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NEWS TAGGED HBM
Thursday 30 July 2026
Samsung signs five-year memory deals as chip shortage stretches to 2028
Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing...
Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...

Thursday 30 July 2026
South Korean suppliers win HBM4 tester orders from SK Hynix
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...
Thursday 30 July 2026
Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
Thursday 30 July 2026
Samsung sees tripled HBM4 sales in 3Q26; HBM share to reach parity with DRAM position

Samsung Electronics expects HBM4 sales to increase more than threefold sequentially in the third quarter of 2026, the company said...

Thursday 30 July 2026
Samsung memory sales up 471% in 2Q26; foundry targets double-digit second-half growth

Samsung Electronics' Device Solutions (DS) division posted the most profitable quarter in its history in 2Q26, generating operating...

Wednesday 29 July 2026
SK Hynix prepares for prolonged memory tightness as AI infrastructure expands

SK Hynix reported record second-quarter revenue, underscoring the firm's strong demand for AI-related memory despite supply constraints...

Wednesday 29 July 2026
From Silicon Valley to Sicily: Samsung, SK chiefs take Korea's AI supply-chain pitch to Google Camp

A high-level technology gathering in Sicily, reportedly to be attended by the leaders of two of South Korea's largest semiconductor...

Tuesday 28 July 2026
CXMT's record IPO and Apple talks collide with US curbs as DRAM tightens

AI-driven demand is tightening the global memory market just as China's leading DRAM producer, ChangXin Memory Technologies, or CXMT,...

Tuesday 28 July 2026
SK Hynix's HBM paradox: DDR5 surge builds leverage for HBM4 price hikes

AI spending is broadening the memory upcycle beyond high-bandwidth memory, lifting prices for conventional DRAM, NAND flash and enterprise...

Tuesday 28 July 2026
Nvidia remaps Asia's AI supply chain, raising fresh questions over Taiwan's edge
Generative AI is reshaping the semiconductor and electronics industries while redefining how global supply chains divide roles across design, manufacturing, infrastructure, and app...
Tuesday 28 July 2026
Apple, Micron's clash over CXMT puts White House in the middle
Apple and Micron are fighting over whether the smartphone maker can buy memory chips from Chinese manufacturer ChangXin Memory Technologies (CXMT) for non-US devices, a move opposed...
Monday 27 July 2026
Samsung converts AMD and OpenAI ties into HBM4 supply wins

Samsung Electronics is showing renewed momentum in the AI memory race as it deepens ties with both OpenAI and AMD, two partnerships...

Monday 27 July 2026
Samsung to use 2nm process for HBM5 base die as heat challenge grows

Samsung Electronics plans to manufacture the base die for its next-generation HBM5 memory using a 2nm gate-all-around foundry process,...

Monday 27 July 2026
Weekly news roundup: Samsung and SK Hynix favor DDR5, Intel accelerates 18A, Alibaba deepens CXMT ties
AI infrastructure, memory and advanced chipmaking led this week's tech agenda, with Intel, Samsung, SK Hynix, CXMT, Alibaba and Foxconn reshaping capacity and supply chains. Below...