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NEWS TAGGED HBM
Tuesday 30 June 2026
Commentary: AI memory boom rewrites chip pricing power, leaving Apple searching for leverage with CXMT

For more than a decade, Apple built one of the industry's most profitable business models by using its purchasing power to drive down...

Tuesday 30 June 2026
SK Hynix accelerates Yongin fab timeline by 12 years as HBM strains memory capacity
SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 ​billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster...
Tuesday 30 June 2026
AI super cycle lifts semiconductors, but China chip group warns of a distorted boom

AI has pushed the global semiconductor industry into a new "super cycle," but the AI boom is also creating distorted demand, tighter...

Tuesday 30 June 2026
DRAM price surge tests South Korean memory makers' HBM4 push

Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory,...

Tuesday 30 June 2026
Commentary: Behind Micron's bet for long memory demand cycles
Micron's latest earnings call pointed to a broader AI shift that could reshape memory demand far beyond data centers, with investors taking note of the company's comments on robots,...
Monday 29 June 2026
BOE's military designation hands South Korean panel makers a strategic opening

The US government's move to add Chinese panel makers BOE and Tianma to a military-related list is raising concerns that Washington's...

Monday 29 June 2026
Samsung could become HBM market share leader in 2027
Samsung Electronics could overtake SK Hynix in the global high-bandwidth memory (HBM) market in 2027, driven by the competitive edge of HBM4, the sixth generation of HBM. Market watchers...
Monday 29 June 2026
SK Hynix sets up new strategy unit as HBM race intensifies
South Korean media report that SK Hynix has created a new memory strategy organization, a "Growth Strategy Department," to map out next-generation semiconductor strategy. The move...
Saturday 27 June 2026
JCET's US$1.1bn expansion shows where China's AI chip crunch is moving

China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic...

Saturday 27 June 2026
Hanmi targets advanced packaging market with FC Bonder 3.5

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...

Friday 26 June 2026
Qualcomm HBC takes aim at HBM costs in AI data centers

Qualcomm has unveiled its latest AI data center platform, Dragonfly, at its annual investor day, highlighting a new technology it calls...

Thursday 25 June 2026
Samsung chairman reviews HBM4 supply as revenue tops US$1 billion

Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations,...

Thursday 25 June 2026
Commentary: Micron turns AI memory crunch into a buyback story
Micron Technology is turning the AI memory boom into a new Wall Street story: not just record DRAM, NAND and HBM demand, but stronger free cash flow, long-term customer commitments...
Thursday 25 June 2026
SK Hynix eyes record Nasdaq ADR to fund AI memory expansion

SK Hynix said on June 24 its board approved a plan to issue new shares backing American Depositary Receipts on the Nasdaq Global Select...

Wednesday 24 June 2026
SK Hynix reportedly eases HBM4 push as commodity DRAM margins surge

SK Hynix is reportedly easing the pace of some HBM4 production conversions and redirecting more attention toward commodity DRAM, as a...