Keywave Technology is a fabless semiconductor company founded in December 2022 that specializes in radio frequency (RF) integrated circuit (IC) design and advanced radar sensing solutions. Capitalizing on the explosive growth of Edge AI and opportunities for technological innovation, the company builds ultra-low-power microwave radar chips, modules and spatial sensing devices to track multiple targets with centimeter-level precision spatial positioning applications.Keywave Technology currently business focuses primarily on the UK market, where it has achieved significant success in projects spanning lighting, energy-saving systems, HVAC optimization, and smart applications involving precise occupancy tracking, smart environmental sensing and human-machine interaction.Jenny Cheng, founder and CEO of Keywave, established an office in Zhubei as early as 2023 and marked a strategic expansion into Taiwan's core semiconductor and electronics ecosystem. Recognized strong growth of Taiwan’s electronics manufacturing and semiconductor market, she formally launched an "Asia Business Division" team in 2026 with over 20 members.Following collaboration and engagement with major Taiwanese electronics manufacturing, and OEM/ODMs, Keywave has developed two radar sensor product lines, operating at 5.8 GHz and 24 GHz targeting markets such as AI robotics, smart spaces, smart buildings, automation, and edge AI sensing. Through proof-of-concept (PoC) initiatives and product design, the Keywave R&D team has focused on applications requiring high-precision spatial sensing and trajectory tracking. These innovative products, characterized by high accuracy, rapid sensing capabilities, energy efficiency, and cost-effectiveness. Now these solutions are being officially introduced to Taiwan’s industrial internet of things (IoT) and automation sector, paving the way for new business opportunities.MP Kan, VP of Technology and CTO at Keywave, outlined the shortcomings of traditional microwave radar and infrared (PIR) sensing technologies. Benchmarked against radar devices from leading global analog integrated circuits (ICs) manufacturers, he identified the primary drawbacks of these existing solutions: false detections leading to unintended activations, a technical inability to detect motionless objects or resting human bodies, and issues regarding high costs and excessive power consumption.In contrast, Keywave KW007, the compact 5.8GHz ultra-low-power radar sensor, achieves exceptional efficiency by drawing only 30µA to 100µA of operating current, enabling continuous motion detection for years on a single AA battery depending on sensitivity and the selected detection distance.This exceptional energy efficiency relies on smart sensing algorithm with proprietary multi-dimensional "Space and Time" sensing technology. This approach differs from traditional radar designs, which utilize high-performance DSP chips and extensive memory, resulting in inflated costs and high power consumption.In June 2026, Kan was invited to France to attend the inaugural European Semiconductor FSNP Meetup. Held on June 4, 2026, at Château de Seguin near Bordeaux, this was an exclusive, invitation-only event for the semiconductor industry, co-hosted by the European chip R&D platform EuroCDP and Silicon Catalyst.EU. He presented this ultra-low-power microwave radar sensing technology based on time-and-space correlation algorithms. The technology’s key strength lies in its integration of proprietary "Spatial Intelligence" and trajectory tracking, enabling it to accurately distinguish actual human movement from environmental noise in dynamic settings. It currently supports a sensing range of up to 20 meters and effectively prevents false triggers caused by natural wind, indoor fans, vibrations, or environmental noise.By combining radar sensors with AI technology, Keywave KW307, a 24GHz human presence and occupancy sensing module, enables the development of advanced, intelligent applications capable of detecting not only people and objects but even micro-motions like typing, breathing, or minor gestures. Given the regulatory restrictions in EU’s General Data Protection Regulation (GDPR) and California's CCPA/CPRA regarding the major concerns of camera-based systems capturing real-person images or personal identifiers, Keywave’s radar sensors have secured a significant market advantage by measuring motion, distance, and velocity.These microwave radar sensors facilitate applications such as office occupancy monitoring, object trajectory analysis, and climate and lighting control, while integrating seamlessly with the Industrial IoT devices, robotics, and smart home sectors to rapidly expand the scope of smart use cases. Kan also revealed that the next-generation radar sensor currently under development aims to push detection boundaries from a few hundred meters to several kilometers. This will explore the business potentials for deeper integration with drone and robotics applications to assist autonomous systems with spatial awareness and reliable presence detection in variable or low-light conditions.The most impressive technological breakthrough of Keywave Technology lies in its ability to achieve precise stationary presence detection and micro-motion tracking by analyzing the minute chest movements caused by breathing, even when a person is completely motionless. The current popular demonstration of Smart Spaces include powering privacy-compliant occupancy tracking for automated lighting and optimized HVAC adjustments. There are more use cases in the industrial controlling and detecting systems.The company is currently actively forging partnerships across various sales channels, including IC distributors, ODM/OEM manufacturers, and system integrators. In addition to offering engineering evaluation kits, development boards and support to technical teams, Keywave is seeking strategic partners to collaborate closely on the co-design of new applications with hardware and software system integrators.For further viewing the ultra-low-power radar porducts of Keywave, the company will exhibit at Microelectronics UK 2026, taking place at ExCeL London on September 29–30, 2026. The showcasing booth stand is located at Stand G16, ExCeL London, Royal Victoria Dock. At Keywave, we have been working on exciting new developments designed to help our partners navigate complex engineering challenges, optimize performance, and drive innovation. Visiting our booth will give you an exclusive look at our latest product demonstrations, upcoming technology roadmap, and a chance to speak directly with our technical experts.Credit:Keywave TechnologyKeywave radar sensor accurately tracks and records the movement trajectories of individuals.Credit:Keywave Technology

Tescan will participate in SEMICON Taiwan 2026 from September 2 to 4 at Booth R8201, 4F, Taipei Nangang Exhibition Center Hall 2 (TaiNEX 2). Under the theme "Streamlined Failure Analysis for Advanced Packaging," Tescan will present a correlative workflow that connects defect localization, rapid access to regions of interest (ROIs), site-specific sample preparation, and nanoscale characterization.Chiplet architectures, heterogeneous integration, advanced packaging, high-bandwidth memory (HBM), and wide-bandgap power devices are increasing structural complexity and introducing more diverse material stacks. As critical defects are often buried within packages or devices, failure analysis (FA) laboratories need an efficient end-to-end workflow that preserves sample context from non-destructive inspection through root-cause analysis.From Defect Localization to Nanoscale AnalysisTescan structures the workflow across four stages: Inspect, Access, Prepare, and Analyze. Tescan UniTOM HR 2 micro-CT provides non-destructive 3D imaging of internal package structures, warpage, and potential defects. Tescan FemtoChisel then uses gas-assisted femtosecond laser processing to expose buried ROIs, followed by precise cross-sectioning and sample preparation with Tescan SOLARIS X 2 plasma FIB-SEM under real-time SEM guidance. Tescan TENSOR 4D-STEM completes the workflow with nanoscale structural and materials characterization.By maintaining defect location and sample context across successive stages, the integrated workflow reduces repeated localization, rework, and unnecessary sample transfers. This helps R&D, process engineering, yield enhancement, and high-volume manufacturing (HVM) teams shorten time-to-answer and improve confidence in analytical results.Femtosecond Laser Processing Accelerates Workflows for Large, Complex SamplesDesigned for semiconductor sample preparation and failure analysis, Tescan FemtoChisel supports cross-sectioning, decapsulation, delayering, cavity preparation, and large-volume material removal. Gas-assisted femtosecond laser processing increases throughput while preserving the structural integrity and surface quality required for downstream high-resolution SEM, FIB-SEM, or TEM/STEM characterization.FemtoChisel Forum Presentation: From Hours to MinutesOn 2026, September 4 from 15:05 to 15:30, Hervé Macé, Semiconductor Solution Sales Development Director at Tescan, will present at the Semiconductor Advanced Inspection and Metrology Forum in Room 402 on the fourth floor of TaiNEX 1.Tescan FemtoChisel: From Hours to Minutes: High-Throughput Gas-Assisted Femtosecond Laser Workflows for Advanced Semiconductor Analysis and CharacterizationThe presentation will highlight how gas-assisted femtosecond laser processing accelerates sample preparation for large structures and complex material stacks while maintaining the quality required for downstream high-resolution characterization.Explore the Workflow at Booth R8201Tescan will host SPIN. MATCH. ENJOY. at Booth R8201 from 10:00 on 2026, September 2 and 3. Visitors can match Tescan technologies with their signature drinks while learning how non-destructive inspection, laser-based ROI access, and FIB-SEM sample preparation work together. Tescan specialists will also be available to discuss real-world failure analysis challenges and application requirements. Learn moe about Tescan at SEMICON Taiwan 2026 here.

Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At Booth L0716 (TaiNEX 1, Level 4). ASMPT will be presenting technologies supporting next-generation AI, High-Performance Computing (HPC), Co-Packaged Optics (CPO) and photonics applications under the theme "Empower the Intelligence Revolution."  Reflecting its continued commitment to Taiwan, one of the world's leading semiconductor hubs, ASMPT is also strengthening its local leadership and customer engagement capabilities.Taiwan remains a key center for semiconductor innovation and advanced packaging. Working closely with customers across the region, ASMPT supports the industrialization of next-generation semiconductor technologies, helping bring advanced concepts into reliable, high-volume manufacturing and enabling the innovations that power the AI era.As part of its continued investment in Taiwan, ASMPT appointed Johnny Fan as General Manager, Country Head & Head of Sales, Semiconductor Solutions Taiwan, further strengthening its local leadership and customer support."Taiwan is at the forefront of semiconductor innovation, particularly in advanced packaging technologies that are enabling the AI era," said Johnny Fan. "Our customers are driving some of the world's most advanced semiconductor innovations in AI, HPC and photonics. The challenge is turning those innovations into production-ready solutions at scale, and that's where ASMPT helps its customers succeed."As AI applications continue to drive demand for more powerful and efficient semiconductor architectures, advanced packaging is playing an increasingly important role in delivering the required performance, power efficiency and integration. At SEMICON Taiwan 2026, ASMPT will present solutions supporting applications in HPC, AI accelerators, silicon photonics and Co-Packaged Optics (CPO), leveraging technologies such as Thermocompression Bonding (TCB) and Hybrid Bonding.As an example of these capabilities, ASMPT will showcase its MEGA multi-chip bonding solution. MEGA combines high-precision placement with alignment accuracy of ±2μm and ±0.1°, integrated epoxy dispensing and stamping capabilities, parallel processing of multiple adhesive materials, immediate UV fixation and integrated 3D inspection of the adhesive application. Independently operating pick and bond arms, together with a flip-pick unit and integrated rotation stage, enable flexible process execution for complex multi-chip and photonics applicationsJohnny Fan, ASMPT Taiwan Country Head, drives customer engagement & local ecosystem. Credit:ASMPT

Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in an AI multichip package while scaling up glass panel sizes? If so, visit iCometrue at Booth M0957, Hall 1, 4F, Taipei Nangang Exhibition Center during SEMICON Taiwan 2026!Glass substrates have emerged as a promising platform for large-size, high-performance AI multichip packages due to their superior thermal, mechanical, and electrical properties. At SEMICON Taiwan 2025 last year, iCometrue exhibited the Through-Polymer-Via (TPV) Connector, a novel technology that provides vertical interconnection in Glass Cores for use in Glass Interposers and BGA substrates to solve the microcrack problem in glass substrates caused by TGV fabrication.At SEMICON Taiwan 2026 this year, iCometrue plans to exhibit solutions for delivering 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in the high-performance AI multichip package. The solutions include:1. Embedding Cu blocks in glass substrates for power/ground delivery: Reducing the number of TPVs/TGVs originally used for power/ground delivery by 80%, thereby lowering fabrication complexity, improving manufacturing yield, and reducing manufacturing costs.2. Packaging Voltage Converter/Regulator (VCR) chips in the AI multichip package: Allowing high-voltage (for example, 48V) power supply input to the package and reducing power supply voltage (for example, down to 1V) within the package, based on the copper-block-based low resistance power delivery system. The innovated copper-block-based low resistance power delivery system reduces the heat generation.3. Embedding Si bridges, deep-trench decoupling capacitors (DTCs), and Voltage Converter/Regulator (VCR) chips in the frontside interconnection scheme over the glass substrate: Silicon bridges, DTCs, and VCR chips are embedded directly into the frontside interconnection scheme over the glass substrate, leaving large holes in the glass substrate dedicated to TPV connectors and copper blocks to streamline manufacturing.4. Installing electrical/optical connectors at the edges of the AI multichip package: This architecture uses electrical and/or optical connectors at the package edges for power and signal input/output, replacing the conventional power and signal routing that traditionally relied on bottom solder balls. This unleashes a TPV/TGV-free System-on-Panel (SOP) package, allowing thicker glass substrates that drastically reduce panel bending and enable larger manufacturing panel sizes.By using innovations mentioned above, iCometrue provides a scalable, practical alternative to traditional TGV processes. These breakthroughs extend Moore's Law into the era of glass-based system packaging, accelerating high-performance computing (HPC) and AI applications.

