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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Wednesday 30 September 2026
TDK and Taiyo Yuden to explore alliance on AI-grade capacitors and inductors
TDK and Taiyo Yuden have signed a memorandum of understanding to begin discussions on a business alliance to develop electronic components, including MLCCs and inductors jointly, the...
Wednesday 30 September 2026
Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant
Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026,...
Wednesday 30 September 2026
GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck
GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon...
Wednesday 30 September 2026
AI boom strains PCB supply chain as materials, equipment shortages persist into 2027
Rapid growth in AI server and high-speed networking demand since the second half of 2025 has tightened supply across printed circuit boards (PCBs), integrated circuit (IC) substrates,...
Tuesday 29 September 2026
AI boom sends China and Taiwan's PCB makers racing to HK for capital
Global investment in AI infrastructure is expanding rapidly, driving specification upgrades across the supply chain, from AI servers to high-speed optical modules, and pushing printed...
Tuesday 29 September 2026
Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion
Samsung Electro-Mechanics said it will invest KRW6.78 trillion (about US$5 billion) in South Korea and Vietnam to expand ABF substrate production for AI servers and high-performance...
Tuesday 29 September 2026
Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics...

Tuesday 29 September 2026
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding...
Tuesday 29 September 2026
Trump-Xi state dinner puts tech titans at the head table, spotlighting Taiwan's quiet supply chain clout

Chinese President Xi Jinping and his wife, Peng Liyuan, arrived at the White House on the evening of September 24 US time to attend...

Tuesday 29 September 2026
AI server MLCC prices rise as Chinese suppliers gain ground in generic parts

Multilayer ceramic capacitor (MLCC) prices for AI servers have continued to climb, while prices for general-purpose components used...

Tuesday 29 September 2026
Taiwan PCB output hits record high on AI demand, putting NT$1 trillion year within reach

AI server, high-speed networking, and memory demand continued to lift Taiwan's PCB industry in the second quarter of 2026, boosting...

Monday 28 September 2026
China's Micro Han Xin code takes aim at Data Matrix in semiconductor traceability

China is trying to carve out a foothold in semiconductor supply-chain standards with Micro Han Xin, a miniaturized version of its home-grown...

Friday 25 September 2026
Bright LED Electronics rides PCBA rebound to double-digit growth

Bright LED Electronics said its core profit rebounded in the first half of 2026, helped by recovering printed circuit board assembly...

Thursday 24 September 2026
AI drives Episil GeSi, PMIC growth

Semiconductor epitaxy maker Episil Precision said on September 22 that rising demand from AI data centers has created two main growth...

Thursday 24 September 2026
Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC
Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat...