中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    China smartphone market rebounded in April, with Apple poised to benefit most
    3h 10min ago
    China LLM price war widens gap with global leaders
    3h 10min ago
    Analysis: China’s AI chips gain new security clearance, rewritting market entry rules
    3h 10min ago
    Airbus delays A350 and A320neo deliveries as supply chain bottlenecks may last through 2030
    3h 10min ago
    Pentagon AI usage surged as drone procurement accelerated
    3h 10min ago
    Huawei’s Tau law draws DeepSeek-style buzz amid chip restrictions
    3h 10min ago
    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Monday 4 May 2026
    Yageo's Pierre Chen says AI hardware boom is lifting passive component demand

    Yageo chairman Pierre Chen said the rise of AI applications is driving stronger demand not only for advanced semiconductors and memory,...

    Monday 4 May 2026
    BenQ Materials unit Cenefom enters memory supply chain with CMP brush wheels
    BenQ Materials is accelerating its expansion into semiconductor materials as its subsidiary Cenefom officially begins operations at its new Guangyuan plant. The facility's chemical...
    Monday 4 May 2026
    AI chip demand ignites embedded substrate race among Samsung, Ibiden, Unimicron
    Samsung Electro-Mechanics (Semco) has moved early to commercialize embedded semiconductor substrates, but the window is rapidly closing as Japan's Ibiden and Taiwan's Unimicron prepare...
    Monday 4 May 2026
    Zhen Ding expands NTHU partnership with new five-year research program
    PCB maker Zhen Ding Technology has launched the second phase of its joint research center with National Tsing Hua University, aiming to deepen collaboration on advanced PCB and IC...
    Saturday 2 May 2026
    Yageo AI revenue reaches 15% as chair says sector remains early in cycle
    Yageo chairman Pierre Chen said the company has undergone a major transformation over the past eight years, driven in part by the rise of AI applications.
    Saturday 2 May 2026
    Samsung Electro-Mechanics tops US$2 billion quarterly sales, flags ABF substrate shortage
    Samsung Electro-Mechanics (Semco) reported its first-ever quarterly revenue exceeding KRW3 trillion (approx. US$2.2 billion), driven by expanding AI infrastructure investment and rising...
    Friday 1 May 2026
    Samsung Electro-Mechanics weighs MLCC price hike of 5–10% as supply tightens
    Samsung Electro-Mechanics is considering raising prices for multilayer ceramic capacitors (MLCCs) by about 5% to 10% as demand from artificial intelligence (AI) infrastructure tightens...
    Thursday 30 April 2026
    Chang Wah Technology forecasts double-digit growth in the second quarter on EMC LED strength
    Packaging leadframe maker Chang Wah Technology Co., Ltd. reported that it achieved NT$3.672 billion (US$116 million) in revenue in the first quarter of 2026, its fourth-highest quarterly...
    Wednesday 29 April 2026
    Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key
    Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level...
    Wednesday 29 April 2026
    PCB industry urges four policy moves in Thailand expansion
    Amid global supply chain restructuring, Asia's PCB industry is moving toward closer regional collaboration. Industry experts say that as southbound expansion in the PCB sector takes...
    Tuesday 28 April 2026
    AI chip testing complexity lifts probe card and upstream supply chain demand
    As AI chips move to advanced process nodes and packaging technologies, semiconductor testing requirements are becoming significantly more complex.
    Monday 27 April 2026
    Thailand's PCB industry moves upmarket, local supply gaps persist

    Thailand is fast emerging as a critical hub for high-end electronics manufacturing, as global supply chains shift and demand for AI computing...

    Monday 27 April 2026
    TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
    ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first,...
    Monday 27 April 2026
    Weekly news roundup: Micron's Sanand ramp shifts India chip debate; Qualcomm Chief reportedly seeks deals in South Korea
    Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:
    Monday 27 April 2026
    Innolux enters leading tier of advanced packaging with new RDL and TGV technology
    Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies...
    6/52 pages
    Research Report Database
    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
    marketing
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook