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Wednesday 19 February 2025
China's HBM breakthrough intensifies pressure on Samsung
China's memory industry is making remarkable progress, substantially closing the technology gap with South Korea in DRAM and NAND flash manufacturing. The country has also achieved significant breakthroughs in high-bandwidth memory (HBM), a critical component for AI-driven computing.
Wednesday 19 February 2025
Global silicon wafer shipments and revenue start to recover in late 2024
In the latter half of 2024, global demand for silicon wafers began to rebound from the industry's downturn experienced in 2023, as reported by the SEMI Silicon Manufacturers Group (SMG) in its year-end assessment of the silicon wafer sector.
Wednesday 19 February 2025
SK Hynix expands HBM3E production, boosting Hanmi Semiconductor's growth despite DeepSeek threat
SK Hynix is reportedly expanding its production of fifth-generation, 12-layer HBM3E, with Hanmi Semiconductor and ASMPT expected to lead in equipment orders. Hanmi is set for growth in the expanding market, fueled by increased Micron investment in HBM. However, the rise of DeepSeek could create uncertainties in the HBM market, potentially affecting equipment demand.
Wednesday 19 February 2025
Samsung semiconductor chief reportedly meets with Nvidia CEO as HBM3E race heats up
Samsung Electronics' semiconductor head Young-Hyun Jun reportedly met with Nvidia CEO Jensen Huang in the US, fueling speculation that Samsung is advancing its bid to supply HBM3E memory. Industry sources suggest the visit signals that Samsung's 8-layer HBM3E could soon pass Nvidia's quality certification.
Wednesday 19 February 2025
SK Hynix taps VP to lead US HBM packaging facility
SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched as the company navigates intensifying market competition.
Tuesday 18 February 2025
Strong fundamentals for DRAM and NAND drive memory prices to rise in 2Q25
Chip manufacturers are actively promoting price rises in the second quarter, leading to an expected rise in DRAM and NAND flash prices during this period.
Tuesday 18 February 2025
DRAM manufacturers reportedly plan to cease DDR3, DDR4 production by late 2025
The DRAM market is shifting as falling prices due to weak demand prompt top players like Samsung Electronics, SK Hynix, and Micron to adjust their strategies. These companies are pivoting toward DDR5 and high-bandwidth memory (HBM) and may phase out DDR3 and DDR4 by 2025, anticipating a future focused on advanced memory technologies.
Tuesday 18 February 2025
Taiwan 4Q24 IC output value increases
Taiwan's total IC industry output value—including IC design, IC manufacturing, IC packaging, and IC testing—was NT$1.49 trillion (US$45.5 billion) in the fourth quarter of 2024, up 8% quarter-over-quarter and 24.2% year-over-year, according to Taiwan's Industrial Technology Research Institute's Industrial Economics and Knowledge Center (IEK).
Tuesday 18 February 2025
NEG expands glass substrate production amid HBM and semiconductor packaging boom
Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due to the growing demand for generative AI, which has boosted sales of glass materials used for support in semiconductor processes. The company plans to enhance capacity at its Shiga Prefecture factory in Japan.
Monday 17 February 2025
Kioxia announces capex reduction due to NAND surplus despite profitability forecast
Kioxia has projected a return to profitability for fiscal 2024 (April 2024 - March 2025). However, its capex is expected to decrease by approximately 25% year-over-year in response to the accumulation of NAND Flash inventory.
Monday 17 February 2025
Kioxia expects return to profitability in FY24, driven by AI-related SSDs
Kioxia forecasts a return to profitability in its fiscal year 2024, propelled by robust demand for SSDs in AI infrastructure.
Monday 17 February 2025
Micron plans 12-layer HBM3E production for Nvidia, challenging Samsung's position
Recent industry reports reveal that Micron is preparing to begin mass production of its 12-layer HBM3E memory for Nvidia, potentially creating significant pressure on Samsung Electronics as it struggles to keep pace with this advancement, which could impact its memory business.
Monday 17 February 2025
Mexico launches Kutsari Project to boost semiconductor sector amid global competition pressures
Mexico launched the "Kutsari Project" to transform its semiconductor sector by improving design capabilities, revising patent laws, and establishing dedicated R&D centers. This initiative comes as global semiconductor competition intensifies, and Mexico lags despite significant commitments, necessitating swift advancement.
