi Semiconductor eyes record sales in Computex debut as HBM4 demand grows
    Hanmi Semiconductor is projecting record annual revenue this year, as rising demand for high-bandwidth memory equipment lifts prospects for the South Korean chip-equipment maker and...
    Thursday 4 June 2026
    Ventec wins spillover high-speed CCL orders, revenue rises
    Ventec International said May 2026 revenue kept growing, driven by sustained demand for high-margin aerospace polyimide (PI) materials, the start of mass production after high-speed...
    Thursday 4 June 2026
    Samsung's rumored CIS production shift highlights industry debate over fab ownership
    Samsung Electronics' decision to place a key image sensor production line under its System LSI division highlights a broader question facing the CMOS image sensor (CIS) industry: whether...
    Thursday 4 June 2026
    LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

    LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples...

    Thursday 4 June 2026
    Taiwan test interface maker CHPT rides AI chip orders to record May revenue
    Chunghwa Precision Test Tech. (CHPT), a supplier of semiconductor test interfaces, reported revenue in May 2026 that reached another monthly record, supported by sustained orders from...
    Thursday 4 June 2026
    AI sparks tight supply warning for high-end passive components; MLCC rally eyes new super cycle
    AI-driven demand for computing infrastructure has ended the passive components industry's inventory adjustment phase, with Taiwan-based leaders Yageo and Walsin Technology both seeing...
    Thursday 4 June 2026
    Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
    Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
    Thursday 4 June 2026
    Exclusive: China tightens its grip on Silicon Carbide as the industry shifts to 8-inch wafers
    At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a...
    Thursday 4 June 2026
    xMEMS tackles data center heat with chip-level cooling tech
    Surging demand for artificial intelligence computing has accelerated the buildout of data centers, pushing system cooling closer to its limits. As power consumption rises, heat-related...
    Thursday 4 June 2026
    Goldkey targets NT$10B funding to lock in memory supply as prices surge
    Memory module maker Goldkey said it plans to raise NT$6 billion (US$191.4 million) to NT$10 billion in working capital in 2026 through multiple channels as tight supply and rising...
    Thursday 4 June 2026
    Interview: Andhra Pradesh moves to become India's semiconductor packaging hub
    Andhra Pradesh is making its most concrete move yet in semiconductors, zeroing in on packaging as the immediate entry point into the chip supply chain. Speaking on the sidelines of...
    Thursday 4 June 2026
    Taiwan's Walsin Technology gains pricing power from AI demand

    Walsin Technology, one of Taiwan's leading manufacturers of multilayer ceramic capacitors (MLCCs), has notified distributors that it will...

    2/55 pages
    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    marketing
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook