News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Monday 23 March 2026

Commentary: CPO mass production put to test as photonic integration faces challenges

Driven by massive demand from cloud AI, silicon photonics continues to gain momentum. At the Optical Fiber Communication Conference (OFC 2026), industry players engaged in in-depth...

Monday 23 March 2026

Ventec eyes double-digit growth in 2026 amid product price hikes and niche material expansion

Niche copper-clad laminate (CCL) manufacturer Ventec expects to achieve double-digit revenue growth in 2026, driven by ongoing product price increases and strategic expansion into...

Monday 23 March 2026

Konica Minolta to expand AI chip inspection optics capacity 2.6x by 2027

Japanese optical component and office equipment maker Konica Minolta said on March 18 it will scale up its optical components business for...

Monday 23 March 2026

Taiwan materials maker Daxin pivots to semiconductors with new display film ramp in 2026

Daxin Materials is expanding its semiconductor materials portfolio while maintaining optimization efforts in display materials. The company expects 2026 display material revenue to...

Friday 20 March 2026

Lumotive makes optical breakthrough, targets 10,000-port data centers

As Nvidia and Coherent signal a shift toward all-optical networking to solve the AI power crisis, Redmond-based Lumotive has announced a milestone...

Friday 20 March 2026

Research Insight: AI reshapes Taiwan's PCB industry around high-end capacity and materials

DIGITIMES observes that as demand surges for AI servers, high-speed switches, optical communication modules, and edge AI devices, Taiwan's PCB industry is undergoing a structural...

Friday 20 March 2026

HiSilicon unveils self-developed CIS chip, shaking global sensor supply chain

The global CMOS image sensor (CIS) supply chain faces a major disruption as HiSilicon, Huawei's core semiconductor subsidiary, officially enters the high-end CIS market with its first...

Friday 20 March 2026

MediaTek on cruise control as chipmakers scramble for next-gen silicon photonics standards

Nvidia GTC 2026 and the Optical Fiber Communication Conference (OFC) have underscored the growing importance of optical communication in cloud AI, with chipmakers playing an increasingly...

Friday 20 March 2026

AI tailwinds and global reach put Topco on track for double-digit growth in 2026

Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC)...

Friday 20 March 2026

Allied Circuit sees server, IPC market growth boosting 2H26 outlook

Benefiting from rising demand across the server and industrial PC (IPC) markets, Allied Circuit (ACCL), a PCB manufacturer backed by Compal, reported that its new capacity added in...

Friday 20 March 2026

Lumotive creates world's first 2D photonic beamforming chip

Lumotive, a pioneer in programmable optical semiconductor technology, has demonstrated the world's first programmable two-dimensional (2D) photonic beamforming chip. Built on its Light...

Thursday 19 March 2026

Samsung Electro-Mechanics rumored to supply MLCCs to top private aerospace firm

Samsung Electro-Mechanics (Semco) is reportedly supplying multilayer ceramic capacitors (MLCC) for low Earth orbit (LEO) satellites to the world's largest private aerospace company...

Thursday 19 March 2026

China curbs, Middle East tensions drive surge in chip material risks from gallium to helium

Global semiconductor supply chains are facing rising pressure as Middle East geopolitical tensions and China's tightening export controls...

Tuesday 17 March 2026

MOEA establishes high-speed silicon photonics verification lab to shorten development timelines

In January 2026, Taiwan's Executive Yuan officially approved the Ten AI Initiatives Promotion Plan, coordinated by the National Development Council (NDC) in collaboration with the...

Monday 16 March 2026

Sony CIS yield issue raises Apple supply risks, opens door for Samsung

Sony's core semiconductor business, CMOS image sensors (CIS), has reportedly encountered yield challenges in recent production. Industry...

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook