Samsung Electro-Mechanics (Semco) has moved early to commercialize embedded semiconductor substrates, but the window is rapidly closing as Japan's Ibiden and Taiwan's Unimicron prepare...
PCB maker Zhen Ding Technology has launched the second phase of its joint research center with National Tsing Hua University, aiming to deepen collaboration on advanced PCB and IC...
Yageo chairman Pierre Chen said the company has undergone a major transformation over the past eight years, driven in part by the rise of AI applications.
Samsung Electro-Mechanics is considering raising prices for multilayer ceramic capacitors (MLCCs) by about 5% to 10% as demand from artificial intelligence (AI) infrastructure tightens...
Packaging leadframe maker Chang Wah Technology Co., Ltd. reported that it achieved NT$3.672 billion (US$116 million) in revenue in the first quarter of 2026, its fourth-highest quarterly...
Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level...
Amid global supply chain restructuring, Asia's PCB industry is moving toward closer regional collaboration. Industry experts say that as southbound expansion in the PCB sector takes...
ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first,...
Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies...
The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate...
A tightening supply of high-end materials is emerging as a key constraint just as PCB specifications and manufacturing processes move into a new upgrade cycle. Shortages span from...
