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7 days
14 days
Oct
28
2026
Ex-TSMC CTO says Taiwan's research institutes get too much funding and train too little talent
Transformation in focus as display supply chain kicks off investor briefings
Oracle accelerates AI chip diversification with Cerebras, Google, and SambaNova deals
CHPT posts record 3Q26 results as nine-month profit jumps over 90%
HTC launches Vivee AI companion pet in US
Toyota accelerates robot commercialization as IKKA targets supply-chain opportunities
SK Hynix bets on EUV to extend 6F-squared DRAM as CXMT pushes 4F-squared
Cloud AI costs drive demand for on-premises computing, squeezing Asus RTX Spark supply
AI startups face scrutiny over revenue metrics used to promote rapid growth
Kentec targets CSP opportunities with AIDC infrastructure integration
AI reshapes China wealth rankings as ByteDance's Wenfeng Liang debuts at No. 7
Microsoft medical AI tops 80% accuracy in complex cases
PC makers reportedly shift production back to China as AI boom drives up component costs
India-based Spintronics AI weighs GaN chip fab in Madhya Pradesh
Alibaba wins injunction over Pentagon rule targeting shared lobbying firms
AMD to invest US$1 billion in Meta's stock sale as Helios racks enter testing
SK Hynix's Solidigm ties US$45B US NAND fab to Washington nod on China tool upgrade
SK Hynix's next bet goes beyond memory chips
Fujifilm to boost magnetic tape capacity 5x as AI data storage demand grows
SK Hynix looks beyond IPO to fund Solidigm's US expansion
Google TPUs land Oracle, with OpenAI reportedly next
SK Hynix's next AI memory bet isn't HBM
Unimicron steers resources to Taiwan AI substrates with NT$50.9B equipment orders, Japan unit sale
Corning hits US$20 billion run-rate goal early as optical demand drives next growth phase
IC designers MediaTek, Realtek, and Parade face 3Q26 earnings tests
Celestica says awarded programs already put 2028 demand above its 2027 outlook
Micron recruits in South Korea for Taiwan roles as Taoyuan strike dispute persists
Anthropic's surging compute demand fuels ASIC prospects, favoring Broadcom over MediaTek
Seagate sees a multi-year storage upcycle as long-term deals lock up supply through 2028
Seagate's pricing gains strengthen profitability as HAMR transition advances
NXP's automotive content gains, industrial demand strengthen its growth outlook
Corning's AI fiber growth puts capacity delivery, customer funding in focus
Apple leans on AI silicon as reviewers call its Mac refresh incremental, question iPad mini pricing
NXP lines up software-defined vehicles, industrial AI and data centers for double-digit growth in 2027
SK Hynix's record quarter shows AI demand turning memory into a contracted, supply-limited business
Simmtech steps up SOCAMM investment as BT substrate supply tightens
Nvidia DSX POD targets AI factories as Microsoft and AWS push modular data centers to the edge
Semiconductor equipment is not AI chip growth's biggest bottleneck
Cambricon profit jumps 131%, CEO says firm never gave 1 million-chip forecast
TLB develops SOCAMM3 substrates; Vietnam plant to break ground
Google prioritizes frontier AI as cloud capacity runs short
Huawei elevates consumer chief Gang He to board as consumer unit gains strategic weight
Goke Microelectronics raises KGD packaging prices again
Samsung DX division opens Suzhou robotics R&D hub
MiCo Ceramics acquires idle LGD plant for KRW150 billion to boost semiconductor component capacity
FarEasTone, Elveo Mobile expand satellite-to-phone connectivity in Taiwan
CXMT reportedly prioritizes China demand, rejecting Apple's DRAM inquiry
Germany diversifies transport fuels to cut carbon emissions as HVO 100, eSAF reshape global supply chains
Skymizer partners with Egis to develop 12nm and 6nm AI accelerators
From superconductors to optics: The six Silicon Valley startups bringing AI bottleneck solutions to Taiwan
Macronix posts record 3Q26 profit as gross margin hits 70%
SpaceX turns Nvidia GPUs into long-duration assets with US$40 billion Apollo deal
Analysis: 3M's investment in Genius Electronic Optical puts EBO mass production to the test
Analysis: What happens if Claude demand cools before its compute bills do?
