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NEWS TAGGED HBM
Wednesday 8 July 2026
Samsung's Jae-yong Lee heads to Sun Valley Conference for likely AI talks

Samsung Electronics Chairman Jae-yong Lee departed for the Sun Valley Conference in the US on July 7, marking his second straight year...

Wednesday 8 July 2026
AI memory boom turns price hikes into antitrust flashpoint across supply chain
As AI demand drives record price increases in the memory market, the aftermath of such volatility is weighing on the wider supply chain, rippling into downstream industries where manufacturers...
Wednesday 8 July 2026
Samsung widens Nvidia Vera Rubin memory play with PCIe 6.0 eSSD

Samsung Electronics has started mass production of its PM1763 enterprise SSD, a PCIe 6.0-based drive built for AI infrastructure and slated...

Wednesday 8 July 2026
Samsung's HBM4 comeback hinges on one chip-level advantage

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...

Wednesday 8 July 2026
Apple tests CXMT DRAM, thrusting China's memory champion into AI spotlight

China's CXMT has moved from a little-known state-backed DRAM maker to one of the most closely watched companies in the global memory...

Wednesday 8 July 2026
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor...
Monday 6 July 2026
Samsung, SK Hynix and Micron face HBM4 race as custom chip demand grows

The global high-bandwidth memory market is expected to pivot from HBM3E to HBM4 in the second half of 2026, setting up a sharper contest...

Monday 6 July 2026
LG Chem begins first mass supply of semiconductor strippers to Amkor

LG Chem has begun supplying semiconductor strippers to Amkor Technology, a major US-based packaging and testing provider, in its first...

Monday 6 July 2026
Samsung said to seek up to 20% DRAM price hike as AI demand tightens supply

Samsung Electronics is negotiating with customers to raise average selling prices for commodity DRAM by as much as 20% in the third...

Monday 6 July 2026
Micron breaks ground on Hiroshima expansion to boost AI memory chip production
Micron Technology has begun construction on an expansion of its existing semiconductor plant in Higashi-Hiroshima, western Japan, as part of a JPY1.5 trillion (approx. US$9.3 billion)...
Sunday 5 July 2026
Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM,...
Friday 3 July 2026
Global server demand is set to stay strong through 2027 as supply chain pressure widens

Global server demand is expected to stay strong through 2027, with implications for cloud operators, hardware makers, and data center...

Friday 3 July 2026
Samsung escalates South Korea buildout: maps fresh US$90 billion chip, display, battery push in central region

Samsung Group detailed plans on July 2 to invest KRW140 trillion (US$90 billion) in display panels, batteries, chips, and chip materials...

Friday 3 July 2026
Samsung's HBM4E yield tops 70%, sharpening AI memory race with SK Hynix and Micron
Samsung Electronics is moving closer to commercialising HBM4E, its seventh-generation high-bandwidth memory (HBM), after internal testing showed reliability yields above 70%, strengthening...
Thursday 2 July 2026
Memory price relief for PC brands is expected to be temporary

Memory suppliers are renegotiating high-bandwidth memory contracts, and PC brands say price increases may slow later this year. For...