CONNECT WITH US
NEWS TAGGED HBM
Thursday 20 August 2026
Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September
Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea,...
Thursday 20 August 2026
Intel Malaysia packaging expansion draws HBM flows from Taiwan

South Korean export data showed a sharp shift in high-bandwidth memory, or HBM, shipments toward Malaysia and away from Taiwan, according...

Wednesday 19 August 2026
SK Hynix to cancel record KRW40tn in shares, signalling confidence in a long AI memory cycle

SK hynix said on August 19 that its board had approved a plan to repurchase and cancel KRW40 trillion (roughly US$29 billion) of its...

Wednesday 19 August 2026
Hanmi Semiconductor scales up bonding capacity with US$91.4 million plant buy amid AI packaging boom

Amid a global shortage of AI semiconductor equipment, Hanmi Semiconductor announced on August 18 that it will acquire a factory owned...

Tuesday 18 August 2026
Samsung faces tougher HBM4E test after HBM4 comeback

Samsung Electronics' semiconductor chief has told executives not to treat the company's HBM4 comeback as proof that its recovery is...

Monday 17 August 2026
Samsung's China sales surge 272% in 1H26; Nvidia not among top five customers

Samsung Electronics' consolidated sales in China surged 272% in the first half of 2026, far outpacing growth in the Americas as a sharp...

Monday 17 August 2026
AMD eyes Taalas: will the system ditch HBM, advanced packaging, 3D stacking?
The AI compute landscape was jolted in February 2026 by Taalas, a Canadian startup founded by former AMD and NVIDIA architect Ljubisa Bajic. Emerging with an unconventional "Model-Based"...
Monday 17 August 2026
Samsung weighs Giheung R&D line for 2nm HBM foundry capacity

Samsung Electronics is reportedly considering repurposing the second line at its next-generation semiconductor R&D complex in Giheung...

Saturday 15 August 2026
Gelsinger calls HBM 'lousy', SK Hynix says it's not memory's final answer

High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...

Friday 14 August 2026
Samsung weighs moving legacy memory backend work to Vietnam to free up capacity for HBM
Samsung Electronics may move part of the general-purpose DRAM and NAND packaging and testing now handled at its Cheonan and Onyang sites in South Korea to Vietnam, potentially freeing...
Friday 14 August 2026
SK Hynix looks beyond memory with new global growth team
SK Hynix has set up a dedicated team to search for growth opportunities beyond its core memory business and has put a senior group executive in charge, a move aimed at turning the...
Thursday 13 August 2026
Hanmi pulls ahead of Hanwha as HBM4 orders rebound

South Korea's Hanmi Semiconductor is pulling ahead of rival Hanwha Semitech in thermal compression (TC) bonders for high-bandwidth memory...

Wednesday 12 August 2026
Samsung HBM4 yield nears 80% in push to rival SK Hynix

Samsung Electronics' production yield for its sixth-generation high-bandwidth memory, HBM4, has reportedly approached 80%, marking a...

Tuesday 11 August 2026
Memory drives 62% of Nvidia Vera Rubin's cost — SOCAMM2, not HBM4, leads the bill

Memory chips account for roughly 62% of the cost of Nvidia's next-generation AI platform, Vera Rubin, according to a new cost breakdown...

Tuesday 11 August 2026
Samsung tackles AI memory wall with zHBM, V10 BV-NAND concepts

Samsung Electronics is betting on new 3D memory architectures and tighter processor-memory integration as AI workloads put growing pressure...