CONNECT WITH US
NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Tuesday 8 September 2026
ChenFull Precision expands from defense and semiconductor equipment into quantum computing
ChenFull Precision has expanded rapidly in recent years from traditional precision manufacturing operations such as welding and surface treatment into the semiconductor process equipment...
Tuesday 8 September 2026
Intel CPU prices reportedly rising 10% again as Qualcomm and MediaTek target IPC and IoT gaps
Intel's PC CPU prices have continued to rise since the end of 2025, and supply chain sources said the company is expected to raise them by another 10%. Its low-margin small-core line...
Tuesday 8 September 2026
ViTrox rides AI demand, expands Taiwan push as Malaysia semiconductor base grows
After several years away from SEMICON Taiwan, Malaysia-based inspection equipment maker ViTrox returned to the show this year and has already confirmed plans to exhibit again next...
Tuesday 8 September 2026
Interview: California companies highlight synergy between the state and Taiwan
This year's SEMICON Taiwan saw companies worldwide flock to Taipei to learn new industry developments and score potential business opportunities. Many came from elsewhere in Asia,...
Monday 7 September 2026
JM-Applied sees gas equipment demand surge on AI expansion, order book exceeds NT$3 billion
JM-Applied, a Taiwanese semiconductor gas equipment manufacturer and supply chain member for Micron and TSMC, said on September 4 that revenue in the first half of 2026 exceeded NT$600...
Monday 7 September 2026
Wah Lee sees faster growth in 2027 as supply stays tight
Wah Lee Industrial expects growth to accelerate in 2027 as advanced packaging capacity comes online and foundries continue building overseas fabs, while tight supplies of semiconductor...
Sunday 6 September 2026
Hiwin Mikrosystem targets SiPh inspection gear as capacity expands 20%, order visibility extends to 2Q27
Driven by the shift from copper to optical interconnects, silicon photonics (SiPh) and co-packaged optics (CPO) are moving rapidly toward mainstream adoption, fueling demand across...
Sunday 6 September 2026
I-Chiun eyes Nvidia Vera Rubin supply chain as thermal business nears half of sales
I-Chiun Precision Industry is accelerating its shift from LED lead frames into high-end thermal solutions, with thermal products now accounting for 40-45% of revenue. The company expects...
Sunday 6 September 2026
Tongtai doubles semiconductor orders on AI data-center demand
Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent...
Sunday 6 September 2026
Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem
In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...
Saturday 5 September 2026
Taiwan semiconductor output targets NT$8 trillion
As Semicon Taiwan kicked off at the Taipei Nangang Exhibition Center, the Ministry of Economic Affairs (MOEA) announced that, based on forecasts compiled from multiple research institutions,...
Friday 4 September 2026
Samsung turns to chips, OLED for next phase of Vietnam expansion
Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end chip substrates, OLED displays and R&D emerging as the next pillars of its presence...
Friday 4 September 2026
K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap
Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment...
Friday 4 September 2026
CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures,...
Friday 4 September 2026
Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications
Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications,...