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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Friday 1 August 2025
China's auto sector spirals into chaos, component makers in despair
China's auto and parts industries have historically been entangled in cutthroat price wars. Even with Chinese authorities repeatedly calling for an end to the involution, no improvement...
Friday 1 August 2025
China remains core to server PCB supply despite SEA expansion
Amid rising US-China tech tensions, Taiwan-based PCB suppliers have accelerated factory expansions in Southeast Asia since 2022. However, despite new PCB clusters reaching full production,...
Thursday 31 July 2025
Samsung-Tesla AI chip deal: a potential four-way win for all?
Samsung's major AI chip contract with Tesla has sparked heated discussions, with Elon Musk pledging to personally step in to help Samsung improve production efficiency while hinting...
Wednesday 30 July 2025
From substrate to system: A deep dive into Nvidia's CoWoP packaging shift
As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...
Wednesday 30 July 2025
Yageo expects modest 3Q25 growth amid FX losses
Taiwanese passive component giant Yageo held its earnings call on July 29, 2025, revealing that its second-quarter revenue growth exceeded expectations. It benefited from strong end-market...
Tuesday 29 July 2025
TI tempers outlook as leadframe makers seek new markets
US-based semiconductor giant Texas Instruments (TI) recently released its financial report for the second quarter of 2025. Although quarterly revenue increased by 16% year-over-year,...
Tuesday 29 July 2025
Phison warns of BT substrate shortages, partial supply constraints expected from August 2025
As raw materials for IC substrates face shortages, the supply of BT substrates continues to tighten. This has led to material shortages in flash and SSD packaging ICs. Phison CEO...
Tuesday 29 July 2025
China's PCB industry hit hard by continued bankruptcy wave
China's PCB upstream and downstream supply chain has seen massive expansion supported by government policies in recent years. However, the subsequent industry downturn has led to...
Monday 28 July 2025
Eternal Materials 2Q25 operating profit up 18.6%, but FX losses weigh on earnings
Eternal Materials reported stable shipments across its three core business segments in June, with consolidated revenue totaling NT$3.297 billion (approx. US$110 million), down 1.9%...
Thursday 24 July 2025
AI server boom runs into fiberglass bottleneck
As the four major cloud service providers (CSPs) actively invest in self-developed application-specific integrated circuits (ASICs), market forecasts predict a rapid increase in shipments...
Wednesday 23 July 2025
Dixon Technologies holds back on bare PCB manufacturing despite new govt incentives
Dixon Technologies has decided to pause plans to enter bare PCB manufacturing, citing limited financial upside despite government incentives. During its fiscal first-quarter 2025...
Tuesday 22 July 2025
US copper tariffs send prices soaring, but AI server demand boosts Taiwan's CCL makers
As the US prepares to impose steep tariffs on imported copper, global copper prices have rebounded, raising concerns about rising costs across copper-intensive industries. Among the...
Tuesday 22 July 2025
Taiwan's passive component market poised for growth amid AI and auto boom
Taiwan's passive component industry is positioned for growth driven by AI adoption across cloud servers, AI PCs, and smartphones, alongside rising automotive electrification. Industry...
Tuesday 22 July 2025
Yageo advances Shibaura acquisition talks, factory visits next in cross-border deal
Yageo, Taiwan's leading passive component manufacturer, said its third meeting with Japan's Shibaura Electronics concluded successfully in Taipei, marking a key step in Yageo's ongoing...
Tuesday 22 July 2025
HBM equipment race intensifies as newcomers battle for market entry
Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current...