As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between processors and memory. Even with continuous improvements in processor performance, if data cannot be delivered in real time, overall system efficiency remains limited.To overcome this bottleneck, Die-to-Die high-speed interconnect and HBM4/PHY IP integration have emerged as critical technologies for next-generation AI and HPC chip designs.Progate Group Corporation(PGC), a member of the TSMC Design Center Alliance (DCA), leverages its ASIC turnkey expertise and participation in the Synopsys IP OEM Program to deliver advanced design capabilities comparable to leading international players-while offering a more cost-effective, high-value service model that helps global customers accelerate AI and HPC deployment and mass production.Technical Highlights: Comprehensive Support from Design to ProductionPGC provides one-stop technical services, supporting clients from chip design to production. The coverage includes high-speed interconnects, memory integration, foundry certifications, and AI/HPC application-oriented designs, helping clients shorten time-to-market efficiently.Die-to-Die Interconnect and Chiplet ArchitecturePGC offers advanced expertise in Die-to-Die interconnect and Chiplet-based system design, supporting 2.5D and 3D integration technologies to enable high-speed, low-latency, and low-power chip-to-chip communication. All solutions are compliant with the Universal Chiplet Interconnect Express (UCIe) standard, ensuring interoperability and scalability across heterogeneous and cross-supply-chain environments.This capability addresses the growing demand for high-bandwidth and flexible multi-die integration, empowering customers to build next-generation Chiplet-based systems with enhanced performance and modularity.HBM4 / PHY IP IntegrationLeveraging Synopsys-certified IP, PGC enables rapid integration of HBM4 memory and PHY interfaces to shorten design cycles while strengthening design reliability. These high-bandwidth memory solutions help design teams overcome data transfer bottlenecks and achieve terabyte-per-second (TB/s) throughput, meeting the stringent performance requirements of AI and high-performance computing (HPC) applications.TSMC DCA Certification AdvantageAs a certified member of TSMC's Design Center Alliance (DCA), PGC provides end-to-end design-to-tape-out support within the TSMC's ecosystem. Customers can leverage TSMC's CyberShuttle multi-project wafer (MPW) program to conduct rapid prototyping and design validation, followed by seamless transition to mass production through PGC's ASIC turnkey services. All designs are fully compatible with advanced packaging technologies such as Wafer-on-Wafer (WoW) and 2.5D/3D integration architectures within major foundry ecosystems, ensuring a smooth and efficient path from prototype to production.AI / HPC Application FocusPGC's dedicated ASIC designs are optimized for AI and high-performance computing (HPC) applications, spanning AI accelerators, data center chips, and high-speed network switch devices. These designs support AI training, HPC simulation, and large-scale data processing workloads, meeting the performance, power, and scalability requirements of next-generation computing environments.Ecosystem IntegrationPGC's services are closely aligned with TSMC's advanced foundry ecosystem, combined with Synopsys-certified EDA and IP solutions, to deliver a complete ASIC turnkey flow covering: High-speed interface IP - ASIC design service - process support - packaging service - verification - testing - mass production.In addition to its own testing equipment and validation capabilities, PGC maintains long-term partnerships with multiple advanced test houses, enabling precise analysis for high-frequency, high-speed interface and advanced-node devices.This level of integration significantly reduces design risk and accelerates time-to-market, while ensuring that the design results are fully compatible with mainstream advanced packaging technologies - such as 2.5D/3D integration and wafer-on-wafer architectures within major foundry ecosystems - as well as international standards including UCIe.PGC delivers high reliability, low risk, and accelerated time-to-production through its comprehensive ASIC turnkey services, allowing customers to focus on differentiated design and market innovation. By leveraging its proven engineering expertise and established partnerships across the semiconductor supply chain, PGC helps customers reduce overall design and ASIC development costs, enhance design success rates, and improve product stability.In addition, PGC provides cross-regional engineering and project management support spanning Taiwan, Japan, China, and the United States - empowering global deployment strategies for AI and HPC applications with consistent quality and technical alignment.PGC provides complete ASIC turnkey services supporting 2.5D/3D advanced packaging technologies.Credit:PGC

As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled applications-from data center accelerators to compact edge devices-require processing systems with exceptional computational power, high performance, and access to large memory storage.To meet these demands, the semiconductor industry is making rapid strides in advanced packaging technologies. These innovations are now central to system integration and architectural breakthroughs-yet they also introduce new challenges in reliability, thermal management, and multi-chip assembly.Material companies are transforming their offerings to meet the stringent purity, precision, and performance requirements of the evolving semiconductor industry, while also creating more sustainable and environmentally friendly products. In this exclusive interview with Mr. Kenji Kuriyama, Director of Electronics for Japan & Taiwan at Henkel Adhesive Technologies, we explore how Henkel is helping semiconductor leaders overcome these challenges through materials innovation, strategic collaboration, and a deep commitment to Taiwan's ecosystem.Mr. Kuriyama shares his optimistic outlook on the explosive growth of the advanced packaging market. In particular, Taiwan's semiconductor industry stands out as a global leader in advanced node manufacturing, producing the majority of the world's most sophisticated chips. Henkel looks forward to working closely with customers in Taiwan to accelerate the development of high-performance chips that drive AI innovation.Mr. Kenji Kuriyama Director, Japan & Taiwan, Henkel Adhesive Technologies Electronics.Credit: HenkelHenkel Adhesive Technologies' Electronics division maintains a strong and deliberate focus on both the semiconductor and consumer electronics sectors, supplying advanced materials for electronics assembly, semiconductor packaging, and thermal management. Its product portfolio includes solutions for die attach, underfills, encapsulants, lid attach adhesives, and thermal interface materials—essential components that enable the high performance, miniaturization, and reliability of modern electronic devices.Showcasing Material Solutions for AI-Enabling Advanced Packaging at SEMICON Taiwan 2025Taiwan remains a global hub for advanced packaging innovation, and at SEMICON Taiwan 2025, the spotlight is on technologies that are rapidly evolving to become the backbone of system integration and architectural breakthroughs.Henkel Adhesive Technologies Showcases a portfolio of high-performance materials, and offers tailored solutions aligned with the industry's most critical technologies. The company presents encapsulation, underfill, and adhesive materials that support high-end AI accelerators in data centers, as well as compact Edge AI chips. These devices rely on packaging architectures such as 2.5D and 3D designs, chiplet designs and heterogeneous integration to meet the demands of next-generation computing.Advanced data center AI accelerator chips and smartphone application processors require large dies and large-body packages that consume significant power during operation. As a result, they are susceptible to high stress, warpage, and thermo-mechanical challenges that can impact reliability and performance.Henkel Adhesives has developed semiconductor underfill technologies-including pre-applied pastes and films, capillary materials, and liquid molded solutions-that have set the benchmark for both performance and processability.Henkel's encapsulation technology plays a critical role in protecting large, thin dies from warpage. It also enables high-density 2.5D fan-out wafer-level packaging (WLP) and supports emerging panel-level packaging (PLP) formats-making it one of Henkel's flagship innovations.In the automotive electronics sector, Henkel offers die attach pastes and encapsulants which are widely used across the ecosystem. Its pressure-less and pressure-assisted sintering materials are instrumental in enabling high-performance wide band gap power devices that are critical for modern electric vehicles. Henkel showcases a broad range of sintering technologies, including its latest copper-based pressure-assisted sintering material. This innovation delivers exceptional thermal conductivity, requires lower processing pressure and temperature compared to silver-based alternatives, and offers a lower total cost of ownership.Mr. Kenji Kuriyama presenting at Henkel seminar and panel talk in SEMICON Taiwan 2025.New Release: Loctite Eccobond LCM 1000AG-1 -Liquid Mold Material for Warpage Control in WLP and PLP ProcessesFurthermore, as heterogeneous integration and photonic convergence become increasingly prevalent, advanced packaging technologies such as panel-level packaging (PLP) and co-packaged optics are gaining significant attention. PLP, for example, enables larger AI-enabling IC packages by improving scalability and manufacturing efficiency. However, these advancements introduce new challenges in managing the thermal demands of heterogeneously integrated devices-particularly in data center and smartphone applications-as well as in optimizing materials that interface directly with IC chips. A range of advanced materials-including liquid molded underfills (LMUF), first-level thermal interface materials (TIMs), and capillary underfills-are being developed to effectively distribute and extract heat, thereby enhancing device performance and reliability. Notably, the rise of advanced AI processors with stacked memory architectures has driven strong demand for molded underfill materials that address key challenges in 3D stacking and assembly, such as manufacturing throughput, process complexity, and overall cost.Meanwhile, Henkel is introducing new innovations in fine-filler liquid compression molding (LCM) and molded underfill materials to support both near-term and long-term roadmaps for 2.5D and 3D packaging. These materials are designed to mitigate warpage while demonstrating excellent flowability and void-free filling capabilities at the wafer level, even in fine-pitch (<30 µm) and narrow-gap (<20 µm) configurations.At SEMICON Taiwan 2025, Henkel launches Loctite Eccobond LCM 1000AG-1 , a new anhydride-free, ultra-low warpage liquid molding material designed for wafer-level packaging (WLP) and panel-level packaging (PLP) processes. This new product delivers stable warpage control throughout redistribution layer (RDL) processing, enabling high-yield, reliable advanced packaging solutions.Working with Customers to Enable Materials for Next-Gen Semiconductor DevicesAdvanced packaging is rapidly emerging as a key driver of innovation in semiconductor technology, enabling breakthroughs in system integration, performance, and sustainability. As an innovator in the advanced packaging materials space, Henkel is actively collaborating with Taiwan's leading industrial customers across critical areas-including new material design, customer support, green energy, and sustainable development.This type of collaboration facilitates the sharing of knowledge, resources, and technology, accelerates global competitiveness, and ultimately achieves a win-win for more markets-helping to grow the global semiconductor industry. Henkel is committed to investing resources in solution design tailored to specific functions and maintaining long-term relationships with its customers.Mr. Kuriyama shares two use cases that demonstrate strong momentum in customer collaborations in Taiwan. The first example is thermal cycle reliability for application processor chips. A customer approached Henkel to help pass thermal cycle reliability testing for an end customer's application processor. The challenge extended beyond reliability-it required enhanced processability for high-throughput production. Henkel responded by investing resources and developing new materials to meet the target and support the customer's goals.Among the two cases, the second example focuses on underfill flow speed optimization. In this case, a customer was facing production bottlenecks due to the slow flow speed of their existing underfill material. Henkel stepped in to assess the specific requirements and engineered a faster-flowing underfill solution to replace the legacy product. This not only resolved the throughput issue but also significantly improved overall production efficiency. The case is well-articulated, outcome-driven, and demonstrates Henkel's ability to deliver tailored, high-performance solutions in advanced packaging.The timelines for joint development projects vary significantly depending on the scope of work. Projects involving complex advancements-such as new process development or complete material replacement-can take two to three years. In contrast, initiatives focused on optimizing existing processes within current specifications are much faster, with development cycles of just three to six months.In Taiwan, IC design houses, semiconductor foundries, and Outsourced Semiconductor Assembly and Test (OSAT) providers represent the three major