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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Wednesday 27 May 2026
Sino-American Silicon taps AI to tackle Taiwan's green power crunch
Sino-American Silicon Products (SAS) is turning to AI-based power management as Taiwan's green-power shortage persists, and electricity demand from advanced chipmaking and AI data...
Wednesday 27 May 2026
WinWay weighs Texas shift after AI chip testing surge in North America
US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only...
Wednesday 27 May 2026
Hiwin opens Italy HQ, bridging Europe to global markets
Taiwanese machinery component maker Hiwin has officially opened its new headquarters in Agrate Brianza for its Italian subsidiary, saying the site will serve as a key hub connecting...
Wednesday 27 May 2026
PCB drill bit maker Topoint raises NT$600 million, brings in PCB giants as strategic investors
Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600...
Tuesday 26 May 2026
LED maker Ennostar pivots to optical interconnects after high-value shift agin traction
Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account...
Tuesday 26 May 2026
Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die —...
Tuesday 26 May 2026
Taiwan MLCC makers plug into AI server demand
AI servers are driving a surge in demand for high-end passive components, rapidly eating into multilayer ceramic capacitor (MLCC) capacity and extending lead times to more than 16–20...
Tuesday 26 May 2026
Wingtech sues Nexperia for US$1.2B as it fights delisting risk
Wingtech Technology, the Chinese tech company that owns Dutch semiconductor manufacturer Nexperia, has filed a civil lawsuit against Nexperia and five defendants for alleged damages...
Tuesday 26 May 2026
Holy Stone Enterprise says AI power surge will deepen global MLCC shortages
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks...
Tuesday 26 May 2026
Lightmatter joins TSMC on COUPE for 3D optical engines
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
Monday 25 May 2026
AI servers drive order growth; Weltrend's fan motor driver IC visibility strong
At its earnings conference, Weltrend Semiconductor described the first quarter of 2026 as an exceptional one. Despite the period being historically slow, the company posted year-over-year...
Monday 25 May 2026
AI data centers spark 800V HVDC rush for Taiwan lead frame suppliers

The shift toward 800V high-voltage direct current (HVDC) power architectures in AI data centers is driving a surge in demand for power...

Monday 25 May 2026
Ample Electronic says AI demand is boosting MLCC-related passive components
Ample Electronic said rising demand from artificial intelligence end customers has driven a stronger market for multilayer ceramic capacitors and related passive components, lifting...
Monday 25 May 2026
Samsung Electro-Mechanics secures large silicon capacitor supply contract
Samsung Electro-Mechanics (Semco)'s KRW1.5 trillion (approx. US$990 million) silicon capacitor supply contract with a major global company could reshape component supply for AI servers,...
Monday 25 May 2026
Embedded substrates draw AI chip interest as packaging turns strategic
Rising interest in embedded substrates among Nvidia, AMD, and Intel signals potential shifts in AI data‑center supply chains, as the technology promises improved signal integrity...