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    Huawei's AITO targets Europe as Maextro faces brake-component controversy
    8h 6min ago
    SmartSens raises CNY3.2 billion to target automotive CIS and robot vision
    8h 6min ago
    Chinese automakers face three hidden barriers in European expansion
    8h 6min ago
    Why high-tech power plant investment still remains conceptual
    8h 6min ago
    Ecosia drops Mistral AI models for Chinese open-weight alternatives
    8h 6min ago
    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Monday 12 October 2026
    How 'Filter Moore's Law' is doubling revenue for a Taiwan chip filter maker
    Under what the industry terms the "Filter Moore's Law," each process node shrink lowers tolerance for airborne molecular contaminants, causing filtration demand to grow exponentially...
    Monday 12 October 2026
    Sumitomo Bakelite expands packaging material production across Singapore, China
    Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This...
    Monday 12 October 2026
    AI racks approach megawatt power levels as SiC, GaN, silicon divide power delivery roles
    The rapid expansion of AI infrastructure is driving demand for higher power and voltage levels, pushing power semiconductor development toward greater efficiency, higher power density,...
    Monday 12 October 2026
    Weekly news roundup: Musk's Terafab faces reality check; Samsung HBM4E clears quality validation
    This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces...
    Monday 12 October 2026
    India roundup: AI data center buildout accelerates as semiconductor push continues to broaden

    India's technology buildout is deepening across semiconductors and AI infrastructure, with chip IP, packaging and equipment initiatives advancing...

    Saturday 10 October 2026
    TPCA Show 2026 to spotlight AI computing, Unimicron chair keynote
    As explosive AI computing demand drives hardware architecture change, Taiwan Printed Circuit Association (TPCA) is set to open its annual flagship event, with the 21st International...
    Saturday 10 October 2026
    Semco moves glass substrates to package-level testing
    Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking...
    Saturday 10 October 2026
    JNTC bets US$259 million on glass substrates ahead of 2028 ramp
    South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...
    Saturday 10 October 2026
    Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst
    Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years,...
    Friday 9 October 2026
    Ample revenue slips in September as passive component demand stays strong

    Ample Electronic, a supplier of conductive paste materials for the passive components industry, reported September 2026 revenue of NT$304 million (approx. US$9.6 million), down...

    Friday 9 October 2026
    Inpaq reshuffles management, appoints Joyin chair as new head
    Inpaq, part of the PSA Group, said it will eliminate the chief executive officer (CEO) position effective immediately as it adjusts its organizational structure and management responsibilities...
    Thursday 8 October 2026
    Hanmi wins rare Samsung order amid US$5 billion chip substrate expansion
    South Korea's Hanmi Semiconductor has secured a KRW24.48 billion (approx. US$18.3 million) equipment order from Samsung Electro-Mechanics, a rare deal with a Samsung Group affiliate...
    Thursday 8 October 2026
    Viking Tech lead times stretch to 6 months; orders seen into 2H27
    Viking Tech said demand from AI, data centers, server power, military, and aerospace applications has kept capacity fully loaded as it enters the fourth quarter of 2026, with its book-to-bill...
    Thursday 8 October 2026
    AI demand drives Episil SiC V-shaped recovery as GaN and TVS capacity reaches full utilization
    Episil Technologies Chairman Rex Hsu said overall demand has gradually recovered following an industry downturn, with silicon carbide (SiC) capacity utilization rebounding sharply...
    Thursday 8 October 2026
    Doosan bets big on China as CCL prices climb
    South Korea's Doosan is directing more than half of its record KRW968.4 billion (approx. US$724 million) copper-clad laminate (CCL) investment to China, positioning itself closer to...
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    BIZ FOCUS
    Oct 8, 08:00
    Nuvoton, AMI Empower AI Factories Via Arbel NPCM8XX OpenBMC
    Thursday 8 October 2026
    Edge-Cloud Computing Blocks Scams Before the Click
    Thursday 8 October 2026
    Dietary Therapy in Traditional Chinese Medicine and Modern Nutritional Science
    Wednesday 7 October 2026
    Chunghwa Telecom's Simplified Modular Data Center delivers fast turnkey deployment