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    China humanoid robot chips shift focus from raw compute to coordination efficiency
    4h 12min ago
    Russia drives ICE exports as Europe masks NEV transshipment demand
    4h 12min ago
    China tightens grip on LCD panels as TV share nears 80% and monitor share tops 70%
    4h 12min ago
    Samsung’s HBM comeback is only the beginning, exec warns
    4h 13min ago
    Commentary: AMD’s Taalas acquisition signals a shift toward ASIC-based AI inference
    4h 14min ago
    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Monday 17 August 2026
    Samsung Electro-Mechanics, LG Innotek substrate lines near full capacity as AI demand rises

    Samsung Electro-Mechanics (SEMCO) and LG Innotek pushed their semiconductor package substrate operations close to full capacity in...

    Monday 17 August 2026
    Topoint's high-end drill bits hit 56% share ahead of schedule, aims to double capacity by end of 2028

    Printed circuit board (PCB) drill bit manufacturer Topoint Technology stated during its second-quarter 2026 earnings call that strong...

    Monday 17 August 2026
    Toppan eyes FC-BGA substrate price hikes as new line fills up
    Japan's Toppan is negotiating price increases for FC-BGA substrates with customers as its new FC-BGA substrate plant ramps up, lifting the operating margin of its electronics business...
    Monday 17 August 2026
    T-glass demand surges as IC substrate makers see shortages through 2028
    As the global AI computing infrastructure boom drives rapid demand growth for GPUs, CPUs, and ASICs, the ABF substrate industry is set to swing into shortage in 2026, with the supply-demand...
    Saturday 15 August 2026
    Lotes sees tight supply, says demand remains intact

    Connector maker Lotes is deepening its server business, with its server quick disconnect (QD) line set to enter mass production in July,...

    Saturday 15 August 2026
    Tripod posts record second-quarter margins on strong server and memory demand
    Tripod Technology said revenue and profit both hit record highs in the second quarter of 2026, driven by strong shipments of server and memory products and the continued effect of...
    Friday 14 August 2026
    OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?

    For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove...

    Friday 14 August 2026
    Eternal Precision Mechanics accelerates advanced packaging push with wafer lamination
    Eternal Precision Mechanics (EPM), a small but fast-growing subsidiary of Eternal Materials, is accelerating its shift from IC substrates into advanced packaging equipment. The company...
    Friday 14 August 2026
    Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
    International tungsten prices have risen 666% year-on-year amid China's export controls, while the US Department of Commerce recently announced restrictions on exports of tungsten...
    Friday 14 August 2026
    LandMark Optoelectronics says silicon photonics capacity is "very, very tight"
    LandMark Optoelectronics said demand for its silicon photonics (SiPh) products is extremely strong, with output expected to keep rising over the next several quarters as capacity at...
    Friday 14 August 2026
    China PCB makers pour billions into AI server, HPC, optical markets
    Chinese printed circuit board (PCB) makers are stepping up investment in higher-value markets including AI servers, high-performance computing (HPC) and optical communications. Following...
    Friday 14 August 2026
    Interview: 'Modern warfare is a battle of PAs'–Transcom targets overseas defense, LEO satellite growth

    Amid escalating geopolitical tensions, defense awareness is rising rapidly worldwide, with drone and counter-drone technologies becoming...

    Friday 14 August 2026
    ABF substrate boom lifts Eternal Precision prices 20%

    Strong Ajinomoto Build-Up Film (ABF) substrate demand has driven a surge in orders for vacuum laminating equipment, with Eternal Precision...

    Friday 14 August 2026
    Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure
    AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.
    Friday 14 August 2026
    Korea's CNT pellicle race heats up as aweXome Ray pushes toward EUV commercialization
    As South Korea's major memory manufacturers race to secure next-generation lithography technologies for increasingly advanced process nodes, the approaching High-NA EUV era is adding...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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