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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Tuesday 31 March 2026
Elite Material plans multi-country expansion to reach 9.45 million CCL sheets monthly capacity by 2027
Elite Material (EMC), a leading Taiwanese copper-clad laminate (CCL) manufacturer, announced the completion of capacity expansions at its Huangshi and Zhongshan plants in China and...
Tuesday 31 March 2026
Top 10 chart: Taiwan's AI winners diverge as market corrects ahead of lagging revenue data

By late March, Taiwan's equity market is offering a more nuanced read of the AI infrastructure boom. While accumulated revenue and year-over-year...

Tuesday 31 March 2026
Huawei poaches top scientist as Germany's tenure rules drive talent away
Huawei has recruited a leading scientist from a German research institute, raising concerns among the German government and academic circles. According to Nikkei Asia, Martin...
Tuesday 31 March 2026
DDI price hikes mainly aim to pass on costs, not boost profits
The recent surge in display driver IC (DDI) price hikes has spread from China to Taiwan, with reports indicating that Taiwanese DDI design firms will begin raising prices starting...
Tuesday 31 March 2026
Fuel cell shift to metal bipolar plates opens door for Taiwan manufacturers
The Metal Industries Research & Development Centre (MIRDC) held the "2026 Metal Bipolar Plate Drives New Generation of Hydrogen Energy Symposium" on March 27, focusing on fuel...
Monday 30 March 2026
Passive component maker Tai-Tech wins US client, scales Malaysia plant for AI server, EV demand

Taiwan inductor maker Tai-Tech has begun mass production at its Malaysia plant, targeting customers shifting supply chains away from China...

Monday 30 March 2026
Tai-Tech flags AI, auto demand as inductor price hikes loom
Taiwan-based inductor maker Tai-Tech Advanced Electronics said artificial intelligence and automotive electronics will drive growth in 2026, as rising raw material costs are setting...
Saturday 28 March 2026
Holy Stone Enterprise expands Japan and Taiwan capacity, signaling tighter MLCC supply for AI power supplies
Holy Stone Enterprise plans to invest another NT$3 billion (US$94 million) to add a production line at its Hokkaido R&D center and expand capacity at its Yilan Lize plant in Taiwan...
Friday 27 March 2026
PCB material shortages intensify as CCL lead times hit 6 months, quota system imposed
The surge in AI applications driving PCB material upgrades is exacerbating upstream raw material supply shortages. Notably, besides ongoing price hikes, some IC substrate makers report...
Friday 27 March 2026
Eikei targets automotive and AI markets, establishes Slovakia subsidiary
Automotive printed circuit board (PCB) manufacturer Eikei Group announced plans to establish a subsidiary in Slovakia, aiming to diversify geopolitical risks across its three major...
Friday 27 March 2026
UPS and Applied Materials boost Taiwan semiconductor logistics with new Taoyuan hub
Targeting the growing needs of Taiwan's high-tech and semiconductor sectors, UPS has officially launched its Taoyuan International Logistics Center (TILC) with a total investment nearing...
Thursday 26 March 2026
Innos set for late April listing on TPEx, riding advanced packaging boom
Probe card automation equipment maker Innostar Service (Innos) is expected to list on the Taipei Exchange (TPEx) main board in late April 2026. With artificial intelligence (AI) applications...
Thursday 26 March 2026
Holy Stone expects AI-driven surge in MLCC demand to lift 2026 revenue
Holy Stone Enterprise expects a 20–30% rise in passive component revenue in 2026 as demand for high-power AI server components accelerates globally. Doubling AI product sales...
Thursday 26 March 2026
Lelon Electronics eyes 10% revenue growth in 2026 driven by automotive and AI servers
Lelon Electronics expects shipments to rise in 2026, driven by automotive electronics and AI servers, with wider supply-chain and pricing implications for global electronics manufacturers...
Thursday 26 March 2026
Broadcom to mass-produce 400G single-lane PAM4 DSP by 2027, vows to maintain lead
Broadcom recently announced that it completed development of a 400G single-lane PAM4 digital signal processor (DSP) at the Optical Fiber Communication Conference (OFC) 2026, signaling...