News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Friday 6 February 2026

Nittobo targets 2028 launch for next-generation glass fiber cloth

Nitto Boseki (Nittobo), which currently holds around 90% market share in the semiconductor materials glass fiber cloth segment, is planning to launch its next-generation T-glass glass...

Thursday 5 February 2026

SiTime to buy Renesas timing unit for US$3 billion

SiTime said it will acquire assets related to Renesas Electronics' timing business in a transaction valued at about US$3 billion, as the Japanese chipmaker narrows its focus on embedded...

Thursday 5 February 2026

Google AI platform win elevates Innoscience's 8-inch GaN manufacturing clout

Driven by expanding AI servers, data centers, and new energy applications, third-generation semiconductor gallium nitride (GaN) is moving from niche technology toward mainstream power...

Thursday 5 February 2026

Japan's Ibiden channels US$3.3bn into IC substrate expansion for AI servers

Ibiden plans to invest JPY500 billion (about US$3.3 billion) over three years starting in fiscal 2026 to expand production of its core IC...

Wednesday 4 February 2026

Samsung Electro-Mechanics poised to enter Nvidia NVSwitch substrate supply chain

Samsung Electro-Mechanics (Semco) has secured its first supply role with Nvidia, the world's leading GPU manufacturer, to provide high-end...

Tuesday 3 February 2026

Huawei-linked Hubble invests in automotive chipmaker Norelsys pre-IPO

Norelsys (Tianjin) Co., Ltd. has begun IPO counseling after filing registration for listing guidance with the Tianjin branch of the China...

Tuesday 3 February 2026

Shanghai fast-tracks 'Oriental IC Port,' adds fourth-gen semiconductors to roadmap

China is pushing ahead with its semiconductor materials strategy. Shanghai, one of the country's leading cities, has included brain-computer...

Tuesday 3 February 2026

Ample Electronic expects quarterly growth as silver price drop prompts passive component clients to resume orders

Ample Electronic Technology, a major upstream manufacturer of conductive pastes for passive components, said that the sharp decline in silver has revived downstream customers' ordering...

Tuesday 3 February 2026

C Sun invests NT$1.48 billion in Taichung plant to boost AI advanced packaging equipment

Semiconductor and printed circuit board (PCB) equipment maker C Sun announced plans to invest approximately NT$1.48 billion (US$46.87 million) to acquire a nearly 3,000-ping (106,750...

Tuesday 3 February 2026

Sumitomo Bakelite to acquire Kyocera unit, paving way for Chang Wah expansion

Japanese materials maker Sumitomo Bakelite has announced plans to acquire the materials business of Japanese electronic components company Kyocera. Industry observers say the companies'...

Monday 2 February 2026

Kinsus approves US$744M ABF expansion on clear three-year demand outlook

Kinsus, the IC substrate arm of Pegatron, has approved additional project-based capital spending totaling NT$23.5 billion (approx. US$744 million) to support ABF substrate equipment...

Monday 2 February 2026

Chinese process control powerhouse Jingce targets nearly triple profit growth in 2025

Wuhan Jingce Electronic Group forecasts net profit of CNY80 million to CNY90 million (approx. US$11.5 million to US$13 million) for 2025, representing year-over-year growth of 181.97%...

Monday 2 February 2026

Semco's Tianjin MLCC plant capacity runs flat out on EV, AI server expansion

Rising automotive electronics demand has pushed Samsung Electro-Mechanics (Semco)'s Tianjin plant to full capacity across its multilayer ceramic capacitor (MLCC) production lines,...

Monday 2 February 2026

Taiwan PCB makers vie for AI server market with new 2026 capacity

As demand for AI infrastructure continues to grow steadily, major networking and server PCB suppliers such as Gold Circuit Electronics (GCE), First Hi-tec (FHt), and Allied Circuit...

Friday 30 January 2026

ABF substrate crunch reshapes market: Unimicron leads and rivals close in

AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight...

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook