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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Monday 28 September 2026
China's Micro Han Xin code takes aim at Data Matrix in semiconductor traceability

China is trying to carve out a foothold in semiconductor supply-chain standards with Micro Han Xin, a miniaturized version of its home-grown...

Friday 25 September 2026
Bright LED Electronics rides PCBA rebound to double-digit growth

Bright LED Electronics said its core profit rebounded in the first half of 2026, helped by recovering printed circuit board assembly...

Thursday 24 September 2026
AI drives Episil GeSi, PMIC growth

Semiconductor epitaxy maker Episil Precision said on September 22 that rising demand from AI data centers has created two main growth...

Thursday 24 September 2026
Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC
Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat...
Thursday 24 September 2026
OUCC sees semiconductor chemical shipments ramping up in 2027
Oriental Union Chemical Corporation (OUCC) expects shipments of semiconductor chemicals to ramp up in 2027 as more products complete customer qualification, with the Taiwan-based chemical...
Wednesday 23 September 2026
SKC raises Absolics stake to 82% as glass substrates remain in testing
SKC is increasing its investment in its US glass substrate subsidiary Absolics, raising its stake to more than 82%, as the South Korean materials group commits more capital to a business...
Wednesday 23 September 2026
ZDT prices US$800M ECB to expand AI server PCB push

Printed circuit board (PCB) maker Zhen Ding Technology (ZDT) Group completed pricing of its sixth overseas convertible bond issue on...

Wednesday 23 September 2026
Nvidia's 800V power shift hands Taiwan's capacitor makers a new AI segment

As AI computing workloads surge, demand for higher GPU and CPU performance is triggering exponential growth in data center power density...

Tuesday 22 September 2026
BOE looks beyond displays with glass substrates for AI packaging
Chinese display maker BOE Technology is expanding beyond its core panel business. Chairman Chen Yanshun said at the BOE Global Innovation Partner Conference 2026 on September 22 that...
Tuesday 22 September 2026
Nvidia Rubin architecture drives high-end MLCC demand, solidifying Murata, SEMCO leadership

While market focus surrounding AI infrastructure has centered primarily on core computing components—such as GPUs, CPUs, high-bandwidth...

Monday 21 September 2026
Lattice Mach-N2 transitions to 16nm FinFET, integrating post-quantum encryption to strengthen control security

Lattice Semiconductor recently unveiled its next-generation secure control field-programmable gate array (FPGA) series, the Mach-N2...

Monday 21 September 2026
ByteDance's China AI chip push hits substrate shortage

China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...

Monday 21 September 2026
Intel reportedly in talks with AUO on advanced packaging
Intel is reportedly in talks with AUO on Micro LED substrate-based advanced packaging for co-packaged optics (CPO) and high-density computing, as display makers look to turn large-area...
Monday 21 September 2026
Largan makes seventh land, factory purchase of 2026 in co-packaged optics push

Major Taiwanese optical lens maker Largan Precision announced on September 17 that it acquired around 7,468.43 square meters of land...

Monday 21 September 2026
Ampoc AI PCB orders surge as it expands into CPO

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on...