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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Monday 19 October 2026
Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years
Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor...
Monday 19 October 2026
Semiconductor equipment demand rises as risks curb AI bubble
SEMI's latest 12-inch fab outlook projects double-digit annual growth in equipment spending from 2026 through 2029, with forecasts revised upward from its previous edition. However,...
Saturday 17 October 2026
Samsung Electro-Mechanics' US$5.1 billion expansion faces equipment supply constraints
Samsung Electro-Mechanics (Semco) faces potential equipment procurement bottlenecks in its KRW6.78 trillion (approx. US$5.1 billion) expansion of semiconductor substrate production...
Friday 16 October 2026
Holtek targets higher-value MCU markets with AI server cooling orders set to lift 2027 revenue
Taiwan-based microcontroller (MCU) manufacturer Holtek Semiconductor unveiled its 2026 product roadmap on October 15, focusing on four core areas: smart protection, green energy and...
Friday 16 October 2026
BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead
Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...
Friday 16 October 2026
LG Innotek targets 2028 glass substrate supply as it expands beyond smartphones
LG Innotek expects to begin supplying glass substrates for advanced semiconductor packaging around 2028 and sees its chip substrate business improving in 2027, as the South Korean...
Friday 16 October 2026
Nvidia unveils PTFE switch board at OCP, names Taiwan partners
Nvidia showcased the latest developments in its MGX server platform ecosystem at the OCP Global Summit 2026, unveiling for the first time a switch board sample using polytetrafluoroethylene...
Friday 16 October 2026
MediaTek ASIC deal with ByteDance would expand data center push
ByteDance is in advanced talks with MediaTek to purchase custom data center chips, with the companies potentially reaching an agreement soon, according to people familiar with the...
Friday 16 October 2026
LG Innotek eyes 2027 chip substrate growth as Big Tech supply talks continue
South Korea's LG Innotek expects its semiconductor substrate business to improve in 2027 as it pursues long-term supply agreements (LTAs) with major technology companies and prepares...
Thursday 15 October 2026
Touch Taiwan 2027 expands tech scope with advanced packaging and SiPh shows
Touch Taiwan 2027 will take place on April 21–23, 2027, and will expand its scope with two dedicated co-located shows: the Advanced Packaging & Testing Expo and the Silicon...
Thursday 15 October 2026
South Korea's Hanwool wins Delta Electronics MLCC inspection equipment order, breaking Japanese dominance
South Korean inspection equipment manufacturer Hanwool Semiconductor has secured an order to supply ultrasonic inspection equipment for multilayer ceramic capacitors (MLCCs) to a subsidiary...
Thursday 15 October 2026
Yuan Jen targets semiconductor shift with focus on packaging, specialty wire materials
Chemical and solvent distributor Yuan Jen Enterprises is actively expanding its electronic materials business. Company chairman Yuan-Jen Hsu stated that Yuan Jen established a dedicated...
Thursday 15 October 2026
Taiwan’s second-generation leaders rebuild family firms, from semiconductor filters to sushi
First-generation Taiwanese entrepreneurs are retiring or leaving their businesses, driving a clear rise in second- and third-generation succession in recent years. At Chimei, for example,...
Thursday 15 October 2026
UMC declines expedited Samsung order for Galaxy Z Fold8; GF eyed as backup DDI foundry
Following stronger-than-expected demand for its Galaxy Z Fold8, Samsung Electronics submitted an expedited wafer production request to United Microelectronics Corporation (UMC) that...
Thursday 15 October 2026
SEMI sees glass substrates entering market by 2028
The rapid expansion of AI and data center chip package sizes is accelerating the adoption of glass substrates, with SEMI's Beth Keser now forecasting market entry around 2028, two...