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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Wednesday 10 July 2024
US to invest up to US$1.6 billion to award domestic semiconductor advanced packaging R&D efforts
On July 9, the US Department of Commerce issued a Notice...
Wednesday 10 July 2024
Unimicron to expand high-end IC substrate market share
Unimicron Technology aims to expand its share of the high-end IC substrate market and surpass Japanese competitors by 2025, according to T. J. Tseng, chairman of the Taiwan-based...
Tuesday 9 July 2024
Taiwan seeks to alleviate labor shortage with relaxed residency regulations
To enhance corporate investment momentum in Taiwan and address talent shortages, Taiwan's National Development Council (NDC) said it is considering a system similar to Japan's "J-Skip"...
Tuesday 9 July 2024
SEMICON Taiwan 2024 to highlight AI as key driver of industry growth
As artificial intelligence (AI) continues to be a major driver of global semiconductor industry growth, SEMICON Taiwan 2024 is set to bring together industry leaders and visionaries...
Tuesday 9 July 2024
Passive component demand picking up, thanks to market recovery and AI
AI has been a driving force for Taiwan-based companies in relevant supply chains, boosting their profiles on the global stage.
Tuesday 9 July 2024
OmniVision expands automotive CIS market share
Onsemi and OmniVision are now in a tight race for leadership in the automotive CMOS image sensor (CIS) market, with conflicting reports from research firms about which company held...
Monday 8 July 2024
Taiwanese PA chip makers see strong demand from China and US
As the smartphone industry enters its peak shipment season in the second half of 2024, major brands are launching new devices. Taiwan's power amplifier (PA) chip supply chains, including...
Monday 8 July 2024
TSMC's CoWoS innovator honored as Academia Sinica Academician in Taiwan
The 34th Academia Sinica academician and honorary academician election recently welcomed 28 new members, including Douglas Yu, Vice President of Pathfinding for System Integration...
Monday 8 July 2024
Taiwan's chipmaking supply chain keen to forge GaN ecosystem, eyeing lucrative application opportunities
Gallium nitride (GaN), a third-generation compound semiconductor, has not developed as rapidly as silicon carbide (SiC). Nevertheless, this hasn't deterred new opportunists from joining...
Friday 5 July 2024
Japan, South Korea race to develop GCS for next-gen chip packaging amid Intel push
Glass core substrates (GCS) are poised to play a crucial role in next-generation advanced chip packaging. In response, Japanese and South Korean semiconductor supply chain players...
Friday 5 July 2024
AI applications to drive CCL demand in 2H24
Taiwan-based copper clad laminate (CCL) makers Elite Material, Iteq, and Taiwan Union Technology (TUC) are poised for a robust second half of the year, driven by growing demand for...
Wednesday 3 July 2024
SMC Diode to quadruple production with new fab in China
SMC Diode Solutions has recently celebrated the inauguration of its second power discrete fab in Nanjing, China.
Wednesday 3 July 2024
Global demand's 18x growth for semiconductor talent outpaces Taiwan's supply: Burn-Jeng Lin
Despite increasing numbers of graduates from electrical engineering, electronics, and optoelectronics programs trained by six universities joining the industry, Taiwan still faces...
Wednesday 3 July 2024
PCB firm Chin-Poon remains bullish about long-term demand for EVs
Chin-Poon Industrial, an automotive PCB specialist, maintains an optimistic outlook on the long-term demand for Electric Vehicles (EVs).
Wednesday 3 July 2024
PanelSemi diversifies from displays to semiconductor sector
PanelSemi, which was established with the backing of Foxconn founder Terry Gou and invested by panel manufacturer Innolux, has expanded its operations beyond displays to semiconduc...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research