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NEWS TAGGED HBM
Friday 3 July 2026
Global server demand is set to stay strong through 2027 as supply chain pressure widens

Global server demand is expected to stay strong through 2027, with implications for cloud operators, hardware makers, and data center...

Friday 3 July 2026
Samsung escalates South Korea buildout: maps fresh US$90 billion chip, display, battery push in central region

Samsung Group detailed plans on July 2 to invest KRW140 trillion (US$90 billion) in display panels, batteries, chips, and chip materials...

Friday 3 July 2026
Samsung's HBM4E yield tops 70%, sharpening AI memory race with SK Hynix and Micron
Samsung Electronics is moving closer to commercialising HBM4E, its seventh-generation high-bandwidth memory (HBM), after internal testing showed reliability yields above 70%, strengthening...
Thursday 2 July 2026
Memory price relief for PC brands is expected to be temporary

Memory suppliers are renegotiating high-bandwidth memory contracts, and PC brands say price increases may slow later this year. For...

Wednesday 1 July 2026
SK Hynix talent hunt targets HBM's next frontiers while drawing Samsung employees' attention

SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than...

Tuesday 30 June 2026
Commentary: AI memory boom rewrites chip pricing power, leaving Apple searching for leverage with CXMT

For more than a decade, Apple built one of the industry's most profitable business models by using its purchasing power to drive down...

Tuesday 30 June 2026
SK Hynix accelerates Yongin fab timeline by 12 years as HBM strains memory capacity
SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 ​billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster...
Tuesday 30 June 2026
AI super cycle lifts semiconductors, but China chip group warns of a distorted boom

AI has pushed the global semiconductor industry into a new "super cycle," but the AI boom is also creating distorted demand, tighter...

Tuesday 30 June 2026
DRAM price surge tests South Korean memory makers' HBM4 push

Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory,...

Tuesday 30 June 2026
Commentary: Behind Micron's bet for long memory demand cycles
Micron's latest earnings call pointed to a broader AI shift that could reshape memory demand far beyond data centers, with investors taking note of the company's comments on robots,...
Monday 29 June 2026
BOE's military designation hands South Korean panel makers a strategic opening

The US government's move to add Chinese panel makers BOE and Tianma to a military-related list is raising concerns that Washington's...

Monday 29 June 2026
Samsung could become HBM market share leader in 2027
Samsung Electronics could overtake SK Hynix in the global high-bandwidth memory (HBM) market in 2027, driven by the competitive edge of HBM4, the sixth generation of HBM. Market watchers...
Monday 29 June 2026
SK Hynix sets up new strategy unit as HBM race intensifies
South Korean media report that SK Hynix has created a new memory strategy organization, a "Growth Strategy Department," to map out next-generation semiconductor strategy. The move...
Saturday 27 June 2026
JCET's US$1.1bn expansion shows where China's AI chip crunch is moving

China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic...

Saturday 27 June 2026
Hanmi targets advanced packaging market with FC Bonder 3.5

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...