Goldman Sachs recently released a striking report on the high-bandwidth memory (HBM) market, stating that regardless of forecasting scenarios, SK Hynix's monopoly over HBM will eventually...
Nvidia's H20 chip has been granted approval by the US government to be sold in China, despite being a lower-spec version compared to its original design. This approval has quickly...
Nvidia has begun limited production of its next-generation AI server platform, the GB300, with volume shipments expected to ramp up starting in September 2025, according to sources...
Global memory giants are phasing out or discontinuing DDR4 DRAM production to accelerate capacity shifts toward advanced process products such as DDR5 and high-bandwidth memory (HBM),...
Taiwanese memory module maker Adata Technology reported after-tax profit of NT$462 million (US$15 million) in June 2025, marking a dramatic turnaround from a loss in the same month...
LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth...
Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company...
A tight supply of DDR4 DRAM has triggered a buying spree. Goldkey Technology chairman Vicky Tseng said that since May and June 2025, DDR4 spot prices have skyrocketed more than 100%,...
China remains at a disadvantage in high-bandwidth memory (HBM) and other advanced chip technologies, with sanctions on cutting-edge process nodes further delaying domestic semiconductor...
Driven by major DRAM manufacturers focusing on investment and research in high-bandwidth memory (HBM) and gradually phasing out mature process products, DDR4 spot prices have rapidly...
Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, respectively — for next-generation NAND flash memory...
Memory chipmaker Macronix is betting on advanced technologies to escape a bruising price war as US-China tensions reshape the global semiconductor landscape.
On July 9, 2025, the JEDEC Solid State Technology Association, the leading organization for microelectronics standards, introduced LPDDR6 (JESD209-6), its latest low-power DRAM specification...