customer types. Design houses focus on delivering new products with innovative IC chips, foundries explore novel materials for advanced packaging solutions, and OSATs emphasize manufacturing capabilities. Once a new material is introduced, Henkel's Taiwan-based application engineering and sales teams work closely with all customer types to ensure the material's functionality meets their specific requirements.Henkel Provides Next-Level Support to Build Strategic Partnerships with Taiwan CustomersAs semiconductor advanced packaging technologies continue to evolve, new opportunities are emerging across Co-Packaged Optics (CPO), panel-level packaging (PLP), and other next-generation formats. These innovations are reshaping how chips are integrated, aligned, and scaled for high-performance applications.Taking CPO as an example, Mr. Kuriyama highlights it as a rising application in advanced semiconductor packaging. Henkel is developing light-pass adhesive materials to address the challenge of precise active alignment for optical components. These light-curing adhesives enable accurate alignment, supporting the assembly of complex optical systems within the CPO process.Henkel Adhesives continues to invest heavily in material innovation and deepen its understanding of the evolving needs of the semiconductor and electronic materials markets. It is aligning its solutions with customers' technology roadmaps and contributing to the development of next-generation products. To fulfill these needs, the Henkel Taiwan Electronics Adhesives Technical Center in Zhubei City provides prompt technical support and fosters collaboration with Taiwan customers to accelerate prototyping and development. This Technical Center is dedicated to supporting innovation and product development through faster application simulation, data generation, and analysis—ultimately speeding up time-to-market for advanced packaging technologies.As the industry shifts from a linear supply chain to a more integrated and collaborative ecosystem, Henkel Adhesives plans to strengthen its local support for Taiwan's semiconductor sector. This includes expanding beyond its application center by establishing local R&D resources and a satellite R&D office in Taiwan to provide direct, localized support. This strategic move will strengthen customer partnerships and accelerate the development of packaging technologies critical for AI chip innovation and the broader semiconductor ecosystem."Taiwan is a leading global center for advanced semiconductor process nodes and packaging innovations," Mr. Kuriyama concludes. "Through Henkel's dedicated support teams and close partnerships with customers, Henkel Adhesives is strongly committed to the Taiwan market and will contribute to technical breakthroughs that open a new frontier in advanced semiconductor packaging."To learn more about Henkel and its advanced packaging solutions, visit the official Henkel website or official LinkedIn for more information.

The semiconductor industry is undergoing a profound transformation, driven by the strategic integration of artificial intelligence. At SEMICON Taiwan 2025, experts from Microsoft, Advantech, and Nvidia shared insights on the sector’s rapid shift toward “Lights-Out” factories—fully automated, 24/7 operations powered by AI. This evolution is designed to tackle monumental challenges while unlocking new levels of efficiency and resilience.AI Models Evolve for Deeper InsightsAI development has accelerated dramatically in recent years. From early domain-specific models for tasks such as entity recognition or computer vision, AI has advanced into sophisticated multi-domain models that integrate diverse functionalities within a single framework. Notable advancements include Retrieval-Augmented Generation (RAG), which constrains responses for greater accuracy, and multimodal models that seamlessly combine text, audio, and visual inputs.A pivotal breakthrough has been the emergence of reasoning models, capable of delivering deeper insights for complex problems across scientific, mathematical, and manufacturing domains. These models provide richer and more comprehensive analyses compared with their predecessors. Beyond individual models, multi-agent systems are now automating entire workflows, enabling specialized AI agents to collaborate on intricate challenges. One example is Toyota’s “obeya agent,” which integrates multiple sub-agents to assist powertrain engineers in analyzing vast datasets.According to Saj Kumar K, Senior Director of Manufacturing (APAC) at Microsoft, these advanced AI models are already being applied to manufacturing. The Production Copilot functions as a factory agent, analyzing data to identify root causes of downtime and optimize maintenance schedules. The Quality Advisor leverages multimodal AI for visual inspection and defect analysis, potentially rendering traditional image labeling obsolete. AI is also being used to optimize fab scheduling and Automated Material Handling Systems (AMHS), improving overall cycle times. Furthermore, large language models (LLMs) are training humanoid robots to perform complex tasks through single-shot teaching.Advantech’s Edge AI Strategy Targets Speed and PrecisionSemiconductor manufacturing faces unique pressures, particularly from the massive scale of data generated. A single wafer inspection can produce up to seven petabytes of data, requiring enormous computational power and real-time processing. The transition from single-beam to multi-beam inspection demands a tenfold increase in computational speed today, with projections of a hundredfold increase by 2030. Combined with the need for instantaneous data transfer and ultra-low latency to prevent defects, these requirements are driving a shift away from traditional data centers toward powerful edge computing solutions. Meanwhile, global labor shortages and skill gaps are accelerating the need for advanced automation.Advantech is at the forefront of this transformation with a comprehensive Edge AI strategy focused on process optimization, inspection, and fab automation. "Inspection is the heart of semiconductor manufacturers," said Magic Pao, Vice President at Advantech. The company’s strategy is built on four pillars: high computing power, high throughput, low latency, and robust local storage for analytics.Advantech is spearheading this transformation with a comprehensive Edge AI strategy focused on process optimization, inspection, and fab automation. “Inspection is the heart of semiconductor manufacturing,” said Magic Pao, Vice President at Advantech. The company’s approach is built on four pillars: high computing power, high throughput, low latency, and robust local storage for analytics.To achieve this, Advantech embeds AI into every element of its solutions, including products such as SkyRack and the MIC-7000/7500 industrial servers with direct-liquid cooling, both carrying critical SEMI certifications for fab deployment. High-speed connectivity