Friday 14 February 2025
Macronix plans inventory reduction, targets 3D NOR contribution by 2026
Macronix International, a Taiwan-based manufacturer of mask ROM and flash memory, is strengthening its competitive product portfolio while anticipating its in-house developed 3D NOR chips to bolster operations starting in 2026.
Friday 14 February 2025
AUO to sell more assets to Micron; Singapore facility seeking buyer
AUO has agreed to sell the Taichung facilities of its subsidiary, AUO Crystal, to Micron Technology. This is the second time the panel maker has sold assets to the memory vendor.
Thursday 13 February 2025
CXMT advances to 16nm DRAM production, pushes 15nm development
ChangXin Memory Technologies (CXMT) has accelerated its next-generation DRAM development, transitioning from 17nm to 16nm process technology for its first DDR5 product, according to TechInsights. The company is also advancing 15nm DRAM, with plans to complete R&D by 2025 and begin mass production in late 2026.
Thursday 13 February 2025
Samsung boosts foundry output with rising 4nm orders fueling Exynos and crypto growth
Samsung Electronics' foundry unit is set to ramp up production, lifting shutdown measures on its manufacturing equipment and targeting full operational capacity at its Pyeongtaek facility by June 2025, according to industry sources.
Thursday 13 February 2025
Samsung reportedly to upgrade China NAND production to 286 layers
Samsung Electronics plans to convert part of its 3D NAND production at its Xi'an plant in China to the company's most advanced 286-layer stacked products.
Thursday 13 February 2025
PCIe Gen5 in high-end PCs set to drive Silicon Motion's sales growth in 2025
The PC market is expected to show weak performance in the second half of 2024, but the industry remains optimistic about replacement demand in 2025. The introduction of PCIe Gen5 in high-end models is set to begin in Q2 2025, with a projected penetration rate of 5% for the year. Growth will further accelerate in 2026, with the overall penetration rate reaching 20-30%.
Thursday 13 February 2025
Micron reportedly seeks new contractors for India ATMP facility amid delays
Micron Technology has launched the bidding process to secure a construction partner for the second phase of its ATMP project, as the first phase of its Indian ATMP facility faces delays, challenging India's goal of timely producing its first domestically manufactured chip.
Thursday 13 February 2025
SK Hynix's North American revenue more than double in 2024
Major South Korean companies saw their revenue from the North American market increase by around 20% in 2024, with high-bandwidth memory (HBM) market leader SK Hynix seeing the largest growth. However, potential new tariffs under consideration by US President Donald Trump, including a 25% tariff on all steel and aluminum imports and new tariffs on semiconductors, could come as a significant blow if imposed.
Wednesday 12 February 2025
CXMT's DRAM rise: a déjà vu from South Korea's past disruption of Japanese dominance
China's ChangXin Memory Technologies (CXMT) is emerging as a formidable player in the global DRAM market, potentially challenging Samsung Electronics and SK Hynix's market dominance. This development bears striking similarities to South Korea's disruption of Japan's memory industry decades ago.
Wednesday 12 February 2025
SK Hynix, Samsung see exports of multi-chip packages fall in January 2025
South Korean memory maker SK Hynix saw its exports of multi-chip packages (MCP) fall by nearly 30% sequentially in January 2025. At the same time, some analysts believe that after two years of rapid growth, high-bandwidth memory (HBM) is becoming more sensitive to seasonal demand changes.
Tuesday 11 February 2025
DeepSeek challenges memory makers SK Hynix, Samsung's HBM strategies
Chinese AI startup DeepSeek has demonstrated a cost-effective approach to high-performance AI, potentially disrupting SK Hynix and Samsung Electronics' positions as key suppliers of high-bandwidth memory (HBM) for Nvidia. This development has prompted both companies to consider strategic shifts, with industry observers closely monitoring the situation.
Tuesday 11 February 2025
NAND prices rise as memory market shows recovery signs
Following production cuts by NAND flash manufacturers and the resolution of inventory destocking issues in China's sector, industry supply chain sources indicate that NAND spot pricing has begun to increase after the Lunar New Year holiday.
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