News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Friday 14 August 2026

ABF substrate boom lifts Eternal Precision prices 20%

Strong Ajinomoto Build-Up Film (ABF) substrate demand has driven a surge in orders for vacuum laminating equipment, with Eternal Precision...

Friday 14 August 2026

Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure

AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.

Friday 14 August 2026

Korea's CNT pellicle race heats up as aweXome Ray pushes toward EUV commercialization

As South Korea's major memory manufacturers race to secure next-generation lithography technologies for increasingly advanced process nodes, the approaching High-NA EUV era is adding...

Thursday 13 August 2026

Pegatron stocks AI server parts early as shortages spread through supply chain

Pegatron Corp. said in its second-quarter 2026 results that its server business posted strong gains and that it had already begun preparing for demand in the second half of 2026 while...

Thursday 13 August 2026

Zhen Ding targets 50% revenue share from AI servers, optical modules, IC substrates by 2030

Zhen Ding Tech (ZDT), a major PCB supplier, said at its second-quarter 2026 earnings conference on August 11 that rising investment...

Thursday 13 August 2026

409.6T switches could push industry toward CPO, Arista says

Co-packaged optics (CPO) has become a major focus of the optical networking industry, but pluggable modules remain the mainstream choice for optical interconnects. At a silicon photonics...

Thursday 13 August 2026

Lenovo Capital backs Niobium Optoelectronics in Series B funding for TFLN chips

Jiangsu Niobium Optoelectronics Technology, a Chinese maker of thin-film lithium niobate (TFLN) photonic chips, has closed a Series B funding round worth several hundred million yuan...

Thursday 13 August 2026

Can diamond rewrite the rules of AI chip cooling? Wiwynn is putting it to the test

As AI processors become more powerful, one of the industry's most stubborn constraints is becoming increasingly physical: there is only so much heat conventional materials can move...

Thursday 13 August 2026

LSE Semiconductor wins strategic investment from TIS

Lithography Semiconductor Equipment Co. (LSE) officially announced on August 11 that TECO Image Systems Co. (TIS) had completed a strategic...

Wednesday 12 August 2026

MediaTek, Realtek, Himax, Elan eye optical communications boom in 2027

The use of optical communications in cloud AI data-center interconnect architectures is rising sharply, and Taiwan IC design firms including MediaTek, Realtek Semiconductor, Himax...

Wednesday 12 August 2026

Nichidenbo sees MLCC supply tightness as AI pushes lead times to 36 weeks

Passive component distributor Nichidenbo said supply of MLCCs and other products remains tight as AI servers and ASIC applications...

Wednesday 12 August 2026

OCP APAC 2026: Murata upgrades power, optical products as AI data centers strain global infrastructure

Murata Manufacturing has unveiled upgraded power converters and optical components, highlighting how rising AI workloads are pushing data centers worldwide toward denser, more efficient...

Tuesday 11 August 2026

YAGEO, Walsin post record July sales as AI demand lifts passive components

YAGEO and Walsin Technology reported strong July 2026 revenue as artificial intelligence demand continued to lift Taiwan's passive components sector. Both companies said orders from...

Tuesday 11 August 2026

Dynamic delays Thailand AI mass production, clouding 2026 revenue target

Dynamic said its Thailand plant will not begin mass-producing high-end AI products until the fourth quarter of 2026, a delay that could...

Tuesday 11 August 2026

China silicon wafer expansion accelerates: Eswin scales 12-inch capacity, Lion Micro consolidates 6- and 8-inch assets

China's silicon wafer industry is entering a new phase of simultaneous capacity expansion and consolidation, with Xi'an Eswin Material...

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Sep 11, 08:00

DAS Expands in Taiwan and Unveils World First at SEMICON

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