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Wednesday 16 September 2026
Samsung reportedly weighs Micron's newest memory for Galaxy S27
Samsung Electronics is reportedly testing Micron's most advanced 1γ LPDDR5X memory for possible use in the Galaxy S27 series, as rising costs around next-generation mobile DRAM...
Wednesday 16 September 2026
Apple reportedly accepts Samsung's 1Q27 memory hike, raising the 2027 smartphone cost floor
Apple's acceptance of sharply higher Samsung Electronics memory prices for early 2027 is putting a number on the cost of the AI boom for smartphones. The reported agreement comes just...
Wednesday 16 September 2026
Micron unveils 512GB DDR5 RDIMM for next-gen servers

Micron has demonstrated what it calls the world's first 512GB DDR5 registered dual in-line memory module (RDIMM) across multiple server...

Wednesday 16 September 2026
Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end
Samsung Electronics is reportedly handing the growth in its commodity memory module business to outside assemblers in Vietnam, India, and the Philippines, a sign of how completely...
Wednesday 16 September 2026
Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
Hanmi Semiconductor has reportedly secured an order to supply advanced packaging equipment to Elon Musk's Terafab, marking the first known entry by a South Korean back-end equipment...
Wednesday 16 September 2026
Kepler bets HBM can scale without EUV — chip giants are buying in

US memory chip startup Kepler Computing has emerged from stealth after seven years, disclosing US$468 million in total funding and a...

Wednesday 16 September 2026
Astera says customers are rethinking HBM needs for AI accelerators

AI infrastructure customers are starting to reconsider how much high-bandwidth memory (HBM) needs to be placed alongside accelerators...

Wednesday 16 September 2026
AI efficiency fuels Jevons Paradox debate over HBM demand
As artificial intelligence (AI) models move from answering questions to autonomously completing multi-step tasks, OpenAI's new model GPT-6 Astra, or Astra, is drawing fresh market...
Wednesday 16 September 2026
Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory...

Wednesday 16 September 2026
NVHBM is not a memory revolution; Nvidia seeks to platformize cHBM, dominate custom AI architectures

DIGITIMES observed that Nvidia's newly announced NVHBM is not a brand-new memory technology, but rather an extension of existing custom...

Wednesday 16 September 2026
DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...

Wednesday 16 September 2026
Charts: Memory has held six of the ten fastest-growing spots in Taiwan's chip sector for seven straight months

Of the 94 listed Taiwanese semiconductor companies DIGITIMES tracks, 80 grew year-over-year in August 2026 and 14 declined. Median year-over-year...

Tuesday 15 September 2026
Astera Labs targets the KV cache bottleneck as agentic AI outgrows GPU memory
Astera Labs has added three products to its Leo memory controller line, aimed at a problem that arises as AI inference shifts from single queries to agents that run continuous loops:...
Tuesday 15 September 2026
High-capacity memory shortages worsen: Team Group reveals edge AI strategy amid rising price pressures

As memory shortages worsen, Team Group is aggressively deepening its footprint in the industrial control market. Vice general manager...