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NEWS TAGGED HBM
Monday 28 September 2026
South Korea's HBM-linked exports surge as Taiwan, Malaysia emerge as high-value destinations

South Korea's exports of the customs category that carries high-bandwidth memory (HBM) are no longer a two-destination story. Unit-value...

Monday 28 September 2026
Weekly news roundup: China gains ground in memory and AI hardware as supply stays tight
China's AI sector is shifting from catch-up to commercialization, with value concentrating in hardware bottlenecks and large platforms rather than independent model labs. Across memory,...
Saturday 26 September 2026
Samsung foundry recovery gains pace, but 2nm, Taylor fab remain hurdles

Samsung Electronics' foundry recovery is gaining pace as higher utilization, firmer pricing, and stronger advanced-node demand improve...

Saturday 26 September 2026
Acer, Phison split on DRAM outlook as PC memory supply eases
Acer and Phison Electronics are offering sharply different readings of the DRAM market as supply conditions improve for mainstream PC memory while AI and server demand keep the broader...
Thursday 24 September 2026
CXMT gains ground in DRAM as Samsung, SK Hynix shift more capacity to HBM
China's ChangXin Memory Technologies (CXMT) is gaining ground in the global DRAM market as Samsung Electronics and SK Hynix allocate more production capacity to high-bandwidth memory...
Thursday 24 September 2026
SK Hynix Indiana HBM plant faces lawsuit

SK Hynix's high-bandwidth memory (HBM) production site under construction in Indiana has been drawn into local litigation as the race...

Tuesday 22 September 2026
Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging
Hanmi Semiconductor said on September 22 that it has shipped its first FC Bonder 75 to a customer, expanding the South Korean equipment maker's reach beyond high-bandwidth memory (HBM)...
Tuesday 22 September 2026
Samsung weighs 4nm expansion as HBM4 demand strains capacity

Samsung Electronics is considering expanding its 4nm foundry capacity as rising HBM4 base-die demand pushes existing capacity to full...

Tuesday 22 September 2026
GUC Announces 2nm 16 Gbps HBM4E IP

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs....

Monday 21 September 2026
Samsung reportedly plans to double HBM4 output in 2027 as memory supply stays tight

Samsung Electronics is reportedly preparing to at least double production of its HBM4-family memory in 2027, accelerating a shift toward...

Saturday 19 September 2026
CXL adds memory capacity, but HBM retains its bandwidth edge

Growing memory requirements are increasing interest in Compute Express Link (CXL) as a way to add capacity beyond locally attached memory...

Friday 18 September 2026
Solidigm weighs first US NAND fab, explores upstate New York

Solidigm, the US NAND flash subsidiary of SK Hynix, is considering building its first NAND manufacturing plant in the US, with upstate...

Friday 18 September 2026
China's memory push gains ground across LPDDR6, advanced NAND, with HBM still the test

AI is reshaping the global memory industry, tightening supply while creating an opening for China's domestic suppliers. With Samsung...

Thursday 17 September 2026
SK Hynix looks beyond HBM as inference workloads diversify
SK Hynix is expanding its memory strategy beyond the conventional GPU-HBM pairing as inference workloads split between latency-sensitive services and capacity-heavy, long-context a...
Thursday 17 September 2026
Samsung bets on zHBM as 2.5D memory nears its limits
Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising...