中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Commentary: How FCC ban proposal is affecting China’s optical module makers
    Aug 5, 18:36
    Exclusive: Musk builds a US solar supply chain that may extend to polysilicon
    Aug 5, 18:36
    Potenial curbs on Chinese data center optical modules creates opportunities for non-red supply chains
    Aug 5, 18:35
    TSMC expands CoW outsourcing to OSATs, benefiting South Korean equipment makers
    Aug 5, 18:35
    Offshore wind projects face bidding failures as supply chain warns of a market gap
    Aug 5, 18:35
    China's overcapacity curb and US's potential tariffs double squeeze polysilicon supply chain
    Aug 5, 18:33
    NEWS TAGGED HBM
    Wednesday 5 August 2026
    SK Hynix to hold late-August groundbreaking for US$3.9 billion Indiana chip packaging plant
    SK Hynix plans to hold a formal groundbreaking ceremony in late August for its US$3.9 billion advanced chip packaging facility in West Lafayette, Indiana, as the memory maker expands...
    Wednesday 5 August 2026
    FMS 2026 opens with major memory makers present, but CXMT missing from exhibitor list
    FMS 2026 opened in Santa Clara with Samsung, SK Hynix, and Micron highlighting AI memory plans, while China's CXMT was absent from the official roster. The omission is drawing attention...
    Wednesday 5 August 2026
    Samsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026
    Samsung Electronics used the Future of Memory and Storage (FMS) 2026 conference to lay out an AI memory roadmap built around 3D architecture, previewing two concept models —...
    Wednesday 5 August 2026
    Research Insight: Samsung indicates diversification in AI memory demand, LTA reshapes supply
    Samsung Electronics' memory business was the clear focus of its second quarter 2026 earnings call, accounting for about one-third of the Q&A session. DIGITIMES Intelligence said...
    Wednesday 5 August 2026
    Hanwha Semitech expands packaging tools as TCB turns profitable

    South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging...

    Tuesday 4 August 2026
    SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
    SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...
    Tuesday 4 August 2026
    2027 memory capacity reportedly sold out as buyers quietly lock in supply

    Tight memory supply is expected to persist into 2027, with industry sources saying manufacturers have already completed much of their...

    Tuesday 4 August 2026
    CXMT listing fuels concerns over DRAM prices and global memory competition
    China's CXMT drew fresh attention after its parent ChangXin Memory Technology (CXMT) went public, with market estimates of the firm's future valuation ranging from US$160 billion to...
    Friday 31 July 2026
    Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war
    Nvidia CEO Jensen Huang recently appeared alongside SK Group Chairman Chey Tae-won and Samsung Electronics Executive Chairman Lee Jae-yong at a high-profile AI gathering in San Francisco,...
    Thursday 30 July 2026
    Samsung signs five-year memory deals as chip shortage stretches to 2028
    Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing...
    Thursday 30 July 2026
    South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

    Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...

    Thursday 30 July 2026
    South Korean suppliers win HBM4 tester orders from SK Hynix
    South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...
    Thursday 30 July 2026
    Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
    Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
    Thursday 30 July 2026
    Samsung sees tripled HBM4 sales in 3Q26; HBM share to reach parity with DRAM position

    Samsung Electronics expects HBM4 sales to increase more than threefold sequentially in the third quarter of 2026, the company said...

    Thursday 30 July 2026
    Samsung memory sales up 471% in 2Q26; foundry targets double-digit second-half growth

    Samsung Electronics' Device Solutions (DS) division posted the most profitable quarter in its history in 2Q26, generating operating...

    1/38 pages
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
    reportAIglasses