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NEWS TAGGED MEMORY CHIPS
Thursday 18 December 2025
Micron hikes FY26 capex to US$20b to accelerate HBM and US fab output
Micron Technology is ramping up capital spending to address tightening memory supply, raising fiscal 2026 capex to about US$20 billion as it accelerates investments in high-bandwidth...
Thursday 18 December 2025
Micron says fab start-up costs to have limited impact on gross margins despite expansion push
Micron Technology signalled confidence in sustaining elevated gross margins as its memory portfolio shifts further toward high-value products, even as new fab investments begin to...
Thursday 18 December 2025
Micron's blowout quarter underscores tightening memory supply and rising AI leverage
Micron Technology's latest financial results point to a deepening structural upswing in the memory market, with AI-driven demand pushing pricing, margins, and investment plans higher,...
Thursday 18 December 2025
Cost surge for wafer, memory, and materials threatens consumer electronics pricing in 2026
After sharp price hikes across multiple memory categories caused by tight supply-demand conditions, overall supply-chain costs have come into sharper focus. Memory is far from the...
Wednesday 17 December 2025
Memory shortages threaten to cut panel demand in 2026
Based on estimates from third-party market research firms, small- and medium-sized panel maker HannStar Display stated that the 2026 panel market is expected to be relatively stable,...
Wednesday 17 December 2025
SK Hynix taps US$340M state loan to ramp up HBM production
SK Hynix has secured approval for an additional KRW500 billion (US$340 million) in low-interest financing from the state-run Korea Development Bank. The funds will be used to increase...
Tuesday 16 December 2025
Samsung Chairman Lee Jae-yong meets with Lisa Su and Elon Musk to discuss potential collaboration
Samsung Electronics Chairman Lee Jae-yong has returned to South Korea after a week-long business trip to the US. Lee reportedly met with Tesla CEO Elon Musk in Austin, Texas, with...
Tuesday 16 December 2025
Samsung nears deal to supply over 30% of Nvidia's HBM4 memory in 2026
Samsung Electronics is close to finalizing negotiations with Nvidia to supply more than 30% of its sixth-generation high-bandwidth memory (HBM4) for 2026, aiming to regain market...
Tuesday 16 December 2025
Samsung steadies 12-Layer HBM3E, eyes larger Google TPU orders
Samsung Electronics has reportedly stabilized the performance of its 12-layer high-bandwidth memory, a development that could allow the company to expand shipments to Google's artificial...
Tuesday 16 December 2025
China's chip resilience: Naura M&A, ACM's HBM push defy US export controls
Escalating US-China tech rivalry and the politicization of the supply chain are accelerating a structural transformation in the global semiconductor equipment sector. While the US...
Tuesday 16 December 2025
Acer CEO urges firms to boost resilience amid memory price surge
Acer chairman and CEO Jason Chen has pointed out that soaring memory prices have triggered ripple effects across the market, driving up costs and retail prices, which in turn impact...
Tuesday 16 December 2025
Apple braces for DRAM cost surge as Korean suppliers reprice contracts
Apple is facing renewed cost pressure as its long-term DRAM supply contracts with South Korean memory makers approach expiry in January 2026, heightening concerns that higher component...
Tuesday 16 December 2025
Smartphone industry faces cost challenges in 2026 amid memory shortages and rising prices
The smartphone industry is facing considerable cost challenges in 2026 amid ongoing memory supply shortages and rising prices. This situation is expected to lead to a 1.6% decrease...
Tuesday 16 December 2025
Notebook market may see second consecutive year of seasonal demand distortion in 2026
The notebook market is expected to encounter an unusual shift in seasonal demand for a second consecutive year, with 2026 poised to replicate the disruption seen in 2025. While geopolitical...
Monday 15 December 2025
SK Hynix taps ASMPT for HBM4 TC bonders amid Hanmi-Hanwha patent clash

SK Hynix has reportedly placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT as it accelerates preparations...