Finance ministers and central bank governors from the ASEAN+3 countries convened in Milan on May 4, 2025, for the 28th ASEAN+3 Finance Ministers' and Central Bank Governors' Meeting (AFMGM+3), co-chaired by Malaysia and China. The high-level dialogue underscored regional economic resilience, despite mounting global challenges, and produced a strong joint statement committing to bolstered financial cooperation, macroeconomic stability, and sustainable growth
Despite flat demand for most consumer electronics chips and a muted outlook for traditional wire bonding and packaging equipment, Singapore's semiconductor packaging equipment giant Kulicke & Soffa (K&S) has confirmed its close collaboration with Taiwan's semiconductor foundry leaders in the advanced packaging field for high-end chips