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    SK Hynix moves cooling directly to D2D PHY to tackle rising HBM heat challenges
    1min ago
    China pushes homegrown AI stack with local chips, LLMs
    16min ago
    Taiwan's quantum research enters second phase, eyeing Finland for HPQC collab
    16min ago
    Intel CEO Lip-Bu Tan Taiwan-bound for closed-door meetings ahead of Computex
    19min ago
    Taiwan MLCC makers plug into AI server demand
    33min ago
    Wingtech sues Nexperia for US$1.2B as it fights delisting risk
    34min ago
    Commentary: Stellantis is funding America's car future — and China may be the one building Europe's
    May 25, 19:07
    GlobalWafers : Asian capacity is full; Texas ramp-up and square wafer shipments in 4Q26
    May 25, 19:07
    Samsung to shift P4 output toward HBM, tightening DRAM supply
    May 25, 19:07
    NEWS TAGGED HBM
    Tuesday 26 May 2026
    SK hynix unveils 'iHBM' thermal solution to boost AI performance

    SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs) within the high-bandwidth...

    Monday 25 May 2026
    Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
    Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...
    Monday 25 May 2026
    Samsung Electro-Mechanics secures large silicon capacitor supply contract
    Samsung Electro-Mechanics (Semco)'s KRW1.5 trillion (approx. US$990 million) silicon capacitor supply contract with a major global company could reshape component supply for AI servers,...
    Saturday 23 May 2026
    SK Hynix weighs opening Seoul office at SK Group headquarters

    SK Hynix is reportedly considering opening a Seoul office and sales operation inside SK Group's Seorin Building in Jongno, Seoul, a symbolic...

    Thursday 21 May 2026
    AI chip boom strains ABF substrate supply chain
    AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used...
    Thursday 21 May 2026
    SK Hynix reportedly shifts Cheongju mask fab toward HBM yield push
    SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the...
    Monday 18 May 2026
    Samsung reportedly boosts 1b DRAM yields as Korean memory rivalry heats up
    Samsung Electronics has significantly improved yields for its latest DRAM technologies used in high-bandwidth memory (HBM), according to IT Chosun, underscoring the intensifying...
    Monday 18 May 2026
    TSMC CoWoS yields top 98% as capacity expands
    Following its North America technology forum, TSMC held the Hsinchu session on May 14, 2026. The company said the smart revolution is beginning, with AI evolving from generative AI...
    Sunday 17 May 2026
    Taiwan chipmakers quietly fill gaps left by Korea's HBM push
    Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology...
    Thursday 14 May 2026
    TSMC SVP: better AI days lie ahead, remember the keyword 'COUPE'
    Taiwan Semiconductor Manufacturing Co. (TSMC) used its 2026 Technology Forum on May 14 to outline a sweeping view of the AI-driven transformation in semiconductors. Co-COO and senior...
    Thursday 14 May 2026
    Samsung reportedly speeds up 3D NAND, packaging, and substrate plans
    Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates —...
    Thursday 14 May 2026
    Samsung and SK Hynix rush to expand capacity as AI memory demand soars
    The artificial intelligence(AI) boom is triggering an unprecedented expansion race among the world's largest memory chipmakers.
    Tuesday 12 May 2026
    TSMC CoWoS shortage drives SK Hynix-Intel 2.5D push
    TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI acceler...
    Monday 11 May 2026
    Samsung strike threat puts memory output at risk as 18-day walkout looms
    A planned 18-day strike at Samsung Electronics is shifting investor attention from labor negotiations to the risk of memory-output disruption, as estimates from Korean media point...
    Monday 11 May 2026
    Memory bottlenecks threaten data-center GPU efficiency as AI inference scales, says Micron SVP
    Micron's senior vice president, Jeremy Werner, told The Circuit Podcast that memory has become a strategic bottleneck for data-center inference, warning that insufficient memory can...
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    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook