Taiwan-based PCB maker Zhen Ding Tech has stated that as customers' next-generation product platforms gradually enter mass production starting from the second quarter of 2026, its...
Taiwanese printed circuit board (PCB) giant Zhen Ding Technology Group held a groundbreaking ceremony for the HD Campus of the "Zhen Ding Technology Group Huai'an Tech City" in Huai'an,...
Powerchip Semiconductor Manufacturing (PSMC) held an earnings call on April 21 to address developments in memory and logic foundry services, as well as its future business outlook...
Powerchip Semiconductor Manufacturing (PSMC) reported revenue of NT$13.57 billion (approx. US$432 million) in the first quarter of 2026, up 6% from the previous quarter and 22% year...
Optical communications company APAC Opto Electronics reported that its inventory digestion phase is nearing completion, with market demand showing a clear rebound. Looking ahead to...
In 2026, critical semiconductor materials face a perfect storm of rising prices, shortages, and geopolitical disruption. Lead times for multilayer ceramic capacitors (MLCCs) and power...
Brand Cheng, chairman of Foxconn Industrial Internet (FII), a cloud networking business under Foxconn, recently announced ongoing advancements in technologies, including co-packaged...
AI GPUs, CPUs, and ASICs are driving demand for increasingly larger sizes and higher layer counts in substrate technology. The supply-demand gap for high-end ABF substrates continues...
Printed circuit board (PCB) giant Zhen Ding Technology held a board meeting on April 17 and approved plans for its subsidiary, Leading Interconnect Semiconductor Technology (LIST),...
Japanese electronic components maker Taiyo Yuden recently issued a price increase notice, announcing that it will raise prices on some products starting in May, specifically in the...
Glass core substrates, valued for their low dielectric loss and warpage reduction, are key to next-generation advanced semiconductor packaging. In South Korea, traditional glass makers...
AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers...
The 2026 International Symposium on VLSI Technology, Systems and Applications (VLSI TSA) kicked off on April 14, gathering over 800 semiconductor professionals worldwide. The conference...
