China's leading DRAM maker CXMT has gone from years of accumulated losses to one of the most profitable companies on the mainland market, propelled by an extraordinary memory upcycle...
Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high...
China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI...
As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as...
As trillion-parameter large language models (LLMs) and agentic AI become mainstream, the AI infrastructure bottleneck is shifting from raw compute power toward system-level integration...
Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...
Samsung Electronics is reportedly developing an 8-layer version of seventh-generation high-bandwidth memory for Nvidia, matching the chipmaker's requirements for its customized NVHBM...
SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as...
Nvidia reported second-quarter revenue for fiscal year 2027 of US$96.22 billion, a 106% year-over-year increase, driven by a 117% surge in data center revenue to US$89 billion. With...
Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...
Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...
As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...
The AI infrastructure race has spent the past few years fixated on high-bandwidth memory as one of the most indispensable building blocks of accelerated compute. Yet as model sizes,...
China's memory-chip industry is narrowing parts of the technology gap with global leaders on two fronts. YMTC is approaching SK Hynix in NAND revenue share while running a more advanced...
SK Hynix is weighing closer cooperation with Japan's Kioxia Holdings in NAND flash, extending the strategic message from its newly launched US HBM expansion into a memory segment where...
