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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Tuesday 16 June 2026
China mass produces silicon-28 amid quantum computing race with US

China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) —...

Tuesday 16 June 2026
AMD opens EFB front beyond CoWoS, putting Taiwan substrate trio in play
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility...
Tuesday 16 June 2026
TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...

Tuesday 16 June 2026
Supply security over cost: Google leads CSP charge to diversify InP substrate sourcing

China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity...

Tuesday 16 June 2026
AT&S to invest up to EUR2 billion in Malaysia to expand AI substrate capacity
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as...
Monday 15 June 2026
Walsin sees passive component crunch stretching into 2028 as memory shortages weigh

Walsin Technology expects the tight supply of passive components could last into 2028, as demand from AI infrastructure, automotive...

Monday 15 June 2026
Wus Printed Circuit sees turnaround on high-end PCB demand

Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward...

Monday 15 June 2026
China eases InP substrate exports, lifting compound semiconductor supply

China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026...

Monday 15 June 2026
General-purpose server demand exceeds expectations; component shortages expected to normalize in 3Q26

While artificial intelligence (AI) server orders remain robust, tight component supplies have raised concerns about shipments across...

Monday 15 June 2026
LG Innotek's Vietnam substrate investment plan comes as FC-BGA demand broadens

LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand...

Sunday 14 June 2026
Chunghwa Leading Photonics targets SWIR testing demand in advanced packaging

Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has...

Saturday 13 June 2026
PCIM 2026: Why Western carmakers cannot have 'China-free' SiC at subsidized prices

During a panel discussion between executives and research experts from Bosch, Infineon, Rohm Semiconductor, Nexperia, Wolfspeed, and...

Friday 12 June 2026
Taiwan compute suppliers rise on booming AI demand, with several firms extending strong growth
Taiwan's semiconductor and electronics supply-chain companies continued to post generally firm sales in May, according to monthly revenue data and company disclosures, with the strongest...
Friday 12 June 2026
PCIM 2026: Accepting local component deficits for system-level benefits

In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth),...

Thursday 11 June 2026
Nvidia takes PCB material competition upstream as HVLP4 copper foil gap widens
AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains...