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NEWS TAGGED HBM
Saturday 25 July 2026
SK Hynix and Nvidia strike long-term deal to co-develop next-generation HBM
SK Group and Nvidia have announced a comprehensive partnership valued at more than $500 billion, spanning AI factory construction and next-generation memory supply, with letters of...
Saturday 25 July 2026
Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...
Friday 24 July 2026
Samsung to break ground on Onyang HBM expansion in October, targets 2029 production
Samsung Electronics plans to break ground in October 2026 on a KRW 1.3 trillion (approx. US$884 million) expansion of its Onyang semiconductor packaging site in South Korea, targeting...
Thursday 23 July 2026
Samsung weighs Besi's Korean rivals for 50-bonder hybrid bonding line as pricing talks drag on

Samsung Electronics is preparing a die-to-wafer hybrid bonding production line with about 50 bonders at its Pyeongtaek campus for next-generation...

Thursday 23 July 2026
SK Hynix speeds P&T7 cleanroom rollout, keeps overall budget at KRW19 trillion
SK Hynix's board approved approximately KRW 7.09 trillion (approx. US$4.83 billion) in facility investment on July 22 to accelerate construction of its P&T7 advanced packaging...
Wednesday 22 July 2026
Chinese equipment makers win early production orders as TGV packaging moves beyond the lab

Chinese semiconductor equipment suppliers are beginning to secure production orders for through-glass via (TGV) manufacturing tools,...

Wednesday 22 July 2026
Memory shortage to worsen in 2027 as AI inference strains supply, Silicon Motion CEO says
The global memory shortage will worsen in 2027 and may not begin to ease until the second half of 2028, with prices likely to remain elevated for the next two to three years, according...
Tuesday 21 July 2026
Memory shortage could turn into a glut by 2028 as chipmakers expand

A powerful rally in memory-chip stocks has stalled as investors reconsider whether record spending on AI data centers could eventually...

Tuesday 21 July 2026
Electronics Supply Chain Outlook: Where H2 2026 Momentum Is Heading

Six months into 2026, the story isn't whether the electronics supply chain has stabilized. It has, broadly. The real story is that it has split into two distinct markets...

Tuesday 21 July 2026
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels

Samsung Electronics and SK Hynix are reportedly allocating additional or flexible DRAM production capacity to server DDR5 and other...

Tuesday 21 July 2026
Samsung could overtake SK Hynix in the HBM market by 2027
Samsung Electronics could overtake SK Hynix to lead the global high-bandwidth memory market in 2027 as shipments of HBM4 expand, according to forecasts from UBS cited by Money...
Tuesday 21 July 2026
Zeiss accelerates push into AI chip advanced packaging, CPO

Zeiss is moving into a new AI chip battleground as advanced packaging and silicon photonics rise on the back of chiplet-based architectures,...

Monday 20 July 2026
HBM4 battle shifts to cooling as hybrid bonding slips
Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major...
Monday 20 July 2026
Commentary: China's DRAM comes of age with CXMT's IPO — but a trio of hurdles remains

CXMT's STAR Market IPO marks a coming-of-age moment for China's DRAM industry, but the listing is only the beginning. Having proved...

Monday 20 July 2026
Samsung preps multi-billion-dollar P5 orders as AI boom speeds up memory demand

Samsung Electronics' latest multi-billion-dollar equipment procurement reflects the company's accelerating investment in AI memory...