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    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Wednesday 16 September 2026
    Glass substrates, TGV set to reshape 2027 advanced packaging race
    As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
    Wednesday 16 September 2026
    Apple, Intel links sharpen focus on Lens Technology's next glass growth markets
    Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: Apple-linked foldable devices and Intel-linked through-glass-via...
    Wednesday 16 September 2026
    FSC teams with South Korean maker on TGV equipment for glass substrates
    Fu Chun Shin Machinery Manufacture (FSC), a major plastic injection molding machine maker, is expanding further into semiconductors by teaming up with Korean-Chinese joint venture...
    Wednesday 16 September 2026
    A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors
    High-end multilayer polymer capacitors (MLPCs) — increasingly critical to power delivery in AI servers and high-wattage GPUs and CPUs — have historically been dominated...
    Wednesday 16 September 2026
    As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
    At the China International Optoelectronics Expo (CIOE), a palm-sized metal transceiver represents the shift from copper to light in data center infrastructure, one of the biggest transformations...
    Tuesday 15 September 2026
    Murata considers bigger MLCC expansion as AI server demand extends beyond 2028

    Murata Manufacturing is considering a new, potentially larger expansion of multilayer ceramic capacitor (MLCC) capacity beyond its existing...

    Tuesday 15 September 2026
    AI servers are eating MLCC capacity, Chinese suppliers are taking what's left

    AI servers are reshaping the global multilayer ceramic capacitor (MLCC) market. Murata Manufacturing and Samsung Electro-Mechanics (SEMCO)...

    Tuesday 15 September 2026
    Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

    As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

    Tuesday 15 September 2026
    Sivers Semiconductors positions laser arrays as solution to copper's limits

    At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the...

    Tuesday 15 September 2026
    AI server tracker: CCL makers outpace PCB and substrate suppliers as server demand grows
    Taiwan's copper-clad laminate (CCL) makers significantly outpaced printed circuit board (PCB) and IC substrate suppliers in August, as stronger server demand, pricing and product-mix...
    Tuesday 15 September 2026
    Chinese chip tools reach 35% of equipment installed at local fabs
    Chinese-made semiconductor equipment accounted for roughly 35% of tools installed at fabs in China in 2025, up from about 25% a year earlier, as domestic suppliers gain ground in key...
    Tuesday 15 September 2026
    Inside CIOE: takeaways from China's biggest optoelectronics show
    Last week, from September 9 to 11, thousands of vendors gathered for an enormous trade show in the Chinese tech hub of Shenzhen. At the China International Optoelectronic Expo (CIOE),...
    Tuesday 15 September 2026
    Global data center capex could reach US$31.6 trillion by 2050 as AI demand surges
    PwC and Oxford Economics jointly released their Global Data Centre Outlook 2026–50 in early September, projecting cumulative global...
    Tuesday 15 September 2026
    Exclusive: China's 8-inch SiC suppliers turn to pricing discipline after 6-inch price war

    As the silicon carbide (SiC) industry shifts from 6-inch to 8-inch wafer manufacturing, leading China-based substrate suppliers are...

    Monday 14 September 2026
    STMicro lead times top 1 year, boosting Taiwan chip makers
    AI crowd-out effects are rippling through the supply chain, with lead times for microcontroller units (MCUs) from STMicroelectronics reportedly stretching beyond 1 year and triggering...
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