The global wave of AI data center construction continues to accelerate, driving structural growth across the PCB and passive component...

AI data center expansion and high-speed network upgrades continue to support demand for networking equipment. However, as the industry...

Samsung Electronics is reportedly facing difficulties securing large-format FC-BGA package substrates for custom AI chips, as suppliers...

Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon...

Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom...

Power semiconductor makers say prices are still being adjusted as upstream raw material costs rise and AI-driven high-margin products...