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Thursday 16 April 2026
Samsung targets May HBM4E samples for Nvidia after validation

Samsung Electronics is aiming to produce its first samples of next-generation high-bandwidth memory (HBM4E) as early as May, with plans...

Wednesday 15 April 2026
SK Hynix may cut Nvidia HBM4 shipments as Rubin ramp reportedly faces delays

SK Hynix is reportedly considering reducing its planned 2026 shipments of high-bandwidth memory (HBM4) to Nvidia by about 20-30%, amid...

Wednesday 15 April 2026
Samsung tipped to lead global chip profits as AI elevates memory, veteran exec predicts
Yoon-woo Lee, a semiconductor expert and former vice chairman of Samsung Electronics, believes Samsung may become the world's most profitable company by 2027–2028, driven by...
Tuesday 14 April 2026
DDR5 dethrones HBM as memory's top profit engine
The AI boom has reshuffled memory industry priorities. DDR5 modules have overtaken high-bandwidth memory (HBM) as the primary profit source for manufacturers — a reversal few...
Monday 13 April 2026
Qualcomm moves into custom DRAM with CXMT for smartphones
Qualcomm is reportedly exploring a partnership with China's Changxin Memory Technologies (CXMT) to develop custom DRAM tailored for smartphones, a move that reflects mounting pressure...
Friday 10 April 2026
SK Hynix M15X reportedly ramps early production
SK Hynix's M15X is widely viewed as the company's next-generation DRAM manufacturing hub in Cheongju, South Korea. Designed primarily to support high-bandwidth memory (HBM) output...
Friday 10 April 2026
CXMT targets 12-layer HBM production by 2027, closing gap with Korea
China's largest memory maker CXMT is targeting mass production of 12-layer high-bandwidth memory (HBM) by 2027, positioning itself to challenge mainstream specifications long dominated...
Thursday 9 April 2026
Samsung, SK Hynix pivot to long-term memory deals; Kioxia signals dividend confidence

Samsung Electronics and SK Hynix are reportedly shifting to multi-year memory supply agreements, marking a structural change in how the...

Thursday 9 April 2026
CXMT IPO delay eases DRAM supply risks, supports pricing cycle
China's DRAM maker ChangXin Memory Technologies (CXMT) may be delaying its IPO, easing near-term supply concerns, and reinforcing the current memory upcycle. Sources cited by iNews24...
Monday 6 April 2026
China 2.5D packaging demand surges, supporting Korean backend equipment growth
China's semiconductor equipment market is emerging as a critical growth engine for South Korean suppliers, driven by accelerating AI deployment and tighter restrictions on US vendors...
Thursday 2 April 2026
Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM

Samsung Electronics and SK Hynix are reportedly stepping up efforts to advance hybrid bonding for next-generation high-bandwidth memory...

Wednesday 1 April 2026
Micron reportedly developing stacked GDDR to address shifting AI memory demand

Micron is reportedly developing vertically stacked graphics DRAM (GDDR) products to address shifting AI memory demand, according to...

Wednesday 1 April 2026
Arm, Tesla chip push reshuffles supply chains, lifts AI memory demand
Global technology and semiconductor companies are moving to build independent chip ecosystems to meet rising artificial intelligence (AI) demand, a shift that stands to reshape semiconductor...
Wednesday 1 April 2026
Commentary: AI efficiency shock rattles memory stocks, tests chip demand narrative
On March 30, US tech stocks fell sharply, with the Philadelphia Semiconductor Index down 4.2%. Memory stocks led the losses: Micron Technology dropped 9.88%, Western Digital fell 8.6%,...
Tuesday 31 March 2026
Nvidia CEO Jensen Huang reframes AI compute as a token-minting revenue machine
Nvidia CEO Jensen Huang said on the Lex Fridman Podcast that computing is undergoing a structural shift — from a "storage system," where data is pre-defined and retrieved, to...