Henkel Adhesive Technologies today announced the launch of Loctite ABLESTIK CDF900, its next-generation conductive die attach film (cDAF) series, at SEMICON Taiwan 2026. Delivering thermal conductivity exceeding 8 W/m-K, the new material is designed to help semiconductor manufacturers overcome rising thermal and stress challenges in AI, 5G and emerging 6G telecommunications, and high-performance computing (HPC) applications.As AI, HPC, and next-generation communications drive higher chip frequencies, greater thermal design power, and more complex package architectures, efficient heat dissipation and stress control have become critical to device performance and reliability. Loctite ABLESTIK CDF900 addresses these challenges by combining high thermal conductivity with the precision and process consistency of a film-based die attach format.Technical Breakthrough for High-Performance AI Packaging"Henkel is a global leader in conductive die attach film, with technology widely adopted in Wi-Fi communications, automotive electronics, and power devices. Today, Loctite ABLESTIK CDF900 pushes thermal performance to new heights while expanding applications into large-die packaging scenarios such as processors and AI chips. This offers customers broader design flexibility and superior thermal management solutions," said Kaihua Zhou, Head of Market Strategy for Semiconductor at Henkel Adhesive Technologies Electronics.The core breakthrough of Loctite ABLESTIK CDF900 lies in its proprietary thermal filler technology, which substantially increases thermal conductivity to more than 8 W/m-K. This enables high-power components in mobile phones, processors, and Wi-Fi equipment to dissipate heat efficiently and maintain stable performance in demanding operating environments.Compared with competing liquid die attach adhesives, Loctite ABLESTIK CDF900's film-based format helps eliminate the risks of material bleed-out and non-uniform bondline thickness. This enables chip designers to achieve smaller, more precise die footprints within constrained spaces while enhancing overall package reliability and robustness.Complete Material Solutions to Address Stress Challenges in AI Advanced PackagingTo address warpage during processing and component stress issues inherent in large-die advanced packaging, Henkel continues to expand its material portfolio. The company has developed high-thermal-conductivity liquid molding compounds, high-performance capillary underfills, and diverse packaging material platforms to meet requirements for efficient heat dissipation, high reliability, and process flexibility. By reinforcing structural strength, toughness, and adhesion, Henkel's materials help mitigate stress imbalances while meeting the stringent reliability and high-volume manufacturing stability requirements of high-end AI packaging.At SEMICON Taiwan 2026, Henkel will present its complete portfolio for critical advanced packaging applications, including underfill, conductive die attach film, liquid molded underfill, and non-conductive liquid adhesive technologies.Kevin Becker, Senior Vice President of Product Development and Engineering, added, "These solutions support board-level to wafer-level packaging, low to high thermal conductivity applications, and small to large die footprints. Leveraging its comprehensive product portfolio, global R&D resources, and localized technical support, Henkel empowers customers to improve thermal performance, package reliability, and mass-production readiness in advanced package designs, while providing vital material support for the next generation of AI development."Global Footprint and Multi-Site Support Deliver Supply Chain ResilienceAmid geopolitical shifts and global expansion, semiconductor supply chain resilience has become a priority in international procurement decisions. Henkel has established a robust multi-site support network and operates manufacturing facilities across North America, Europe, and Asia, with established production and technical support hubs in Taiwan, South Korea, China, Japan, and Southeast Asia. Flexible backup production sites enable localized, real-time support to meet global customers’ capacity expansion and procurement flexibility needs.Sustainability Commitment: Advancing Circularity in Semiconductor MaterialsSustainability is a core value at Henkel. In material R&D, the company has pioneered the integration of eco-friendly product design methodologies. For example, Henkel is collaborating with partners to advance circular economy practices, including the use of silver powder from recycled silver, a precious metal widely used in semiconductor packaging. Henkel is committed to working hand in hand with industry partners to reduce carbon emissions and minimize resource waste.Visit Henkel at SEMICON Taiwan 2026During SEMICON Taiwan in September, Henkel will present its full suite of material solutions for advanced packaging and high-performance semiconductor applications in Room 404, Hall 1 of the Taipei Nangang Exhibition Center. The company will showcase its technical capabilities across AI infrastructure, HPC, next-generation communications, and Edge AI.The hospitality suite will feature a variety of interactive experiences, creating opportunities for customers and industry partners to engage directly with Henkel's technical experts. Together, participants will explore innovative solutions for advanced packaging, including thermal management, reliability enhancement, stress mitigation, and readiness for high-volume manufacturing. Through collaboration and knowledge exchange, Henkel continues to support the semiconductor industry's progress toward higher performance, greater reliability, and enhanced resilience.Details about Henkel consumer electronics materials are available here, and information about its semiconductor solutions can be found here.LOCTITE is a registered trademark of Henkel and/or its affiliates in the USA, Germany and elsewhere.

ViTrox, which aims to be the World's Most Trusted Technology Company, is excited to announce its participation in SEMICON Taiwan 2026, one of the world's leading semiconductor industry events. The exhibition will take place from 2 to 4 September 2026 at TaiNEX 1 & 2 in Taipei, Taiwan. Visitors can visit ViTrox at TaiNEX 2, 1F, Malaysia Pavilion, Booth #P6006.The semiconductor industry continues to face increasing challenges as packaging architectures such as SiP, memory technologies like HBM, and advanced processes such as CoWoS become more widely adopted. While these technologies enable higher performance and integration, they also introduce greater process complexity and stricter quality requirements.Key challenges include:-Precision Bottlenecks: Sub-micron defect detection requires inspection capabilities beyond conventional methods.-Hidden Complexity: Advanced 3D structures often conceal internal defects that are difficult to detect.-Yield Pressure: Rising investment in advanced manufacturing places greater emphasis on first-pass yield and equipment efficiency.To address these challenges, ViTrox provides next-generation AI-powered vision inspection solutions that enhance detection accuracy, improve process stability, and support efficient semiconductor manufacturing.At SEMICON Taiwan 2026, ViTrox will showcase a fully integrated inspection ecosystem that seamlessly supports the entire semiconductor manufacturing journey, delivering end-to-end quality assurance from wafer to board level.At the Wafer Level, we address the earliest stages of manufacturing with the WiX Ai Smart Wafer AOI Machine. This an unified platform that gives fabs full-depth wafer visibility, from surface to inner layer, before wafers progress to later stages. It detects sub-micron surface defects (< 1 µm) with AI-enhanced accuracy, while proprietary SWIR technology uncovers hidden inner cracks that conventional inspection cannot see.During Die Sorting & Packaging, once the wafer is transformed into dies, precision sorting becomes critical. Our PX40Ai Smart Die Sorting Machine streamlines high-speed sorting, six-sided inspection, and tape-and-reel packaging, replacing conventional manual inspection with exceptional accuracy and improved production efficiency.Designed to address the growing complexity of advanced packaging, the TH3000i Smart Tray Based Vision Handler combines an adaptive vision system with AI-powered defect detection to support diverse package inspection requirements. Building on this intelligent inspection capability, V-ONE In-Process Verification further enhances overall inspection efficiency by enabling remote inspection review and verification.During Final Assembly & Post-Seal, the VR20Ai G2 Smart Post Seal Vision Handler minimises machine idle time through a high-speed dual-track system design, while supporting automated tape insertion and width conversion (8 to 32 mm), ensuring compliance with international quality standards.At the Strip & Board Level Inspection stage, the V510Ai Smart 3D AOI System for Substrate-Level and SiP Inspection utilises high-resolution 3D measurements and SWIR imaging to detect surface anomalies, component offsets, and inner die cracks on strips and complex high-density modules, ensuring robust inspection for IC package integrity.During the show, ViTrox will also introduce our SMT Full Line Solutions, including Smart 3D SPI, Smart 3D AOI System, Smart 3D AXI System, and Smart Robotic Optical System (ARV). These smart manufacturing solutions are linked to ViTrox's Manufacturing Intelligence Solutions Towards Industry 5.0 – V-ONE to form an end-to-end AI-driven Inspection Ecosystem, guaranteeing seamless data connectivity and true closed-loop control. Ultimately, this comprehensive integration enables manufacturers to reduce human error, accurately detect defects early, optimise process performance, and maintain consistent product quality across every production stage.Visit at TaiNEX 2, 1F, Malaysia Pavilion, Booth #P6006 to connect with experts and discover tailored inspection solutions for any manufacturing needs. To schedule a meeting with ViTrox team during the exhibition, simply complete the appointment form. For further inquiries, please contact us at enquiry@vitrox.com. 

