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Tuesday 2 June 2026
Intel CEO Lip-Bu Tan anchors AI comeback on 18A, x86, and Taiwan ties at Computex 2026
Intel CEO Lip-Bu Tan used his Computex 2026 keynote in Taipei to frame Intel's AI-era reset around execution, infrastructure, and deeper ties with Taiwan's PC and semiconductor supply...
Tuesday 2 June 2026
Intel CEO Lip-Bu Tan's Computex keynote: 1,000 steps up Elephant Mountain and a live demo with Perplexity's CEO
Intel CEO Lip-Bu Tan opened his Computex 2026 keynote in Taipei on June 2 with a personal note that set him apart from every Intel CEO before him.
Tuesday 2 June 2026
Nvidia's N1X chip adds pressure to x86 PCs as AI demand reshapes the market
Nvidia's new N1X processor, developed with MediaTek, signals a broader shift in PC computing as AI agents gain traction worldwide. The Arm-based chip could boost supply choices, intensify...
Tuesday 2 June 2026
Intel unveils Xeon 6+ to power agentic AI inference, challenges GPU-centric infrastructure
Intel is expanding its data center portfolio with new Xeon 6+ processors, Ethernet E835 networking products, and fresh details on its Crescent Island AI accelerator, positioning the...
Tuesday 2 June 2026
Phison and Intel roll out aiDAPTIV to boost local AI on Intel AI PC platforms
Phison Electronics announced a collaboration with Intel to bring aiDAPTIV memory extension technology to Intel AI PC platforms running Intel Core Ultra processors, aiming to enable...
Tuesday 2 June 2026
Commentary: Intel turns AI packaging crunch into foundry comeback test
Intel's foundry revival may depend less on beating TSMC at the most advanced process nodes than on whether it can turn AI-driven demand into a profitable advanced packaging busines...
Monday 1 June 2026
Nvidia expects AI boom to keep supply tight beyond 2027
Nvidia chief executive Jensen Huang said the artificial intelligence industry is entering a rapid growth phase that could keep revenue rising sharply into 2027, while supply-chain...
Monday 1 June 2026
AI spillover puts CPUs and ASICs on Computex stage
Computex 2026 will open under the theme "AI Together," with attention shifting beyond Nvidia's training-focused hardware to AI computing, robotics, smart mobility, and next-generation...
Monday 1 June 2026
Exclusive: TSMC SoIC deepens AI chipmaker lock-in while Huawei hits process wall
The global semiconductor industry is at an inflection point, split between those who can still shrink transistors and those who can no longer do so. US export controls and the denial...
Monday 1 June 2026
MediaTek touts One MediaTek strategy, upbeat on ASIC ASPs
MediaTek held a media event ahead of Computex, with several top executives taking part as the company highlighted progress in AI data centers and its broader "One MediaTek" strategy...
Monday 1 June 2026
MediaTek highlights supply chain advantage, says focus with Nvidia is product cooperation
MediaTek held a pre-Computex 2026 media event in Taipei, Taiwan, on May 29, after which president and COO Joe Chen and CFO and co-COO David Ku spoke with reporters. Ku shared his views...
Saturday 30 May 2026
Intel makes first major move into India's semiconductor ecosystem with advanced glass substrate manufacturing MoU
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state...
Saturday 30 May 2026
'Hardware is sexy again': Plug and Play CEO says AI boom has finally fulfilled his 2006 semiconductor dream
The building where Saeed Amidi runs his global venture empire was once one of the most important semiconductor facilities on the West Coast. Philips Electronics operated a fabrication...
Friday 29 May 2026
Intel's foundry comeback hinges on advanced packaging
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect...
Tuesday 26 May 2026
Intel's Rio Rancho fab becomes test case for AI-era chip packaging
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...