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Tuesday 3 February 2026
Germany pivots to Korean chipmakers as Intel retreats

German state governments are stepping up efforts to secure new semiconductor partners in South Korea after Intel shelved plans to build...

Tuesday 3 February 2026
Intel's 14A mass production timeline faces skepticism with rising capacity and confidence challenges, says DIGITIMES analyst
Before Intel released its latest earnings report, market sentiment was unusually upbeat. In a DIGITIMES podcast program, DIGITIMES analyst Luke Lin noted that expectations were buoyed...
Monday 2 February 2026
SMIC reportedly sets up advanced packaging research institute in Shanghai
As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with...
Monday 2 February 2026
Weekly news roundup: Diversification, memory power, capacity politics
Below are the most-read DIGITIMES stories from the week of January 16 – February 1, 2026.
Saturday 31 January 2026
Intel signals return to memory with new DRAM bonding research
In early 2026, a research update published by Sandia National Laboratories (SNL), part of the US Department of Energy, sparked industry discussions about whether Intel is poised to...
Friday 30 January 2026
ASML gains from rising EUV demand and US chip spending
After TSMC chairman C.C. Wei said on a recent earnings call that AI demand is real and that AI is becoming embedded in daily life as a long-term trend, expectations for ASML's performance...
Friday 30 January 2026
GlobalFoundries stalls France fab as US manufacturing push sidelines Europe's chip ambitions
Following Intel's major global wafer fab plan cuts, including halting projects in Germany and Poland, GlobalFoundries (GF) and STMicroelectronics (ST) have faced fresh scrutiny over...
Friday 30 January 2026
BIWIN Mini SSD Ecosystem Application Seminar Concluded Successfully

The "From Shenzhen to Global Opportunity: BIWIN Mini SSD Ecosystem Application Seminar", jointly hosted by BIWIN and Intel, was successfully concluded at the Intel Greater...

Friday 30 January 2026
Memory, CPU shortages hit Wintel notebooks, benefiting Apple
Notebook makers are under growing pressure as memory shortages and price increases persist, while a widening shortage of CPUs adds a second constraint. What began as a supply gap at...
Thursday 29 January 2026
Jensen Huang hints at H200 approval for China, cements TSMC’s central role
Nvidia CEO Jensen Huang arrived in Taiwan at noon on January 28 following a visit to China for a subsidiary's year-end event, where he outlined the latest status of H200 export approvals...
Wednesday 28 January 2026
Exclusive: Nvidia to reportedly shift 2028 chip production to Intel, reshaping TSMC strategy
TSMC's dominance in advanced process and packaging has made it a prime target amid US manufacturing mandates. Chip customers now face mounting pressure to diversify supply chains due...
Tuesday 27 January 2026
China reportedly enters semiconductor glass substrate market
China is moving into the semiconductor glass substrate market, with both chip-related suppliers and display makers entering the field, according to Korean industry reports.
Tuesday 27 January 2026
Apple, Qualcomm rethink heavy reliance on TSMC as costs rise

Even as TSMC retains a clear technological lead in advanced process nodes, Apple and Qualcomm are reassessing how heavily they rely...

Monday 26 January 2026
Lisa Su's toughest call: scrapping AMD's server roadmap

Jodi Shelton, co-founder and CEO of the Global Semiconductor Alliance (GSA) and Shelton Group, recently launched a new podcast,

Monday 26 January 2026
Weekly news roundup: strategy shifts, supply chain realignments, scaling limits
Below are the most-read DIGITIMES Asia stories from the week of January 19-25, 2026.