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Friday 2 October 2026
AMD bets on AI demand by buying World Labs
Under Lisa Su's 12-year tenure at Advanced Micro Devices (AMD), the company has gradually moved beyond its role as Intel's challenger in the CPU market. But in the accelerator market...
Friday 2 October 2026
DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide
Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply...
Friday 2 October 2026
A look at the startup winning Nvidia, Intel backing for AI scale-up optics
Silicon Valley data center optical interconnect startup CScale emerged from stealth on September 30 after raising US$145 million in a Series C funding round backed by Nvidia and Intel...
Thursday 1 October 2026
MediaTek TPU orders rise as chip capacity war intensifies
MediaTek's Google Tensor Processing Unit (TPU) business is still moving steadily higher, but supply-chain sources say the real limit is capacity as chipmakers and cloud service providers...
Thursday 1 October 2026
Lip-Bu Tan calls TSMC a partner rather than a rival
Intel CEO Lip-Bu Tan stated that Intel's relationship with TSMC is built on partnership rather than rivalry. He noted that a collaborative mindset guides key industry leaders, including...
Tuesday 29 September 2026
SoftBank subsidiary Saimemory taps Shinko to bring ZAM closer to commercialization
Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration...
Tuesday 29 September 2026
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
Sunday 27 September 2026
Meta Muse fuels agentic AI demand, tightening CPU supply

Meta's AI assistant Muse is drawing strong market response, and the rise of agentic AI is drawing attention to AI infrastructure shortages...

Friday 25 September 2026
Interview: Intel director talks physical AI, business models, and robotics' future
Physical AI is accelerating like never before. Autonomous intelligent machines can walk, run, fly, swim, and assemble car parts in under a minute. New advances in AI models and technologies...
Thursday 24 September 2026
Peking University Dean's rare Intel China appearance hails AI-plus edge adoption

Chinese macroeconomist Justin Lin, dean of Peking University's Institute of New Structural Economics, made a rare appearance at a tech...

Thursday 24 September 2026
Commentary: Apple's M8 Ultra AI server plan could pull Apple Silicon into Nvidia's enterprise infrastructure game

After more than a decade away, Apple may be preparing to return to the enterprise server market. According to The Information, as reported...

Thursday 24 September 2026
Intel puts CPU-GPU coordination at center of agentic AI strategy
Intel is positioning closer coordination between CPUs, GPUs and other computing resources as a key requirement for the next phase of AI, as agentic AI shifts workloads from model inference...
Thursday 24 September 2026
AMD pushes ROCm for agentic workloads while Intel holds on to OpenVINO

Starting in the second half of 2025, as AI agent programs such as OpenClaw, Hermes, Claude, and DeepSeek Harness were launched one after...

Tuesday 22 September 2026
Acer debuts first Googlebook with 360-degree hinge
Acer has launched its first Googlebook, a new flagship notebook equipped with Gemini Intelligence that combines premium materials, strong performance, smart features, and seamless...
Monday 21 September 2026
Intel reportedly in talks with AUO on advanced packaging
Intel is reportedly in talks with AUO on Micro LED substrate-based advanced packaging for co-packaged optics (CPO) and high-density computing, as display makers look to turn large-area...