Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power...
CXMT, China's leading DRAM maker, plans to launch an IPO in Shanghai as early as the first quarter of 2026, targeting a valuation of up...
While advanced packaging technologies first gained traction in high-end smartphones, it was the supply crunch of AI chips in 2023 that...