CONNECT WITH US
NEWS TAGGED MEMORY CHIPS
Thursday 3 September 2026
Yield has been semiconductor industry's oldest question; now it's Microsoft's test for AI
Microsoft brought the semiconductor industry's own measure of success back to it on Wednesday, and argued that AI will be judged by it.
Wednesday 2 September 2026
Sandisk says HBF can match HBM bandwidth with up to 16x the capacity
Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
Wednesday 2 September 2026
Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth
Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
Wednesday 2 September 2026
DRAM giants target 3D stacking to break memory wall and power bottlenecks
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
Wednesday 2 September 2026
Samsung, SK Hynix inventories surge as valuation reserves fall
Samsung Electronics and SK Hynix ended the first half of 2026 holding sharply more inventory than six months earlier, an unusual development in a memory market where demand continues...
Wednesday 2 September 2026
MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments
Sonix Technology expects consumer IC and MCU sales to keep growing in the second half of 2026, but memory shortages could slow imaging-product shipments. AI-driven demand is also squeezing...
Wednesday 2 September 2026
Semicon Taiwan 2026 signals a broader race for AI-era semiconductor leadership
Semicon Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...
Wednesday 2 September 2026
Apple's M6 and M5 Ultra break rule tying process to chip strength
Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...
Wednesday 2 September 2026
Deep Dive: CXMT challenges Pentagon as Trump-Xi meeting nears
ChangXin Memory Technologies (CXMT) has escalated its defense against the US government, shifting from supply-chain and technological competition into a full-scale courtroom battle...
Wednesday 2 September 2026
China memory-module makers report surging profits, strained cash flow
Seven listed Chinese memory-module and memory-distribution companies have filed first-half 2026 results, and the headline numbers are the largest the tier has ever reported. The more...
Wednesday 2 September 2026
Nvidia pushes into HBM base dies as NVHBM battle heats up
The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
Tuesday 1 September 2026
SK Hynix touts up to 5.15x inference gains with custom HBM

SK Hynix is pushing computation deeper into high-bandwidth memory (HBM), saying a custom HBM architecture that places compute functions...

Tuesday 1 September 2026
Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain
Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...
Tuesday 1 September 2026
Micron opens Tainan plant after 6.5 months amid labor dispute
Micron's plant at the Southern Taiwan Science Park, which it purchased from AUO for NT$7.4 billion (US$233.8 million) in August 2024, is now officially in operation, marking a key...
Tuesday 1 September 2026
China's memory chipmakers post a record 1H — but not all of it came from chips
Nine listed Chinese memory and memory-adjacent chip companies have now filed their first-half 2026 results, and together they measure the depth of the current DRAM and NAND upcycle...