DIGITIMES: News and Insight of the Global Supply Chain

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7 days news

Infineon and ASMedia team up on end-to-end USB 20Gbps setup for AI cameras

Oct 27, 16:58

SEMICONDUCTORS

AI spending surges, Microsoft opens exit door to 60,000 employees

Oct 27, 14:54

ICT

AI data centers drive cooling, power, modular infrastructure demand

Oct 27, 14:46

ICT

Anthropic IPO filing exposes massive compute buildout spanning TPUs, GPUs, and dedicated data centers

Oct 27, 14:33

ICT

PSMC capacity crunch holds back Jeju Semiconductor's growth

Tesla sees Cybercab becoming a new growth bet amid declining auto revenue

Chinese EVs push imported models ahead of South Korean vehicles

JIMTOF 2026 draws 94 Taiwan machine tool exhibitors

SoftBank eyes US$50B Malaysia AI data-center expansion

Broadcom, financial firms agree on US$63 billion funding for Anthropic chip purchases

Mitsubishi Materials scales thermistor capacity sixfold amid AI boom

AI demand squeezes automotive memory, pushing automakers to take control of chip supply

China AI token debate highlights challenge of monetizing compute

The Anthropic IPO filing: 14-fold 1H26 revenue growth behind a US$80.75 billion paper loss

Kazakhstan positions AI infrastructure as a potential export industry after Nvidia CEO's visit

US designates helium as critical material amid Middle East supply shock

Ennostar's optical push could add new growth engine for 2027 and onward

AMD, Nvidia target substrate capacity amid 4x expansion constraints

Fujifilm expands South Korean capacity to meet AI chip demand

FANUC raises forecast as AI, automation demand drives record revenue

Charts: Why German automakers are becoming marginalized in US BEV market

Nvidia says GPUs last 8 years, unlocking AI financing

Malaysia conditionally approves first rare-earth export under new rules

Meta launches US$35 billion equity raise, funds US$60 billion at-the-market program for AI build-out

Applied Materials to raise Besi stake to 20% as hybrid-bonding orders surge

Nvidia's Berlin keynote highlights AI scaling challenges in Europe

Samsung, SK Hynix eye 2Q27 shipments of 8-layer HBM4 to Nvidia

AWS, Google challenge CUDA as AMD, Intel cut AI switch costs

Inside SKT’s push to turn SK Hynix’s fabs into an AI business

China supply-chain price hikes strain domestic demand

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BIZ FOCUS

Oct 23, 08:00

AI Wealth Management: MaiCoin Leverages Startup Energy for Next-Gen Fintech

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MULTIMEDIA

K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue

According to DIGITIMES, Agentic AI, AI server expansion, cloud service provider (CSP) in-house CPU ramp-up, and replacement demand for general-purpose servers will lift global server CPU shipments to 52.6 million units in 2027, up 45.7% year-over-year, wi12_s.jpg

DIGITIMES says the most closely watched model in Apple's high-end iPhone 18 lineup, launched in September 2026, is the long-anticipated first foldable smartphone, the iPhone Duo.

DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.