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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Monday 21 September 2026
Lattice Mach-N2 transitions to 16nm FinFET, integrating post-quantum encryption to strengthen control security

Lattice Semiconductor recently unveiled its next-generation secure control field-programmable gate array (FPGA) series, the Mach-N2...

Monday 21 September 2026
ByteDance's China AI chip push hits substrate shortage

China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...

Monday 21 September 2026
Intel reportedly in talks with AUO on advanced packaging
Intel is reportedly in talks with AUO on Micro LED substrate-based advanced packaging for co-packaged optics (CPO) and high-density computing, as display makers look to turn large-area...
Monday 21 September 2026
Largan makes seventh land, factory purchase of 2026 in co-packaged optics push

Major Taiwanese optical lens maker Largan Precision announced on September 17 that it acquired around 7,468.43 square meters of land...

Monday 21 September 2026
Ampoc AI PCB orders surge as it expands into CPO

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on...

Sunday 20 September 2026
Charts: Two-thirds of Taiwan's chip equipment growth comes from testing AI chips

Taiwan's listed semiconductor equipment, components, and solutions suppliers are growing at nearly twice the pace of the chipmakers...

Saturday 19 September 2026
Memory recovery, price hikes lift Niching IC substrate outlook, order visibility through 2H27

Semiconductor packaging and testing materials distributor Niching Industrial hosted an investor conference on September 17. chief financial...

Saturday 19 September 2026
Ventec invests NT$1.5 billion in Kunshan expansion for AI, HDI orders

Copper-clad laminate (CCL) manufacturer Ventec International Group has approved an expansion budget of NT$1.5 billion (approx. US$47.11...

Friday 18 September 2026
Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management
China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have highlighted ultra-wide bandgap (UWBG) semiconductor materials,...
Friday 18 September 2026
Winbond cements server NOR lead with Infineon deal
Winbond Electronics is expanding its NOR Flash footprint and has agreed to pay US$1.12 billion in cash to acquire Infineon's NOR Flash and F-RAM businesses, a move that will lift it...
Friday 18 September 2026
Doosan commits KRW968 billion to CCL expansion as demand strains capacity
Doosan is investing KRW968.4 billion (approx. US$701 million) to expand high-end copper-clad laminate (CCL) production in South Korea and China, its largest-ever investment in the...
Friday 18 September 2026
CPO raises PCB downgrade concerns but switches stick with M8 CCL

As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that...

Friday 18 September 2026
Mobile SoC battle for 2026 centers on NPUs

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...

Friday 18 September 2026
GaN is winning the AI power argument, not yet the cost battle

Gallium nitride (GaN) is emerging as a key power semiconductor for AI data centers, where rising rack power and the shift toward higher-voltage...

Friday 18 September 2026
Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape

In response to rapid AI market growth, the Taoyuan City Government announced plans to establish a 40-hectare high-end integrated circuit...