For Taiwan's geothermal sector, institutional barriers outweigh drilling challenges
Oct
27
2026
Jensen and Musk both think aging GPUs are worth more than the books show
Tesla sees Cybercab becoming a new growth bet amid declining auto revenue
Australia's AI build-out hits the grid: how a delayed power line wiped out AUD3 billion
Chinese EVs push imported models ahead of South Korean vehicles
Pat Gelsinger warns AI compute efficiency must jump 10,000x amid power, memory, and fab constraints
Nvidia DSX POD challenges traditional AI data center construction
Infineon and ASMedia team up on end-to-end USB 20Gbps setup for AI cameras
JIMTOF 2026 draws 94 Taiwan machine tool exhibitors
Anthropic IPO filing shows the US govt is trying to be frontier AI's customer and gatekeeper
AI spending surges, Microsoft opens exit door to 60,000 employees
SoftBank eyes US$50B Malaysia AI data-center expansion
AI data centers drive cooling, power, modular infrastructure demand
Anthropic IPO filing exposes massive compute buildout spanning TPUs, GPUs, and dedicated data centers
PSMC capacity crunch holds back Jeju Semiconductor's growth
Broadcom, financial firms agree on US$63 billion funding for Anthropic chip purchases
Mitsubishi Materials scales thermistor capacity sixfold amid AI boom
AI demand squeezes automotive memory, pushing automakers to take control of chip supply
China AI token debate highlights challenge of monetizing compute
The Anthropic IPO filing: 14-fold 1H26 revenue growth behind a US$80.75 billion paper loss
Kazakhstan positions AI infrastructure as a potential export industry after Nvidia CEO's visit
US designates helium as critical material amid Middle East supply shock
Ennostar's optical push could add new growth engine for 2027 and onward
AMD, Nvidia target substrate capacity amid 4x expansion constraints
Fujifilm expands South Korean capacity to meet AI chip demand
FANUC raises forecast as AI, automation demand drives record revenue
Charts: Why German automakers are becoming marginalized in US BEV market
Nvidia says GPUs last 8 years, unlocking AI financing
Meta launches US$35 billion equity raise, funds US$60 billion at-the-market program for AI build-out
Applied Materials to raise Besi stake to 20% as hybrid-bonding orders surge
Nvidia's Berlin keynote highlights AI scaling challenges in Europe
Samsung, SK Hynix eye 2Q27 shipments of 8-layer HBM4 to Nvidia
AWS, Google challenge CUDA as AMD, Intel cut AI switch costs
Inside SKT’s push to turn SK Hynix’s fabs into an AI business
China supply-chain price hikes strain domestic demand
Vietnam's first fab reportedly faces doubts over 2027 target
Fine M-Tec rejects component blame as foldable market outlook remains positive
DRAM price gains fall short as supply shrinks up to 50%
AI data center boom risks squeezing power chip supplies for auto, electronics
Weekly news roundup: iPhone Duo shipment target revised upward amid display issues
Japan sets JPY100 billion push to commercialize perovskite solar cells
HCLTech and Rapidus open India centers to support semiconductor engineering
India's smartphone shipments hit a decade low in 3Q26 amid rising prices
As iPhone Duo inner screens crack, Samsung capitalizes on foldable surge
Intel to acquire quantum computing software firm Classiq
Anthropic's IPO filing puts TSMC, HBM, direct leasing at the center of AI compute risk
Tamil Nadu adds independent chip subsidy route as Indian states vie for investment
OPTOELEC seeks AI data center orders as Himax advances CPO optics
China's Neolix eyes Korean assembly of autonomous delivery vans in 2027
Hyundai supplier SL eyes first overseas robot deployment in US
Tata Communications plans up to US$450 million fibre network linking India's AI hubs
KAR bets on fleet monitoring as South Korea expands robotaxi trials
ByteDance denies AI micro-dramas consume over half of China's AI computing power
Amkor turns to customer prepayments as global packaging investment accelerates
Cadence bets on its own chip design AI models as Synopsys teams up with OpenAI
Cadence says chip design demand is broadening beyond AI as analysts test margins, rival targets
India sets October 2028 target for homegrown smartphone brand