Tracking devices play a critical role in the Internet of Things (IoT) by enabling real-time monitoring and data collection across various industries. As IoT applications expand, the demand for energy-efficient solutions becomes increasingly important. This article explores the rise of battery-efficient tracking devices and their transformative impact on IoT ecosystems.Advancements in Tracking DevicesTracking devices first emerged with the advent of GPS technology, revolutionizing location-based services. Early applications were limited, but as the Internet of Things (IoT) grew, tracking devices expanded into sectors like logistics, agriculture, and personal safety, offering real-time monitoring.However, traditional devices faced challenges like short battery life and high maintenance costs. To address these issues, advancements in energy-efficient technologies, such as low-power wireless communication and optimized sensors, led to the development of battery-efficient models. These innovations have paved the way for longer-lasting and cost-effective tracking devices that are essential for the expanding IoT landscape.How Battery-Efficient Technology WorksBattery-efficient tracking devices use low-power wireless technologies like LoRaWAN, NB-IoT, and Bluetooth Low Energy (BLE) to enable long-range communication with minimal power consumption. Sleep modes, energy harvesting techniques (such as solar or kinetic energy), and ultra-low-power processors help extend battery life.Advances in sensor technology allow these devices to collect accurate data while consuming less energy. For example, a GPS trailer tracking uses these technologies to provide long-lasting performance to ensure reliable location tracking without frequent recharging. This makes it ideal for industries like logistics that require continuous monitoring with energy-efficient solutions.Impact on IndustriesBattery-efficient tracking devices have a significant impact across various industries:In logistics and fleet management, they reduce maintenance costs and extend tracking durations for vehicles.In agriculture, smart farming solutions leverage these devices to monitor livestock and machinery with minimal energy consumption.Personal safety benefits from wearable devices that track health and location, requiring less frequent charging.Additionally, the environmental impact of these devices is profound, as longer-lasting batteries help reduce waste and the environmental concerns associated with battery disposal.Benefits Over Traditional Tracking DevicesBattery-efficient tracking devices offer several key advantages over traditional models. Longer operational life is a major benefit, as these devices can run for months or even years on a single charge, reducing the need for frequent recharging or battery replacements. This is especially valuable in remote or hard-to-reach locations.Additionally, reduced maintenance requirements lower operational disruptions, as there’s less need for battery changes or regular maintenance. Lower operational costs are another advantage, with businesses saving on battery replacements and charging infrastructure.Lastly, increased accessibility and scalability enable businesses to deploy more devices across large-scale operations, such as fleet management or asset tracking, without incurring high costs. These benefits make battery-efficient tracking devices an essential solution for industries looking to optimize their IoT networks and reduce long-term costs while enhancing operational efficiency.EndnoteBattery-efficient tracking devices are playing an important role in making IoT systems more sustainable and practical. As technology continues to improve, these devices will become even more integrated into various industries, helping to streamline operations and reduce energy consumption. The ongoing development in this area promises a future where tracking solutions are efficient and cost-effective. 

Amidst the reality of global oil prices continuously skyrocketing due to war, the global market is facing the formidable challenges posed by the turbulence impacting the global economy in 2026. Major Taiwanese electronics manufacturers and supply chains are pivoting to review comprehensive AI strategies. They are adopting a particularly aggressive stance in their strategic deployment of cloud server systems and AI infrastructure, aiming to achieve an operational breakthrough where the market outlook remains far from optimistic.ASUS unveils its complete Professional Services for Sovereign AI. Since the first project in 2018, which resulted in Taiwan's first AI supercomputer, Taiwania 2, ASUS has been actively developing sovereign AI infrastructure and providing customized AI solutions to clients. Delivering trusted AI with total flexibility, from rack-scale AI Factories, desktop AI supercomputing, Edge AI to Enterprise AI solutions deployment, the company is redefining Sovereign AI Solutions with reinforces the company's position as a global leader in AI-driven digital transformation.On April 1, 2026, ASUS joins the DIGITIMES online seminar titled "Leading the Way in Sovereign AI: A Look at Next-Generation AI Computing and Storage Architecture from Supercomputing Performance". This event starts with the construction and practical application of next-generation supercomputers at the National Center for High-Performance Computing (NCHC) of the National Applied Research Laboratories. This collaborative project shows ASUS Powering NCHC to building Taiwan's AI Supercomputer and the next generation of High Performance Computing (HPC) systems.As AI and high HPC workloads push compute density and power consumption beyond the capabilities of traditional air cooling, the flagship ASUS offerings are the ASUS AI POD systems redefining the new architecture of rack-scale powerhouse, storage architecture, and liquid cooling designed for massive AI workloads. This momentum will continue to maximize computing power density through the NVIDIA HGXTM and Blackwell platforms and provide insights into