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    Exclusive: China 6-inch SiC substrate supply tightens, suppliers brace for another price hike
    8h 54min ago
    Intel’s EMIB-T emerges as a backup option as CoWoS capacity tightens
    8h 54min ago
    AUO unit plans to ride synergy gains momentum into entering TSMC ecosystem
    8h 54min ago
    AI buildout lifts demand for China high-speed optical module makers
    8h 54min ago
    SJSemi expands 2.5D packaging to 3.3-reticle size for AI and HPC chips
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    NEWS TAGGED HBM
    Wednesday 2 September 2026
    Sandisk says HBF can match HBM bandwidth with up to 16x the capacity
    Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
    Wednesday 2 September 2026
    Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth
    Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
    Wednesday 2 September 2026
    DRAM giants target 3D stacking to break memory wall and power bottlenecks
    At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
    Wednesday 2 September 2026
    Indium CEO: packaging, cooling and power are next AI bottlenecks
    As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
    Wednesday 2 September 2026
    TSMC reportedly asks suppliers to develop 5μm HBM microbumps
    TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...
    Wednesday 2 September 2026
    Chinese MRAM chipmaker ICY Tech rethinks HBM for rack-scale AI inference
    China-based ICY Tech has introduced its uHBM and uLPU AI inference architectures, extending persistent MRAM computing from validation silicon into a product roadmap spanning compute-memory...
    Wednesday 2 September 2026
    Nvidia pushes into HBM base dies as NVHBM battle heats up
    The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
    Tuesday 1 September 2026
    SK Hynix touts up to 5.15x inference gains with custom HBM

    SK Hynix is pushing computation deeper into high-bandwidth memory (HBM), saying a custom HBM architecture that places compute functions...

    Tuesday 1 September 2026
    Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain
    Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...
    Tuesday 1 September 2026
    Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
    China's leading DRAM maker CXMT has gone from years of accumulated losses to one of the most profitable companies on the mainland market, propelled by an extraordinary memory upcycle...
    Tuesday 1 September 2026
    Samsung locks 70% of memory output as HBM spot prices soar
    Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high...
    Tuesday 1 September 2026
    Commentary: CXMT's HBM3E leap gives China's AI chipmakers a new path to scale
    China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI...
    Tuesday 1 September 2026
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

    As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as...

    Tuesday 1 September 2026
    Nvidia targets HBM race with custom NVHBM, expands NVLink Fusion
    As trillion-parameter large language models (LLMs) and agentic AI become mainstream, the AI infrastructure bottleneck is shifting from raw compute power toward system-level integration...
    Tuesday 1 September 2026
    Samsung weighs HBM4 bonuses as memory, foundry teams align
    Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
    Wednesday 2 September 2026
    Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026
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