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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Thursday 18 June 2026
Exclusive: Penang moves up value chain; Galatek flags deep-tech, IP hurdles
Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive...
Thursday 18 June 2026
Exclusive: Galatek sees Penang facility driving semiconductor, life sciences ecosystem growth
Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering,...
Wednesday 17 June 2026
China PCB maker DSBJ bets US$1.2 billion on AI optical modules
Suzhou Dongshan Precision Manufacturing (DSBJ) will invest US$1.2 billion to expand optical chip and optical module capacity at Source Photonics, accelerating its shift from PCB manufacturing...
Wednesday 17 June 2026
PCIM 2026: How high-voltage infrastructure is unifying AI and e-mobility sectors
Semiconductor manufacturers, market analysts, and engineering departments have long tracked the clean energy transition through siloed vertical markets. For example, they will calculate...
Wednesday 17 June 2026
Ajinomoto's chip film faces supply test as AI demand climbs

The global appetite for AI chips is putting new strain on materials suppliers, turning one of Ajinomoto's lesser-known products into...

Wednesday 17 June 2026
Samsung Electro-Mechanics expands silicon capacitor push on integration edge

Samsung Electro-Mechanics (Semco) is rapidly gaining ground in the silicon capacitor market as AI infrastructure investment and technology...

Tuesday 16 June 2026
China mass produces silicon-28 amid quantum computing race with US

China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) —...

Tuesday 16 June 2026
AMD opens EFB front beyond CoWoS, putting Taiwan substrate trio in play
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility...
Tuesday 16 June 2026
TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...

Tuesday 16 June 2026
Supply security over cost: Google leads CSP charge to diversify InP substrate sourcing

China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity...

Tuesday 16 June 2026
AT&S to invest up to EUR2 billion in Malaysia to expand AI substrate capacity
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as...
Monday 15 June 2026
Walsin sees passive component crunch stretching into 2028 as memory shortages weigh

Walsin Technology expects the tight supply of passive components could last into 2028, as demand from AI infrastructure, automotive...

Monday 15 June 2026
Wus Printed Circuit sees turnaround on high-end PCB demand

Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward...

Monday 15 June 2026
China eases InP substrate exports, lifting compound semiconductor supply

China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026...

Monday 15 June 2026
General-purpose server demand exceeds expectations; component shortages expected to normalize in 3Q26

While artificial intelligence (AI) server orders remain robust, tight component supplies have raised concerns about shipments across...