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Tuesday 14 July 2026
South Korea exports top US$100B in a month, stoking chip dependence fears

South Korea's exports surpassed US$100 billion in a single month for the first time in June 2026, raising expectations that the country...

Tuesday 14 July 2026
Rambus unveils DDR5 9600 chipset for next-generation AI servers
Rambus has introduced a new DDR5 9600 server RDIMM chipset aimed at faster, denser data center memory systems. The move matters beyond one supplier because higher bandwidth and better...
Tuesday 14 July 2026
Ingenic's first-half profit set to jump more than 400% as memory super-cycle lifts chip prices
Chinese chip designer Ingenic Semiconductor expects its net profit for the first half of 2026 to surge between 431% and 531% year-over-year, to a range of CNY1.079 billion (approx...
Tuesday 14 July 2026
Commentary: Terafab and DRAM reveal Tan's long-term vision for Intel

US President Donald Trump recently claimed that Taiwan's TSMC will double the size of its Arizona fab project, reviving attention on...

Tuesday 14 July 2026
Intel challenges HBM leaders with XBM and ZAM in a bid to reshape AI memory

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization...

Tuesday 14 July 2026
AI demand lifts entire Taiwan semiconductor supply chain in June, memory revenue nearly quadruples
All 13 tracked sub-sectors of Taiwan's semiconductor supply chain recorded positive year-over-year revenue growth in June 2026, according to monthly revenue filings, pointing to an...
Tuesday 14 July 2026
GigaDevice director maps memory's next three years: capacity, AI demand, and the race for new applications

AI computing demand continues to fuel growth in the global memory market, but the industry's attention is shifting beyond short-term price...

Monday 13 July 2026
SK Hynix shares plunge after blockbuster Nasdaq ADR debut

SK hynix shares suffered their steepest-ever decline on Monday, just one trading day after the memory chipmaker made a strong debut...

Monday 13 July 2026
SK Hynix reportedly starts Nvidia HBM4 shipments ahead of September ramp

SK Hynix began mass-production shipments of 12-layer HBM4 to Nvidia at the end of June and is increasing output ahead of a broader...

Monday 13 July 2026
Samsung targets 2029 Yongin fab opening as infrastructure timetable tightens
Samsung Electronics plans to begin operations at its first Yongin fab in 2029, one to two years ahead of the original schedule, increasing pressure on South Korea to accelerate the...
Monday 13 July 2026
SK Group chair: US investment plan will far exceed US$35B

SK Group chairman Chey Tae-won said the South Korean conglomerate is preparing a US investment plan that would far exceed US$35 billion—the...

Monday 13 July 2026
Nanya lifts long-term capacity to 50%, eyes 4x capex in 2027
Memory chipmaker Nanya said its second-quarter 2026 operations hit a record high, with President Pei-Ing Lee saying signed long- and short-term agreements now account for 50% of total...
Monday 13 July 2026
Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

Monday 13 July 2026
SK Hynix hybrid bonding push signals next phase of HBM packaging race
SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...
Monday 13 July 2026
Complex Micro Interconnection sees June sales rise as AI-led device demand lifts orders

Flexible circuit board maker Complex Micro Interconnection (CMI) said June 2026 revenue rebounded as consumer electronics shipments...