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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Friday 16 October 2026
LG Innotek targets 2028 glass substrate supply as it expands beyond smartphones
LG Innotek expects to begin supplying glass substrates for advanced semiconductor packaging around 2028 and sees its chip substrate business improving in 2027, as the South Korean...
Friday 16 October 2026
Nvidia unveils PTFE switch board at OCP, names Taiwan partners
Nvidia showcased the latest developments in its MGX server platform ecosystem at the OCP Global Summit 2026, unveiling for the first time a switch board sample using polytetrafluoroethylene...
Friday 16 October 2026
MediaTek ASIC deal with ByteDance would expand data center push
ByteDance is in advanced talks with MediaTek to purchase custom data center chips, with the companies potentially reaching an agreement soon, according to people familiar with the...
Friday 16 October 2026
LG Innotek eyes 2027 chip substrate growth as Big Tech supply talks continue
South Korea's LG Innotek expects its semiconductor substrate business to improve in 2027 as it pursues long-term supply agreements (LTAs) with major technology companies and prepares...
Thursday 15 October 2026
Touch Taiwan 2027 expands tech scope with advanced packaging and SiPh shows
Touch Taiwan 2027 will take place on April 21–23, 2027, and will expand its scope with two dedicated co-located shows: the Advanced Packaging & Testing Expo and the Silicon...
Thursday 15 October 2026
South Korea's Hanwool wins Delta Electronics MLCC inspection equipment order, breaking Japanese dominance
South Korean inspection equipment manufacturer Hanwool Semiconductor has secured an order to supply ultrasonic inspection equipment for multilayer ceramic capacitors (MLCCs) to a subsidiary...
Thursday 15 October 2026
Yuan Jen targets semiconductor shift with focus on packaging, specialty wire materials
Chemical and solvent distributor Yuan Jen Enterprises is actively expanding its electronic materials business. Company chairman Yuan-Jen Hsu stated that Yuan Jen established a dedicated...
Thursday 15 October 2026
Taiwan’s second-generation leaders rebuild family firms, from semiconductor filters to sushi
First-generation Taiwanese entrepreneurs are retiring or leaving their businesses, driving a clear rise in second- and third-generation succession in recent years. At Chimei, for example,...
Thursday 15 October 2026
UMC declines expedited Samsung order for Galaxy Z Fold8; GF eyed as backup DDI foundry
Following stronger-than-expected demand for its Galaxy Z Fold8, Samsung Electronics submitted an expedited wafer production request to United Microelectronics Corporation (UMC) that...
Thursday 15 October 2026
SEMI sees glass substrates entering market by 2028
The rapid expansion of AI and data center chip package sizes is accelerating the adoption of glass substrates, with SEMI's Beth Keser now forecasting market entry around 2028, two...
Thursday 15 October 2026
Topco eyes Idaho base as North American chip expansion accelerates
Topco Scientific (TSC) is evaluating a new base in Boise, Idaho, as the US enters a fresh wave of chip manufacturing expansion and Micron ramps up advanced memory investment. The company...
Wednesday 14 October 2026
Kingboard Laminates raises thin-cloth laminates, prepreg prices 15% in eighth hike of 2026
Kingboard Laminates Holdings (KB Laminates), a leading Chinese manufacturer, announced its eighth price increase of 2026 on October 13, raising prices by 15% for laminates and prepreg...
Wednesday 14 October 2026
PMIC vendors diverge as PC exposure drives revenue gap
Taiwanese power management IC (PMIC) vendors reported their September and third-quarter 2026 revenue, with results diverging as PC exposure widened the performance gap. Global Mixed-mode...
Wednesday 14 October 2026
Taiwan FPCB maker CMI targets flat 2026 revenue despite memory, CPU shortages hitting notebook demand
Flexible printed circuit board (FPCB) manufacturer Complex Micro Interconnection (CMI) reported September 2026 revenue of NT$163 million (≈ US$5.1 million), down 15.43% year-on-year,...
Tuesday 13 October 2026
AI substrate material shortages ease, but advanced equipment emerges as expansion bottleneck
As the customer base for AI accelerators expands rapidly and consumes IC substrate capacity, advanced packaging remains a critical industry bottleneck. Consequently, supply chain attention...