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REALTIME NEWS
Exclusive: China 6-inch SiC substrate supply tightens, suppliers brace for another price hike
Tomorrow's Headlines
1h 33min ago
Intel’s EMIB-T emerges as a backup option as CoWoS capacity tightens
Tomorrow's Headlines
1h 33min ago
AUO unit plans to ride synergy gains momentum into entering TSMC ecosystem
Tomorrow's Headlines
1h 33min ago
AI buildout lifts demand for China high-speed optical module makers
Tomorrow's Headlines
1h 33min ago
SJSemi expands 2.5D packaging to 3.3-reticle size for AI and HPC chips
Tomorrow's Headlines
1h 33min ago
Sep 2, 16:30
Fresh off Nasdaq listing, Pasqal turns to Taiwan's photonics industry to help it scale
Sep 2, 17:41
Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth
Sep 2, 16:45
DRAM giants target 3D stacking to break memory wall and power bottlenecks
Sep 2, 17:03
Lam Research exec says automated preventive maintenance key to fabs of the future
Sep 2, 14:19
Energy and water: How to tackle the fab resource crunch
LATEST STORIES
7 days news
Sandisk says HBF can match HBM bandwidth with up to 16x the capacity
Sep 2, 17:54
SEMICONDUCTORS
Samsung, SK Hynix inventories surge as valuation reserves fall
Sep 2, 15:41
EAST ASIA
World's first legged robot standard sets global benchmark for humanoids, robot dogs
Sep 2, 15:10
EAST ASIA
Indium CEO: packaging, cooling and power are next AI bottlenecks
Sep 2, 14:55
SEMICONDUCTORS
TSMC reportedly asks suppliers to develop 5μm HBM microbumps
IBM's quantum pitch to chip audience: bottleneck is now manufacturing
MediaTek pushes advanced packaging and supply chain to keep pace with AI
EU EV battery recycling still lacks a profitable model
Taiwan's semiconductor ecosystem has the UK taking notes
Nvidia and Micron top NT$4.4T in Taiwan investment
Zhen Ding launches 1.6T optical modules, 34-layer AI server boards at Semicon Taiwan to meet next-gen AI infrastructure demand
Semicon Taiwan 2026 to test cloud AI investment boom
Wonderful Hi-Tech expands Thailand, Vietnam capacity to capture emerging space data center, physical AI demand
India reportedly readies AI agent payments on UPI, its national payment rails
TSMC moves into Baipu Industrial Park, boosts advanced packaging
Certain Micro targets AI test-interface demand with three Semicon products
China's Galactic Energy puts PALLAS-1 in orbit, raising stakes in reusable rocket race
Meta reportedly taps SeeYA for Phoenix OLEDoS panels as BOE fails to qualify
Operations shake-up: how SpaceX is reengineering its AI data center strategy
Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center
Manus resumes independent operations after Meta deal collapses
Hardware isn't the problem — TSMC exec flags software, substrate gaps in 3D IC
SDC to expand foldable iPhone OLED mass production in September
European chip ambitions hinge on more than subsidies, says TSMC
ByteDance-ZTE Nubia NaviX Ultra clears launch hurdle, takes agentic AI beyond smartphone assistants
Chinese foundry Hua Hong Grace adds 55,000-wpm Wuxi capacity in US$4.17 billion Phase III buildout
China moves to curb overseas price wars as automakers accelerate global expansion
Taiwan doesn't just want a quantum lab — it wants a quantum fab
TCL CSOT bets on InP laser chips as supply tightens
MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments
More news
BIZ FOCUS
Sep 2, 08:22
World Diamond Technology accelerates mass production of 300 mm diamond wafers
Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains
Wednesday 2 September 2026
Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026
MOST-READ
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
2027 memory capacity reportedly sold out as buyers quietly lock in supply
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
Interview: Nvidia exec on progress of CPO production and pluggable optics
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Nvidia Feynman pushes TSMC A16 and CPO ramp
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
The end of the Tim Cook era at Apple
After a 15-year tenure, Apple CEO Tim Cook is stepping down on September 1, 2026, and handing the reins to hardware veteran John Ternus.
Tim Cook concludes 15-year Apple tenure, John Ternus takes over
Apple reshuffles leadership, shifts Schiller out of App Store
John Ternus takes over an Apple with one growth engine, no obvious second
...More
EV
Wednesday 29 July 2026
Chinese brands seize 25% of Europe midsize SUV sales as BEV demand surges
Commentary: Malaysia wants foreign automotive investment to leave more behind
Wednesday 2 September 2026
EU EV battery recycling still lacks a profitable model
Wednesday 2 September 2026
China moves to curb overseas price wars as automakers accelerate global expansion
Wednesday 2 September 2026
TECH
Wednesday 2 September 2026
European chip ambitions hinge on more than subsidies, says TSMC
Chinese court freezes US$318M in Nexperia assets, further escalating corp rift
Tuesday 1 September 2026
The architect of Apple's China machine also built its hardest problem
Monday 31 August 2026
Apple is only the test: Chinese memory makers CXMT, YMTC target North American cloud market
Wednesday 26 August 2026
ASIA
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
Samsung, SK Hynix inventories surge as valuation reserves fall
Wednesday 2 September 2026
India reportedly readies AI agent payments on UPI, its national payment rails
Wednesday 2 September 2026
Manus resumes independent operations after Meta deal collapses
Wednesday 2 September 2026
OPINIONS
Tuesday 1 September 2026
Commentary: Why America fell behind on Open models — and how Nvidia plans to close the gap
Commentary: DeepSeek out, SMIC in? TIME100 AI maps China's widening AI battleground
Tuesday 1 September 2026
Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
Tuesday 1 September 2026
Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
Tuesday 1 September 2026
TOPICS
THE END OF THE TIM COOK ERA AT APPLE
TSMC UPDATES
GEOWATCH
THE RISE OF MALAYSIA
SPECIAL REPORTS
Wednesday 2 September 2026
Global smartphone industry, 2Q 2026
According to DIGITIMES, smartphone memory contract prices surged by 50% to 80% in the first half of 2026, prompting most vendors to continue cutting shipments of mid- and low-end models and to raise product prices.
Friday 28 August 2026
AI data center 800VDC power architecture takes shape; future hurdles require balancing multiple key factors
DIGITIMES believes that 2026 will be a pivotal year in the stabilization of 800VDC power architectures for AI data centers.
Wednesday 26 August 2026
Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components
DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued to rise.
Tuesday 25 August 2026
Chinese automakers expand to humanoid robotics with technology, supply chain and scenario advantages
DIGITIMES observes that the humanoid robot market is expanding rapidly, supported by global labor shortages and advances in artificial intelligence (AI), and Chinese automakers are also moving aggressively into this emerging field.
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