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    Exclusive: Taipower's new green power sandbox could ease TSMC's surplus electricity problem
    5min ago
    Xiaomi warns of more India price hikes as AI squeezes the phone from both sides
    7min ago
    NEWS TAGGED MEMORY CHIPS
    Monday 7 September 2026
    SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
    SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
    Monday 7 September 2026
    Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV
    China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density...
    Monday 7 September 2026
    Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens
    AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion,...
    Sunday 6 September 2026
    Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem
    In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...
    Sunday 6 September 2026
    Trumpf CTO says advanced packaging reshapes semiconductor equipment race
    AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data...
    Saturday 5 September 2026
    Micron looks to lock in Taiwanese construction capacity with long-term deals
    The global rush to build semiconductor fabs is creating a historic opportunity for Taiwan's construction and facility engineering supply chain, and Micron Technology is looking to...
    Saturday 5 September 2026
    Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC
    China's memory industry is shifting from a single-champion model towards a three-pronged structure. ChangXin Memory Technologies (CXMT) is building its position in DRAM, Yangtze Memory...
    Friday 4 September 2026
    TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
    TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
    Friday 4 September 2026
    SEMICON Taiwan 2026: QuantumDiamonds cracks the hybrid bonding blind spot with new inline metrology
    The global semiconductor industry is hitting a physical wall. As artificial intelligence demands push architectures toward three-dimensional packaging, high-bandwidth memory (HBM)...
    Friday 4 September 2026
    China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development

    Montage Technology is accelerating its move beyond traditional DDR memory interfaces, with CXL 3.2, DDR6 and PCIe products positioning the...

    Friday 4 September 2026
    Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
    Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...
    Friday 4 September 2026
    Processor, memory boom could push chip supply chain out of sync, says Yole
    Gary Huang, vice president and head of Asia-Pacific research and business development at Yole Group, said the imbalance is already showing signs of what he described as supply-chain...
    Friday 4 September 2026
    AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

    The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

    Friday 4 September 2026
    Kioxia pitches flash as a DRAM substitute as Micron, YMTC close in
    Kioxia's plan to push NAND flash into work that DRAM currently does is less a product launch than an answer to a structural problem. Alone among the leading memory makers, it does...
    Friday 4 September 2026
    Nanya, ESMT hit record August revenue on higher contract prices
    Memory chip makers continue to post sequential revenue gains, with Nanya Technology and Elite Semiconductor Microelectronics Technology (ESMT) both reporting record consolidated revenue...
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    GlobalExhibition
    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
    Wednesday 2 September 2026
    DAS Introduces ALCEA for Integrated NOx Treatment in Semiconductor Fabs
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