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Saturday 30 August 2025
Huawei develops AI SSDs to cut reliance on HBM, putting Korean chipmakers on edge
Huawei is preparing to commercialize solid-state drives tailored for artificial intelligence, a move that industry analysts say could challenge the dominance of high-bandwidth memory...
Saturday 30 August 2025
Samsung, SK Hynix lose US waiver for China fabs
The U.S. Department of Commerce has announced the revocation of waivers that allowed a select group of foreign semiconductor manufacturers to export U.S.-origin semiconductor manufacturing...
Thursday 28 August 2025
Silicon Motion accelerates PCIe Gen5 production as Windows 10 retirement fuels PC upgrade surge
PC demand remains soft under macroeconomic pressures, but the phase-out of Windows 10 is expected to drive an upgrade cycle that will accelerate PCIe Gen5 adoption. NAND flash controller...
Thursday 28 August 2025
Micron CEO reportedly meets Samsung's MX division head, bolstering grip on Galaxy's DRAM supply
Micron is tightening its grip on Samsung's flagship smartphone supply chain, even as the South Korean tech giant works to steady its own memory production business.
Thursday 28 August 2025
Samsung’s hush on HBM4 fuels doubts over Nvidia supply readiness
South Korean media report that Samsung Electronics' sixth-generation high-bandwidth memory (HBM4) has cleared Nvidia's preliminary tests and could enter pre-production (PP) by late...
Thursday 28 August 2025
South Korea races to close gap in hybrid bonding as global rivals move ahead
South Korean experts are raising alarms that domestic semiconductor equipment manufacturers may be falling behind in developing hybrid bonding technology—critical for advancing...
Wednesday 27 August 2025
Nvidia's Huang meets Samsung, SK leaders at US summit as HBM battle escalates
The South Korea-US summit offered a rare gathering of tech heavyweights, as Nvidia CEO Jensen Huang met with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Chey Tae-won...
Wednesday 27 August 2025
Samsung, SK Hynix face pivotal test as Nvidia targets 1Q26 for HBM4
South Korean media reports suggest Nvidia plans to complete final qualification tests for sixth-generation high-bandwidth memory (HBM4) in the first quarter of 2026, a milestone that...
Tuesday 26 August 2025
Huawei to launch AI SSD in Shanghai, aims to tackle HBM supply bottlenecks
Huawei will debut its self-developed artificial intelligence (AI) solid-state drive on August 27 at its Lianqiu Lake R&D Center. The company said the device is designed to address...
Tuesday 26 August 2025
NOR flash prices set to surge in 4Q25 on cost pressures, supply constraints

After months of sluggish demand and weakened pricing, the NOR Flash memory market appears poised for a significant turnaround, particularly...

Monday 25 August 2025
Samsung and SK Hynix slash NAND spending as SK Hynix unveils 321-layer breakthrough
Samsung Electronics and SK Hynix are reportedly pulling back on investments in advanced NAND flash memory as weak demand and rising costs push them to concentrate on higher-margin...
Monday 25 August 2025
Battle for HBM4 dominance: HBM capacity expected to reach 400,000 units by year-end
High bandwidth memory (HBM) has reshaped the global DRAM industry landscape, fueled by a surge in AI demand over the past three years. Nvidia's next-generation AI accelerator "Rubin"...
Monday 25 August 2025
ADATA hits 15-year revenue high as memory market shifts
ADATA, a memory module manufacturer, recorded its best quarterly performance in more than 15 years during the second quarter of 2025. Despite an adjustment period in DDR4 shipments...
Monday 25 August 2025
SK Hynix begins 321-layer 2TB QLC NAND mass production, targets AI data center market
SK Hynix announced on August 25 that it has completed development of its 321-layer 2TB QLC NAND flash and has begun mass production, with global customer certification finalized and...
Monday 25 August 2025
Nvidia reportedly pushes Samsung to step up HBM4 production
Nvidia executives have reportedly urged Samsung Electronics to prioritize production of sixth-generation high-bandwidth memory (HBM4) rather than fifth-generation 12-layer HBM3 during...