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NEWS TAGGED HBM
Tuesday 21 July 2026
Memory shortage could turn into a glut by 2028 as chipmakers expand

A powerful rally in memory-chip stocks has stalled as investors reconsider whether record spending on AI data centers could eventually...

Tuesday 21 July 2026
Electronics Supply Chain Outlook: Where H2 2026 Momentum Is Heading

Six months into 2026, the story isn't whether the electronics supply chain has stabilized. It has, broadly. The real story is that it has split into two distinct markets...

Tuesday 21 July 2026
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels

Samsung Electronics and SK Hynix are reportedly allocating additional or flexible DRAM production capacity to server DDR5 and other...

Tuesday 21 July 2026
Samsung could overtake SK Hynix in the HBM market by 2027
Samsung Electronics could overtake SK Hynix to lead the global high-bandwidth memory market in 2027 as shipments of HBM4 expand, according to forecasts from UBS cited by Money...
Tuesday 21 July 2026
Zeiss accelerates push into AI chip advanced packaging, CPO

Zeiss is moving into a new AI chip battleground as advanced packaging and silicon photonics rise on the back of chiplet-based architectures,...

Monday 20 July 2026
HBM4 battle shifts to cooling as hybrid bonding slips
Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major...
Monday 20 July 2026
Commentary: China's DRAM comes of age with CXMT's IPO — but a trio of hurdles remains

CXMT's STAR Market IPO marks a coming-of-age moment for China's DRAM industry, but the listing is only the beginning. Having proved...

Monday 20 July 2026
Samsung preps multi-billion-dollar P5 orders as AI boom speeds up memory demand

Samsung Electronics' latest multi-billion-dollar equipment procurement reflects the company's accelerating investment in AI memory...

Monday 20 July 2026
Weekly news roundup: AI chip race widens across silicon photonics, HBM, memory fabs, and frontier models

AI competition is widening from chips to connectivity, memory, talent, patents, and model access,...

Monday 20 July 2026
Nvidia shrugs off HBM shortage, bets on AI infrastructure to sustain explosive growth
Nvidia CEO Jensen Huang has delivered a clear message ahead of his trip to Japan: the chipmaker's growth is still accelerating, even with quarterly revenue approaching US$100 billi...
Monday 20 July 2026
Micron's 10-year deal with GlobalWafers signals tighter 12-inch supply

Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon...

Monday 20 July 2026
Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms
South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that...
Saturday 18 July 2026
JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift
As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...
Friday 17 July 2026
China's DRAM milestone arrives with CXMT IPO; HBM now separates contenders from leaders

ChangXin Memory Technologies (CXMT) opened subscriptions for its STAR Market IPO on July 16, launching one of China's largest A-share listings...

Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.