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    Aug 3, 08:09
    India roundup: R&D hubs, domestic tooling, OSAT investments, and AI hubs are powering India’s chip push
    Aug 3, 08:10
    FCC robot restrictions cast uncertainty over Unitree and China's consumer robotics exports
    Aug 3, 08:09
    Flexible PCB maker Flexium sees AI server shipments doubling after 2Q margin turns positive
    Aug 3, 08:07
    AI server demand revives long-term MLCC supply agreements as shortages intensify
    Aug 3, 08:10
    Column: AI agents are advancing rapidly, but the automation map remains smaller than expected
    LATEST STORIES
    7 days news
    TSMC Kumamoto fab faces first major quake test with chip-material supplies secured
    Aug 3, 11:55
    South Korea accelerates LEO satellite ambitions, targets sovereign communications network by 2035
    Aug 3, 11:55
    SK On posts record quarterly profit as South Korea battery makers recover
    Aug 3, 11:55
    Taiwan auto market braces for second-half sales push as new models arrive
    Aug 3, 11:55
    German carmakers turn defensive in China as sales and margins fall
    MA-tek sells 80% stake in Shanghai subsidiary to accelerate global expansion
    Apple says advanced-node capacity tightens amid 2nm race
    Xiaomi raises flagship phone prices as memory and chip costs climb
    Ferrari's Luce sells out 2025 quota two months after launch
    Taiwan manufacturing business climate improves in June, headlined by electronics sector
    OpenAI reportedly expands probe after finding additional AI agent containment escapes
    India advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push
    Intel EMIB yields hit target, MediaTek eyes 2028 ASIC ramp
    India expands chip talent pipeline amid surging global chip demand
    IBM and Sarvam team up on India's sovereign AI push
    Dixon sees mobile, IT hardware, and component push lift export and margin outlook
    Pat Gelsinger joins xLight in bid to bring TSMC into US-made lithography project
    Rising component costs, new Indian incentives, and export push shape Dixon's outlook
    Samsung's GaN rumored setbacks threaten foundry launch, leaving it racing to close reliability gap
    OpenAI says next-generation model solved 10 longstanding math problems
    Weekly news roundup: Intel revives DDR4, Samsung challenges TSMC at 2nm, Qualcomm raises chip prices
    Doosan's SK Siltron acquisition reshapes semiconductor supply chain, accelerates AI-focused portfolio shift
    Samsung Electro-Mechanics deepens AI supply-chain bet with new contracts, eyes glass substrate production in 2027
    ROEC eyes AI optical communications without competing
    Liteon lifts 2026 capex after AI data center demand sends 2Q profit up 126%
    C.C.P. Contact Probes teams with chipmaker on MEMS probes and test-cleaning sheets
    FICG launches Singapore-Malaysia dual-core strategy
    Elevated Materials names Jay Wang as chief revenue officer
    Holtek raises MCU prices by up to 20% as wafer and OSAT costs continue climbing
    Beijing's AI 'golden circle' draws Moonshot, Z.ai, US$14B in funding
    More news
    Research Report Database
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
    reportAIglasses
    MOST-READ
    MULTIMEDIA
    Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
    2026 Kumamoto Earthquake
    A powerful earthquake struck Japan's Kyushu region at 4:27 pm on July 28. The Japan Meteorological Agency initially estimated the quake at magnitude 7.1 with a depth of 6.2 miles (10 kilometers).
    ...More
    EV
    Wednesday 29 July 2026
    Chinese brands seize 25% of Europe midsize SUV sales as BEV demand surges
    Elon Musk denies rumored Tesla China contingency plans; discussions on supply chain localization shifts persist
    Friday 31 July 2026
    Amazon's Zoox receives US approval for commercial deployment of robotaxis
    Friday 31 July 2026
    Auto chip demand recovers, but restocking remains elusive
    Friday 31 July 2026
    TECH
    Friday 31 July 2026
    Amazon lifts 2026 capex to US$220 billion, pins the increase on memory prices
    SK Hynix sees record-breaking 2Q on surging AI demand
    Wednesday 29 July 2026
    Nvidia remaps Asia's AI supply chain, raising fresh questions over Taiwan's edge
    Tuesday 28 July 2026
    AMD's latest 2nm-EPYC rollout signals broader role for CPUs in the AI data center
    Friday 24 July 2026
    ASIA
    Thursday 30 July 2026
    China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
    Exclusive: Asian chipmakers' shift to US helium raises concentration risk
    Friday 31 July 2026
    Elon Musk denies rumored Tesla China contingency plans; discussions on supply chain localization shifts persist
    Friday 31 July 2026
    Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war
    Friday 31 July 2026
    OPINIONS
    Friday 31 July 2026
    Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy
    Analysis: The AI buildout stopped being a demand story
    Friday 31 July 2026
    Research Insight: CXMT reaches 7.67% DRAM share with US$4.4B IPO, 2028 tech roadmap
    Friday 31 July 2026
    Analysis: Behind Microsoft's AI strategy to sharpen platform edge
    Friday 31 July 2026
    TOPICS
    2026 KUMAMOTO EARTHQUAKE
    JAPAN ADVANCED SEMICONDUCTOR MANUFACTURING, INC. (JASM)
    TSMC UPDATES
    LG ENERGY SOLUTION
    SPECIAL REPORTS
    Friday 31 July 2026
    China smartphone market and industry, 2Q 2026
    China smartphone market and industry, 2Q 2026: 2H26 shipments to drop by over 30% YoY
    Friday 24 July 2026
    TGV still faces technical barriers; CoPoS commercialization not likely until 2030
    TGV still faces technical barriers; CoPoS commercialization not likely until 2030
    Monday 13 July 2026
    Huakun deepens server cooperation with Huawei, targets overseas growth through on-premise AI applications
    Huakun deepens server cooperation with Huawei, with clients already in ASEAN, Central Asia, and South Asia. The company targets overseas growth through on-premise AI applications.
    Thursday 9 July 2026
    Notebook shipment update, May 2026
    In May 2026, combined shipments from the top five notebook brands increased by approximately 8% month-over-month. However, shipments by brand vendors were still down about 6% compared with May 2025.