Mitsubishi Gas Chemical (MGC) announced on November 10 that it will expand manufacturing and shipment-inspection equipment at its Thailand subsidiary to increase capacity for BT (Bismaleimide-Triazine) laminates used in semiconductor packaging. The new line is scheduled to begin construction in April 2027 and start operations in October 2028, targeting growing demand from data centers, servers and high-density IC substrates.

Mitsui Kinzoku will invest about JPY190 billion (approx. US$1.2 billion) to build a copper foil plant near its existing Malaysia site, targeting demand from optical communications components and advanced chips used in AI data centers. The facility will begin phased operations from April 2031.

Malaysia's Prime Minister Anwar Ibrahim's comments supporting the one-China principle and the use of force to unify Taiwan continue to weigh on Taiwan-Malaysia ties nearly three months later, raising concerns over Taiwanese companies' willingness to invest in Malaysia.

Grab and SoftBank Group plan to invest a combined US$1.85 billion in two AI infrastructure projects, including data centers, in Malaysia, as they seek to capitalize on growing demand for AI computing capacity across Southeast Asia.

Yankey Engineering’s order backlog reached a record NT$57.1 billion (US$1.74 billion) as of the end of September, with its subcontracting project for the second wafer fab in Kumamoto, Japan, expected to contribute revenue from 2027. The company said strong global AI infrastructure demand, advanced semiconductor processes, advanced packaging, and memory expansion drove its revenue and profit to record levels in the first three quarters of 2026.

Vanguard International Semiconductor (VIS) said its Singapore wafer fab is expected to become a growth driver in 2027, with capacity nearly sold out, customer commitments secured, and artificial-intelligence interposers projected to generate about half of revenue. The expansion could accelerate, but rising depreciation and fixed costs are expected to pressure profitability.

Tong Hsing Electronic Industries (THEIL), a semiconductor packaging company under the YAGEO Group, said its board has approved the acquisition of a 100% stake in Singapore-listed Global Testing Corporation for approximately SGD76.71 million (US$59.88 million). The deal will take Global Testing private and is intended to transform Tong Hsing from a traditional packaging manufacturer into a comprehensive packaging and testing service provider.

FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging technologies. The facility has six production lines and a maximum designed capacity of 300 million chips annually, the company said in a November 3 release.

Google's plan to invest US$15 billion in Malaysia over 2027 and 2028 deepens its bet on what AFP calls Southeast Asia's fastest-growing data center hub, and ties the expansion to commitments on power, water, and skills as Malaysian authorities scrutinize the facilities' demands on national resources.

Taiwan-based Horngyu Electric is leveraging manufacturing in Vietnam to meet rising demand for electrical equipment from AI data centers (AIDCs), Taiwan makers investing in the US, and new-energy projects. Horngyu's Vietnam plant is scheduled to begin trial production by the end of 2026 and enter mass production in 2027.

Malaysia is attaching tougher conditions to its data center boom, pairing a newly approved renewable energy quota with stricter screening of power and water requests and pressure on operators to supply more of their own electricity.

Taiwan became Thailand's third-largest trade partner in the first half of 2026 as AI growth and geopolitical shifts accelerate Taiwanese investment in the country, Taiwan Representative to Thailand Peter Lan said. Around 200,000 Taiwanese businesspeople are now based in Thailand, with the pace accelerating under the China+1 trend.

Delta Electronics approved plans on October 28 to establish a large manufacturing base in Penang, Malaysia, as the power and thermal management company expands overseas production to support customer demand. The site is expected to ramp up to capacity comparable to that of Delta's Thailand operations over five years, with space reserved for process research and development and a potential future R&D center.

Thailand-based precision sheet-metal manufacturer JPP Holding (jpp-KY) has secured more than 20 aerospace special-process certifications from Airbus, including certifications for A350 cockpit structural parts and related subprojects, formally entering the aircraft maker's high-end structural-component supply chain.

South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers at home and abroad, according to sources. The company expects SOCAMM3 to enter mass production in 2028 as it expands SOCAMM2 production and builds capacity to retain its position in the high-end memory module substrate market.