The largest engineering school on the US West Coast by enrollment is training engineers for Taiwan Semiconductor Manufacturing Co. (TSMC) and pioneering advanced 3D packaging desig...

SEMICON Taiwan 2027 will be held on August 18 to 20, about one month earlier than its usual September timing. The organizer noted that venue planning needs instead drive the schedule...

Artificial intelligence (AI) and high-performance computing (HPC) are driving the global semiconductor industry into a new expansion cycle, with fabs extending from Taiwan to the US,...

As global net-zero efforts accelerate, major technology companies are setting increasingly ambitious renewable energy targets. TSMC has pledged to reach RE60 by 2030 and RE100 by 2...

JM-Applied, a Taiwanese semiconductor gas equipment manufacturer and supply chain member for Micron and TSMC, said on September 4 that revenue in the first half of 2026 exceeded NT$600...

TSMC is steering the future of artificial intelligence toward high-density three-dimensional advanced packaging designed to mimic the architectural connectivity of the human brain,...

TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...

TSMC says surging AI demand is stretching the global chip industry beyond its usual planning cycle, with fast-changing procurement needs, labor shortages, and infrastructure constraints...

AUO Group's AET Corporation (AET), formed in September 2025 through the merger of AUO Envirotech and AUO Digitech, is expanding across the semiconductor supply chain and has reportedly...

Unimicron chairman SC Chien said the company is working to ease the tightening shortage of AI substrates as MediaTek seeks capacity support for the next three years, during a public...

The UK wants to understand how Taiwan built such a successful semiconductor ecosystem, said Andy McLean, CEO of the UK Semiconductor Center, at a forum organized by Taiwan's Ministry...

TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...

TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...

Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at Semicon Taiwan...