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Aug 21, 12:17
Google, Marvell long-term deal keeps Broadcom at bay, limits MediaTek impact
Aug 21, 10:01
Analyst: CPO gains momentum as AI interconnect demands outpace chip gains
Aug 21, 11:35
Apple's VR retreat deepens with rumored layoffs in its Vision team
Aug 21, 09:24
Alibaba guides AI cloud revenue toward US$10 billion run-rate next quarter
Aug 21, 06:17
Charts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up
LATEST STORIES
7 days news
Taiwan automation shifts from hardware specs to AI platforms and open robot architectures
Aug 21, 13:45
ICT
Automation Taipei 2026: The invisible joint — why aerospace lightweighting is rewriting how parts are built
Aug 21, 12:14
AEROSPACE
Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
Aug 21, 12:08
SEMICONDUCTORS
Automation Taipei 2026: German suppliers target aerospace's hidden manufacturing bottlenecks
Aug 21, 11:46
AEROSPACE
SK hynix weighs Japan memory fab in Miyagi, but says no investment is final
Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's
Alibaba’s 45% AI cloud jump masked by 75% capex surge and margin squeeze
JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale
Honor Robot Phone moves from concept to mass production
AI paid user conversion rate in US only 3% as rising token costs fuel edge AI server demand
Analyst: 2028 key year for optical interconnects in AI racks
Iris Optronics upgrades solar-powered ChLCD e-paper series, expands outdoor and indoor displays
HP Korea localizes AI strategy with Upstage in healthcare, finance
Goertek reports higher revenue and profit in 1H26
FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production
Anthropic venture acquires Casper Studios to expand enterprise AI services
China's new solid-state battery standards could reshape the industry
800VDC adoption in AI data centers is set to reshape power chip demand
TIER IV and Renesas team up on open AI-native computing platform for autonomous vehicles
Taiwan export orders near US$98 billion in July, with US as top buyer
Stripe weighs US$7 billion OpenRouter deal to expand AI model routing
SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
Unitree chief says humanoid robots are not yet ready for mass real-world work
Micron launches long-horizon research hub to push memory and AI development
US ban on robot dogs clears the way for Taiwan's Swancor
JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
Charts: AI test demand drives broadest growth among Taiwan's chip equipment suppliers
Elice to build South Korea's first warm-water-cooled AI data center, unveils coding agent
Korean display makers step up OLED patent push as China narrows technology gap
Nitto Denko to expand HDD baseboard capacity for AI data center demand
More news
BIZ FOCUS
Aug 20, 11:00
Corning-IRICO Trade Secret Case Enters New Phase
Thursday 20 August 2026
PGC Helps Startups Accelerate ASIC Development with Turnkey Services
Thursday 20 August 2026
Chroma's Proprietary ASIC Technology Reshapes the Semiconductor Test Landscape
Thursday 20 August 2026
Henkel Launches LOCTITE ABLESTIK CDF900 Series Conductive Die Attach Film
MOST-READ
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
2027 memory capacity reportedly sold out as buyers quietly lock in supply
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Interview: Nvidia exec on progress of CPO production and pluggable optics
Nvidia Feynman pushes TSMC A16 and CPO ramp
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
OCP APAC Summit 2026
The OCP APAC Summit 2026 takes place August 11-12 at the TaiNEX2 exhibition hall in Taipei.
Lightmatter sets optical interconnect blueprint as AI hits copper wall
OCP APAC 2026: When AI starts running the hardware that runs it
OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?
...More
EV
Wednesday 29 July 2026
Chinese brands seize 25% of Europe midsize SUV sales as BEV demand surges
Xiaomi's AI strategy moves beyond models as MiMo becomes the intelligence layer across human-car-home ecosystem
Thursday 20 August 2026
Samsung and Hyundai expand alliance from EV batteries into software-defined vehicles
Thursday 20 August 2026
Taiwan chip designers see automotive demand rebound
Thursday 20 August 2026
TECH
Thursday 20 August 2026
Marvell issues Google warrant worth $12.2bn at exercise — custom chip work spans five TPU-related categories
MediaTek widens ASIC services as market share surges
Tuesday 18 August 2026
OCP APAC 2026: Intel sees agentic AI shifting bottlenecks toward CPUs, memory
Thursday 13 August 2026
OCP APAC 2026: Microsoft leans on Taiwan supply chain for 'silicon-to-systems' AI buildout
Wednesday 12 August 2026
ASIA
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
Unitree post-IPO: Chairman Wang weighs profit, scale and 80% home-robot threshold
Thursday 20 August 2026
Samsung gains foundry pricing power as 4nm capacity stays tight through 2027
Thursday 20 August 2026
China tightens grip on global LCD market as TV panel share tops 70%
Thursday 20 August 2026
OPINIONS
Thursday 20 August 2026
Analysis: Google keeps Sunfish at Broadcom, Zebrafish at MediaTek — Marvell's US$12.2bn warrant buys a category nobody was defending
Commentary: How iPad Air became a catalyst for IT OLED expansion
Thursday 20 August 2026
Analysis: Unitree IPO exposes the economics behind China's humanoid robot boom
Thursday 20 August 2026
Analysis: Marvell's US$120bn Google deal is the AI chip industry's new playbook — equity for orders, not cash
Thursday 20 August 2026
TOPICS
TRENDS IN INDUSTRIAL COMPUTING
EMS WATCH
XIAOMI'S 3NM BREAKTHROUGH
TSMC UPDATES
SPECIAL REPORTS
Thursday 20 August 2026
Global server market, 2Q 2026: Supply constraints curb shipment momentum, global server shipments up 2.8% in 3Q26
In the second quarter of 2026, global server shipments were below prior expectations, growing 3.8% quarter-over-quarter. The main reason was tight supply of key components such as memory, CPU, and IC substrate, which curbed overall system shipment momentu
Wednesday 19 August 2026
BYD leverages in-house semiconductors to power next phase of automotive intelligence; smart driving chip roadmap moves towards 4nm SoC
DIGITIMES notes that BYD Semiconductor's portfolio has expanded from the IGBTs and SiC power chips developed to meet early electric vehicle (EV) demand into high-computing-power smart-driving SoCs.
Friday 14 August 2026
AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
Thursday 13 August 2026
Taiwan notebook industry, 2Q 2026
Taiwan notebook industry, 2Q 2026
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