Below are the top DIGITIMES Asia stories from July 14 to 20, 2025. The top three topics include Nvidia teams up with Micron for a major SOCAMM rollout, aiming to challenge high-bandwidth...
Samsung Electronics is preparing a major push to reclaim ground in the high-bandwidth memory (HBM) market, where it has lagged behind SK Hynix and Micron. Its sixth-generation 1c...
As demand for artificial intelligence (AI) accelerates, tech giants like Amazon, Google, and Meta are emerging as major players in the high-bandwidth memory (HBM) market. These companies...
Nvidia is reportedly preparing to enter a new phase in the memory market by planning to deploy between 600,000 and 800,000 SOCAMM modules in 2025. This initiative positions SOCAMM...
SK Hynix is ramping up domestic semiconductor production as US export controls and geopolitical tensions prompt a broader reshuffling of the global memory supply chain. The company...
EmBestor Technology, a Taiwan-based flash storage provider specializing in industrial applications, is poised to return to growth in the second half of 2025 as customers complete...
Goldman Sachs recently released a striking report on the high-bandwidth memory (HBM) market, stating that regardless of forecasting scenarios, SK Hynix's monopoly over HBM will eventually...
Nvidia's H20 chip has been granted approval by the US government to be sold in China, despite being a lower-spec version compared to its original design. This approval has quickly...
Nvidia has begun limited production of its next-generation AI server platform, the GB300, with volume shipments expected to ramp up starting in September 2025, according to sources...
Global memory giants are phasing out or discontinuing DDR4 DRAM production to accelerate capacity shifts toward advanced process products such as DDR5 and high-bandwidth memory (HBM),...
Taiwanese memory module maker Adata Technology reported after-tax profit of NT$462 million (US$15 million) in June 2025, marking a dramatic turnaround from a loss in the same month...
LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth...
Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company...
A tight supply of DDR4 DRAM has triggered a buying spree. Goldkey Technology chairman Vicky Tseng said that since May and June 2025, DDR4 spot prices have skyrocketed more than 100%,...
China remains at a disadvantage in high-bandwidth memory (HBM) and other advanced chip technologies, with sanctions on cutting-edge process nodes further delaying domestic semiconductor...
