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    CXMT valuation gap highlights uncertainty over China’s DRAM push
    1h 21min ago
    Interview: Memory makers’ expansion drives up material costs and exposes FOUP shortages
    1h 21min ago
    BYD accelerates in-house chip push with 4nm Xuanji A3
    1h 21min ago
    Intel China adds day 0 support for MiniMax H3 after DeepSeek
    1h 21min ago
    L&F Plus ships first samples from South Korea’s first LFP cathode mass-production line
    1h 22min ago
    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Monday 3 August 2026
    AI infrastructure orders extend PCB expansion race
    Global demand for AI infrastructure is rising, and as order visibility improves, the PCB supply chain has launched a marathon of factory expansion. Upstream copper-clad laminate (CCL)...
    Monday 3 August 2026
    India expands chip talent pipeline amid surging global chip demand
    India has stepped up efforts to build a larger semiconductor workforce through training, curriculum reform, and industry partnerships. The plan matters beyond India because chip supply...
    Monday 3 August 2026
    Samsung Electro-Mechanics deepens AI supply-chain bet with new contracts, eyes glass substrate production in 2027
    Samsung Electro-Mechanics used its second-quarter earnings call to signal that its bet on AI infrastructure is paying off and about to get bigger, pointing to a run of long-term supply...
    Monday 3 August 2026
    Flexible PCB maker Flexium sees AI server shipments doubling after 2Q margin turns positive
    Flexium Interconnect said its second-quarter operating loss narrowed from the previous quarter as new flexible printed circuit products entered mass production for a US customer's...
    Monday 3 August 2026
    C.C.P. Contact Probes teams with chipmaker on MEMS probes and test-cleaning sheets
    C.C.P. Contact Probes said it has expanded its presence in the AI sector through a joint development project with a major semiconductor company covering microelectromechanical systems...
    Monday 3 August 2026
    AI server demand revives long-term MLCC supply agreements as shortages intensify
    Surging demand for AI servers is tightening global capacity for high-end passive components, prompting customers to once again pursue long-term supply agreements (LTSAs) as they seek...
    Saturday 1 August 2026
    Elite Material posts record 2Q result on strong AI-related demand
    Elite Material Co. said booming demand for advanced materials used in AI hardware kept its factories fully loaded in the second quarter of 2026, lifting revenue and profit to record...
    Saturday 1 August 2026
    Thintronics wins proposed US CHIPS incentives for advanced substrate technology
    Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research...
    Friday 31 July 2026
    AI server boom reshapes MLCC pricing as capacity shifts upmarket

    The rapid expansion of AI infrastructure is reshaping one of the semiconductor industry's most overlooked component markets. Soaring...

    Friday 31 July 2026
    Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

    Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

    Friday 31 July 2026
    Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
    TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
    Friday 31 July 2026
    Chang Wah sees broadening demand recovery and higher margins in 2Q26
    Chang Wah Technology said stronger demand and tighter inventories are lifting its business across multiple markets, a sign that the recovery in electronics supply chains is widening...
    Thursday 30 July 2026
    Japan and South Korea MLCC makers signal further price hikes amid AI demand

    Japan and South Korea's MLCC suppliers are again raising prices, signaling tighter supply conditions that could affect electronics...

    Wednesday 29 July 2026
    China's glass substrate supply chain takes shape for AI chip packaging
    Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
    Wednesday 29 July 2026
    Huawei targets 2027 glass substrate production to gain an edge in AI chips

    Huawei is reportedly working through its domestic supply chain to begin mass production of semiconductor glass substrates in 2027,...

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    Research Report Database
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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