CONNECT WITH US
NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Monday 24 August 2026
TPK TGV pilot line to start by September, Thailand plant eyes 2027 ramp
TPK Holding is accelerating its move from consumer touch panels into semiconductors, with its Through Glass Via (TGV) pilot line in Taoyuan, Taiwan set to begin operations in August...
Monday 24 August 2026
AI chip boom lifts South Korean semiconductor materials makers' profits in 2Q26
The AI semiconductor investment boom is increasingly spilling over into the materials supply chain. South Korea's major semiconductor materials suppliers broadly improved profitability...
Monday 24 August 2026
CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
Saturday 22 August 2026
Manz Asia says yield is key to glass core mass production
As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
Friday 21 August 2026
China silicon wafer maker NSIG nears 1.2 million monthly 300mm capacity after 90% shipment jump
National Silicon Industry Group (NSIG) reported a 36.51% rise in first-half 2026 revenue as shipments of 300mm semiconductor silicon wafers increased more than 90%, though continued...
Thursday 20 August 2026
China reportedly delays germanium, quartz clearances, impacting Taiwan optics and aerospace suppliers
China has reportedly delayed customs clearance for critical materials — including germanium, quartz-based materials and neodymium magnets — since 2025, lengthening delivery...
Thursday 20 August 2026
Chinese SiC substrate maker SICC hits record Q2; 8-inch wafers top 50% of core revenue

SICC reported stronger first-half 2026 revenue and margins as its 8-inch silicon carbide substrate business gained scale, highlighting...

Thursday 20 August 2026
Asia Optical eyes Metalens, CPO, and AI cooling opportunities; digital camera shipments to surpass 4 million units
Asia Optical delivered strong second-quarter financial results while accelerating its strategic expansion across optical technologies. Key growth drivers include Metalens and Co-Packaged...
Thursday 20 August 2026
High-end PCB supply tightens as CCL expansions face delays
As AI applications demand faster data transmission from PCBs, M8 and higher-grade copper-clad laminate (CCL) materials are becoming increasingly mainstream in server boards. The shift...
Wednesday 19 August 2026
Manz Asia targets PLP demand with three lines and three sizes
Manz Asia is broadening its push into panel-level packaging (PLP) as interest in the technology continues to rise. General manager Robert Lin said the company has shipped more than...
Wednesday 19 August 2026
PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...
Wednesday 19 August 2026
Taiwanese firms' China investment returns hit record high on AI boom

Driven by surging global demand for AI and high-performance computing (HPC), Taiwanese listed companies achieved record combined profits...

Wednesday 19 August 2026
Charts: Taiwan's materials suppliers split: wafer giants stall, substrate and lead-frame names run

The two largest silicon wafer companies are the sector's slowest growers on a cumulative basis. Everything running fast sits downstream...

Wednesday 19 August 2026
LG's raw material costs jump by over KRW1 trillion in 1H26, auto components hit hardest

Rising chip and copper prices are rapidly increasing cost pressure on LG Electronics.

Wednesday 19 August 2026
AI drives EISO high-end PCB orders as CCL shortages bite

Niche printed circuit board (PCB) maker EISO Enterprise said that 2026 industry demand has returned to post-pandemic highs as AI applications...