Samsung Electronics is reportedly considering repurposing the second line at its next-generation semiconductor R&D complex in Giheung...

High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...

South Korea's Hanmi Semiconductor is pulling ahead of rival Hanwha Semitech in thermal compression (TC) bonders for high-bandwidth memory...

Samsung Electronics' production yield for its sixth-generation high-bandwidth memory, HBM4, has reportedly approached 80%, marking a...

Memory chips account for roughly 62% of the cost of Nvidia's next-generation AI platform, Vera Rubin, according to a new cost breakdown...

Samsung Electronics is betting on new 3D memory architectures and tighter processor-memory integration as AI workloads put growing pressure...

Samsung Electronics has reportedly pushed the production yield of its sixth-generation high-bandwidth memory (HBM4) close to 80%, marking...

SK Hynix is facing an expanding US patent dispute with MonolithIC 3D. A second US International Trade Commission (USITC) investigation...