is ensured through Time-Sensitive Networking (TSN) and industrial-grade switches. AI-powered vision systems—incorporating smart cameras with Nvidia GPU acceleration and FPGA-based technology—are central to the precision required for inspection. Advantech also emphasizes ecosystem strength, partnering with Nvidia for advanced computing and Intel for reliable system integration.Nvidia’s Physical AI Drives Industrial AutonomyNvidia is at the forefront of a new industrial revolution, evolving from a chipmaker into an “infrastructure company” advancing Physical AI. This strategy seeks to create “AI factories” that power advanced applications. Andrew Liu, Senior Manager at Nvidia, explained that this vision rests on two pillars: advanced foundation models for robotics and sophisticated simulation environments.Nvidia is developing powerful Vision-Language-Action (VLA) models that enable robots to interpret high-level prompts and images, translating them into precise physical actions and learning from observation or single-shot teaching. To address the scarcity of real-world robotics data, Nvidia relies heavily on its Omniverse platform for digital twins and simulation. Omniverse provides physically accurate, photorealistic virtual environments where synthetic data can be generated and robots can be trained and validated. This approach helps alleviate labor shortages and enables rapid “factory cloning” to mitigate geographic supply chain risks. Nvidia’s integrated platform spans systems for training foundation models, servers for Omniverse digital twins, and embedded platforms for industrial robot deployment.Toward the Lights-Out FutureThe convergence of advanced AI models, strategic infrastructure, and targeted edge solutions is accelerating the path toward fully automated “Lights-Out” semiconductor manufacturing, promising significant gains in productivity, efficiency, and resilience that will redefine the industry’s future. At SEMICON Taiwan 2025, the AI Technology Zone (advised by the International Trade Administration) underscores this transformation by showcasing the full AI ecosystem—from chip manufacturing and IC design to dedicated hardware.As part of its broader focus on AI innovation, SEMICON Taiwan 2025 also features the AI Technology Zone, advised by the International Trade Administration, underscores the transformation by showcasing the full AI ecosystem, from chip manufacturing and IC design to dedicated hardware. The zone brings together global innovators and industry leaders, providing a platform to foster collaboration and accelerate AI adoption across the semiconductor value chain.SEMICON Taiwan 2025 Smart Manufacturing Forum. SEMI

As the semiconductor market accelerates toward an estimated US$1.3 trillion valuation by 2030, industry leaders are converging on a shared vision. AI is ushering in an era of unprecedented growth and technological transformation.At the CEO Summit 2025, organized by SEMI, thought leaders from Infineon, NXP, Google,DENSO     , Tenstorrent, and ASE gathered to discuss the critical role of power in enabling AI, the opportunities and challenges semiconductors bring across applications—from data centers to edge computing—and the importance of global collaboration across the ecosystem.In their inaugural speeches in Taiwan, the CEOs of Infineon and NXP delivered a unified message on the future of AI. Both leaders underscored a critical and often overlooked point: power is the foundational element driving the next wave of AI computing performance. Their presence also underscored Taiwan’s strategic importance within the global technology ecosystem.Infineon Technologies CEO Jochen Hanebeck highlighted that AI’s power demand is becoming a fundamental bottleneck. Without sufficient power, the challenge extends beyond generation to the infrastructure needed to deliver electricity from the grid to the processing core. Ultimately, he warned, society may be unable to enjoy the full convenience and progress AI promises.NXP Semiconductors CEO Kurt Sievers echoed this sentiment, emphasizing that AI’s power demands extend well beyond data centers into "physical AI" applications such as autonomous vehicles and humanoid robots. This shift, he explained, is fueling rapid growth in edge AI. When AI interacts with the physical world, factors such as bandwidth, energy efficiency, latency, and trust become paramount. Consequently, these complex systems require advanced architectures with sophisticated power management for critical functions such as motor control and sensor integration.Sievers further elaborated on this concept, referring to it as "attending A", which he believes will enable truly autonomous machines. He stressed the industry’s immense responsibility to ensure these technologies are developed responsibly for the benefit of humanity, remarking: "We all share quite some responsibility to do this right for the better of humankind." He explained that intelligent systems consist of multiple "agents" that must be carefully orchestrated and enabled to work in harmony.Dr. Hirotsugu Takeuchi, CTO of DENSO     , shared insights on how semiconductors are transforming mobility. He outlined the requirements of automotive applications and the need for new SoCs to power the rise of Software-Defined Vehicles (SDVs). He pointed to the breakthrough of SiC technology as a key enabler of a sustainable, carbon-neutral society. Takeuchi emphasized that semiconductors will drive safer, more comfortable mobility and that collaboration with Taiwan and the broader global network will be essential to the future of the automotive industry.Rehan Sheikh, Vice President of Global Silicon Chip Technology & Manufacturing at Google Cloud, noted that demand for AI compute is growing exponentially. He highlighted that AI inference volume doubled in the past year, with Google’s internal data showing a 50-fold increase in monthly processed tokens across its services. Sheikh introduced Google’s latest TPU, Ironwood—a powerful, energy-efficient chip specifically designed for large-scale inference workloads. It represents Google’s first TPU purpose-built to balance high performance with power efficiency in meeting the demands of the AI boom.Jim Keller, veteran chip architect and CEO of Tenstorrent, emphasized his mission to champion open-source architectures and foster a spirit of global collaboration at a time when AI computing is becoming increasingly complex and costly. Keller explained that Tenstorrent aims to democratize high-end AI computing, making it more accessible, faster, and more open. The company’s strategy rests on three pillars: RISC-V, OpenAI, and a unified software stack. At the heart of this approach is a commitment to open standards and collaborative development, challenging the industry's traditionally closed ecosystems.During the fireside chat, speakers reflected on Taiwan's evolving role in the global semiconductor landscape. Long established as a manufacturing hub for