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    Taiwanese suppliers expand China capacity with AI components in focus
    5h 14min ago
    Commentary: YMTC IPO highlights strong profits but three hurdles remain
    5h 14min ago
    Foxconn's China investment returns lead Taiwan peers on AI and HPC demand
    5h 14min ago
    Nvidia and SK Hynix diverge on CPO as 3D optics-centric design may arrive after 2030
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    Tactical drone market shifts as startups and incumbents compete and cooperate
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    NEWS TAGGED HBM
    Monday 24 August 2026
    SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
    Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
    Monday 24 August 2026
    Analysis: SK Hynix pushes beyond HBM with HBF and CPO
    SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
    Monday 24 August 2026
    Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
    Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell,...
    Friday 21 August 2026
    Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
    The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
    Friday 21 August 2026
    Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's
    As South Korea's semiconductor exports continue to power its economic expansion, market concerns are growing regarding the risks of excessive concentration in the tech sector. Recent...
    Friday 21 August 2026
    SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
    SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...
    Friday 21 August 2026
    JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
    JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
    Thursday 20 August 2026
    Samsung gains foundry pricing power as 4nm capacity stays tight through 2027

    Samsung Electronics is gaining pricing power in its foundry business as AI and high-bandwidth memory (HBM) demand tightens advanced-node...

    Thursday 20 August 2026
    SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders
    SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts...
    Thursday 20 August 2026
    Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September
    Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea,...
    Thursday 20 August 2026
    Intel Malaysia packaging expansion draws HBM flows from Taiwan

    South Korean export data showed a sharp shift in high-bandwidth memory, or HBM, shipments toward Malaysia and away from Taiwan, according...

    Wednesday 19 August 2026
    SK Hynix to cancel record KRW40tn in shares, signalling confidence in a long AI memory cycle

    SK hynix said on August 19 that its board had approved a plan to repurchase and cancel KRW40 trillion (roughly US$29 billion) of its...

    Wednesday 19 August 2026
    Hanmi Semiconductor scales up bonding capacity with US$91.4 million plant buy amid AI packaging boom

    Amid a global shortage of AI semiconductor equipment, Hanmi Semiconductor announced on August 18 that it will acquire a factory owned...

    Tuesday 18 August 2026
    Samsung faces tougher HBM4E test after HBM4 comeback

    Samsung Electronics' semiconductor chief has told executives not to treat the company's HBM4 comeback as proof that its recovery is...

    Monday 17 August 2026
    Samsung's China sales surge 272% in 1H26; Nvidia not among top five customers

    Samsung Electronics' consolidated sales in China surged 272% in the first half of 2026, far outpacing growth in the Americas as a sharp...

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    BIZ FOCUS
    Aug 24, 08:00
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
    Thursday 20 August 2026
    Corning-IRICO Trade Secret Case Enters New Phase
    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services
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