solving heat dissipation bottlenecks with advanced liquid cooling technology to meet the performance and energy efficiency requirements of high-computing environments.Practical experience in building a leading infrastructure in Taiwan High Performance ComputingThe first session features a keynote lecture by Nobel Hsia, ASUS Deputy Manager of Product Planning, titled "Leading the Sovereign AI Wave: From the National Center for High-performance Computing (NCHC) projects to ASUS's Forward-Looking Infrastructure and Storage Solutions." ASUS's Sovereign AI targets the business opportunities that countries are currently striving to play the vital role of innovation in securing data sovereignty and security with in-house data processing and computing capabilities, and promotes the transformation of scientific research in the industry. ASUS has partnered with NVIDIA to build a massive AI supercomputer system with an "ALL IN on AI" strategy. Through the maximum computing power density provided by the NVIDIA HGXTM and Blackwell platforms, ASUS has deployed complete portfolio ranging from rack-scale AI factories to edge and enterprise deployment. With its proven track record of successfully supplying AI infrastructure at the B300 and GB300 levels in the market, ASUS has become a trusted partner, providing complete end-to-end solutions.It is worth mentioning that ASUS has ten years of experience collaborating with the National Center for High-performance Computing on supercomputer projects. ASUS's sovereign AI expertise is proven by several successful national-level AI project deployments, including flagship supercomputing initiatives such as Taiwania 2 and Forerunner 1, cementing its leadership in high-performance computing and AI systems. Through ASUS Professional Services, the collaboration covers all aspects from design, deployment to operation.The latest Nano4 (Crystal 26) NVIDIA HGXTM H200 cluster AI server system was to build a next-generation AI supercomputer capable of handling complex large language models (LLMs), deep learning, and advanced HPC workloads. In this new project ASUS has built Taiwan's first AI supercomputer project based on NVIDIA GB200 NVL72 system architecture with direct-cooling technology. The engineering team has played an important role in the delivery of the servers, the planning of large-scale computing architecture, deployment and optimization, which has become the foundation for ASUS to expand its overseas AI deployment and demonstrate ASUS's ability to build computing power from national to international levels.Opening Agentic AI Frontier: ASUS Supports NVIDIA Vera Rubin Platform and InfrastructureIn response to the advent of the new-generation NVIDIA Vera Rubin platform and its accompanying infrastructure architecture, ASUS has developed the next-generation ASUS AI POD highlighting a proficiency in liquid-cooled AI solution. Spanning the new design from rack-scale AI factories, data center servers to desktop workstations and edge AI devices, this solution delivers end-to-end AI computing power and infrastructure, specifically targeting trillion-parameter models and million-token contexts, maximizing efficiency across power, memory, and compute.Hsia began by introducing the ASUS flagship XA VR721-E3 architecture. This system supports the NVIDIA Vera Rubin NVL72 platforms; it is purpose-built for large-scale AI model inference and training to deliver massive AI performance for large-scale AI factories. while also accommodating the specific workloads required for agentic AI. Designed as a 100% liquid-cooled, rack-scale system, it features a Thermal Design Power (TDP) reaching up to 227 kW, which is a capability that fully satisfies the demand for the immense performance required to compute AI models with trillions of parameters.Furthermore, addressing rigorous enterprise-grade data-center demands, ASUS has simultaneously launched the XA NR series. These product series support the NVIDIA HGXTM Rubin NVL8 architecture, featuring eight Rubin GPUs interconnected via the sixth-generation NVLink, which each GPU could deliver a maximum bandwidth of 800 GB/s. To facilitate a seamless and cost-effective transition to liquid cooling, ASUS offers two distinct solutions: the XA NR1I-E12L, an innovative hybrid-cooled option; and the XA NR1I-E12LR, a 100% liquid-cooled system.To support these powerful systems and democratize AI development, ASUS also has established a robust data ecosystem by partnering with NVIDIA-Certified storage providers. The storage solutions offers the technologies such as JBOD, DPDK, and Object Storage, thereby delivering scalable, resilient solutions for memory-intensive AI applications to support robust capabilities for the integrated storage and operational management.On the software front, ASUS provides a suite of one-stop platforms. Leveraging the ASUS Infrastructure Deployment Center (AIDC), ASUS automated the setup process including ACC (ASUS Control Center) and BMC, accelerating time-to-market for critical research resources. To address the full spectrum of requirements for system construction, deployment, and operations, ASUS provides expert consultation, a broad portfolio of tailor-made AI solution while simultaneously catering to the comprehensive lifecycle management needs of the entire data center.WEKA data storage platform is redefining AI storage economicsTo meet the elastic data storage requirements of AI workloads across diverse usage scenarios, ASUS's AI POD system incorporates a comprehensive storage solution featuring a high-speed, All-Flash NVMe SSD storage architecture. ASUS has collaborated with its ecosystem partners to develop a next-generation unified storage system with high-reliability storage servers and professional validation of network. WEKA, the AI storage company, is one of partners providing high-performance, software-defined storage for GPU-accelerated AI and HPC environments, combining low latency with unified data management.In the second presentation of the session is delivered by Ray Wu, Senior