logic chips, Taiwan is now emerging as the ideal platform for integrating diverse technologies and solving system-level challenges, thanks to its mature ecosystem, advanced packaging capabilities, and open-minded approach. Executives from Infineon, NXP, and Tenstorrent all stressed that no single company or region can address these challenges alone. The future of the industry, they agreed, depends on deep cooperation across sectors and geographies, combining expertise in areas ranging from high-performance computing to power and sensing technologies.In closing, ASE CEO Dr. Tien Wu referenced A Chip Odyssey, Taiwan’s first documentary film spotlighting its globally leading semiconductor industry. He described the film as a powerful reminder to both senior leaders and younger generations to maintain confidence in the steady progress of semiconductor development.The film chronicles Taiwan’s journey from humble beginnings to its emergence as a critical player in the global industry. Dr. Wu shared that he was deeply moved by the story of two generations of talent—each bringing vision, diligence, and leadership—who together created a lasting legacy. He extended this reflection beyond Taiwan, noting that the United States, Japan, Korea, and Europe have each experienced their own “chip odysseys.” This, he emphasized, illustrates that Taiwan's story is part of a larger global network of interdependence, where collective collaboration produces outcomes greater than the sum of individual contributions. Tenstorrent CEO Jim Keller champions open-source architectures and global collaboration to democratize AI computing. DIGITIMES

At the MEMS & Sensors Forum in SEMICON Taiwan 2025 held in Taipei on September 9, two leading experts presented complementary visions for the future of robotics. Dr. Hiroshi Ishiguro, a renowned Japanese humanoid robotics expert, offered a philosophical perspective on avatars and societal change. Meanwhile, Dr. Jwu-Sheng Hu, Executive VP of Taiwan’s Industrial Technology Research Institute (ITRI), provided a more "down to earth" view on industrial strategy and the robotics supply chain.The Human-Avatar Symbiotic SocietyDr. Ishiguro argued that the most transformative industries are those that repeatedly reshape the world, such as semiconductors. His focus is on developing avatars, which he defines as any robot or computer-generated agent that acts based on a person's intentions. He believes that the COVID-19 pandemic accelerated the adoption of remote work, finally removing the societal barriers that once hindered the avatar market.Central to his philosophy is the idea that humanoid robots are the ideal interface because our brains are naturally wired to recognize other humans. Dr. Ishiguro views this work as a "constructive science," using the creation of humanlike robots to understand our own higher cognitive functions, such as emotion and consciousness, and to explore "what it means to be human". He credits the advent of large language models with solving the longstanding challenge of creating humanlike conversational functions in robots.He showcased his own robot avatar, a "convenient double" that can speak multiple languages, including Chinese (which he cannot). The avatar's perfect memory and ability to conduct media interviews allows Dr. Ishiguro to manage his busy schedule. He even uses over 50 robots to guide visitors through his Expo pavilion, a demonstration of his vision for a future where people are no longer constrained by their physical bodies.Dr. Ishiguro then highlighted practical use cases, many of which are already under development through Japan’s government-backed Moonshot project. The initiative’s first goal is to establish by 2050 a society where individuals are no longer constrained by their physical bodies, brains, space, or time—expanding human abilities and granting new opportunities for participation.Dr. Ishiguro showcased how avatars are already reshaping daily life across multiple sectors:Retail and Service: In Japanese convenience stores and supermarkets, avatars assist customers around the clock. One wheelchair user was able to control five avatars remotely, earning a higher salary than in-person staff. Avatars also open global labor markets, enabling people in other time zones—for instance, Brazil—to work overnight shifts in Japan.Education: Avatars act as personalized tutors, adapting to each student’s strengths and preferences, while also enabling international students to join classes virtually.Healthcare: On a remote Japanese island of just 200 residents, avatars allow the local doctor to collaborate with university hospital specialists, effectively transforming a small clinic into a major medical hub.Business: From public officials delivering speeches without security risks to life insurance agents conducting sensitive consultations, avatars are reshaping professional engagement.From Automation to AutonomyDr. Hu’s presentation focused on the fundamental shift in robotics from automation to autonomy. He explained that while earlier robots were pre-programmed for repetitive tasks, advances in AI now enable them to handle complex, multi-joint motions. This new capability also introduces challenges such as high power consumption and overheating—issues Dr. Hu described as “exciting” because they fuel fresh opportunities for business and industry. He noted that the service robot market is projected to grow at a significant 23% annual rate through 2030.He highlighted the key difference: in automation, humans provide both the objective and the action plan, whereas in autonomy, the robot generates its own plan from a human-defined objective. A major hurdle, he stressed, is the shortage of real-world data to train what he calls the “large behavior model.” Dr. Hu outlined two strategies to address this challenge:Learning by Demonstration: A robot observes a human performing a task and uses that data to generalize the behavior to new situations.Sim2Real: Robots are trained in a virtual world using digital twins, which is cost-effective but requires massive amounts of electricity and computing power to process image and sensor data.Taiwan’s Strategy and a Shared FutureDr. Hu outlined Taiwan’s robotics strategy, which builds on the nation’s strength in small and medium-sized enterprises (SMEs). The plan emphasizes enhancing existing systems with AI functions and advancing manufacturing and design for next-generation hardware. He underscored Taiwan’s role in supplying key components for the global robotics value chain.ITRI has already spun off several robotics startups, including companies developing exoskeletons and robotic skin. As part of a new four-year, US$20 billion initiative, ITRI will also establish a national robotics center to spearhead this research.Both speakers concluded with a unified message. Dr. Ishiguro stressed that avatars can enable a society of diversity and inclusion by liberating people from the constraints of their physical bodies and highlighting their skills and contributions. Dr. Hu reiterated that the ultimate goal is for robots not merely to entertain but to work—and specifically to perform the “dirty and dangerous” jobs on behalf of human beings. Together, their presentations offered a compelling roadmap for a future in which robots are seamlessly integrated into society to enhance human potential.Professor Hiroshi Ishiguro, the key note speaker of MEMS & Sensors Forum of SEMICON Taiwan 2025. SEMIDr. Jwu-Sheng Hu, Executive Vice President, Industrial Technology Research Institute at SEMICON Taiwan 2025. SEMI

