SK Hynix has reportedly placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT as it accelerates preparations for HBM4, underscoring both the strategic importance of advanced packaging equipment and rising complexity in the TC bonder supply chain amid a patent dispute between South Korean rivals Hanmi Semiconductor and Hanwha Semitech. The move reflects SK Hynix's broader push to diversify critical equipment suppliers while aligning with Nvidia's next-generation AI roadmap

Singapore will invest SGD37 billion (approx. US$28.5 billion) over the next five years under its Research, Innovation and Enterprise 2030 Plan. The funding will support semiconductor development, biopharma research, and talent programs aimed at strengthening the country's position in high-value technology sectors

FarEasTone (FET) has taken a major step in exporting its telemedicine capabilities abroad, announcing on Dec. 8 that it has signed a memorandum of understanding with Taiwan's Teleport Access Services and Indonesia's state-owned satellite operator Telkomsat. The three parties will jointly develop satellite-based telemedicine services aimed at remote and underserved communities across Indonesia's far-flung islands