中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Chinese image sensor maker GalaxyCore raises the stakes in high-end CIS
    3min ago
    SK Hynix pushes deeper into logic for next-generation 3D DRAM
    21min ago
    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Thursday 17 September 2026
    Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity
    The global optical communications module market continues to grow, and Taiwan's test and packaging companies are moving to capture demand in silicon photonics (SiPh) transimpedance...
    Thursday 17 September 2026
    AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns

    Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader...

    Thursday 17 September 2026
    Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag
    Google's Humufish TPU project, scheduled to enter mass production by the end of 2027, is set to adopt Intel's EMIB-T advanced packaging technology with support from ASIC partner MediaTek...
    Thursday 17 September 2026
    Chip equipment, materials suppliers lead India investment pledges ahead of SEMICON India 2026

    Foreign commitments timed around SEMICON India are moving deeper into the supply chain. In the three days before the 2026 edition opened...

    Thursday 17 September 2026
    Column: China tightens rare earth controls, exposing hidden vulnerabilities in Taiwan's supply chain
    China's rare earth export controls are changing the rules governing global critical mineral supply chains. For Taiwan, the real concern is not that China could suddenly halt all exports...
    Wednesday 16 September 2026
    Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
    Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
    Wednesday 16 September 2026
    Taiwan CCL makers ride Nvidia's M9 shift as AI servers move to 52-layer PCBs

    Global cloud service providers are continuing to expand AI infrastructure, driving a surge in demand for high-frequency, high-speed...

    Wednesday 16 September 2026
    Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

    AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

    Wednesday 16 September 2026
    Glass substrates, TGV set to reshape 2027 advanced packaging race
    As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
    Wednesday 16 September 2026
    Apple, Intel links sharpen focus on Lens Technology's next glass growth markets
    Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: Apple-linked foldable devices and Intel-linked through-glass-via...
    Wednesday 16 September 2026
    FSC teams with South Korean maker on TGV equipment for glass substrates
    Fu Chun Shin Machinery Manufacture (FSC), a major plastic injection molding machine maker, is expanding further into semiconductors by teaming up with Korean-Chinese joint venture...
    Wednesday 16 September 2026
    A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors
    High-end multilayer polymer capacitors (MLPCs) — increasingly critical to power delivery in AI servers and high-wattage GPUs and CPUs — have historically been dominated...
    Wednesday 16 September 2026
    As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
    At the China International Optoelectronics Expo (CIOE), a palm-sized metal transceiver represents the shift from copper to light in data center infrastructure, one of the biggest transformations...
    Tuesday 15 September 2026
    Murata considers bigger MLCC expansion as AI server demand extends beyond 2028

    Murata Manufacturing is considering a new, potentially larger expansion of multilayer ceramic capacitor (MLCC) capacity beyond its existing...

    Tuesday 15 September 2026
    AI servers are eating MLCC capacity, Chinese suppliers are taking what's left

    AI servers are reshaping the global multilayer ceramic capacitor (MLCC) market. Murata Manufacturing and Samsung Electro-Mechanics (SEMCO)...

    2/67 pages
    BIZ FOCUS
    Sep 21, 08:00
    GMIF 2026 Agenda Unveiled: Tech Giants on Lineup
    Monday 21 September 2026
    Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026
    Friday 18 September 2026
    SK hynix Launches 'SK hynix Ventures' in Silicon Valley
    Monday 14 September 2026
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    reportAIglasses