News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Monday 31 August 2026

Unimicron search puts spotlight on cross-border manufacturing for Taiwan's electronics sector

Unimicron, a major Taiwanese IC substrate maker, came under intense supply chain scrutiny last week after reports that prosecutors and investigators searched the company over a suspected...

Monday 31 August 2026

Unimicron stock prices fall 10% daily limit, says origin probe covers PCBs, not substrates

Unimicron Technology shares plunged to Taiwan's 10% daily downside limit on August 31, the first trading session after prosecutors disclosed...

Monday 31 August 2026

Kingboard Laminates raises prices again as CCL shortages deepen

Kingboard Laminates, a leading Chinese copper-clad laminate (CCL) maker, has issued another price increase notice as shortages of core materials such as fiberglass cloth and copper...

Monday 31 August 2026

South Korea risks 'HBM 2.0' trap in emerging CPO market

Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...

Monday 31 August 2026

China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands

Hangzhou Lion Microelectronics plans to invest about CNY3 billion (approx. US$446 million) in a new 12-inch silicon wafer project in Jiaxing,...

Saturday 29 August 2026

Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM

The AI infrastructure race has spent the past few years fixated on high-bandwidth memory as one of the most indispensable building blocks of accelerated compute. Yet as model sizes,...

Friday 28 August 2026

Update: ABF substrate maker Unimicron searched in origin-labeling probe

(The latest status of the probe as of August 29th is updated below.)

Friday 28 August 2026

Long-term contracts tie up InP capacity due to data center optics demand

Compound semiconductor supply-chain players say China has recently eased some substrate export controls, but the upgrade of high-frequency transmission in AI data centers toward 200G...

Thursday 27 August 2026

HBM hybrid bonding delayed by 300°C heat and CMP dishing

As high-bandwidth memory (HBM) stack counts continue to rise, the industry originally anticipated that hybrid bonding (HB), a next-generation packaging solution, would be officially...

Thursday 27 August 2026

Doosan thins memory-package CCL insulation to 13µm

Doosan Corporation's Electro-Materials BG has developed copper-clad laminate (CCL) technology that reduces the prepreg (PPG) insulating layer used in memory semiconductor package substrates...

Thursday 27 August 2026

AI glass substrate race shifts toward reliability and mass production

The competition to develop glass substrates for artificial intelligence (AI) semiconductor packaging is intensifying, with Japanese and South Korean manufacturers pursuing different...

Wednesday 26 August 2026

Record mid-2026 growth for WUS Printed Circuit and China's pivot to ultra-high-layer PCBs

The global hardware supply chain is undergoing a structural transformation, driven by an unprecedented surge in artificial intelligence infrastructure investment. "This shift has brought...

Wednesday 26 August 2026

Kyocera to ramp up MLCC production for AI servers with JPY60B investment

Japanese components maker Kyocera is making a major push to capture surging AI demand. As part of its mid-term growth strategy toward FY2031, the company plans to begin mass production...

Tuesday 25 August 2026

Nexperia China rebuilds 12-inch local supply chain after 330 days

Nexperia China said it has rebuilt a domestic 12-inch wafer supply chain after 330 days of overseas wafer supply disruptions, unveiling the new platform at a press conference outlining...

Tuesday 25 August 2026

AI's power crunch hits Taiwan: foundry capacity tightens, chip prices climb into 2H26

AI data centres are becoming a new stress point for the global power and semiconductor supply chain. As facilities shift towards megawatt-scale architectures, demand is rising for...

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Aug 31, 08:00

NewPower Worldwide expands credit facility to $750M for growth

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