ACE Solution, in collaboration with Taiwan Nano & Micro-Photonics, made a strong presence at SEMICON 2025, one of the world's most influential semiconductor exhibitions. ACE Solution showcased their latest semiconductor and silicon photonics solutions, featuring five key technologies: Silicon Photonics Sensing Platform, Silicon Photonics and Optical Communication Solutions, Teradyne Compound Semiconductor Test, TZ-6000 Non-Destructive Material and Wafer Inspection, and 3DIC Advanced Packaging Non-Destructive Inspection. Each demonstration received enthusiastic responses and attracted a wide range of industry professionals.ACE Solution highlighted its core strength of "from materials to wafers to packaging," showcasing its deep expertise in testing and system integration. Quantifi Photonics, with its integrated opto-electrical testing system, enables ultra-high transmission speeds and reduced energy consumption, bridging groundbreaking research with efficient production testing.In the fast-growing automotive and renewable energy industries, the Teradyne Compound Semiconductor Test system drew significant attention. As the industry's top power IC testing platform, it can achieve up to 6000V and 4000A, supporting testing needs for EV power systems, battery management, as well as Gallium Nitride (GaN) and Silicon Carbide (SiC) power modules, power discrete, and mixed-signal devices.In the field of material and wafer inspection, the TZ-6000 provides non-destructive quality measurement solutions. Leveraging terahertz (THz) technology, it achieves higher penetration depth for semiconductor wafer materials such as silicon, SiC, and GaN, and supports various sizes and shapes to ensure wafer quality. It enables comprehensive quality control for thickness, refractive index, resistivity, dielectric constant, localized surface/subsurface defects, and full-wafer scanning.For 3DIC advanced packaging non-destructive inspection, the Electro-Optical Terahertz Pulse Reflectometer (EOTPR) stood out with its 5-micron precision positioning capability. It is the world's first instrument to use isolation technology for integrated circuit packaging fault analysis and quality monitoring, making it another highlight of the exhibition.ACE Solution remains committed to a customer-centric approach, focusing on developing advanced testing technologies that deliver higher efficiency and lower power consumption. By addressing the rising demand in high-performance computing, electric vehicles, and AI applications, ACE Solution will continue to develop customized inspection solutions and deepen collaborations with global partners to drive innovation and sustainable growth in the semiconductor industry.From left: Application Engineer Jacky Lee, Sales Manager Jason Hsieh, Marketing Specialist Mia Hung, Marketing Manager Jenny Lin, Senior System Integration Manager Leon Chang. ACE Solution

In the wake of the AI and Electric Vehicle (EV) era, efficient power supply and conversion have become a critical battleground. For over a decade, 3S Silicon Tech has been deeply committed to developing high-reliability packaging equipment for power devices and modules. Over the past five years, the company's formic acid vacuum reflow oven has gained widespread acclaim from leading international IDMs and the world's largest OSATs. Its remarkable advantages—including low void rates, flux-free soldering, and post-solder cleaning-free processes—effectively resolve metal oxidation issues, establishing 3S as a leading brand for high-end power module reflow packaging.From data to prediction: AI empowers equipment3S Silicon Tech's core technology utilizes AI to build process behavior models, enabling equipment to learn from data, predict, and self-optimize. Through machine learning (ML), the system analyzes vast amounts of data from sources like MES, sales, and SQL databases to identify key process variables.This allows the equipment to learn from past experience and provide precise parameter recommendations, leading to:1. Precise process tuning: The AI model recommends optimal parameters for different product types, ensuring perfect soldering every time. For example, baseline models for heating elements in various temperature zones are established before the equipment leaves the factory. By continuously monitoring the heating elements, the AI uses predictive analysis to issue early warnings before a malfunction occurs, ensuring process stability, preventing unexpected downtime, and even predicting the lifespan of the heating element.2. Yield and quality optimization: AI analysis quantifies the interactive relationships between different parameters and variables. Using a correlation matrix model, it provides optimal parameter recommendations for power modules, effectively boosting yield and product reliability.3. Precise predictive profiling: This technology effectively prevents up to 99.99% of equipment failures, optimizing production efficiency, reducing downtime, and significantly lowering maintenance costs.Green sustainability: Achieving flux-free solderingBeyond intelligence, this new launch also emphasizes sustainability. 3S Silicon Tech's AI-empowered formic acid vacuum reflow oven features a unique flux-free soldering capability. This not only enables a clean and highly reliable soldering process without the need for post-solder cleaning, but also reduces waste by up to 99%, providing a dual benefit of environmental protection and cost control for businesses.3S Silicon Tech sincerely invites you to SEMICON Taiwan 20253S Silicon Tech's AI-empowered formic acid reflow oven offers semiconductor manufacturers a highly efficient and easily implementable solution. This technology is specifically designed to address customers' void rate concerns, clearly demonstrating the immense application value of AI in semiconductor manufacturing. It further helps companies achieve a comprehensive upgrade in yield stability, predictive analysis, and maintenance optimization.3S Silicon Tech cordially invites all industry professionals and partners to visit our Booth Q5338 at Hall 2 of the Nangang Exhibition Center during SEMICON Taiwan from September 10-12, 2025. Come experience our cutting-edge AI and formic acid reflow oven technology and witness the journey toward smart, optimized manufacturing. For more information, please visit the 3S Silicon Tech Official Website.

