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NEWS TAGGED HBM
Friday 23 January 2026
ASML leads chip equipment charge into advanced packaging
Global semiconductor equipment suppliers are accelerating their push into advanced packaging. They are positioning back-end processes as a new growth engine as artificial intelligence...
Friday 23 January 2026
HBF likely overtaking HBM market by 2038 as commercialization speeds up

High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting...

Wednesday 21 January 2026
Research Insight: High-end fiberglass cloth supply tightens as server demand spotlights Nittobo

As next-generation AI server platforms enter volume deployment, supply chain constraints are extending beyond high-bandwidth memory (HBM)...

Wednesday 21 January 2026
Samsung reportedly exploring ASMPT for TCB supply
Samsung Electronics is reportedly diversifying its supply chain for thermal compression bonders (TCB), a critical tool in high-bandwidth memory (HBM) production, by engaging Singapore-based...
Wednesday 21 January 2026
China's semiconductor equipment leaders push HBM autonomy as US tightens restrictions
US export restrictions on advanced semiconductor equipment to China have become the biggest obstacle to China's domestic production of high-bandwidth memory (HBM). It has been reported...
Tuesday 20 January 2026
Samsung Device Solutions eyes 47% bonuses after profit surge

Samsung Electronics on January 16 announced payout ratios for its 2025 excess profit performance incentive, with the Device Solutions...

Monday 19 January 2026
Micron sets 1γ as mainstream node for 2026 as HBM and SOCAMM2 ramp
With shipments of application-specific integrated circuits (ASICs) and XPUs expected to rise sharply in 2026, AI accelerators are set to continue relying on fifth-generation high-bandwidth...
Monday 19 January 2026
Advantest ATE lead times remain tight as AI and memory markets expand
As demand strengthens in markets such as GPUs and high-bandwidth memory (HBM), Japan-based Advantest said orders for semiconductor automated test equipment (ATE) remain stable, with...
Sunday 18 January 2026
SK Hynix accelerates advanced packaging from Korea to Indiana
SK Hynix plans to invest KRW19 trillion, about US$12.9 billion, to build an advanced semiconductor packaging plant in Cheongju, South Korea, as it moves to secure capacity for AI-driven...
Saturday 17 January 2026
Internal memo reveals Micron has locked in PSMC HBM capacity through prepayment

Powerchip Semiconductor Manufacturing Corporation (PSMC) has provided new details on its planned sale of the Tongluo P5 fabrication plant...

Saturday 17 January 2026
Samsung DS rebounds to record KRW20 trillion under new leadership
Samsung Electronics Vice Chairman Jun Young-hyun, since his appointment in May 2024, has spearheaded significant changes at the company's Device Solutions (DS) division, reversing...
Friday 16 January 2026
Phison, Infinitix build enterprise AI infrastructure stack

Demand for high-performance compute and storage for AI training and inference continues to climb. Phison has partnered with AI infrastructure...

Thursday 15 January 2026
SK Hynix accelerates Yongin fab launch by three months
SK Hynix plans to bring forward the opening of a new semiconductor factory by three months and will also begin operating another new plant in February 2026, as surging memory demand...
Thursday 15 January 2026
ASML CEO claims China's EUV lags by 8 gen ahead of 4Q25 earnings
ASML, the Dutch semiconductor equipment leader and exclusive supplier of EUV lithography systems, is set to release its fourth-quarter 2025 and full-year financial results on January...
Thursday 15 January 2026
Samsung reportedly files new HBM trademarks as HBM4 advances
Samsung Electronics has reportedly filed a series of new trademarks related to high bandwidth memory as it advances preparations for its sixth-generation HBM4 products.