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Friday 21 August 2026
Analyst: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
Friday 21 August 2026
Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's
As South Korea's semiconductor exports continue to power its economic expansion, market concerns are growing regarding the risks of excessive concentration in the tech sector. Recent...
Friday 21 August 2026
SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...
Friday 21 August 2026
JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
Thursday 20 August 2026
Samsung gains foundry pricing power as 4nm capacity stays tight through 2027

Samsung Electronics is gaining pricing power in its foundry business as AI and high-bandwidth memory (HBM) demand tightens advanced-node...

Thursday 20 August 2026
SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders
SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts...
Thursday 20 August 2026
Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September
Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea,...
Thursday 20 August 2026
Intel Malaysia packaging expansion draws HBM flows from Taiwan

South Korean export data showed a sharp shift in high-bandwidth memory, or HBM, shipments toward Malaysia and away from Taiwan, according...

Wednesday 19 August 2026
SK Hynix to cancel record KRW40tn in shares, signalling confidence in a long AI memory cycle

SK hynix said on August 19 that its board had approved a plan to repurchase and cancel KRW40 trillion (roughly US$29 billion) of its...

Wednesday 19 August 2026
Hanmi Semiconductor scales up bonding capacity with US$91.4 million plant buy amid AI packaging boom

Amid a global shortage of AI semiconductor equipment, Hanmi Semiconductor announced on August 18 that it will acquire a factory owned...

Tuesday 18 August 2026
Samsung faces tougher HBM4E test after HBM4 comeback

Samsung Electronics' semiconductor chief has told executives not to treat the company's HBM4 comeback as proof that its recovery is...

Monday 17 August 2026
Samsung's China sales surge 272% in 1H26; Nvidia not among top five customers

Samsung Electronics' consolidated sales in China surged 272% in the first half of 2026, far outpacing growth in the Americas as a sharp...

Monday 17 August 2026
AMD eyes Taalas: will the system ditch HBM, advanced packaging, 3D stacking?
The AI compute landscape was jolted in February 2026 by Taalas, a Canadian startup founded by former AMD and NVIDIA architect Ljubisa Bajic. Emerging with an unconventional "Model-Based"...
Monday 17 August 2026
Samsung weighs Giheung R&D line for 2nm HBM foundry capacity

Samsung Electronics is reportedly considering repurposing the second line at its next-generation semiconductor R&D complex in Giheung...

Saturday 15 August 2026
Gelsinger calls HBM 'lousy', SK Hynix says it's not memory's final answer

High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...