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NEWS TAGGED HBM
Tuesday 4 August 2026
SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...
Tuesday 4 August 2026
2027 memory capacity reportedly sold out as buyers quietly lock in supply

Tight memory supply is expected to persist into 2027, with industry sources saying manufacturers have already completed much of their...

Tuesday 4 August 2026
CXMT listing fuels concerns over DRAM prices and global memory competition
China's CXMT drew fresh attention after its parent ChangXin Memory Technology (CXMT) went public, with market estimates of the firm's future valuation ranging from US$160 billion to...
Friday 31 July 2026
Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war
Nvidia CEO Jensen Huang recently appeared alongside SK Group Chairman Chey Tae-won and Samsung Electronics Executive Chairman Lee Jae-yong at a high-profile AI gathering in San Francisco,...
Thursday 30 July 2026
Samsung signs five-year memory deals as chip shortage stretches to 2028
Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing...
Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...

Thursday 30 July 2026
South Korean suppliers win HBM4 tester orders from SK Hynix
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...
Thursday 30 July 2026
Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
Thursday 30 July 2026
Samsung sees tripled HBM4 sales in 3Q26; HBM share to reach parity with DRAM position

Samsung Electronics expects HBM4 sales to increase more than threefold sequentially in the third quarter of 2026, the company said...

Thursday 30 July 2026
Samsung memory sales up 471% in 2Q26; foundry targets double-digit second-half growth

Samsung Electronics' Device Solutions (DS) division posted the most profitable quarter in its history in 2Q26, generating operating...

Wednesday 29 July 2026
SK Hynix prepares for prolonged memory tightness as AI infrastructure expands

SK Hynix reported record second-quarter revenue, underscoring the firm's strong demand for AI-related memory despite supply constraints...

Wednesday 29 July 2026
From Silicon Valley to Sicily: Samsung, SK chiefs take Korea's AI supply-chain pitch to Google Camp

A high-level technology gathering in Sicily, reportedly to be attended by the leaders of two of South Korea's largest semiconductor...

Tuesday 28 July 2026
CXMT's record IPO and Apple talks collide with US curbs as DRAM tightens

AI-driven demand is tightening the global memory market just as China's leading DRAM producer, ChangXin Memory Technologies, or CXMT,...

Tuesday 28 July 2026
SK Hynix's HBM paradox: DDR5 surge builds leverage for HBM4 price hikes

AI spending is broadening the memory upcycle beyond high-bandwidth memory, lifting prices for conventional DRAM, NAND flash and enterprise...

Tuesday 28 July 2026
Nvidia remaps Asia's AI supply chain, raising fresh questions over Taiwan's edge
Generative AI is reshaping the semiconductor and electronics industries while redefining how global supply chains divide roles across design, manufacturing, infrastructure, and app...