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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Friday 31 May 2024
Yageo eyeing transition into IDM
Yageo has been steadily evolving over the last 5-10 years, deliberately investing in new company groupings through M&A and private equity investments.
Friday 31 May 2024
Zhen Ding prepares for advanced developments, discusses AI server opportunities
Charles Shen, Chairperson of Zhen Ding, the major PCB company, stated that the first half of 2024, as in previous years, is the off-season for operations. However, compared to the...
Thursday 30 May 2024
Strong AI momentum expected to drive passive component demand
As demand for AI servers steadily grows, it directly drives the need for passive components.
Thursday 30 May 2024
HBM competition (1): advanced packaging technology divergence explained
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
Wednesday 29 May 2024
Nuvoton gradually increases MCU market share in China despite uncertain auto industry outlook
Microcontroller manufacturer Nuvoton Technology held its shareholders' meeting on May 28. The company reported that the PC market performed better than initially expected, and MCU...
Wednesday 29 May 2024
Semiconductor industry co-opetition between Taiwan and South Korea
The semiconductor industry is the lifeblood of South Korea, a country that heavily depends on its exports. In 2023, South Korea exported US$131 billion of semiconductors and imported...
Wednesday 29 May 2024
Taiwan PCB makers gear up for AI PC era, replacement demand to emerge in 2H24
With 2024 widely regarded as the inaugural year for the AI PC era, Taiwanese PCB manufacturers are revving up to meet the upcoming replacement demand for AI PCs and notebooks, expected...
Wednesday 29 May 2024
TASC to expand GaN, SiC component shipments
Sensor component specialist Taiwan-Asia Semiconductor (TASC) will boost its GaN and SiC component shipments in the second half of 2024, to generate more than 5% of revenue from the...
Wednesday 29 May 2024
With AI driving demand for passive components, IC distributors prepare for surge in orders
As AI technology increasingly moves from the cloud to edge devices, the use of passive components—in particular Multilayer Ceramic Capacitors (MLCC)—will rise exponentially...
Wednesday 29 May 2024
Nan Ya PCB expects substantial demand recovery in 2H24
Nan Ya Printed Circuit Board (Nan Ya PCB), one of Taiwan's largest IC substrate suppliers, expects business will pick up in the second half of 2024, after a slow start in the first...
Wednesday 29 May 2024
China Big Fund kicks off 3rd phase capital support for local chip industry
China's freshly launched CNY344 billion (US$47.5 billion) national chip fund is likely to prioritize investments in major semiconductor firms, supporting their development of AI computing...
Tuesday 28 May 2024
China can break through US EUV ban with mature-node innovation, but how?
China's Huawei claims to have successfully achieved domestic substitution of using its self-developed 7nm and 5nm chips in its smartphones and has boosted market standings of HiSilicon...
Monday 27 May 2024
Yageo to acquire 20% stake in PMIC firm uPI
Passive component maker Yageo has disclosed plans to take part in uPI Semiconductor's impending private placement. uPI Semiconductor is an affiliate of Asustek Computer specializing...
Monday 27 May 2024
PCB firm Compeq expects modest recovery in CE demand
Compeq Manufacturing, an HDI PCB specialist, forecasts a modest rebound in demand for consumer electronics applications in the second half of 2024 while remaining optimistic about...
Monday 27 May 2024
Taiwan fab tool makers see demands rising in US and Europe
Onshoring efforts of semiconductor manufacturers have spurred the demand for more cost-effective fab tools. Fab machinery makers in Taiwan, including the supply chain partners of...