Consultant for the Asia-Pacific region at WEKA. His speech titled the theme "Ultimate Data Empowerment: How WEKA Helps NCHC Build an AI-Accelerated Computing Storage Architecture". To address NCHC's requirements for extreme performance and energy efficiency, Wu highlighted the unified data management solutions to provide rapid scalability, which emphasizing flexibility and intelligent adaptive capabilities, and effectively addressing the demands of a wide array of usage scenarios.Addressing the requirements of diverse application environments such as Kubernetes and Slurm in NCHC Nano4, WEKA serves as the high-performance storage foundation through its efficient storage platform. Based on the NVIDIA AI Data Platform reference architecture, the solution employs an end-to-end system to accelerate data processing performance for HPC applications. This assists the NCHC in optimizing the deployment of high-efficiency AI computing, dramatically reducing the time required for AI application deployment and development from months to mere minutes.This ASUS WEKA storage solutions demonstrates the NCHC's technical excellence in leveraging its ecosystem and integrated services to rapidly deliver the low-latency, scalable and high throughput required capabilities and swiftly support the next generation of agent-based AI applications. WEKA solutions empower enterprises to transition from experimentation to full-scale operations, rendering AI applications economically viable and maximizing performance across a wide spectrum of fields, ranging from next-generation AI agent systems to AI-enabled healthcare applications.In this event, ASUS showcases fully liquid-cooled AI infrastructure with the critical thermal management required for the next-generation NVIDIA Vera Rubin NVL72 system platform. By efficiently dissipating heat from high-performance CPUs, GPUs, and accelerator-dense racks, ASUS significantly reduces energy consumption while supporting unprecedented rack density to enable enterprises and cloud service providers to build high-performance, energy-efficient large-scale AI clusters with unmatched efficiency and dramatically reduced PUE and TCO.【White paper download】Empowering Scalable AI Reasoning with ASUS AI POD featuring【Webinar on-demand】Bridging NCHC Success to NVIDIA Vera Rubin Architecture 

HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable again after use, as well as manage the packaging logistics of high-quality industrial products. They do so for clients in the semiconductor and other high-tech industries. The process procedures and packaging solutions ensure the parts, modules or components of highly sophisticated equipment are fully protected during transportation and logistical arrangements. And at the same time, the system will meet the customer demand for protection of valuable products during transit while adhering to environmental, social, and governance (ESG) principles. The packaging design incorporates features like sustainable materials, waste reduction strategies, and carbon footprint minimization, alongside ensuring the integrity of high-value goods through robust physical protection. The company provides complete packaging solutions, starting with the development and sourcing of customized packaging materials. HQ Pack's regional Service Centers ensure that reusable packaging materials are ready to use again by cleaning and repairing them to like-new condition. They can also support reuse of parts by harvesting them before scrapping for new build packaging. If there is material destined for waste management, HQ Pack supports this at the same time.Because most of its high-tech clients operate on a global scale, HQ Pack operates not only at its headquarters in Eindhoven, the Netherlands, but also in Johor and Penang in Malaysia, Taiwan, Singapore, Germany, and in the United States (locations in Brookfield (CT), Newark (CA), and San Diego (CA)) providing the same quality and service at each location. With their Service Centers they support both their customers' sustainability goals as well as their own. Their slogan "We Create to Protect" is exactly what they do. The high-quality packaging solutions ensure that valuable and fragile products, modules, components and/or parts can be safely transported worldwide. With over 40 years of experience and global presence, no compromission on quality, flexibility at the heart of our organization, they are a full-service provider with fast, reliable and sustainable packaging solutions.

DigiKey, has introduced an industry-power supply configuration tool, which simplifies the process of designing power supply solutions.Developed for engineers, designers, and system integrators, this intuitive online tool enables the quick selection of key attributes - such as outputs, voltage, current and more - to generate a tailored power supply solution that meets users’ desired requirements. Once configured, the custom power supply is assembled and shipped directly within days. Hosted on DigiKey's trusted, high-performance website, the configurator enables fast and accurate selection and sourcing - making it easier than ever to design, customize and order the right power solution for the project."DigiKey is thrilled to offer this industry-first tool that allows our customers to configure their own power supply independently," said Heather Fulara, senior director, interconnect and electromechanical for DigiKey. It dramatically reduces the time it takes to acquire a configured unit, which allows for more efficient workflows, saving time and accelerating design.The tool available from DigiKey currently features the NEVO+ and VCCM series from Vox Power, which is the first supplier involved in the program."Vox Power is proud to collaborate with DigiKey as the first supplier to participate in this innovative, time-saving tool," said Marco Prinsloo, co-owner of Vox Power. "We trust DigiKey's expertise in making our customers' designs come together seamlessly through its efficient online design and customization options."