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REALTIME NEWS
China auto market cools as Taiwan suppliers brace for 2H26 inventory cuts
Electric Vehicles
30min ago
Sep 30, 12:13
CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
Sep 30, 11:45
Inside Anthropic's multi-billion-dollar loop: how circular financing powers the AI boom
Sep 30, 12:18
VSMC bets on value over cost as Singapore fab builds next-generation R&D and IP capabilities
Sep 30, 12:20
US-China trade truce extension draws orders back to China, threatening Taiwanese booking volumes
Sep 30, 10:33
AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties
LATEST STORIES
7 days news
EOI lays out three growth engines, eyes AI optical communications
Sep 30, 15:55
ICT
SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
Sep 30, 15:33
EAST ASIA
China's battery race enters post-scale era: Beijing shifts focus to solid-state and quality
Sep 30, 15:24
EAST ASIA
AI boom draws display makers into semiconductors with glass core substrates and Micro LED
Sep 30, 15:20
SEMICONDUCTORS
Interview: iFLYTEK Medical sees clinical integration as key to healthcare AI expansion in South Korea
Samsung SDI targets AI data centers with cylindrical LFP batteries and fire-propagation safeguards
Murata begins mass production of world's smallest three-terminal MLCCs
Acer targets new niches in mature device markets with education tablets, e-paper displays
ByteDance makes up a fifth of China's AI data center capacity amid growing buildout
Jensen Huang, Lisa Su join Tsinghua University advisory board, putting AI chip leaders closer to Beijing
NSIG chair exit brings leadership succession into focus
China's generative AI user base tops 700 million, driving adoption into manufacturing and humanoid robots
Samsung Electro-Mechanics' disclosed 2026 supply agreements total US$2.6 billion as server demand surges
Column: Memory and logic collide as AI shifts the balance
Commentary: What risks does China's DRAM capacity face amid tightening market?
DeepSeek brings software tools to Huawei's Ascend 950 to take on Nvidia
Geely-NIO deal signals consolidation in China's fragmented EV battery-swapping market
Foxconn links motors, humanoids, smart factories into a vertically integrated robotics strategy
Magnesium prices fall below aluminum as EV makers look to cut weight
Jensen Huang rejects AI doomsday framing, calls safety an engineering problem
Chinese EV tech is set to challenge US market barriers over time
Foundry 2.0 revenue hits record as growth spreads beyond TSMC
Tesla secures US$30B credit package to fuel AI and robot capex race
China auto market cools as Taiwan suppliers brace for 2H26 inventory cuts
Chief Telecom, Google Cloud launch backup services to bolster cable resilience
Tatung pivots to AI infrastructure integration
Trump-Xi meeting, upcoming APEC summit put US-China-Russia diplomacy in focus
Taiwan upgrades Circular Redesign Center as govt pushes top-down circular economy ecosystem
Linde secures Sanand land as global materials suppliers race to localize for India's first fabs
CXMT expansion meets surging GigaDevice DRAM demand, sharpening China's memory supply-chain buildout
More news
BIZ FOCUS
Sep 30, 08:00
Hackathon Team Optimizes Urban Evacuation Decision-Making
Wednesday 30 September 2026
AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
Wednesday 30 September 2026
Powering Next-Gen AI: Materials Enabling Advanced Packaging's Future
Tuesday 29 September 2026
Breaking free from keyword constraints: GeoGraph elevates job matching
MOST-READ
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
Musk's Memphis move puts xAI at the center of his empire
SK Hynix touts up to 5.15x inference gains with custom HBM
TSMC locks in 3-6% wafer out price hikes for 2027
TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
Singapore's chip progress
Singapore's semiconductor sector took a major step this week with the launch of VSMC's first 12-inch wafer fab in Tampines on September 28.
GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck
In global semiconductor race, Singapore bets on critical, mature technologies
Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Foxtron writes a new chapter in Taiwan auto history
Tuesday 29 September 2026
Mercedes-Benz and ProLogium expand solid-state battery testing partnership
Tuesday 29 September 2026
South Korea looks beyond high-nickel NCM in battery push
Tuesday 29 September 2026
TECH
Tuesday 29 September 2026
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
Commentary: Apple's M8 Ultra AI server plan could pull Apple Silicon into Nvidia's enterprise infrastructure game
Thursday 24 September 2026
Analysis: Foxconn's EV push moves beyond demo and toward scale
Wednesday 23 September 2026
China's memory race turns inward — CXMT, YMTC head toward patent showdown
Tuesday 22 September 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
Trump-Xi state dinner puts tech titans at the head table, spotlighting Taiwan's quiet supply chain clout
Tuesday 29 September 2026
Chips make up nearly half of South Korea's September exports; China, Hong Kong account for 52% of them
Tuesday 29 September 2026
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
Tuesday 29 September 2026
OPINIONS
Tuesday 29 September 2026
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
Tuesday 29 September 2026
Column: Beyond Zero Trust – why AI supply chain resilience needs a plan B
Tuesday 29 September 2026
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
Tuesday 29 September 2026
TOPICS
SINGAPORE'S CHIP PROGRESS
TRUMP-XI WASHINGTON SUMMIT 2026
HUAWEI
GEOWATCH
SPECIAL REPORTS
Thursday 17 September 2026
Physical AI drives autonomous driving upgrade; three efficiency factors lift AI accelerator demand
End-to-end autonomous driving has become the mainstream technology path, and the inference demand created by Physical AI in autonomous driving systems is, in turn, reshaping automotive system-on-chip (SoC) design.
Wednesday 16 September 2026
Global top-3 memory maker status, 3Q 2026: AI servers drive record memory revenue; SSD, LPDDR upgrades ahead
DIGITIMES observes that major memory suppliers posted record-high revenue in the second quarter of 2026, with yearover-year growth remaining in the triple digits. Driven by AI demand, SSDs and LPDDR are emerging as key competitive
battlegrounds.
Tuesday 15 September 2026
AI demand reshapes capital allocation and operating models in telecom sector
Although the global 5G mobile communications market is still growing in 2025, higher 5G user penetration has not necessarily translated into equivalent revenue growth for telecom operators, while annual growth in mobile data traffic has continued to slow.
Monday 14 September 2026
Notebook shipment update, July 2026
DIGITIMES' survey of July 2026 notebook shipments (excluding detachable models) from the world's top five notebook brands (excluding Apple) and the top three notebook ODMs
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