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UAE weighs investment in 500 MW AI data center plan in Japan

Aug 24, 14:35

ICT

Nvidia reportedly weighs Perplexity investment as AI strategy expands beyond chips

Aug 24, 13:59

ICT

German auto industry hardens stance against Chinese competition

Aug 24, 13:55

EAST ASIA

Taiwan semiconductor materials hit golden opportunity

Aug 24, 13:45

SEMICONDUCTORS

Europe's struggling auto industry turns to China, drawing US scrutiny

Analysis: SK Hynix pushes beyond HBM with HBF and CPO

Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment

India weighs new capital subsidies to build domestic polysilicon capacity

Commentary: Robots go to work— highlight of the five robotic trends at WRC 2026

SEMI launches alliance to ride semiconductor materials boom

Interview: Inside Foxconn's playbook for the sovereign AI data center race

Taiwan speeds chip materials push with consumables, ITRI says

Pixel 11 preorder surge lifts Google's Taiwan smartphone share

Fujifilm opens new post-CMP cleaner plant at Oita to meet AI chip demand

Shanghai accepts YMTC's STAR Market listing application

ASE's Huang urges AI profits to fund R&D for CPO, PLP

Taiwan semiconductor materials team up to build local supply chain

India-based Raana Semiconductors in talks to raise US$10.4 million Series A for crystal-growth expansion

Jeilin shifts upmarket as high-end image SoCs drive margins higher

Robots shift from POC to ROI as logistics, manufacturing lead

USITC opens cylindrical battery probe as China-Korea competition intensifies

Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design

Half of GenAI projects stall at PoC as data gaps widen

Jinpao Precision anticipates 2H26 growth from AI orders, aerospace progress

AI packaging demand exposes supply-chain gaps for Taiwan materials makers

India targets domestic mobile phone design capabilities with new US$7.5 billion manufacturing scheme

MIT study finds AI image attribution weakens as training data grows

Alibaba plans HKD80 billion share placement to fund AI expansion

India advances Wi-Fi mmWave FWA trial as Gemtek eyes 100x shipments

AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint

More news

BIZ FOCUS

Aug 24, 08:00

STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility

MOST-READ

MULTIMEDIA

Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman

DIGITIMES has observed that Siri AI is built around four core layers - devices, models, reasoning, and applications - and is designed to transform Siri from a voice assistant into an AI agent capable of executing tasks.

In the second quarter of 2026, global server shipments were below prior expectations, growing 3.8% quarter-over-quarter. The main reason was tight supply of key components such as memory, CPU, and IC substrate, which curbed overall system shipment momentu

DIGITIMES notes that BYD Semiconductor's portfolio has expanded from the IGBTs and SiC power chips developed to meet early electric vehicle (EV) demand into high-computing-power smart-driving SoCs.