Samsung Electronics and AMD have collaborated to validate Compute Express Link (CXL) memory technology designed to expand capacity and bandwidth for AI servers, as Samsung broadens...
As the gap between memory supply and demand widens due to the surge in AI applications, supply chain sources report that major GPU and custom ASIC vendors are considering lower-spec...
DDR4 contract prices are rising faster than those of the newer DDR5 standard, reversing the usual pricing pattern in the memory market. The artificial intelligence (AI) boom has prompted...
China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
Qualcomm is pushing to cut edge AI's energy cost as phones, cars, and other devices face tighter power and cooling limits than data centers. At the opening of Applied Materials' EPIC...
Memory IC design house AP Memory Technology has successfully priced its global depositary receipt (GDR) offering, raising a total of US$415.5 million. The GDRs were priced at US$56.15...
AI infrastructure expansion is shifting semiconductor competition beyond individual chip performance towards memory bandwidth, data-transfer power consumption, transistor scaling,...
GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
As AI reshapes the global computing landscape, former Intel CEO Pat Gelsinger said AI is making chip design easier, while physical bottlenecks in manufacturing, memory, and energy...
China's ChangXin Memory Technologies (CXMT) is raising concerns over the future pricing power of Samsung Electronics, SK Hynix, and Micron as its plans for next-generation server DRAM...
SK Hynix has unveiled a new processor architecture designed to reduce power consumption and chip area in solid-state drive (SSD) controllers, expanding its efforts to address storage...
After 2013, planar NAND flash memory began reaching its scaling limits at the 15–16nm process node. Capacitive coupling between the floating gates of adjacent memory cells increasingly...
Solidigm, the SK Hynix subsidiary, has reportedly created its first senior post dedicated to US government relations, a move that could matter for chip investors, regulators, and customers...
Samsung Electronics and SK Hynix are expected to see a sharp increase in NAND flash profits in 2026 as surging demand for enterprise solid-state drives (SSDs) drives up memory prices...
Samsung Electronics has committed 75–80% of its 2027 memory supply, including high-bandwidth memory (HBM), to long-term agreements (LTAs), the Korea Economic Daily reported...
