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NEWS TAGGED HBM
Thursday 1 October 2026
Charts: Micron earns its best margins from PCs, phones, not AI
Micron's best margins aren't coming from AI data centers. They come from PCs and smartphones, markets where Micron warns that unit sales could fall.
Thursday 1 October 2026
Micron hikes 2027 HBM prices after missing 2026 memory surge on fixed contracts
Micron Technology has sharply raised 2027 prices for high-bandwidth memory (HBM), the stacked DRAM packaged with AI accelerators. The increase comes after a year in which fixed contract...
Thursday 1 October 2026
Applied Materials' EPIC Center adds Kioxia for AI memory, 3D stacking push
Applied Materials announced that Kioxia will join its Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley, California. The two companies will collaborate...
Thursday 1 October 2026
Micron's record quarter rests on pricing power as customers lock in 2027 supply
Micron Technology's fiscal fourth quarter showed a memory maker whose growth now comes mainly from price rather than volume, with customers committing cash years in advance to secure...
Thursday 1 October 2026
Samsung Foundry gets boost from HBM4 as 2nm push continues
Samsung Electronics' HBM4 ramp is giving its foundry business a timely boost, as rising demand for the memory product translates into more work for the company's 4nm logic lines.
Wednesday 30 September 2026
Netlist challenges Micron, Nvidia, Broadcom, Google over alleged HBM patent use
Netlist has begun legal proceedings against Micron and downstream customers Nvidia, Broadcom, and Google to stop them from allegedly using the company's patented high-bandwidth memory...
Wednesday 30 September 2026
Column: Memory and logic collide as AI shifts the balance
As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge...
Wednesday 30 September 2026
Commentary: What risks does China's DRAM capacity face amid tightening market?
China's continued expansion of DRAM capacity has raised a key question for the global memory market: will supply and demand flip?
Tuesday 29 September 2026
CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and additional back-end DRAM testing capacity, stepping up...
Tuesday 29 September 2026
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding...
Tuesday 29 September 2026
Samsung bonus plan to lift South Korea talent race

Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance...

Tuesday 29 September 2026
SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

Tuesday 29 September 2026
HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5
High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate...
Tuesday 29 September 2026
IDC says AI agent growth will widen global compute shortage by 2027

AI agents are moving into enterprise workflows and driving a sharp rise in demand for AI infrastructure, with a new report from IDC...

Monday 28 September 2026
South Korea's HBM-linked exports surge as Taiwan, Malaysia emerge as high-value destinations

South Korea's exports of the customs category that carries high-bandwidth memory (HBM) are no longer a two-destination story. Unit-value...