News tagged HBM at DIGITIMES

NEWS TAGGED HBM

Tuesday 17 February 2026

Global memory chip shortage reportedly forces Sony PlayStation and other tech launches to delay

A global shortage of memory chips is beginning to reshape product launch timelines across the tech industry, impacting everything from smartphones and laptops to gaming consoles and...

Tuesday 17 February 2026

Samsung accelerates HBM hybrid bonding line to meet Nvidia demand

Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus...

Monday 16 February 2026

RAMmageddon? AI-driven memory shortage sends DRAM prices 'parabolic'

The global memory industry is facing its most severe supply crunch in more than a decade. DRAM and NAND prices are rising at record speed,...

Sunday 15 February 2026

CXMT races to scale up as yield gaps and export curbs bite

CXMT, a leading Chinese DRAM maker, is expanding aggressively but faces significant production and regulatory hurdles, ChosunBiz reported, citing industry sources. Despite...

Saturday 14 February 2026

HBM steals the show at SEMICON Korea despite Samsung, SK Hynix skipping the floor

Artificial intelligence-driven growth in the semiconductor industry has drawn increasing public attention. SEMICON Korea, organized by SEMI, continues to expand in scale. The 2026...

Friday 13 February 2026

Citi flags post-HBM shift as edge memory, HBF advance

A Citi analyst said the next phase of artificial intelligence (AI) memory demand will extend beyond high-bandwidth memory (HBM), pointing to emerging opportunities in physical AI devices...

Friday 13 February 2026

SK Hynix reportedly begins equipment orders for Cheongju HBM packaging line amid AI-driven capacity race

SK Hynix has started placing initial equipment orders to convert an idle Cheongju fab into a high-bandwidth memory (HBM) packaging and testing line, according to ET News,...

Friday 13 February 2026

SEMICON Korea: Samsung pushes hybrid bonding HBM, SK Hynix bets on platform AI

SEMICON Korea 2026, held in Seoul from February 11–13, brought senior executives from Samsung Electronics and SK Hynix to outline their AI-era memory R&D strategies. Samsung...

Thursday 12 February 2026

Global Mixed-Mode's DDR5 PMIC push signals tighter memory supply and margin focus

Global Mixed-Mode Technology said it is expanding its DDR5 power management IC (PMIC) portfolio and prioritizing production for high-bandwidth memory (HBM), while warning that rising...

Thursday 12 February 2026

Micron begins high-volume HBM4 shipments as supply stays tight and capex rises

Micron Technology has begun high-volume production and customer shipments of its next-generation HBM4 memory, ramping volumes earlier than expected amid tight industry supply, CFO...

Thursday 12 February 2026

SEMI: AI and HBM lift 2025 silicon wafer shipments, revenue still dips

Worldwide silicon wafer shipments increased 5.8% in 2025 to 12,973 million square inches (MSI), while wafer revenue declined 1.2% to US$11.4 billion, according to the year-end analysis...

Tuesday 10 February 2026

SK Hynix set to ship HBM4 for Nvidia's Vera Rubin this month

SK Hynix is expected to begin shipments this month of its sixth-generation high-bandwidth memory, HBM4, a high-performance, low-power...

Tuesday 10 February 2026

China reportedly enters HBM3 mass production as South Korea pushes into HBM4

China is preparing to initiate large-scale production of high-bandwidth memory (HBM), narrowing a technology gap with South Korea in a...

Tuesday 10 February 2026

Behind Nvidia’s fried-chicken diplomacy

Nvidia CEO Jensen Huang reportedly hosted a "fried chicken and beer" meeting in Silicon Valley on February 5, 2026, with SK Group chairman Tony Choi, according to industry sources...

Monday 9 February 2026

Can ZAM replace HBM? Intel, SoftBank push 'alternative' memory architecture

As the global AI computing race intensifies, the primary constraint is shifting from GPU architecture to memory physics. HBM capacity remains concentrated among Samsung, SK Hynix,...

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook