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    Exclusive: China reportedly tightens solar equipment export reviews ahead of Trump’s visit
    8h 37min ago
    Nvidia deepens Corning tie-up as China’s fiber supply chain draws attention
    8h 37min ago
    Commentary: Pre-summit G2 talks give China’s chip sector a brief reprieve
    8h 37min ago
    AI demand drove chip prices higher as China’s IC exports jumped 83.7% in 4M26
    8h 37min ago
    Arm’s AGI CPU demand surges as supply constraints loom
    8h 37min ago
    Apple, Qualcomm and MediaTek take different paths as TSMC capacity stays tight
    8h 37min ago
    NEWS TAGGED INTEL
    Monday 11 May 2026
    Analysis: Intel's Apple deal boosts CEO Tan's turnaround, but hard part still lies ahead

    Intel's reported preliminary agreement to manufacture some chips for Apple devices would mark a major validation point for CEO Lip-Bu...

    Monday 11 May 2026
    AMD's 2nm defection to Samsung dents TSMC's AI grip
    The AI semiconductor supply chain is showing unexpected signs of a shift, with TSMC's long-held dominance in the foundry market beginning to loosen. US chipmakers are increasingly...
    Monday 11 May 2026
    DIGITIMES Insight: MediaTek denies Intel link as TSMC's packaging lead faces new test

    DIGITIMES senior analyst Luke Lin said Warren Buffett's investment in Apple should be viewed not simply as a stock trade, but as a bet...

    Monday 11 May 2026
    OpenAI and chipmakers roll out MRC to prevent AI training slowdowns
    OpenAI said it has partnered with chipmakers and cloud providers — including AMD, Broadcom, Intel, Microsoft, and Nvidia — to develop a new networking protocol aimed at...
    Monday 11 May 2026
    Weekly news roundup: Taiwan freezes trading in MediaTek; 2D NAND shortage spirals
    Below are the most-read DIGITIMES Asia stories from the week of May 4-10, 2026:
    Friday 8 May 2026
    TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead
    TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to...
    Friday 8 May 2026
    Analysis: AMD overtakes Intel in data center revenue as agentic AI revives x86 CPUs
    AMD data center revenue surpassed Intel's for the first time in the first quarter of 2026, highlighting how the rise of agentic artificial intelligence (AI) is reshaping demand across...
    Thursday 7 May 2026
    Intel shifts data center chip packaging to Vietnam and expands EMIB advanced packaging integration
    Intel is relocating a data center chip production line from Costa Rica to its Vietnam facility. The move, flagged in a Saigon Hi-Tech Park management board report to the Ho Chi Minh...
    Thursday 7 May 2026
    Nvidia, AMD and Intel starve the PC market to feed the AI boom
    The AI boom is beginning to cannibalize the very consumer hardware market that once fueled the PC industry's growth.
    Thursday 7 May 2026
    Commentary: Why Apple's Intel and Samsung talks remain preliminary—and what that means for TSMC
    A year of Intel-Apple negotiations and recent Samsung chatter amount to familiar supply-chain posturing—and TSMC's technical advantages remain unbeatable.
    Thursday 7 May 2026
    Intel targets entry-level advanced packaging, draws interest from Google and Amazon
    Over the past decade, market assessments of Intel have largely been confined to a single lens: execution in advanced process technology. By that metric, Intel has struggled, with delays...
    Wednesday 6 May 2026
    Intel Capital leads QuantWare's US$178 million bet on hyperscale quantum computing ambitions
    QuantWare's US$178 million Series B round aims to accelerate the global rollout of larger, industrial-scale quantum processors, promising hyperscale quantum compute through its VIO-40K...
    Wednesday 6 May 2026
    SoftBank, Intel target HBM limits with 9-layer memory
    SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints...
    Tuesday 5 May 2026
    Another Qualcomm exec joins Intel to lead PC and physical AI unit
    Intel has announced that it has appointed Alex Katouzian as head of its Client Computing and Physical AI Division. With this hire, Intel seeks to align its consumer PC business with...
    Tuesday 5 May 2026
    Apple reportedly explores Intel and Samsung chip production to reshape advanced manufacturing strategy
    Apple is exploring a significant shift in its semiconductor supply chain, holding early discussions with Intel and Samsung Electronics to produce the main processors used in its devices,...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook