As mass production of sixth-generation HBM4 nears, South Korean chip giants Samsung Electronics and SK Hynix are aggressively reconstructing their semiconductor equipment supply chains...
Chipmaker Micron Technology Inc. said it will spend about US$200 billion on US manufacturing, research and development, the latest company to pledge large-scale investments in the...
SK Hynix President and CEO Kwak Noh-jung warned that growing tariff-related uncertainty could heighten market volatility in the second half of 2025. He shared these views during the...
Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong...
Taiwan-based memory module vendors Adata Technology and Team Group Inc. saw notable revenue gains in May 2025, driven by continued price increases for DRAM and NAND flash. Adata reported...
Memory manufacturers are reducing production capacity for older processes, driving DDR4 prices to skyrocket. Although Samsung Electronics' last buy order (LBO) for DDR4 was originally...
In a sign of China's accelerating ambitions in the semiconductor race, ChangXin Memory Technologies (CXMT), the country's leading DRAM manufacturer, is rapidly advancing development...
SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry...
According to a press release on June 10, Micron Technology announced it has begun shipping samples of its 36GB HBM4 with 12-high stacking to multiple customers. The new memory is...
Samsung Electronics' foundry division is targeting the artificial intelligence (AI) chip market with a new collaboration alongside Groq, aiming to bring their jointly developed chip...
Chinese memory chipmaker Yangtze Memory Technologies Co. (YMTC) has filed a federal lawsuit in Washington, DC, accusing US-based Micron Technology of launching a disinformation campaign...
China's largest cloud and internet companies are implementing backup supply chain strategies as bilateral trade uncertainties continue. Baidu Inc., Alibaba, Tencent and Huawei have...
European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready...
The Indian government has amended Special Economic Zone (SEZ) rules to support semiconductor and electronics component manufacturing, reducing the minimum land requirement from 50...
Kioxia, Japan's leading NAND flash memory manufacturer, is preparing for an aggressive expansion. The company has announced a bold plan to double its memory production capacity by...
