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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Thursday 10 September 2026
Spirox TGV inspection capable of scanning entire substrate in 20 minutes
As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
Thursday 10 September 2026
China gets an early shot at the next SiC power-chip cycle

Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the...

Thursday 10 September 2026
Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

Thursday 10 September 2026
Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers
AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...
Thursday 10 September 2026
Europe and US IDM grid-to-core push challenges Taiwan power modules
Data-center power systems are entering a new phase as operators move toward 800V HVDC and denser DC-DC architectures, raising demand for high-voltage, low-loss, and high-frequency...
Thursday 10 September 2026
Yageo's August revenue hits record on AI demand
Yageo posted year-over-year and month-over-month revenue growth in August, extending its streak of record monthly highs to a sixth straight month. The passive components maker said...
Thursday 10 September 2026
AI server ODMs face widening component mismatches, with shortages reaching 15–20%
Nvidia's Vera Rubin platform is entering its production ramp, and although server ODM shipments are still expected to ramp further, server ODMs delivered strong operating results in...
Thursday 10 September 2026
Silicon photonics boom could push InP supply-demand gap above 70%, triggering race for strategic optical resources
As AI drives the transition toward high-speed transmission technologies such as 800G and 1.6T, silicon photonics has become increasingly mainstream in high-speed optical communications,...
Wednesday 9 September 2026
Ample Electronic hits 120% utilization as MLCC customers step up copper paste orders
Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic...
Wednesday 9 September 2026
LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks,...

Wednesday 9 September 2026
Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

Wednesday 9 September 2026
Lotte Energy Materials pivots from EV weakness to AI, ESS copper foil
Cooling electric vehicle demand is forcing South Korean copper foil makers to rethink capital and capacity. Lotte Energy Materials has sold a 90% stake in its architectural exterior...
Tuesday 8 September 2026
PCB maker Zhen Ding tops US$634M August revenue on AI server, optical module demand
PCB maker Zhen Ding Technology (ZDT) said business momentum is accelerating as demand strengthens during the traditional peak season. In addition to continued stocking for new mobile...
Tuesday 8 September 2026
What to expect at CIOE 2026, Shenzhen's optoelectronics mega-expo
This week, DIGITIMES heads to Shenzhen to cover an expo showcasing the world of optoelectronics, a class of technologies that serves as the link between electricity and light. In today's...
Tuesday 8 September 2026
ChenFull Precision expands from defense and semiconductor equipment into quantum computing
ChenFull Precision has expanded rapidly in recent years from traditional precision manufacturing operations such as welding and surface treatment into the semiconductor process equipment...