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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Tuesday 24 March 2026
MediaTek's Airoha takes on US giants in optical comms DSP chip arena
The expansion of AI data centers is creating new business opportunities that are opening the door for upstarts to challenge industry leaders. A prime example is the four-level pulse...
Tuesday 24 March 2026
China's AI GPUs face equipment and software constraints, but system-level design boosts self-reliance
Although it may appear that China's AI GPU development is behind the US by one or more generations, a recent Morgan Stanley report reveals the actual gap is smaller than widely per...
Monday 23 March 2026
China moves into high-end photoresist production: Dinglong ramps up, YMTC lends support
As geopolitical tensions and energy transport risks heighten volatility in the global semiconductor supply chain, the stability of upstream critical materials — particularly...
Monday 23 March 2026
Commentary: CPO mass production put to test as photonic integration faces challenges
Driven by massive demand from cloud AI, silicon photonics continues to gain momentum. At the Optical Fiber Communication Conference (OFC 2026), industry players engaged in in-depth...
Monday 23 March 2026
Ventec eyes double-digit growth in 2026 amid product price hikes and niche material expansion
Niche copper-clad laminate (CCL) manufacturer Ventec expects to achieve double-digit revenue growth in 2026, driven by ongoing product price increases and strategic expansion into...
Monday 23 March 2026
Konica Minolta to expand AI chip inspection optics capacity 2.6x by 2027

Japanese optical component and office equipment maker Konica Minolta said on March 18 it will scale up its optical components business for...

Monday 23 March 2026
Taiwan materials maker Daxin pivots to semiconductors with new display film ramp in 2026
Daxin Materials is expanding its semiconductor materials portfolio while maintaining optimization efforts in display materials. The company expects 2026 display material revenue to...
Friday 20 March 2026
Lumotive makes optical breakthrough, targets 10,000-port data centers

As Nvidia and Coherent signal a shift toward all-optical networking to solve the AI power crisis, Redmond-based Lumotive has announced a milestone...

Friday 20 March 2026
Research Insight: AI reshapes Taiwan's PCB industry around high-end capacity and materials
DIGITIMES observes that as demand surges for AI servers, high-speed switches, optical communication modules, and edge AI devices, Taiwan's PCB industry is undergoing a structural...
Friday 20 March 2026
HiSilicon unveils self-developed CIS chip, shaking global sensor supply chain
The global CMOS image sensor (CIS) supply chain faces a major disruption as HiSilicon, Huawei's core semiconductor subsidiary, officially enters the high-end CIS market with its first...
Friday 20 March 2026
MediaTek on cruise control as chipmakers scramble for next-gen silicon photonics standards
Nvidia GTC 2026 and the Optical Fiber Communication Conference (OFC) have underscored the growing importance of optical communication in cloud AI, with chipmakers playing an increasingly...
Friday 20 March 2026
AI tailwinds and global reach put Topco on track for double-digit growth in 2026
Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC)...
Friday 20 March 2026
Allied Circuit sees server, IPC market growth boosting 2H26 outlook
Benefiting from rising demand across the server and industrial PC (IPC) markets, Allied Circuit (ACCL), a PCB manufacturer backed by Compal, reported that its new capacity added in...
Friday 20 March 2026
Lumotive creates world's first 2D photonic beamforming chip
Lumotive, a pioneer in programmable optical semiconductor technology, has demonstrated the world's first programmable two-dimensional (2D) photonic beamforming chip. Built on its Light...
Thursday 19 March 2026
Samsung Electro-Mechanics rumored to supply MLCCs to top private aerospace firm
Samsung Electro-Mechanics (Semco) is reportedly supplying multilayer ceramic capacitors (MLCC) for low Earth orbit (LEO) satellites to the world's largest private aerospace company...