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    Huawei reportedly shifts AITO partnership to Seres-led model
    Sep 15, 19:08
    China's FAW to become GAC's second-largest shareholder as auto consolidation talk returns
    Sep 15, 19:08
    Column: China tightens rare earth controls, and Taiwan must guard supply chain flexibility
    Sep 15, 19:08
    Analysis: Behind China's CNY30 trillion electronics plan—can AI and robotics outrun a maturing market?
    Sep 15, 19:08
    China’s wafer fabs boost local equipment buying, pressuring South Korean suppliers
    Sep 15, 19:08
    NEWS TAGGED HBM
    Wednesday 16 September 2026
    Chip revenue heads to US$2.4 trillion on price, not volume, Yole says
    The semiconductor industry is on track to nearly quadruple in revenue by 2031 while shipping barely more silicon than it does today, a divergence that makes pricing power, not capacity,...
    Wednesday 16 September 2026
    DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

    SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...

    Tuesday 15 September 2026
    Astera Labs targets the KV cache bottleneck as agentic AI outgrows GPU memory
    Astera Labs has added three products to its Leo memory controller line, aimed at a problem that arises as AI inference shifts from single queries to agents that run continuous loops:...
    Tuesday 15 September 2026
    China elevates HBM and HBF in five-year plan, opening a new front in AI memory
    China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have jointly released the 15th Five-Year Plan for the Development...
    Tuesday 15 September 2026
    Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM
    Samsung Electronics is accelerating the restructuring of its semiconductor packaging footprint. Its Cheonan facility is gradually phasing out packaging operations for the Exynos mobile...
    Tuesday 15 September 2026
    CXMT rides AI boom to 80% operating margin

    China's leading DRAM maker, CXMT Corporation (CXMT), formerly known as ChangXin Memory Technologies, is reaping a windfall from price...

    Monday 14 September 2026
    Sandisk recruits engineers in Korea as memory talent race heats up

    Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND...

    Friday 11 September 2026
    Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says
    Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and...
    Thursday 10 September 2026
    From cHBM to 3D Stacked SRAM, AI inference drives AI accelerators toward memory architecture innovation

    Introduction

    Thursday 10 September 2026
    China's Nvidia rivals raise prices as HBM shortage bites
    Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding...
    Thursday 10 September 2026
    CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

    China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...

    Wednesday 9 September 2026
    Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

    Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...

    Wednesday 9 September 2026
    Backed by Nanya partnership, PieceMakers eyes AI memory upgrade boom
    As AI compute requirements scale, memory bandwidth has become a primary bottleneck governing system performance. PieceMakers Technology, which maintains a strategic partnership with...
    Tuesday 8 September 2026
    US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans
    South Korea and the US are discussing semiconductor investments in the US as part of broader bilateral negotiations, bringing US chip tariff policy closer to the investment decisions...
    Tuesday 8 September 2026
    Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise

    Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from...

    1/40 pages
    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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