At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics (IME), KLA, ASM International, the National University of Singapore (NUS), the SHINE Centre, and ASMPT discussed how advanced packaging is evolving beyond conventional chip integration, with optical interconnects, panel-level packaging, and talent development emerging as key challenges.

Vanguard International Semiconductor (VIS) and NXP Semiconductors' joint venture, VisionPower Semiconductor Manufacturing Company (VSMC), officially opened its 12-inch (300mm) wafer fab on September 28 in Tampines, Singapore. Vanguard and VSMC chairman Leuh Fang said the AI-driven crowding out of capacity has spread across the global semiconductor supply chain, leaving almost no company able to say it has sufficient capacity.

Brake system parts maker Yusin said at an investor conference on September 23 that key equipment at its new Malaysia plant is expected to be installed by the fourth quarter of 2026, with production targeted at 557,500 sets in 2027. Chairman Ching-te Chi said the company was hit by the restructuring of its largest customer, First Brands Group (FBG), which pushed Yusin into a loss in 2025 and sharply cut first-half 2026 revenue, but July and August sales have returned to year-over-year growth, suggesting early signs of a rebound.