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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Wednesday 21 October 2026
Advanced PCB drilling faces growing demand from AI and high-speed applications
Topoint Technology is positioning its precision PCB drilling business for rising demand from AI servers, high-performance computing, and high-speed transmission applications. At TPCA...
Wednesday 21 October 2026
AI customers seek 3-year partnerships as Unimicron calls for Taiwan PCB supply chain collab
TPCA Show Taipei 2026, organized by the Taiwan Printed Circuit Association (TPCA), opened on October 20. Unimicron Technology chairman S.C. Chien delivered a keynote at the opening...
Tuesday 20 October 2026
Unimicron chairman sees substrate sizes reaching 14x current scale by 2030
TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance...
Tuesday 20 October 2026
AI server demand lifts Tongtai drilling orders through 2027
Tongtai Machine & Tool said it had order visibility for its printed circuit board (PCB) drilling equipment through the end of 2027 as AI infrastructure demand increased pressure...
Tuesday 20 October 2026
AUO selects glass substrate specs for semiconductor processes, not size rivalry
AUO is tailoring its glass core substrate specifications specifically to semiconductor process requirements rather than competing on panel dimensions with Innolux, according to Chairman...
Tuesday 20 October 2026
AI servers drive TVS and ESD demand for Yea Shin Tech
AI servers are driving demand for power components, transient voltage suppressors (TVS), and electrostatic discharge (ESD) protection devices. Yea Shin Technology, a subsidiary of...
Tuesday 20 October 2026
Daeduck Electronics targets 2029 ceramic substrates for AI packaging
South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor...
Tuesday 20 October 2026
AI substrate bottleneck shifts from design to manufacturing
AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As...
Tuesday 20 October 2026
TPK targets 2028 TGV mass production with NT$6 billion investment
TPK Holding has completed a pilot production line for glass-substrate through-glass via (TGV) technology at its Zhongli plant and started joint development and validation of early-stage...
Tuesday 20 October 2026
Zhen Ding launches PCB talent development platform with National Central University, partners
Zhen Ding Technology Holding announced that it, Elite Material (EMC), Taliang Technology, and Topoint Technology will jointly invest a total of NT$60 million (approx. US$1.85 million)...
Tuesday 20 October 2026
MediaTek's Google TPU v9 faces potential delay over glass substrate yields, but 2026 orders remain strong
Market reports have recently suggested that MediaTek's tensor processing unit (TPU) v9 project with Google could face delays in volume production as Google reportedly revises the chip's...
Tuesday 20 October 2026
DIGITIMES Insight: AI packaging power reaches kilowatt scale as thermal design moves toward the die
Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt...
Monday 19 October 2026
Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years
Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor...
Monday 19 October 2026
Semiconductor equipment demand rises as risks curb AI bubble
SEMI's latest 12-inch fab outlook projects double-digit annual growth in equipment spending from 2026 through 2029, with forecasts revised upward from its previous edition. However,...
Saturday 17 October 2026
Samsung Electro-Mechanics' US$5.1 billion expansion faces equipment supply constraints
Samsung Electro-Mechanics (Semco) faces potential equipment procurement bottlenecks in its KRW6.78 trillion (approx. US$5.1 billion) expansion of semiconductor substrate production...