News tagged Intel at DIGITIMES

NEWS TAGGED INTEL

Tuesday 14 April 2026

Glass substrates move toward mass production as Intel, Samsung Electro-Mechanics step up efforts

Glass substrates are entering a critical pre-mass production phase as demand for high-performance AI chips accelerates. As AI workloads require larger chip sizes and higher bandwidth,...

Tuesday 14 April 2026

Google and Intel expand CPU partnership, boosting ASIC and startup opportunities

Google recently announced an expanded collaboration with Intel to increase the deployment of Xeon processors in its cloud AI data centers. This move reflects the rapidly growing demand...

Monday 13 April 2026

AI memory crunch revives DDR3 in PC market

AI demand is squeezing global DRAM supply to the point where the PC market is turning back to decade-old technology. Shortages in DDR5 and DDR4 have pushed prices high enough to revive...

Monday 13 April 2026

Intel and SambaNova deepen alliance to capture AI infrastructure demand

As artificial intelligence moves from experimentation to full-scale production, companies are confronting the limits of GPU-only inference...

Monday 13 April 2026

DIGITIMES Insight: US MATCH Act tightens export noose while Intel swaps debt for control and Nvidia co-opts rivals

The semiconductor industry is undergoing coordinated shifts that could reshape equipment flows, corporate financing, and supplier relationships in the AI era, according to DIGITIMES...

Saturday 11 April 2026

Intel unveils ultra-thin GaN chiplet as it advances AI-era systems foundry strategy

Intel Foundry has announced a breakthrough in gallium nitride (GaN) chiplet technology, unveiling what it describes as the world's thinnest GaN chiplet as part of its broader push...

Friday 10 April 2026

Intel–Google alliance reframes AI infrastructure around CPUs

A newly expanded collaboration between Intel and Google signals a key shift in AI infrastructure: CPUs are back at the center of the conversation. Both companies emphasized that the...

Friday 10 April 2026

CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR

Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According...

Thursday 9 April 2026

Why global chipmakers want to join TSMC's certified supply chain

TSMC's long-established supplier verification and management system is gradually becoming an industry standard, attracting major players worldwide. Samsung Electronics, Intel, Japan's...

Thursday 9 April 2026

Intel–Terafab collaboration highlights potential role for 18A in next-generation AI manufacturing

The collaboration between Intel and Elon Musk under the Terafab initiative is emerging as a potential catalyst for demand for Intel's most advanced manufacturing node, 18A, even as...

Thursday 9 April 2026

Geopolitics and AI is redrawing the global chip packaging landscape

The AI computing boom is reshaping where semiconductors get packaged. Geopolitical pressure and supply chain diversification are pushing capacity well beyond its traditional strongholds...

Wednesday 8 April 2026

Intel and Musk's Terafab revive IDM collaboration as chipmaker pushes turnaround

Intel's industrial ecosystem is converging on a vertically integrated chip model, as Intel joins the Terafab project led by SpaceX, xAI, and Tesla—marking both a revival of the...

Tuesday 7 April 2026

Intel challenges TSMC CoWoS as Amazon, Google reportedly explore alternatives

AI-driven demand is pushing advanced chip packaging to its limits, exposing constraints in TSMC's CoWoS capacity and forcing hyperscalers...

Tuesday 7 April 2026

Analysis: NVLink licensing reshapes semiconductor alliance; potential Broadcom truce

In September 2025, Nvidia CEO Jensen Huang made a rare joint livestream appearance with Intel CEO Pat Gelsinger to announce a US$5 billion equity investment in Intel. In March 2026,...

Tuesday 7 April 2026

Cincoze Launches DX-1300 High-Performance Compact Industrial Computer

Cincoze has announced the latest addition to its Rugged Computing - DIAMOND product line: the DX-1300 high-performance compact industrial computer. The DX series, already...

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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