News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Monday 3 August 2026

C.C.P. Contact Probes teams with chipmaker on MEMS probes and test-cleaning sheets

C.C.P. Contact Probes said it has expanded its presence in the AI sector through a joint development project with a major semiconductor company covering microelectromechanical systems...

Monday 3 August 2026

AI server demand revives long-term MLCC supply agreements as shortages intensify

Surging demand for AI servers is tightening global capacity for high-end passive components, prompting customers to once again pursue long-term supply agreements (LTSAs) as they seek...

Saturday 1 August 2026

Elite Material posts record 2Q result on strong AI-related demand

Elite Material Co. said booming demand for advanced materials used in AI hardware kept its factories fully loaded in the second quarter of 2026, lifting revenue and profit to record...

Saturday 1 August 2026

Thintronics wins proposed US CHIPS incentives for advanced substrate technology

Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research...

Friday 31 July 2026

AI server boom reshapes MLCC pricing as capacity shifts upmarket

The rapid expansion of AI infrastructure is reshaping one of the semiconductor industry's most overlooked component markets. Soaring...

Friday 31 July 2026

Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

Friday 31 July 2026

Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry

TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...

Friday 31 July 2026

Chang Wah sees broadening demand recovery and higher margins in 2Q26

Chang Wah Technology said stronger demand and tighter inventories are lifting its business across multiple markets, a sign that the recovery in electronics supply chains is widening...

Thursday 30 July 2026

Japan and South Korea MLCC makers signal further price hikes amid AI demand

Japan and South Korea's MLCC suppliers are again raising prices, signaling tighter supply conditions that could affect electronics...

Wednesday 29 July 2026

China's glass substrate supply chain takes shape for AI chip packaging

Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...

Wednesday 29 July 2026

Huawei targets 2027 glass substrate production to gain an edge in AI chips

Huawei is reportedly working through its domestic supply chain to begin mass production of semiconductor glass substrates in 2027,...

Wednesday 29 July 2026

AI, memory clients lock in long-term orders for Leading Technology

Leading Technology, the IC substrate arm of PCB giant Zhen Ding Technology Group, is pressing ahead with plans for a Hong Kong listing as AI and memory customers sign long-term supply...

Tuesday 28 July 2026

Display industry earnings season shifts spotlight from panel prices to transformation strategies

Taiwan's display supply chain enters second-quarter earnings season this week, with Coretronic reporting results on July 28, followed...

Tuesday 28 July 2026

AI memory demand lifts WF6 prices as PERIC Special Gases adopts market-based pricing

Surging demand for AI servers and advanced memory devices is tightening the global supply of tungsten hexafluoride (WF6), drawing increased attention to one of the semiconductor industry's...

Tuesday 28 July 2026

Eiso raises NT$300M to accelerate AI, aerospace, defense PCB expansion

Printed circuit board (PCB) manufacturer Eiso Enterprise has completed its annual fundraising plan. To strengthen working capital for...

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Sep 11, 08:00

DAS Expands in Taiwan and Unveils World First at SEMICON

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