The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making the integration of nano-precision platforms and thermal stabilization in Semiconductor automation a strategic investment.PBA Systems will debut its latest nano-precision dual gantry platform series and metrology stage series designed for CoWoS and smart manufacturing requirements, to be showcased in the 2025 SEMICON Taiwan exhibition, located at Hall 2, 1st floor, Booth Q5536 in the Taipei Nangang Exhibition Center from Sep. 10th to Sep. 12th.For semiconductor advanced packaging technologyThe technology drivers of Heterogeneous Integration Architectures in Semiconductor advanced packaging involve different materials and bump density, and drive different process equipment requirements. From 2.5D to 3D development, semiconductor advanced Packaging may require different Die Attachment Processes, from high-speed, high-accuracy to thermal compressed and hybrid bonding. These processes require highly precise, custom-designed platforms for automation.PBA's latest dual gantry nano precision platform series offers high precision solutions for flip-chip bonding, thermo-compression bonding, and hybrid bonding. Its special dual-gantry architecture facilitates special simultaneous, multi-axis motion controls for high-speed die bonding and precision assembly applications, with less floor space requirements and high yield rates. PBA offers fast custom design services.Key advantages of PBA dual gantry series include:Nanometer-level assembly accuracy to boost high throughput and yield rates.Design with controllable suppression of thermal expansion minimizes yield loss.Scalability to support heterogeneous integration and next-generation chip architectures.Custom-designed High-speed, high-precision positioning to ensure both productivity and process stability.Flexible joint design, reduction of vibrations and resonance, improved accuracyPowered by PBA motors, an advancement from traditional ball-screw or belt motors, enjoyed low cogging force with anti-cogging features.In addition to offering fast custom design solutions, PBA also offers 250,000 square feet of contract manufacturing space for flexible manufacturing plans for worldwide system partners.PBA will also showcase its Z-Axis High-Precision Positioning Stage series at the upcoming SEMICON Taiwan show. This stage series offers ideal motion solutions for vertical movement in semiconductor automation with limited space and high-precision requirements, ideal for AOI inspection and PCB pick-and-place applications.Leader in nano-precision stage and gantry solutions for automationPBA Korea specializes in high-precision stage technologies. PBA Group further merged Korea SOONHAN Engineering, Korea's leading manufacturer of precision stage systems for 31 years, powering PBA Group to become one of the world's top precision stage experts that provide dynamic custom design and manufacturing services. PBA Systems is also a technology-capable partner of Mitsubishi Electric and Applied Materials. PBA group's contract OEM manufacturing experiences for many world-renowned semiconductor equipment partners in Asia also differentiate the group from regional local vendors.Meet the expert tech talkThe SEMICON Taiwan show will feature several advanced technical talk sessions in dedicated show floor booth sections. In the Smart Manufacturing Expo section, PBA will participate in the Expert Talk session on September 12, located at Talk Booth Q5356, 1F, Nan-Gang Exhibition Hall 2. PBA will be presenting the highly anticipated speech topic: PBA's Dual-Gantry Precision Platform Series for Semiconductor Advanced Packaging and Metrology Equipment. This is a rare opportunity for industry professionals to gain smart manufacturing insights directly from the expert—don't miss it.Global reach, local serviceHeadquartered in Singapore, PBA Group has R&D and sales offices in Singapore, Taiwan, South Korea, Japan, Malaysia, China, the United States, and Europe. The Taiwan branch offers a one-stop solution, providing everything from direct drive motors and modules to custom-integrated, high-precision platform systems. This ensures fast, flexible, and innovative smart manufacturing services for both local and international clients.For system partners with product customization or procurement inquiries, please contact.PBA released their latest Nano-Precision Dual Gantry Stage Platform Series for Heterogeneous Semiconductor Advanced Packaging and Metrology Equipment. To Be Debuted at the 2025 SEMICON Taiwan. PBA

Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, high-performance computing (HPC), and AIoT—designed to meet the evolving demands of next-generation semiconductor testing.Advanced Packaging 3D Metrology Solutions - Chroma 7980/7981The Chroma 7980/7981 systems feature Chroma's patented BLiSTM technology, purpose-built for nanoscale critical dimension measurement. These systems incorporate application-optimized algorithms and user interfaces to deliver high-speed surface profiling and fast auto-focusing capabilities, along with large-area image stitching. They address key needs in advanced packaging processes such as TSV/VIA, RDL, probe mark inspection, overlay, and sub-micron surface profiling. Additionally, Chroma's inspection and in-situ AOI solutions, like the Chroma 7961, enable real-time defect detection and inline process quality control.AI-Driven Test Platform - Chroma 3680When hardware innovation meets AI-enhanced software, a new era of automated test equipment emerges.The Chroma 3680 platform is purpose-built to meet the demands of modern semiconductor testing, combining high-efficiency algorithms with a modular architecture to redefine flexibility and efficiency in test systems.This platform features a unified and intelligent system architecture that enables real-time, accurate test program conversion—reducing migration time and manpower by over 80%. It addresses key pain points such as poor portability of legacy test programs and time-consuming debugging processes, supporting diverse chip architectures with a concrete and effective solution.Chroma 3680 supports modular expansion to meet increasingly diverse future requirements, and can be equipped with the HDRF2 module for one-click activation of RF testing, greatly simplifying test setup. The overall platform is designed for high scalability and flexibility, enabling fast adaptation across different product lines, application needs, and test scales—streamlining both development and validation processes.Tri-Temp