News tagged HBM at DIGITIMES

NEWS TAGGED HBM

Thursday 14 May 2026

TSMC SVP: better AI days lie ahead, remember the keyword 'COUPE'

Taiwan Semiconductor Manufacturing Co. (TSMC) used its 2026 Technology Forum on May 14 to outline a sweeping view of the AI-driven transformation in semiconductors. Co-COO and senior...

Thursday 14 May 2026

Samsung reportedly speeds up 3D NAND, packaging, and substrate plans

Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates —...

Thursday 14 May 2026

Samsung and SK Hynix rush to expand capacity as AI memory demand soars

The artificial intelligence(AI) boom is triggering an unprecedented expansion race among the world's largest memory chipmakers.

Tuesday 12 May 2026

TSMC CoWoS shortage drives SK Hynix-Intel 2.5D push

TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI acceler...

Monday 11 May 2026

Samsung strike threat puts memory output at risk as 18-day walkout looms

A planned 18-day strike at Samsung Electronics is shifting investor attention from labor negotiations to the risk of memory-output disruption, as estimates from Korean media point...

Monday 11 May 2026

Memory bottlenecks threaten data-center GPU efficiency as AI inference scales, says Micron SVP

Micron's senior vice president, Jeremy Werner, told The Circuit Podcast that memory has become a strategic bottleneck for data-center inference, warning that insufficient memory can...

Monday 11 May 2026

AI inference boom fuels memory race, with Samsung in pursuit

AI-driven demand and new product cycles are accelerating competition among major memory makers, creating pressure across storage and component supply chains. Production is running...

Saturday 9 May 2026

Samsung accelerates Pyeongtaek fab expansion as memory supercycle builds

Samsung Electronics is reportedly moving up construction of the final production line at its Pyeongtaek semiconductor campus, accelerating one of its largest capacity-expansion projects...

Wednesday 6 May 2026

SoftBank, Intel target HBM limits with 9-layer memory

SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints...

Tuesday 5 May 2026

South Korea eyes memory-led AI order against Nvidia

As AI shifts from training to inference and from single-task use to multi-agent collaboration, South Korea's semiconductor industry is seeking to recast the market around memory rather...

Tuesday 5 May 2026

SK Hynix disputes report on M15X memory investment shift

SK Hynix disputed reports that it is considering shifting DRAM investment at its new M15X memory production base in Cheongju, South Korea,...

Monday 4 May 2026

ADT lands US AI chip deal using Samsung 4nm

ADTechnology said it has signed a KRW40 billion (US$27.1 million) turnkey contract with a US-based AI fabless company to develop and supply HPC SoC chiplets for AI data-center applications...

Monday 4 May 2026

Samsung strike exposes AI-era pay divide, raises HBM supply risks

A looming strike at Samsung Electronics is exposing deeper fractures than a typical labor dispute, with widening pay gaps, divisional tensions,...

Monday 4 May 2026

Samsung pulls ahead of SK Hynix as commodity DRAM prices surge

Samsung Electronics and SK Hynix are both riding a historic memory upcycle, but a profit gap of about KRW15 trillion (approx. US$10 billion)...

Monday 4 May 2026

China curbs memory speculation; DDR4 spot slides, contract prices surge

Spot memory prices surged in early 2026, triggering stockpiling and speculative buying across distribution channels, before reversing from...

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