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Friday 8 May 2026
TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead
TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to...
Friday 8 May 2026
Analysis: AMD overtakes Intel in data center revenue as agentic AI revives x86 CPUs
AMD data center revenue surpassed Intel's for the first time in the first quarter of 2026, highlighting how the rise of agentic artificial intelligence (AI) is reshaping demand across...
Thursday 7 May 2026
Intel shifts data center chip packaging to Vietnam and expands EMIB advanced packaging integration
Intel is relocating a data center chip production line from Costa Rica to its Vietnam facility. The move, flagged in a Saigon Hi-Tech Park management board report to the Ho Chi Minh...
Thursday 7 May 2026
Nvidia, AMD and Intel starve the PC market to feed the AI boom
The AI boom is beginning to cannibalize the very consumer hardware market that once fueled the PC industry's growth.
Thursday 7 May 2026
Commentary: Why Apple's Intel and Samsung talks remain preliminary—and what that means for TSMC
A year of Intel-Apple negotiations and recent Samsung chatter amount to familiar supply-chain posturing—and TSMC's technical advantages remain unbeatable.
Thursday 7 May 2026
Intel targets entry-level advanced packaging, draws interest from Google and Amazon
Over the past decade, market assessments of Intel have largely been confined to a single lens: execution in advanced process technology. By that metric, Intel has struggled, with delays...
Wednesday 6 May 2026
Intel Capital leads QuantWare's US$178 million bet on hyperscale quantum computing ambitions
QuantWare's US$178 million Series B round aims to accelerate the global rollout of larger, industrial-scale quantum processors, promising hyperscale quantum compute through its VIO-40K...
Wednesday 6 May 2026
SoftBank, Intel target HBM limits with 9-layer memory
SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints...
Tuesday 5 May 2026
Another Qualcomm exec joins Intel to lead PC and physical AI unit
Intel has announced that it has appointed Alex Katouzian as head of its Client Computing and Physical AI Division. With this hire, Intel seeks to align its consumer PC business with...
Tuesday 5 May 2026
Apple reportedly explores Intel and Samsung chip production to reshape advanced manufacturing strategy
Apple is exploring a significant shift in its semiconductor supply chain, holding early discussions with Intel and Samsung Electronics to produce the main processors used in its devices,...
Tuesday 5 May 2026
Intel PC chip roadmap takes shape as Razor Lake, Titan Lake stay on track
Intel is gaining momentum in both chip design and foundry operations. Its PC platform roadmap for the next two years is coming into sharper focus as process technology and yield improve,...
Tuesday 5 May 2026
Intel's revival runs on politics and promises — but supply bottlenecks tell a different story
Intel's share price has hit historic highs as the semiconductor industry draws significant investor attention. But is this hype justified? DIGITIMES analyst Luke Lin took a deep dive...
Tuesday 5 May 2026
Analysis: CoWoS crunch and MediaTek's hire raise a bigger question — can Intel deliver?
The AI chip race is increasingly running into a different kind of limit — not compute, but packaging, as supply constraints around advanced technologies such as CoWoS begin to...
Monday 4 May 2026
Weekly News Roundup: Terafab already affecting wafer fab landscape; Intel launches multi-year reset
Below are the most-read DIGITIMES Asia stories from the week of April 27-May 4, 2026:
Monday 4 May 2026
Commentary: Intel names TSMC as key partner; insider drives its comeback

One year into his tenure, Intel CEO Lip-Bu Tan struck a markedly different tone on the company's outlook. At the first-quarter 2026 earnings...