Celestica's AI growth puts capacity in focus as revenue outlook reaches US$40 billion
Cadence raises 2026 outlook as AI design demand drives record backlog
Amkor gross margin climbs to 18.3% as computing mix offsets consumer weakness
Samsung Executive Chairman reportedly eyes RX unit visit for humanoid robot push
DIGITIMES Insights: AI servers move toward 800V DC as vertical power delivery promises higher efficiency, lower transmission losses
Cheng Mei develops materials for advanced packaging glass substrates
Sunic System wins overseas OLEDoS equipment order
Oct
26
2026
Interview: From afterthought to bottleneck, circuit boards move to the heart of AI hardware
Meta prioritizes high-margin AI inference as Wiwynn, Quanta eye CPU server demand
Taiwan wafer-testing supplier Hermes Testing Solutions commits more than US$215 million to advanced chip testing expansion
Podcast highlights: TSMC's 3nm demand story, Samsung HBM shift, and A14 ramp
India roundup: India's tech build-out opens new markets, but foreign suppliers are first in line
Oct
25
2026
Nvidia unveils OOI CPO prototype for post-2028 AI needs
China clears DeepSeek, MiniMax for overseas AI deployment
Namuga expands beyond Samsung with humanoid robot camera modules
Chinese automakers capture record 14.6% Europe market share as looming hybrid import curbs spur shipments
AI data centers drive Taiwan's electrical firms into modular, EPC markets
Meta’s AI commitments surge to US$825 billion, testing financing power
Texas Instruments sees up to $1,000 in chip content per humanoid robot as analog supply tightens
Column: Will general-purpose models overtake Physical AI?
Magnate Technology sees aerospace, semiconductor growth opportunities
Moonshot's Singapore hiring shows how China's open-model labs plan to get paid abroad
Tesla-SpaceX merger tests whether Musk's technology empire is worth more together
Interview: The story of LEACHIM, a working humanoid robot from the 1970s
Oct
24
2026
Mitsubishi Electric, ABB form joint venture for power distribution business
Nvidia rejects near-term memory glut fears, leaves CXMT cooperation open
SpaceX's 80,000-site push turns Starlink from satellite overlay into full mobile challenger
Bosch to spin off automotive business as Asian rivals intensify pressure
AIDC launches Taiwan's largest industrial microgrid with 9MW/54MWh energy storage capacity
LGES Poland plant nears breakeven as utilization rebounds
Oct
23
2026
Doosan Robotics targets automakers, chipmakers as Chinese rivals cut prices
Taiwan's inaugural semiconductor strike pauses as nearly 70% of Micron Taoyuan Union rejects new bonus offer
Semco's 61-week MLCC lead times give suppliers upper hand in AI supply chain
Lenovo mounts AI comeback with Nvidia Vera Rubin NVL72 deliveries and US plant expansion
Chinese luxury carmakers face barriers in Europe's premium market
Japan targets 2nm medical AI chip with IBM design, Rapidus eyed for foundry
Nvidia B300 chips reportedly surface on China Telecom-linked network, raising export-control questions
First chip-level device on the list: US FCC bans two devices with Huawei HiSilicon chips under new rule
Samsung reportedly orders final tools for first Taylor fab as Texas site nears 2nm output cap
Taiwan's top telecom spins off AI surveillance unit, plans global push with local hardware makers
Apple reportedly taps BOE for LCD iMac development, keeps OLED timetable in question
TSMC advances CoPoS packaging at Taoyuan Longtan site
Rapidus courts US AI customers ahead of planned 2H27 2nm mass production
Commentary: How long can the humanoid robot bubble last? Unitree's valuation correction puts physical AI to the test
Chinese phone brands beat Samsung, Apple to high-refresh OLED
FCC grants Intel a waiver to foreign robot ban to prevent chip disruptions
China's weak car market squeezes automakers, suppliers and dealers
Analysis: Nvidia's Vera CPU takes on Intel and AMD with a platform play
JCET's AI profit surge sets up US$2.73 billion advanced packaging expansion
US signs up to US$389 million in CHIPS R&D deals for power chips and fusion
Anthropic launches Claude Duet to automate cross-app tasks
