CONNECT WITH US
NEWS TAGGED MEMORY CHIPS
Monday 21 July 2025
Weekly news roundup: Nvidia partners with Micron, Huawei's 'Little HiSilicon' launches, GB300 production begins
Below are the top DIGITIMES Asia stories from July 14 to 20, 2025. The top three topics include Nvidia teams up with Micron for a major SOCAMM rollout, aiming to challenge high-bandwidth...
Monday 21 July 2025
Samsung reportedly cracks 1c DRAM yield hurdle, positions HBM4 for AI rebound
Samsung Electronics is preparing a major push to reclaim ground in the high-bandwidth memory (HBM) market, where it has lagged behind SK Hynix and Micron. Its sixth-generation 1c...
Monday 21 July 2025
Amazon, Google drive HBM memory boom as custom AI chips threaten Nvidia’s lead
As demand for artificial intelligence (AI) accelerates, tech giants like Amazon, Google, and Meta are emerging as major players in the high-bandwidth memory (HBM) market. These companies...
Saturday 19 July 2025
Nvidia explores SOCAMM deployment for next-gen AI systems
Nvidia is reportedly preparing to enter a new phase in the memory market by planning to deploy between 600,000 and 800,000 SOCAMM modules in 2025. This initiative positions SOCAMM...
Saturday 19 July 2025
SK Hynix retreats from China, pivots to homegrown DRAM growth
SK Hynix is ramping up domestic semiconductor production as US export controls and geopolitical tensions prompt a broader reshuffling of the global memory supply chain. The company...
Saturday 19 July 2025
EmBestor bets on next-gen flash memory to drive 2H25 growth
EmBestor Technology, a Taiwan-based flash storage provider specializing in industrial applications, is poised to return to growth in the second half of 2025 as customers complete...
Friday 18 July 2025
SK Hynix may lose HBM crown by 2026 as rivals trigger price showdown
Goldman Sachs recently released a striking report on the high-bandwidth memory (HBM) market, stating that regardless of forecasting scenarios, SK Hynix's monopoly over HBM will eventually...
Friday 18 July 2025
H20 comeback sparks rush for HBM with Samsung set to benefit
Nvidia's H20 chip has been granted approval by the US government to be sold in China, despite being a lower-spec version compared to its original design. This approval has quickly...
Friday 18 July 2025
GB300 production underway: Nvidia's strategic shift brings relief to ODMs
Nvidia has begun limited production of its next-generation AI server platform, the GB300, with volume shipments expected to ramp up starting in September 2025, according to sources...
Thursday 17 July 2025
South Korean chipmakers reportedly delay DDR4 phase-out amid supply crunch
Global memory giants are phasing out or discontinuing DDR4 DRAM production to accelerate capacity shifts toward advanced process products such as DDR5 and high-bandwidth memory (HBM),...
Thursday 17 July 2025
Adata surges on memory boom, eyes AI and Biotech for next growth wave
Taiwanese memory module maker Adata Technology reported after-tax profit of NT$462 million (US$15 million) in June 2025, marking a dramatic turnaround from a loss in the same month...
Wednesday 16 July 2025
LG enters hybrid bonding tool race, challenging Samsung and Hanwha
LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth...
Wednesday 16 July 2025
Hanmi Semiconductor says hybrid bonders too costly for HBM4, HBM5 production
Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company...
Wednesday 16 July 2025
Goldkey gears up for August IPO as DDR4 demand takes off
A tight supply of DDR4 DRAM has triggered a buying spree. Goldkey Technology chairman Vicky Tseng said that since May and June 2025, DDR4 spot prices have skyrocketed more than 100%,...
Tuesday 15 July 2025
China's PIM chip sidesteps HBM restrictions, advanced node barriers
China remains at a disadvantage in high-bandwidth memory (HBM) and other advanced chip technologies, with sanctions on cutting-edge process nodes further delaying domestic semiconductor...