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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Monday 13 July 2026
Samsung develops glass interposer as TSMC expands packaging capacity

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

Monday 13 July 2026
China Life commits US$700M to semiconductor fund under Beijing's patient capital strategy

China Life Insurance Company Limited plans to invest CNY4.999 billion (US$697 million) in a new CNY5 billion semiconductor private...

Monday 13 July 2026
CPO mass production accelerates new four-stage test equipment market
AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including...
Sunday 12 July 2026
Taiwan PCB leaders launch fundraising wave for AI data centers

Taiwan's PCB industry is entering a new expansion cycle as investment in AI data centers and other emerging applications accelerates...

Sunday 12 July 2026
InP supply crunch leaves South Korea exposed
Coherent has agreed to prepay AXT US$22.3 million under a three-year agreement for committed 6-inch indium phosphide substrate capacity, showing how buyers are moving to reserve future...
Sunday 12 July 2026
Hermes Testing's June revenue more than doubles as advanced chip test demand surges
Hermes Testing Solutions said that its June 2026 revenue jumped sharply as rising demand for advanced chip testing lifted sales of its custom products, cleaning materials, and engineering...
Saturday 11 July 2026
Taiwan connector maker Bellwether turns high-current design into patent licensing moat

Bellwether Electronic has evolved from a connector and wire harness manufacturer into a technology developer shaping industry standards...

Friday 10 July 2026
Largan samples CPO product in July 2026, eyes GC edge
Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company's...
Friday 10 July 2026
Sigurd posts record second quarter revenue as Hsinchu plant starts ramping up
Sigurd said its revenue hit a record in the second quarter of 2026 and for the first half of the year, driven by stronger demand from overseas customers. June sales stayed at a high...
Friday 10 July 2026
Wolfspeed challenges Navitas over GaN and SiC patent boundaries

Wolfspeed's patent lawsuit against Navitas Semiconductor has opened a new front in the wide-bandgap power chip race, extending the legal...

Friday 10 July 2026
Topco Scientific's June revenue hits record high on strong photoresist, quartz cloth demand
Topco Scientific (TSC) posted June 2026 revenue of NT$7.51 billion (approx. US$233.49 million), an increase of NT$970 million from May and 32.9% from a year earlier, setting a new...
Friday 10 July 2026
CSP ASIC demand drives structural growth in high-speed interconnects
As cloud service providers (CSPs) continue to ramp up capital expenditures, demand for high-speed interconnects within data centers is accelerating. Multiple research firms forecast...
Friday 10 July 2026
Mitsubishi Chemical, JSW ramp GaN substrate capacity for EVs and data centers

Mitsubishi Chemical and Japan Steel Works are preparing a fresh capacity expansion in gallium nitride (GaN) substrates, aiming to capture...

Friday 10 July 2026
PCB midplane snags cast doubt on Nvidia's Kyber rack timeline

Nvidia has denied reports that its next-generation Kyber AI rack system could be delayed to 2028, saying its product roadmap remains...

Friday 10 July 2026
LG Innotek expands Vietnam footprint with new IC substrate plant
LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to...