DIGITIMES Asia news - Southeast Asia

Tuesday 6 May 2025

Japanese companies significantly boost investment in India following 'Make in India' and PLI schemes

According to a report by Nikkan Kogyo Shimbun, the number of Japanese companies investing in India has shown significant growth over the past decade, particularly following key government initiatives aimed at boosting local manufacturing

Weekly news roundup: Nvidia CEO hosts trillion-dollar dinner; TSMC CEO to address bonus backlash in person

Monday 1 June 2026

Nvidia's Vietnam hiring signals push into high-end AI server manufacturing alongside expanding Taiwan ODMs

Friday 29 May 2026

Malaysia's Oppstar revises AI chip deal, formalizes US$2.9 million design contract

Friday 29 May 2026

ByteDance's chip ambition grows with US$70 billion capex plan

Thursday 28 May 2026

LATEST STORIES

Wednesday 27 May 2026

Samsung reportedly to expand Vietnam footprint with new memory chip testing plant

Samsung Electronics plans to invest VND39 trillion (approx. US$1.5 billion) in a new semiconductor testing facility in northern Vietnam, according to documents reviewed by Reuters, marking the company's first chip testing plant in the country as global memory demand surges amid the AI boom

Wednesday 27 May 2026

VinFast names new chair to tackle global expansion

Vietnamese electric-vehicle maker VinFast has appointed a new chairman amid mounting challenges in its overseas expansion across Asia and the US, including delays to its planned US factory, rising losses, and intensifying competition in global EV markets

Tuesday 26 May 2026

TECO completes Malaysia's Dynaciate acquisition to boost data center build capacity

TECO Electric & Machinery announced on the 25th that it signed an agreement to acquire about 78% of Malaysian engineering firm Dynaciate Engineering Sdn. Bhd. for roughly 200 million ringgit (about NT$1.6 billion). The closing was targeted by the end of August and the firm said the move is intended to expand TECO's data center infrastructure footprint in Southeast Asia to serve global cloud service provider customers

Monday 25 May 2026

Singapore launches physical AI testbed at Punggol Digital District

Singapore will launch a new testbed at the Punggol Digital District (PDD) later in 2026 to research, test, and deploy physical artificial intelligence (AI) systems, as the government seeks to accelerate the adoption of robotics and embodied AI in real-world environments. The initiative is being led by the Infocomm Media Development Authority (IMDA), JTC, and the Singapore Institute of Technology (SIT) in collaboration with eight industry partners

Sunday 24 May 2026

OpenAI opens first lab outside the US in Singapore as Google deepens government AI ties

Google and OpenAI's expanded cooperation with Singapore aims to accelerate AI adoption, workforce training, and safety measures, providing a model for other countries. The moves could shape global AI policy, talent flows, and public-sector deployment by showing how major tech firms partner with a small, strategically positioned city-state and innovation

Thursday 21 May 2026

Vietnam issues AI regulations, requires OpenAI and Anthropic to appoint local government liaisons

Vietnam has issued artificial intelligence (AI) regulations requiring companies such as OpenAI and Anthropic to appoint representatives to communicate with the government, with affected firms needing to comply by March 2027

Thursday 21 May 2026

OpenAI picks Singapore for first overseas applied AI lab

OpenAI will commit more than S$300 million (approx. US$235 million) to expand Singapore's artificial intelligence (AI) ecosystem, choosing the city-state for its first applied AI lab outside the US as Singapore pushes to strengthen its position as a regional AI hub

Wednesday 20 May 2026

Aerospace fastener demand extends into multi-year cycle as NAFCO expands Malaysia capacity amid Boeing ramp-up

Taiwan-based aerospace engine fastener maker National Aerospace Fasteners Corporation (NAFCO) said order visibility has extended to as long as eight to nine years as Boeing accelerates aircraft deliveries and global aerospace supply chains remain under strain. To meet rising demand, the company is expanding production capacity in Malaysia

Sunday 17 May 2026

Galatek targets advanced packaging market, eyes Taiwan foundries

Singapore-based AI automation startup Galatek said it is tackling yield bottlenecks in micron-level packaging with AI-embedded equipment as demand for AI and high-performance computing (HPC) chips surges across Southeast Asia and global markets. The company is also pursuing a dual-track expansion spanning Southeast Asia and Taiwan

Friday 15 May 2026

Everlight to build automotive LED plant in Thailand as raw material costs hit profit

Everlight Electronics said it will invest an additional US$56.5 million in its Thai subsidiary to buy land, build a plant, and add equipment, as the LED packaging firm moves to strengthen its presence in the automotive supply chain. The company also reported that first-quarter 2026 profit fell to NT$403 million (US$12.83 million), down 30.99% year on year, as higher raw material costs weighed on margins

Friday 15 May 2026

Malaysia's Arm-backed chip push lifts Oppstar, SkyeChip as startup ambitions expand beyond packaging

Malaysia is accelerating efforts to expand beyond semiconductor assembly and testing into chip design, following a government-backed initiative tied to access to Arm technology

Wednesday 13 May 2026

Taiwan capacitor maker Chinsan locks in Thailand AI server capacity through 2026

Taiwan Chinsan Electronic Industrial said strong demand from cloud and server customers pushed related revenue contribution to 35% in the first quarter of 2026, with high-margin AI server applications accounting for roughly half of the segment

Wednesday 13 May 2026

TECO expands into AI data centers with Malaysia acquisition deal

Taiwan-based industrial manufacturer TECO Electric & Machinery said on May 12 that its board had approved the acquisition of Malaysian engineering firm Dynaciate Engineering Sdn. Bhd. for about RM200 million (approx. US$50.8 million), in a deal expected to close in August 2026. After completion, TECO will gain controlling ownership, with revenue and earnings from the acquired company expected to begin contributing to consolidated results in the second half of 2026

Wednesday 13 May 2026

Doosan to build new CCL plant in Thailand

South Korean copper clad laminate (CCL) maker Doosan is reportedly moving to strengthen its overseas capacity in Thailand, a key production hub for Taiwan PCB suppliers serving global tech giants. The company has announced plans to set up a new subsidiary in Bangpu Industrial Estate and build a new CCL plant there

Wednesday 13 May 2026

Malaysia explores semiconductor listings to strengthen domestic capital markets

Malaysia is exploring ways to encourage more semiconductor-related companies to list on Bursa Malaysia as the government seeks to better align the country's capital markets with its growing role in the global chip supply chain

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BIZ FOCUS

Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook