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REALTIME NEWS
Resonac develops 12-inch SiC substrate to target AI and EV demand
Tomorrow's Headlines
11h 24min ago
High-end GPUs may be slowing China’s AI compute expansion
Tomorrow's Headlines
11h 24min ago
2026 smartphone SoC battle centers on NPU as vendors boost cores and memory for agentic AI
Tomorrow's Headlines
11h 24min ago
LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity
Tomorrow's Headlines
11h 24min ago
Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling
Tomorrow's Headlines
11h 24min ago
Sep 17
SK Hynix looks beyond HBM as inference workloads diversify
Sep 17
CXMT cashes in on the DRAM shortage — and takes aim at HBM
Sep 17
TSMC reconsiders 12-inch equipment donation as Taiwan overhauls scope of research partnership
Sep 17
Samsung bets on zHBM as 2.5D memory nears its limits
Sep 17
Asia's healthcare AI moves from trials to real-world deployment
LATEST STORIES
7 days news
DeepSeek engineer's warning suggests AI may reshape, not simply eliminate, technical work
Sep 18, 00:10
ICT
Winbond's Infineon buyout puts GigaDevice under pressure
Sep 18, 00:08
SEMICONDUCTORS
AMD pivots to China developer ecosystems as Nvidia retreats
Sep 17
EAST ASIA
Deloitte Taiwan seminar highlights system integration as Physical AI moves into industrial applications
Sep 17
ICT
Trumpf eyes glass as AI demand drives packaging innovation
Topview sees supply-chain shifts supporting orders as AI investment reshapes its outlook
Memory LTAs lock up 50-70% of capacity
The Trump-Jensen speakerphone diplomacy: how Nvidia turned political pressure into a seat at the table
VLEO emerges as next orbital frontier as China warns of critical 2026–2030 window
Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer
China optical suppliers power smart glasses supply chain
Humanoid robots could reshape MEMS demand as physical AI advances
Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity
Tier IV open-sources self-driving AI chip design to challenge Nvidia
Wiwynn sees strong AI demand offsetting US data center pushback
Samsung Galaxy S27 series rumored to feature 4 models, reshaping flagship lineup with display and camera upgrades
Samsung expands SRAM, IP to speed chip development
AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns
Why Taiwan's tech needs better storytelling to win global capital
Foxconn Interconnect Technology targets the scaling challenge in AI optical interconnects
Taiwan readies ETS pilot as overseas expansion drives demand
Taiwan to pilot ETS by end-2026, experts urge three safeguards
Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet
20 of China's OSATs push into advanced packaging amid EUV curbs
iPhone 18 Pro preorders rise up to 20% in Taiwan as foldable Duo debuts
China's LCD trio flexes newfound pricing power as Taiwan panel makers retreat
FIT ramps up optical interconnect push as AI race shifts to connectivity
SK Hynix weighs US memory options as buyers lock in 2027 supply
Samsung reportedly starts Tesla chip trial production at Taylor fab
TOK completes KRW101 billion facility in South Korea to bolster semiconductor supply chain
More news
BIZ FOCUS
Sep 14, 08:00
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
Friday 11 September 2026
DAS Expands in Taiwan and Unveils World First at SEMICON
MOST-READ
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
Winstar's AI push gains momentum with some orders extending into 2027
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
CIOE 2026
The 27th China International Optoelectronic Exposition (CIOE 2026) took place September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions.
As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
AR glasses target 2 billion myopia users as China supply chain eyes doubling shipments
Sivers Semiconductors positions laser arrays as solution to copper's limits
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Musk hints at Tesla-SpaceX merger, but the companies are already converging underneath
Thursday 17 September 2026
Tier IV open-sources self-driving AI chip design to challenge Nvidia
Thursday 17 September 2026
Onsemi puts power density at the center of its next-decade strategy
Thursday 17 September 2026
TECH
Thursday 17 September 2026
Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV
Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027
Wednesday 16 September 2026
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
Monday 14 September 2026
Micron pays Taiwan fab workers up to 68 months' salary in memory upturn
Friday 11 September 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV
Thursday 17 September 2026
Samsung bets on zHBM as 2.5D memory nears its limits
Thursday 17 September 2026
Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet
Thursday 17 September 2026
OPINIONS
Thursday 17 September 2026
Column: China tightens rare earth controls, exposing hidden vulnerabilities in Taiwan's supply chain
The Trump-Jensen speakerphone diplomacy: how Nvidia turned political pressure into a seat at the table
Thursday 17 September 2026
DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months
Wednesday 16 September 2026
Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
Wednesday 16 September 2026
TOPICS
CIOE 2026
SEMICON TAIWAN 2026
TSMC UPDATES
HUAWEI
SPECIAL REPORTS
Thursday 17 September 2026
Physical AI drives autonomous driving upgrade; three efficiency factors lift AI accelerator demand
End-to-end autonomous driving has become the mainstream technology path, and the inference demand created by Physical AI in autonomous driving systems is, in turn, reshaping automotive system-on-chip (SoC) design.
Wednesday 16 September 2026
Global top-3 memory maker status, 3Q 2026: AI servers drive record memory revenue; SSD, LPDDR upgrades ahead
DIGITIMES observes that major memory suppliers posted record-high revenue in the second quarter of 2026, with yearover-year growth remaining in the triple digits. Driven by AI demand, SSDs and LPDDR are emerging as key competitive
battlegrounds.
Tuesday 15 September 2026
AI demand reshapes capital allocation and operating models in telecom sector
Although the global 5G mobile communications market is still growing in 2025, higher 5G user penetration has not necessarily translated into equivalent revenue growth for telecom operators, while annual growth in mobile data traffic has continued to slow.
Monday 14 September 2026
Notebook shipment update, July 2026
DIGITIMES' survey of July 2026 notebook shipments (excluding detachable models) from the world's top five notebook brands (excluding Apple) and the top three notebook ODMs
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