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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Wednesday 15 April 2026
Taiwan, Japan team up on advanced materials to power next-gen chips and clean energy
Japan dominates the global market for semiconductor equipment and materials — a strategic chokepoint that its neighbors and partners have long sought to learn from, not just...
Wednesday 15 April 2026
Taiwan cooling suppliers post record March revenue as AI demand lifts liquid cooling

Taiwan's leading thermal solution providers reported record revenue in March 2026, as AI-driven demand extended into general-purpose servers...

Tuesday 14 April 2026
Samsung Electro-Mechanics reportedly to expand AI packaging with MLCC embedded substrate line in Vietnam
As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics...
Tuesday 14 April 2026
Taiwan's auto suppliers pivot to AI and system integration in EV transition, says DIGITIMES Research

The annual "360°MOBILITY Mega Shows," a major gathering for the auto parts and mobility industry, opens on the 14th, drawing heightened...

Tuesday 14 April 2026
Glass substrates move toward mass production as Intel, Samsung Electro-Mechanics step up efforts
Glass substrates are entering a critical pre-mass production phase as demand for high-performance AI chips accelerates. As AI workloads require larger chip sizes and higher bandwidth,...
Tuesday 14 April 2026
Passive component demand splits in 2026; AI and autos hold firm

The passive components sector is emerging from its inventory slump, with Yageo and Walsin Technology flagging a pickup in both commodity...

Tuesday 14 April 2026
King Yuan Electronics posts record 1Q26 revenue, raises capex to NT$50 billion
Benefiting from continued demand driven by artificial intelligence (AI), high-performance computing (HPC), and application-specific integrated circuits (ASIC), semiconductor testing...
Tuesday 14 April 2026
Yaskawa Electric sees AI robot, chip demand boost profits

Japan's Yaskawa Electric is pointing to a turning point in its earnings trajectory, with AI-driven robotics and semiconductor equipment...

Monday 13 April 2026
Global chip sales expect to top US$1 trillion in 2026 on AI demand

Taiwan's semiconductor supply chain posted stronger-than-expected results in the first quarter of 2026, as artificial intelligence (AI)...

Monday 13 April 2026
Weekly news roundup: Shortages spread to MLCCs; SK Hynix reportedly in talks with Microsoft and Google
Below are the most-read DIGITIMES Asia stories from the week of April 6-April 13, 2026:
Monday 13 April 2026
TPK and ASE to launch advanced semiconductor TGV packaging with 3Q26 pilot line
Touch panel maker TPK is partnering with semiconductor packaging giant ASE to enter the advanced through-glass via (TGV) packaging technology sector, focusing on developing glass substrates...
Monday 13 April 2026
Nan Pao posts record March and 1Q26 revenue driven by semiconductors and new products
Nan Pao Resins Chemical Group reported a historic revenue high for March, reaching NT$2.4 billion (approx. US$75.3 million), up 17.4% year-over-year, fueled by raw material price fluctuations...
Saturday 11 April 2026
BenQ Materials expands into semiconductor processes, targets advanced nodes

BenQ Materials is expanding into semiconductor materials, with president Ray Liu saying the company has entered CMP cleaning brush rollers...

Friday 10 April 2026
Eclat Forever Machinery secures large IC substrate orders with visibility to 2027
High-end ABF substrate wet process equipment maker Eclat Forever Machinery (EF) announced that, driven by clear expansion momentum from domestic IC substrate customers, capital expenditures...
Friday 10 April 2026
Cmsemicon seeks suppliers to expand MCU production as supply tightness remains primary limitation
Shenzhen China Micro Semicon (Cmsemicon) chairman and general manager Yang Yong announced that the microcontroller unit (MCU) market is gradually recovering and that prices are gradually...