DIGITIMES Insight: BCI grasping reaches market; implant stability and chip heat keep advanced uses beyond 2030
Tesla, Nvidia reportedly invest KRW3.7 trillion to secure Samsung Electro-Mechanics ABF capacity
Taiwan sits out global chip selloff, thanks to typhoon
Care robots need AI modeling, physics simulation to understand humans
Mounting R&D and memory costs push Huawei to borrow US$2.3B from six Chinese banks
TSMC reportedly surveys suppliers on rare-earth-free motors as China's export-control pause nears legal expiry
ChainSea Information Integration lists, targets AI revenue growth by 2027
Analysis: Nvidia's DSX POD reshapes AI factory supply chains
India becomes Taiwan's third-largest machine tool export market
Tech Mahindra teams up with SpaceXSI to scale AI-assisted software engineering for enterprises
SK Hynix halts Solidigm IPO review in face of broader AI and market volatility
Apple's foldable iPhone Duo launches in China with delivery stretching into 2027
Tesollo develops robot hands as AeiROBOT tests humanoids for shipyard work
Apple's iPhone Duo and touchscreen MacBook could accelerate OLED TDDI adoption
Monitors take over as LG Display's large OLED growth engine while auto panels stall
Western Digital bets on pricing and HAMR, not new capacity, as Toshiba plans to double output
LG Display sees foldables growing faster than expected, but Apple's first foldable panels reportedly go to a rival
Jensen Huang warns Europe risks falling further behind US, China in AI
Western Digital argues AI's longer payoff lies in stored data, not compute
AI cuts chip R&D cycles to 9 months, says Etron chair
DeepSeek reportedly raises US$15B as IPO plans gather pace
LG Display returns to profit as OLED mix offsets chipflation drag
Unitree's cumulative G1 humanoid robot output reaches 10,000–20,000 units
LG Display pitches mask-free FLiPP as its answer to rivals' 8.6G OLED lines
Western Digital widens margins on pricing and exabyte growth
Why is TSMC suddenly looking at Texas?
Interview: TI sees liquid cooling shift to tray-level control in AI data centers
India's CleanMax partners with Apple, Meta to supply green power for AI data centers
Elan targets drone market with solutions contributing revenue in 2026 and 2027
LG home appliance chip volume tops 1 million; spins off startup PADO to target GPU compute leasing
Salesforce Taiwan targets double-digit growth as AI adoption accelerates
CHT launches AI imaging unit, targets IPO
Analysis: Can Tesla's thruster-equipped Roadster hit public roads? US, China, EU regulations pose hurdles
Samsung Foundry targets automotive, edge AI chips with 8LPU+
AUO reshapes businesses with 'quasi-holding company' model
UMC, AP Memory advance AI chip power delivery with validated DTC silicon capacitors for advanced packaging
Oppo targets premium smartphone growth with global Find X10 launch
Taiwan, UK expand offshore wind, CCUS energy cooperation
Lam Research sees WFE topping US$200 billion in 2027
PSMC eyes Taiwan, Japan, Singapore for 3D AI foundry expansion
Compal and Verda expand AI cloud infrastructure partnership
Midea's Clivet targets AI cooling market with compressor redesign
SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production
AMEC ships first Primo Domingo selective etching system, targeting critical gaps in China's advanced 3D chipmaking
BIZ FOCUS
Oct 28, 08:17
SK hynix Announces 3Q26 Financial Results
Wednesday 28 October 2026
CES Asia Unveiled Expands to Hong Kong for CES 2027
Wednesday 28 October 2026
GMIF2026 Exhibition Recap: Innovation Across AI Memory and Storage Chain
Friday 23 October 2026
AI Wealth Management: MaiCoin Leverages Startup Energy for Next-Gen Fintech
MOST-READ
7 DAYS NEWS
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Nvidia unveils OOI CPO prototype for post-2028 AI needs
SK Hynix's Solidigm ties US$45B US NAND fab to Washington nod on China tool upgrade
SK Hynix's next bet goes beyond memory chips
CXMT reportedly prioritizes China demand, rejecting Apple's DRAM inquiry
SK Hynix's record quarter shows AI demand turning memory into a contracted, supply-limited business
SK Hynix bets on EUV to extend 6F-squared DRAM as CXMT pushes 4F-squared
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