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NEWS TAGGED HBM
Thursday 18 June 2026
Tim Cook says Apple price hikes are unavoidable as AI squeezes memory supply

In an exclusive interview with The Wall Street Journal, Apple CEO Tim Cook made an unusually blunt admission. The company is...

Thursday 18 June 2026
SK Hynix ships HBM4E samples to customers
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on s...
Thursday 18 June 2026
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers.

Thursday 18 June 2026
SK Hynix scraps degree rules to court AI chip talent

SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks...

Thursday 18 June 2026
SK Group tops KRW2,000 trillion as AI memory demand and Nvidia visit lift valuation

SK Group's combined market capitalization on the South Korean stock market surpassed KRW2,000 trillion (US$1.32 trillion) for the first...

Tuesday 16 June 2026
SK Hynix reportedly readies HBM4E samples for Nvidia as Samsung pulls ahead
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market....
Monday 15 June 2026
South Korea's chip equipment players ride the HBM4 wave

South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics...

Monday 15 June 2026
SK Hynix readies HBM4 packaging push as Nvidia demand grows

SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for...

Saturday 13 June 2026
SK Hynix weighs supplier price hikes as HBM boom lifts equipment makers

SK Hynix is reviewing rare price increase requests from several tier-one equipment suppliers, a sign that the high-bandwidth memory...

Friday 12 June 2026
Samsung's packaging gap clouds chip comeback as TSMC, Intel push ahead

Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point...

Friday 12 June 2026
Google weighs Samsung's role in next AI chip as TSMC capacity tightens
Google is considering using Samsung Electronics to manufacture part of a future artificial intelligence (AI) chip, a move that would mark a notable shift in the US tech group's supply...
Thursday 11 June 2026
Applied Materials CEO: AI reshapes semiconductor innovation
Applied Materials said artificial intelligence (AI) is reshaping the global semiconductor industry and could drive years of heavy investment in chipmaking, packaging, and materials...
Wednesday 10 June 2026
Commentary: Nvidia CEO visit spotlights Samsung in HBM supply race
Nvidia CEO Jensen Huang's multi-day trip to South Korea put the "triangle relationship" among Samsung Electronics, SK Hynix, and Nvidia over high-bandwidth memory (HBM) in the spotlight,...
Wednesday 10 June 2026
Samsung weighs Gwangju packaging plant as power strains Seoul-area chip expansion

Samsung Electronics is considering building an advanced semiconductor packaging facility in the southwestern city of Gwangju, a move that...

Tuesday 9 June 2026
Samsung foundry profit rebound may come in 3Q26 as 2nm orders rise 130%
Samsung Electronics' foundry business may return to profit as early as the third quarter of 2026, ahead of its previous target of late 2026 to 2027, as improving yields, larger orders,...