System-Level Test SolutionsChroma's 3100 and 3200 pick-and-place handler solutions, paired with the 31000R/31000K Series Temperature Forcing Systems, deliver a powerful, fully integrated platform to meet the unprecedented challenges of AI-era device testing.The advanced 3110, 3200, 3200-HD, 3210, and 3260 pick-and-place systems feature industry-leading SLT testing solutions, including a high-precision contact force system, CVOT (Chroma Virtual Operation Tools) for intelligent yield optimization, integrated device protection features, and a universal change kit design for fast, flexible device conversion. These systems ensure superior test quality through scalable architecture that integrates seamlessly into both engineering and high-volume production environments.The intelligent 31000R thermal solution provides a wide and stable temperature control range from –40°C to 150°C, with high-power dissipation capability up to 2,900 W. It features advanced thermal performance with direct phase-change cooling, intelligent power monitoring, and high-precision multi-zone control. This makes it ideal for AI, HPC, and thermally demanding automotive applications.SuperSizer Nano-Particle Monitoring SystemsPowered by advanced aerosol particle measurement technology, the SuperSizer system delivers precise monitoring of nano-sized particles ranging from 3 nm to 20 nm, overcoming the limitations of conventional optical systems, especially bubble interference.The SuperSizer II, V, VI, and VII generations have been widely adopted for real-time monitoring of critical wet chemicals such as CMP slurry, isopropyl alcohol (IPA), hydrogen peroxide/pure water, and ammonia solutions. The latest addition to the series, SuperSizer VIII, is purpose-built for hydrochloric acid monitoring—extending the system's capabilities into more aggressive chemistries.By enabling in-line and real-time particle detection, the SuperSizer platform helps minimize wafer defects, ensure chemical purity, and improve overall process yield.Visit Chroma at SEMICON Taiwan 2025From September 10–12, Chroma ATE will exhibit at SEMICON Taiwan 2025 at the Taipei Nangang Exhibition Center, Hall 1, 1F (Booth K2876).In addition to showcasing our wide-ranging portfolio of test solutions, Chroma will present at the Semiconductor Advanced Inspection and Metrology Forum. Our presentation "White-Light Interferometry Integration with Electromagnetic Simulation and Digital Light-Field Control for Advanced Packaging" will explore innovative applications of advanced packaging inspection and metrology technologies.Join us at SEMICON Taiwan 2025 and connect with our team to exchange insights on the future of test and innovation.Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, high-performance computing (HPC), and AIoT—designed to meet the evolving demands of next-generation semiconductor testing. Chroma ATE Inc.

Tescan Group proudly introduces its new global brand platform The Art of Discovery at this year's Microscopy Conference (MC) in Karlsruhe, Germany. Built on the belief that beauty lies in what is yet to be discovered, it reflects Tescan's ambition to be a trusted growth partner in science. Following its global introduction at MC 2025, the brand platform will make its Asia-Pacific debut at SEMICON Taiwan (September 8–12, 2025).This rebrand signals a pivotal step in Tescan' s shift toward a more integrated model — combining advanced technology, workflow-focused solutions, expert support, and a community built on shared knowledge. This represents Tescan's broader focus on delivering customer-centric solutions rather than simply providing technology.New Aspiration, Approach and Drivers"Our brand transformation captures who we are today — a company built on strong partnerships, driven by results, fueled by innovation, and committed to delivering purposeful solutions that put users first," says Sirine Assaf, Chief Revenue Officer at Tescan. Guided by its core principles, Tescan sets a clear ambition: to empower customers and partners with tools, software, and services built for what's next. At the heart of this transformation is a simple idea — removing the barriers between a question and its discovery. "This transformation isn't just about technology. It reflects a continuous evolution in how we think, how we work together, and how we enable the scientific community with timely solutions to fasten their discoveries," says Assaf.Automation and InnovationBuilding on last year's successful introduction of multiple new instruments (including the plasma FIB-SEM Amber X 2) — Tescan continues its innovation journey across the entire portfolio. This year, the company's primary focus is on enhancing automation throughout all its products, aiming to streamline scientists' workflows at a time when speed and accuracy are more important than ever. Alongside its new brand platform, Tescan is also unveiling two new software solutions: AutoSection and TEM AutoPrep PRO – Inverted & Planar Lamella Automation. "Our primary goal in this area is to reduce the time from instrument purchase to when users can fully leverage its capabilities. We accomplish this through intelligent automation, deep application expertise, and close collaboration with our customers," closes Bruno Janssens, Chief Strategy Officer at Tescan.CEO PerspectiveJean-Charles Chen, CEO of Tescan Group, commented: "This is much more than a cosmetic redesign. It's a strategic repositioning that reflects the way we see how science is evolving, and how Tescan is evolving with it. We're aligning with a new era of scientific discovery by enabling better-integrated workflows, faster time from question to insight, and a tighter connection between our technology and our users' needs. It's a shift from being a product-oriented company to becoming a solutions partner. This means more automation, smarter software, and a mindset rooted in customer outcomes. The new look is simply a reflection of that deeper change.”APAC RolloutFollowing an exclusive offline preview at the International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) in early August, Tescan will make the APAC debut of its new brand at SEMICON Taiwan (September 8–12, 2025). As part of the Semiconductor Advanced Inspection and Metrology Forum, Hervé Macé, Global Business Development Director for Semiconductors, will speak on September 12 on Development of New Workflows to Address Metrology and Failure Analysis Challenges at Macroscale, Microscale and Nanoscale.Venue: 701F, 7F, Taipei Nangang Exhibition Center Hall 2.