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Wednesday 30 September 2026
GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck
GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon photonics technologies while transferring its existing US 300mm capabilities to Singapore.
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Wednesday 30 September 2026
VSMC bets on value over cost as Singapore fab builds next-generation R&D and IP capabilities
VisionPower Semiconductor Manufacturing Company (VSMC), the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, opened its 12-inch wafer fab in Tampines, Singapore, on September 28.
Tuesday 29 September 2026
In global semiconductor race, Singapore bets on critical, mature technologies
Amid the ongoing restructuring of the global semiconductor supply chain, Singapore is focusing on advanced packaging, heterogeneous integration, silicon photonics, and optical interconnects, aiming to leverage nearly six decades' worth of manufacturing and supply chain expertise. In contrast with industry players in Taiwan, South Korea, and the US, who have continued to pour resources into 2nm and 1.4nm advanced processes, Singapore's semiconductor firms see no need to replicate Taiwan's foundry model. Instead, they aim to harness Singapore's existing strengths in mature and specialty processes, assembly and testing, equipment, materials, and multinational R&D clusters to secure their foothold in the supply chain for next-gen semiconductors.
Tuesday 29 September 2026
Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics (IME), KLA, ASM International, the National University of Singapore (NUS), the SHINE Centre, and ASMPT discussed how advanced packaging is evolving beyond conventional chip integration, with optical interconnects, panel-level packaging, and talent development emerging as key challenges.

Tuesday 29 September 2026
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding beyond the performance of individual tools to hybrid bonding, interface materials, defect metrology, process control, optical interconnects, and panel-level packaging.
Tuesday 29 September 2026
VSMC Singapore fab fully booked as VIS weighs Fab 2
Capacity at VisionPower Semiconductor Manufacturing Company's (VSMC) first 12-inch wafer fab in Singapore is fully booked as the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors begins a preliminary evaluation of a second fab.
Tuesday 29 September 2026
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
VSMC, the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, officially opened its first 12-inch wafer fab in Singapore on September 28, completing construction in just 22 months.
Tuesday 29 September 2026
Vanguard chairman says AI slowdown won't free up chip capacity

Vanguard International Semiconductor (VIS) and NXP Semiconductors' joint venture, VisionPower Semiconductor Manufacturing Company (VSMC), officially opened its 12-inch (300mm) wafer fab on September 28 in Tampines, Singapore. Vanguard and VSMC chairman Leuh Fang said the AI-driven crowding out of capacity has spread across the global semiconductor supply chain, leaving almost no company able to say it has sufficient capacity.

Friday 25 September 2026
Singapore brands its chip sector as it tries to move up from manufacturing
Singapore is deepening semiconductor R&D ties with Applied Materials, KLA, GlobalFoundries (GF) and other industry players across advanced packaging and silicon photonics, as the city-state builds on its manufacturing base to strengthen technology development, validation and commercialization.
Thursday 24 September 2026
Yusin Malaysia plant to fully ramp up by 4Q26

Brake system parts maker Yusin said at an investor conference on September 23 that key equipment at its new Malaysia plant is expected to be installed by the fourth quarter of 2026, with production targeted at 557,500 sets in 2027. Chairman Ching-te Chi said the company was hit by the restructuring of its largest customer, First Brands Group (FBG), which pushed Yusin into a loss in 2025 and sharply cut first-half 2026 revenue, but July and August sales have returned to year-over-year growth, suggesting early signs of a rebound.

Thursday 24 September 2026
Anthropic joins OpenAI, Google DeepMind in Singapore

Anthropic will open its Singapore office in October, making it the company's fifth office in the Asia-Pacific region after Tokyo, Bengaluru, Seoul, and Sydney. The move underscores the AI company's push into Singapore as demand for Claude surges across startups, large enterprises, and government agencies.

Wednesday 23 September 2026
Malaysia reviews data centre benefits after 40-plus 2026 applications
Malaysia has received more than 40 applications to develop or expand data centres so far in 2026, underscoring the region's continued boom in data centre investment. But officials in Malaysia said the focus should go beyond the headline numbers to the value these projects deliver to local communities and to whether they meet environmental standards.
Saturday 19 September 2026
Thailand plans to swap EV subsidies for import taxes to defend its production base

Thailand is preparing to abandon the subsidy-led policy that made it Southeast Asia's fastest-growing electric vehicle market, replacing it with a tax structure built to penalize carmakers that import rather than build. Finance Minister Ekniti Nitithanprapas said the excise tax on fully imported EVs could rise to around 30%, from 10% today — the first time the government has attached a number to the levy.

Wednesday 16 September 2026
Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end
Samsung Electronics is reportedly handing the growth in its commodity memory module business to outside assemblers in Vietnam, India, and the Philippines, a sign of how completely high-bandwidth memory (HBM) has taken over its own packaging space. The shift keeps Samsung's scarce back-end capacity focused on its most profitable products and pushes the geography of its conventional memory supply increasingly outside South Korea.
Tuesday 15 September 2026
Tesla sets up Vietnam unit as VinFast dominates

Tesla has established a subsidiary in Vietnam as it prepares to enter the local market. Reuters reported that filing documents show the unit is registered in Ho Chi Minh City with capital of US$3 million.

Monday 14 September 2026
US finalizes anti-dumping and anti-subsidy duties on solar imports from India, Indonesia, and Laos
The US Commerce Department on September 11 issued final affirmative determinations in its anti-dumping and countervailing duty investigations of crystalline silicon photovoltaic cells and modules from India, Indonesia, and Laos, setting dumping margins of up to 123.04% and subsidy rates as high as 173.70%, according to the department's International Trade Administration.