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NEWS TAGGED INTEL
Tuesday 12 May 2026
TSMC CoWoS shortage drives SK Hynix-Intel 2.5D push
TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI acceler...
Tuesday 12 May 2026
Intel's revival secret: Suppliers with TSMC's stamp of approval
With TSMC capacity under mounting supply-demand pressure, Intel — once written off by many as a company fighting for survival — is staging a credible comeback.
Tuesday 12 May 2026
Apple, Qualcomm and MediaTek take different paths as TSMC capacity stays tight
TSMC is facing fierce customer competition and supply shortages as demand surges for artificial intelligence and high-performance computing chips, forcing fabless chipmakers to consider...
Monday 11 May 2026
Analysis: Intel's Apple deal boosts CEO Tan's turnaround, but hard part still lies ahead

Intel's reported preliminary agreement to manufacture some chips for Apple devices would mark a major validation point for CEO Lip-Bu...

Monday 11 May 2026
AMD's 2nm defection to Samsung dents TSMC's AI grip
The AI semiconductor supply chain is showing unexpected signs of a shift, with TSMC's long-held dominance in the foundry market beginning to loosen. US chipmakers are increasingly...
Monday 11 May 2026
DIGITIMES Insight: MediaTek denies Intel link as TSMC's packaging lead faces new test

DIGITIMES senior analyst Luke Lin said Warren Buffett's investment in Apple should be viewed not simply as a stock trade, but as a bet...

Monday 11 May 2026
OpenAI and chipmakers roll out MRC to prevent AI training slowdowns
OpenAI said it has partnered with chipmakers and cloud providers — including AMD, Broadcom, Intel, Microsoft, and Nvidia — to develop a new networking protocol aimed at...
Monday 11 May 2026
Weekly news roundup: Taiwan freezes trading in MediaTek; 2D NAND shortage spirals
Below are the most-read DIGITIMES Asia stories from the week of May 4-10, 2026:
Friday 8 May 2026
TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead
TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to...
Friday 8 May 2026
Analysis: AMD overtakes Intel in data center revenue as agentic AI revives x86 CPUs
AMD data center revenue surpassed Intel's for the first time in the first quarter of 2026, highlighting how the rise of agentic artificial intelligence (AI) is reshaping demand across...
Thursday 7 May 2026
Intel shifts data center chip packaging to Vietnam and expands EMIB advanced packaging integration
Intel is relocating a data center chip production line from Costa Rica to its Vietnam facility. The move, flagged in a Saigon Hi-Tech Park management board report to the Ho Chi Minh...
Thursday 7 May 2026
Nvidia, AMD and Intel starve the PC market to feed the AI boom
The AI boom is beginning to cannibalize the very consumer hardware market that once fueled the PC industry's growth.
Thursday 7 May 2026
Commentary: Why Apple's Intel and Samsung talks remain preliminary—and what that means for TSMC
A year of Intel-Apple negotiations and recent Samsung chatter amount to familiar supply-chain posturing—and TSMC's technical advantages remain unbeatable.
Thursday 7 May 2026
Intel targets entry-level advanced packaging, draws interest from Google and Amazon
Over the past decade, market assessments of Intel have largely been confined to a single lens: execution in advanced process technology. By that metric, Intel has struggled, with delays...
Wednesday 6 May 2026
Intel Capital leads QuantWare's US$178 million bet on hyperscale quantum computing ambitions
QuantWare's US$178 million Series B round aims to accelerate the global rollout of larger, industrial-scale quantum processors, promising hyperscale quantum compute through its VIO-40K...