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Wednesday 26 February 2025
YMTC's hybrid bonding patents: is Samsung losing ground in 400+ layer 3D NAND?
South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND...
Wednesday 26 February 2025
DeepSeek disrupts AI landscape, igniting edge computing, and memory demand, says Silicon Motion CEO
DeepSeek's emergence is accelerating edge AI adoption, challenging the reliance on Nvidia's ecosystem. Silicon Motion CEO Wallace Kou sees its rise as a shift in AI development strategy...
Wednesday 26 February 2025
Macronix, TSRI announce new 3D DRAM technology
The Taiwan Semiconductor Research Institute (TSRI), under the National Science and Technology Council (NSTC), announced at a press conference held by Taiwan's National Applied Research...
Wednesday 26 February 2025
Samsung signs licensing agreement with YMTC for Hybrid Bonding tech
Samsung Electronics has reportedly signed a patent licensing agreement with Chinese NAND Flash manufacturer Yangtze Memory Technology Corp (YMTC) to license its Hybrid Bonding technology...
Wednesday 26 February 2025
SK Hynix to finalize Intel NAND takeover in March, cementing eSSD leadership
SK Hynix will finalize its acquisition of Intel's NAND flash business, now rebranded as Solidigm, in March 2025. This strategic move strengthens its enterprise SSD (eSSD) market position...
Monday 24 February 2025
AI boom sends HBM demand soaring as Samsung eyes ASIC market shift
The global AI boom is set to keep high bandwidth memory (HBM) in short supply through 2025, as demand surges across AI and data-intensive applications, according to experts at SEMICON...
Monday 24 February 2025
Apacer forecasts NAND and DRAM price rebound by 2Q25 amidst shifting market dynamics
Apacer CEO C.K. Chang believes that the drop in NAND Flash and DRAM prices is almost over, with little room for further declines. Prices are expected to rise in the second quarter,...
Monday 24 February 2025
Weekly news roundup: China shifts strategy on US tech rivalry; Intel reboots foundry business with UMC and MediaTek alliance
These are the most-read DIGITIMES Asia stories from the week of February 17 – February 21.
Monday 24 February 2025
Samsung to launch LPW DRAM in 2028, touted as 'mobile HBM' for on-device AI
As AI applications advance, the demand for high-performance and energy-efficient memory is growing across on-device AI, high-performance computing (HPC), and data centers. In response,...
Friday 21 February 2025
SK Hynix CEO sees greater opportunities for semiconductor industry amid DeepSeek's impact
SK Hynix CEO Noh-Jung Kwak, reflecting on the emergence of China's DeepSeek, predicts that the generative AI model will ultimately have a positive impact on the semiconductor industry...
Friday 21 February 2025
UFS integrated with QLC NAND to penetrate mobile phone market
In recent years, Quad-Level Cell (QLC) NAND has gradually penetrated mainstream applications such as PCs and enterprise-level storage, but it has yet to make substantial inroads into...
Friday 21 February 2025
Micron targets PC replacement trend; PCIe Gen5 penetration to reach 10% in 2026
With the ongoing development of new-generation processors, the introduction of PCIe Gen5 specifications into high-end PC applications is set to commence in 2025. According to Micron...
Friday 21 February 2025
Samsung, Micron ramp up global search for HBM talent
Memory firms are stepping up recruitment efforts, as global demand intensifies for manpower supporting development of semiconductors for AI applications.
Friday 21 February 2025
Ex-Samsung executive sentenced for alleged 18nm DRAM tech leak to CXMT
A former Samsung Electronics senior manager was sentenced to seven years in prison and fined KRW200 million (approx. US$138,820) by a South Korean court for allegedly leaking core...
Thursday 20 February 2025
Kioxia unveils 332-layer NAND flash, redefining speed and efficiency
Japanese NAND Flash manufacturer Kioxia unveiled its latest advancement in NAND flash memory technology on February 20, featuring an impressive increase to 332 layers, up from the...