The Department of Industrial Technology (DOIT) of the Ministry of Economic Affairs (MOEA) hosted the 2025 Taiwan-Japan Technology Summit in Taipei on September 9, 2025, during which...

Japanese chip testing equipment giant Advantest has overtaken Tokyo Electron (TEL) in market capitalization for the first time in nearly two decades, signaling a shift in the balance...

TSMC's plant in Kumamoto, Japan, is fueling deeper investment ties between Kyushu and Taiwan. On September 10, 15 semiconductor suppliers from Fukuoka and Kumamoto exhibited at SEMICON...

Taiwan's Minister of Economic Affairs Kung Ming-hsin, on September 10, 2025, declined to comment on an alleged trade secret theft targeting TSMC's 2nm process technology amid concerns...

Taiwan wafer foundry revenue is estimated to rise mildly in the second half of 2025 from the first half, influenced by US tariff policies and a high revenue base in the first half.

ACM Research (Shanghai), Inc., dual-listed in the US and China, is maneuvering through Washington's escalating curbs on China's chip industry. Chairman David Wang emphasized that...

The Industrial Development Administration (IDA) of Taiwan's Ministry of Economic Affairs (MOEA) is partnering with 16 local companies to present heterogeneous integration packaging...

TSMC's Japanese subsidiary JASM has completed and started operations at its first wafer fab in Kumamoto. According to Japanese sources, a second wafer fab is already under construction...

TSMC posted strong revenue growth in August 2025, recording approximately NT$335.77 billion (approx. US$11.03 billion). The result marks a 3.9% increase from July and a 33.8% rise...

TSMC has confirmed it will exit gallium nitride (GaN) foundry operations within two years, shutting down production at its 6-inch Fab 2 in Hsinchu Science Park. The company is also...

At SEMICON Taiwan 2025, Zeiss Semiconductor Manufacturing Technology offered a rare glimpse into the future of extreme ultraviolet (EUV) lithography, outlining its optics roadmap...

Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in...

To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...

TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...