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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Tuesday 14 May 2024
Semiconductor materials orders driven by advanced processes, packaging demand
Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance...
Monday 13 May 2024
Ahead of the curve: Interview with Introspect CEO on how its innovative GDDR7 memory test system beats the market
Introspect Technology, a Canadian private company, introduced its M5512 GDDR7 Memory Test System, which is designed for testing GDDR7 memory controllers, GDDR7 physical layers, and...
Monday 13 May 2024
Semco accelerates glass substrate production, eyeing high demand in HPC and automotive applications
Samsung Electro-Mechanics (Semco) is reportedly expediting the development of its semiconductor packaging-use Glass Core Substrate (GCS) business by advancing the construction of...
Monday 13 May 2024
TSMC places rush orders for CoWoS-related fab tools to meet global AI demand
The explosive growth in Generative AI (GenAI) business opportunities spurred by ChatGPT drives the demand for hardware and software related to the GenAI supply chain. TSMC, the sole...
Monday 13 May 2024
Zhen Ding expects substantial growth in IC substrates, diversified manufacturing continues
Zhen Ding expects robust growth in AI server-related products and a 3-4x increase in ABF substrate revenue in 2024.
Monday 13 May 2024
Rohm revving up to deepen integration with Toshiba in power semiconductors
Japan's Rohm Semiconductor is seeking to strengthen business integration with the recently delisted Toshiba, particularly in power semiconductors.
Friday 10 May 2024
US to triple semiconductor manufacturing capacity by 2032, says SIA
The US will triple its domestic semiconductor manufacturing capacity from 2022—when the CHIPS and Science Act (CHIPS) was enacted—to 2032. The projected 203% growth is...
Friday 10 May 2024
GF's approach to AI: silicon photonics and power semiconductors
Compared to TSMC, Samsung Electronics, and even Intel Foundry, which have moved into sub-7nm advanced processes, GlobalFoundries (GF), which announced in August 2018 that it would...
Friday 10 May 2024
TASC board undergoes major transformation as equipment depreciation impacts short-term profitability
Taiwan-Asia Semiconductor Corporation (TASC), in its transition from optoelectronic sensing, reported a post-tax loss of NT$38 million in the first quarter of 2024.
Wednesday 8 May 2024
Murata sees smartphone components recovery in 2024
MLCC manufacturer Murata Manufacturing Co., Ltd. stated that demand for components in smartphones is recovering, and there is also expected growth in demand related to automotive...
Monday 6 May 2024
Southeast Asia and Japan attract OSAT interest amid geopolitical diversification
The semiconductor industry is witnessing significant shifts influenced by geopolitical considerations. One recent case exemplifying this trend is King Yuan Electronics's (KYEC) sale...
Friday 3 May 2024
Imec.xpand launches EUR 300M fund amid global race for semiconductor supremacy
Imec.xpand, an independent global venture capital fund, today announced the launch of a new EUR 300 million fund aimed at accelerating the growth...
Friday 3 May 2024
Japan takes ambitious action on advanced packaging technology to capture Chiplet and AI chip opportunities
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly...
Friday 3 May 2024
China's chip self-sufficiency dream a 21st Century Great Leap Forward? How much longer can it subsidize?
Against the backdrop of a secular slowdown in economic growth and a real-estate bubble burst that added debt burdens, how much longer can China continue to subsidize its industries...
Friday 3 May 2024
A step into high-end technology: EISO joins satellite industry with its PCB production
EISO, the PCB factory, participated in the Satellite 2024 Conference & Exhibition held in Washington DC, USA for the first time, marking the company's entry into Low-Earth Orbit...