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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Monday 14 September 2026
STMicro lead times top 1 year, boosting Taiwan chip makers
AI crowd-out effects are rippling through the supply chain, with lead times for microcontroller units (MCUs) from STMicroelectronics reportedly stretching beyond 1 year and triggering...
Monday 14 September 2026
DIGITIMES Insight: China's GaN challengers are no longer playing catch-up
Chinese GaN power semiconductor maker Innoscience gained direct access to capital markets after listing in Hong Kong at the end of 2024, giving it fresh funding to expand GaN capacity...
Monday 14 September 2026
Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a...
Monday 14 September 2026
A Taiwan PCB maker's China affiliate is worth three times its parent — and the parent just bought more of it

UK-based investment firm Palliser Capital announced on September 9 that following several months of constructive dialogue with the management...

Monday 14 September 2026
Renesas readies second price hike amid stronger power-chip demand

Renesas Electronics is reportedly preparing a second product price increase this year, with new pricing set to take effect January 1,...

Sunday 13 September 2026
Artery secures spot in Arm ecosystem, pushing high-end MCUs into robotics, physical AI

As Arm targets expansion in physical AI, microcontroller (MCU) maker Artery Technology has emerged as a key ecosystem partner. Focusing...

Saturday 12 September 2026
AI server boom reshuffles MLCC supply, opening a rare expansion window for Taiwan makers

Strong demand for AI computing is creating a capacity squeeze across the passive-component industry, opening new opportunities for Taiwanese...

Saturday 12 September 2026
Murata targets mass production of its AI power substrate next year
Murata Manufacturing plans to begin mass production next year of iPaS, the power substrate it has spent several years developing for AI chips, a step that would carry the world's largest...
Friday 11 September 2026
Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward...
Friday 11 September 2026
China's DRAM supply chain clears another materials hurdle
China's semiconductor localisation effort has reached another upstream materials milestone.​ Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products...
Friday 11 September 2026
CIOE 2026: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase...

Friday 11 September 2026
AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
Friday 11 September 2026
AI server tracker: Taiwan's August filings say demand is still accelerating
The clearest read yet on whether the AI build-out is still accelerating arrived this week in a batch of unaudited Taipei filings, and it accelerated. The 49 Taiwan-listed companies...
Friday 11 September 2026
Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end...
Thursday 10 September 2026
AUO matching glass substrate size stokes TSMC collab speculation
AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.