News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Tuesday 13 October 2026

South Korea's YMT targets fivefold rise in glass-substrate plating capacity

South Korean electronic materials supplier YMT is accelerating its expansion into glass-substrate electroplating. The company plans to increase related capacity to roughly four times...

Tuesday 13 October 2026

Korea Alcohol Group speeds up pivot into semiconductors

Korea Alcohol Group is accelerating its shift toward semiconductor materials with a KRW450 billion (US$337 million) production base at Yesan County in South Korea's South Chungcheong...

Tuesday 13 October 2026

AI Server tracker: Taiwan's AI server chain grew 55% in September, but the growth narrowed to fewer suppliers

The AI buildout is still lifting Taiwan's server supply chain faster than almost any other industry, yet September's filings show the lift concentrating into fewer hands. The 49 listed...

Monday 12 October 2026

How 'Filter Moore's Law' is doubling revenue for a Taiwan chip filter maker

Under what the industry terms the "Filter Moore's Law," each process node shrink lowers tolerance for airborne molecular contaminants, causing filtration demand to grow exponentially...

Monday 12 October 2026

Sumitomo Bakelite expands packaging material production across Singapore, China

Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This...

Monday 12 October 2026

AI racks approach megawatt power levels as SiC, GaN, silicon divide power delivery roles

The rapid expansion of AI infrastructure is driving demand for higher power and voltage levels, pushing power semiconductor development toward greater efficiency, higher power density,...

Monday 12 October 2026

Weekly news roundup: Musk's Terafab faces reality check; Samsung HBM4E clears quality validation

This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces...

Monday 12 October 2026

India roundup: AI data center buildout accelerates as semiconductor push continues to broaden

India's technology buildout is deepening across semiconductors and AI infrastructure, with chip IP, packaging and equipment initiatives advancing...

Saturday 10 October 2026

TPCA Show 2026 to spotlight AI computing, Unimicron chair keynote

As explosive AI computing demand drives hardware architecture change, Taiwan Printed Circuit Association (TPCA) is set to open its annual flagship event, with the 21st International...

Saturday 10 October 2026

Semco moves glass substrates to package-level testing

Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking...

Saturday 10 October 2026

JNTC bets US$259 million on glass substrates ahead of 2028 ramp

South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...

Saturday 10 October 2026

Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst

Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years,...

Friday 9 October 2026

Ample revenue slips in September as passive component demand stays strong

Ample Electronic, a supplier of conductive paste materials for the passive components industry, reported September 2026 revenue of NT$304 million (approx. US$9.6 million), down...

Friday 9 October 2026

Inpaq reshuffles management, appoints Joyin chair as new head

Inpaq, part of the PSA Group, said it will eliminate the chief executive officer (CEO) position effective immediately as it adjusts its organizational structure and management responsibilities...

Thursday 8 October 2026

Hanmi wins rare Samsung order amid US$5 billion chip substrate expansion

South Korea's Hanmi Semiconductor has secured a KRW24.48 billion (approx. US$18.3 million) equipment order from Samsung Electro-Mechanics, a rare deal with a Samsung Group affiliate...

9/74 pages

BIZ FOCUS

Nov 5, 08:00

Can Wearable Health Devices Reflect Traditional Chinese Medicine Concepts?

MOST-READ
7 DAYS NEWS

Full list