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    Motorola and Google drove 28% growth in North American foldable smartphone shipments in 2025
    6h 46min ago
    2AM's Lim Seul-ong highlights untapped AI potential in entertainment experience economy at AI Expo 2026
    6h 46min ago
    Analysis: OpenAI shifts focus to compete with Anthropic; Gemini targets consumers with Apple's collaboration
    6h 46min ago
    AI computing power to drive semiconductor revenues to US$1.8 trillion by 2030
    7h 5min ago
    TSMC prioritizes 3nm capacity supply for cloud AI and loyal clients
    7h 8min ago
    DIGITIMES chairman and Acer founder praise Taiwan's important role in AI industry
    7h 13min ago
    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Thursday 26 March 2026
    Innos set for late April listing on TPEx, riding advanced packaging boom
    Probe card automation equipment maker Innostar Service (Innos) is expected to list on the Taipei Exchange (TPEx) main board in late April 2026. With artificial intelligence (AI) applications...
    Thursday 26 March 2026
    Holy Stone expects AI-driven surge in MLCC demand to lift 2026 revenue
    Holy Stone Enterprise expects a 20–30% rise in passive component revenue in 2026 as demand for high-power AI server components accelerates globally. Doubling AI product sales...
    Thursday 26 March 2026
    Lelon Electronics eyes 10% revenue growth in 2026 driven by automotive and AI servers
    Lelon Electronics expects shipments to rise in 2026, driven by automotive electronics and AI servers, with wider supply-chain and pricing implications for global electronics manufacturers...
    Thursday 26 March 2026
    Broadcom to mass-produce 400G single-lane PAM4 DSP by 2027, vows to maintain lead
    Broadcom recently announced that it completed development of a 400G single-lane PAM4 digital signal processor (DSP) at the Optical Fiber Communication Conference (OFC) 2026, signaling...
    Wednesday 25 March 2026
    Taiwan Mask poised for advanced packaging growth in 2H26 off semiconductor rebound
    Riding a semiconductor industry recovery and AI-driven demand for advanced packaging, Taiwan Mask Corporation (TMC) President Lidon Chen said the company expects significant and substantial...
    Wednesday 25 March 2026
    Samsung reportedly set to begin GaN foundry production, prepare SiC samples
    Samsung Electronics is reportedly set to begin mass production at its gallium nitride (GaN) power semiconductor foundry line as early as the second quarter, while also preparing silicon...
    Tuesday 24 March 2026
    MediaTek's Airoha takes on US giants in optical comms DSP chip arena
    The expansion of AI data centers is creating new business opportunities that are opening the door for upstarts to challenge industry leaders. A prime example is the four-level pulse...
    Tuesday 24 March 2026
    China's AI GPUs face equipment and software constraints, but system-level design boosts self-reliance
    Although it may appear that China's AI GPU development is behind the US by one or more generations, a recent Morgan Stanley report reveals the actual gap is smaller than widely per...
    Monday 23 March 2026
    China moves into high-end photoresist production: Dinglong ramps up, YMTC lends support
    As geopolitical tensions and energy transport risks heighten volatility in the global semiconductor supply chain, the stability of upstream critical materials — particularly...
    Monday 23 March 2026
    Commentary: CPO mass production put to test as photonic integration faces challenges
    Driven by massive demand from cloud AI, silicon photonics continues to gain momentum. At the Optical Fiber Communication Conference (OFC 2026), industry players engaged in in-depth...
    Monday 23 March 2026
    Ventec eyes double-digit growth in 2026 amid product price hikes and niche material expansion
    Niche copper-clad laminate (CCL) manufacturer Ventec expects to achieve double-digit revenue growth in 2026, driven by ongoing product price increases and strategic expansion into...
    Monday 23 March 2026
    Konica Minolta to expand AI chip inspection optics capacity 2.6x by 2027

    Japanese optical component and office equipment maker Konica Minolta said on March 18 it will scale up its optical components business for...

    Monday 23 March 2026
    Taiwan materials maker Daxin pivots to semiconductors with new display film ramp in 2026
    Daxin Materials is expanding its semiconductor materials portfolio while maintaining optimization efforts in display materials. The company expects 2026 display material revenue to...
    Friday 20 March 2026
    Lumotive makes optical breakthrough, targets 10,000-port data centers

    As Nvidia and Coherent signal a shift toward all-optical networking to solve the AI power crisis, Redmond-based Lumotive has announced a milestone...

    Friday 20 March 2026
    Research Insight: AI reshapes Taiwan's PCB industry around high-end capacity and materials
    DIGITIMES observes that as demand surges for AI servers, high-speed switches, optical communication modules, and edge AI devices, Taiwan's PCB industry is undergoing a structural...
    1/47 pages
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook