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    Peking University's true-3D EDA tool gives Huawei's LogicFolding chip roadmap critical design link
    0min ago
    SK Hynix turns Big Tech's memory scramble into tougher supply terms
    11min ago
    EU plans satellite spectrum shift that could open door to Starlink and Amazon
    24min ago
    China smartphone market rebounded in April, with Apple poised to benefit most
    May 27, 18:51
    Huawei’s Tau law draws DeepSeek-style buzz amid chip restrictions
    May 27, 18:50
    NEWS TAGGED HBM
    Thursday 28 May 2026
    Nvidia's Rubin CPX plans clouded as Groq gains bigger inference role
    Nvidia's plan to launch Rubin CPX, an inference-focused graphics processing unit for its Vera Rubin platform, has become increasingly uncertain as supply-chain activity around the...
    Wednesday 27 May 2026
    Samsung reportedly to expand Vietnam footprint with new memory chip testing plant

    Samsung Electronics plans to invest VND39 trillion (approx. US$1.5 billion) in a new semiconductor testing facility in northern Vietnam,...

    Wednesday 27 May 2026
    From boom-bust to structural growth? Memory's US$1 trillion moment puts AI thesis to the test
    First Micron, then SK Hynix, join the trillion-dollar club, capping an extraordinary repricing of an industry once dismissed as a commodity play. The milestone is more than a valuation...
    Wednesday 27 May 2026
    Global DRAM revenue surges toward US$100 billion in 1Q26 on AI-driven demand
    Global DRAM revenue climbed sharply in the first quarter of 2026, approaching the US$100 billion threshold as artificial intelligence demand and tight supply conditions pushed prices...
    Wednesday 27 May 2026
    SK Hynix seeks to embed cooling inside HBM to beat the heat
    SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into...
    Tuesday 26 May 2026
    Samsung's P4 HBM push could worsen DRAM crunch in 2027

    Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth...

    Tuesday 26 May 2026
    Intel's Rio Rancho fab becomes test case for AI-era chip packaging
    Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...
    Tuesday 26 May 2026
    SK hynix unveils 'iHBM' thermal solution to boost AI performance

    SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs) within the high-bandwidth...

    Monday 25 May 2026
    Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
    Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...
    Monday 25 May 2026
    Samsung Electro-Mechanics secures large silicon capacitor supply contract
    Samsung Electro-Mechanics (Semco)'s KRW1.5 trillion (approx. US$990 million) silicon capacitor supply contract with a major global company could reshape component supply for AI servers,...
    Saturday 23 May 2026
    SK Hynix weighs opening Seoul office at SK Group headquarters

    SK Hynix is reportedly considering opening a Seoul office and sales operation inside SK Group's Seorin Building in Jongno, Seoul, a symbolic...

    Thursday 21 May 2026
    AI chip boom strains ABF substrate supply chain
    AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used...
    Thursday 21 May 2026
    SK Hynix reportedly shifts Cheongju mask fab toward HBM yield push
    SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the...
    Monday 18 May 2026
    Samsung reportedly boosts 1b DRAM yields as Korean memory rivalry heats up
    Samsung Electronics has significantly improved yields for its latest DRAM technologies used in high-bandwidth memory (HBM), according to IT Chosun, underscoring the intensifying...
    Monday 18 May 2026
    TSMC CoWoS yields top 98% as capacity expands
    Following its North America technology forum, TSMC held the Hsinchu session on May 14, 2026. The company said the smart revolution is beginning, with AI evolving from generative AI...
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    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook