Unimicron Technology is reshaping its global production footprint and steering resources toward Taiwan's higher-margin AI supply chain as surging AI and high-performance computing...
Major package substrate makers, including Samsung Electro-Mechanics (Semco), are concentrating capital spending on large, high-layer-count ABF substrates, while capacity expansion...
South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers...
South Korean semiconductor equipment component maker MiCo Ceramics is set to acquire an idle facility in Gumi, North Gyeongsang Province, from LG Display (LGD) for KRW150 billion (approx...
US materials giant 3M recently entered into a strategic partnership with Taiwanese optical component manufacturer Genius Electronic Optical (GSEO), with plans to acquire a 4.7% stake...
As military conflict in the Middle East cripples global energy infrastructure, the United States is emerging as the critical anchor for the world's high-tech manufacturing sector....
South Korean optics maker Optoelec is seeing growing interest from AI data center customers as it seeks to expand its wafer-level optics (WLO) business into high-speed optical communications,...
As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges...
In the era of AI and high-performance computing (HPC), the once-separate worlds of chip design, packaging, and circuit boards are converging. According to the Global Electronics Association,...
Samsung Electro-Mechanics (Semco) is gaining pricing power as AI server demand extends multilayer ceramic capacitor (MLCC) lead times beyond a year. Shortages now span consumer, automotive...
Tesla and Nvidia are reportedly investing a combined KRW3.7 trillion (US$2.8 billion) to help Samsung Electro-Mechanics expand Ajinomoto Build-up Film (ABF) substrate production facilities...
Apple's iPhone Duo has gone on sale, with pre-orders in several key markets reportedly exceeding the company's expectations. Delivery dates have stretched to late 2026 and even early...
UMC and AP Memory announced a technology and manufacturing partnership on October 22 to develop next-generation power delivery solutions for AI data centers, combining UMC's deep trench...
PCB makers are expanding sustainability efforts as artificial intelligence (AI) and high-performance computing (HPC) drive demand for higher-performance boards. Still, the industry...
