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    NEWS TAGGED HBM
    Wednesday 26 August 2026
    Samsung, Intel widen AI chip battle into memory, packaging
    Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports...
    Wednesday 26 August 2026
    SK hynix adds second major customer as Nvidia misses Samsung's top five
    SK hynix added a second customer accounting for more than 10% of revenue in the first half of 2026, while Nvidia remained outside Samsung Electronics' five largest customers, highlighting...
    Tuesday 25 August 2026
    Nvidia and SK Hynix CPO strategies diverge as 3D optics look toward a post-2030 horizon
    On August 20, SK Hynix's global research team published a paper in Nature Electronics detailing its co-packaged optics (CPO) development for high-performance computing (HPC)...
    Tuesday 25 August 2026
    Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026
    Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic...
    Monday 24 August 2026
    SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
    Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
    Monday 24 August 2026
    Analysis: SK Hynix pushes beyond HBM with HBF and CPO
    SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
    Monday 24 August 2026
    Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
    Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell,...
    Friday 21 August 2026
    Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
    The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
    Friday 21 August 2026
    Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's
    As South Korea's semiconductor exports continue to power its economic expansion, market concerns are growing regarding the risks of excessive concentration in the tech sector. Recent...
    Friday 21 August 2026
    SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
    SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...
    Friday 21 August 2026
    JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
    JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
    Thursday 20 August 2026
    Samsung gains foundry pricing power as 4nm capacity stays tight through 2027

    Samsung Electronics is gaining pricing power in its foundry business as AI and high-bandwidth memory (HBM) demand tightens advanced-node...

    Thursday 20 August 2026
    SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders
    SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts...
    Thursday 20 August 2026
    Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September
    Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea,...
    Thursday 20 August 2026
    Intel Malaysia packaging expansion draws HBM flows from Taiwan

    South Korean export data showed a sharp shift in high-bandwidth memory, or HBM, shipments toward Malaysia and away from Taiwan, according...

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    GlobalExhibition
    BIZ FOCUS
    Aug 25, 08:00
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
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