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Tuesday 28 April 2026
Samsung fast-tracks Pyeongtaek fabs to turn HBM4 edge into AI memory scale

Samsung is accelerating one of its most aggressive memory capacity buildouts in years, aiming to bring its Pyeongtaek Line 4 fab, or P4,...

Tuesday 28 April 2026
Wuhan unveils US$38 billion plan; YMTC and XMC lead memory expansion
China's central tech hub Wuhan has unveiled its 2026 major project plan, targeting 355 city-level projects with total investment exceeding CNY260 billion (approx. US$38.1 billion).
Tuesday 28 April 2026
AI lifts memory: SK Hynix hits 72% margin as Samsung nears 70%
SK Hynix reported record results for the first quarter of 2026, with operating margin reaching about 72% — among the highest globally — as artificial intelligence (AI)-driven...
Monday 27 April 2026
Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions...
Monday 27 April 2026
Weekly news roundup: Micron's Sanand ramp shifts India chip debate; Qualcomm Chief reportedly seeks deals in South Korea
Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:
Monday 27 April 2026
NEO Semiconductor advances 3D DRAM with POC validation
Driven by AI, demand for high-bandwidth memory (HBM) is surging, causing a supply shortage in DRAM and prompting cloud service providers to pre-book capacity for the next two years...
Sunday 26 April 2026
Samsung, Kingston reportedly lift SSD prices by over 10% as supply tightens

Samsung Electronics and Kingston Technology have reportedly notified distributors of price increases of more than 10% across their solid-state...

Sunday 26 April 2026
Samsung reportedly advances sub-10nm DRAM as SK Hynix targets HBM4E sampling
Samsung Electronics has reportedly produced a working die for sub-10nm DRAM, marking a potential breakthrough below the 10-nanometer threshold, according to The Elec. SK Hynix,...
Sunday 26 April 2026
Samsung bets its HBM leverage can hold Nvidia's LPU orders — but TSMC is pushing back
The AI era has officially shifted from training to inference and agent-centric computing, prompting Nvidia's strategic acquisition of Groq to integrate LPUs into its own platform....
Friday 24 April 2026
Memory price surge reshapes global notebook competition in 2026
The global notebook market is undergoing a structural shift in competitive dynamics in 2026, moving from product specifications and pricing battles to group-level integrated capabilities...
Friday 24 April 2026
SK Hynix deepens TSMC ties with HBM4, advances memory-logic integration

SK Hynix showcased its latest high-bandwidth memory (HBM) technologies at TSMC's North America Technology Symposium 2026, highlighting...

Friday 24 April 2026
Samsung labor unions rally 40,000 workers, prepares for 18-day strike in May
Three major labor unions at Samsung Electronics held a large-scale protest on the afternoon of April 23 in front of the Pyeongtaek semiconductor campus in South Korea. An estimated...
Friday 24 April 2026
DIGITIMES Insight: SK Hynix's US HBM push sets up a showdown with Micron
SK Hynix Inc. has moved to deepen its presence in the US by building an HBM packaging and testing plant and planning a US stock exchange listing to raise capital — steps that...
Friday 24 April 2026
PC chipmakers warn CPU shortages cloud 2026 shipment outlook
CPU shortages in the PC sector have emerged as a new concern for shipments this year, in addition to ongoing memory supply issues. Industry players supplying PC peripheral chips observe...
Friday 24 April 2026
Interview: Taiwan-Korea cooperation not limited to memory giants; Hwaseong City aims to expand alliances
When it comes to Taiwan-Korea semiconductor cooperation, the outside world often focuses on orders and R&D between memory giants such as Samsung Electronics, SK Hynix, and TSMC...