K Hynix has commenced mass production of the world's first 12-layer HBM3E product, boasting a 36GB capacity, the highest of any current HBM available, according to the memory chip...
Despite a positive outlook for the memory market, driven largely by data centers, Micron anticipates Samsung Electronics' entry into the HBM market and is shifting toward higher-value...
The Biden administration is considering imposing restrictions on the import of high-bandwidth memory (HBM) and related equipment into China, fueling growing demand for domestic substitutes...
The explosive growth of artificial intelligence (AI) has created an unprecedented demand for computational power. As the chip industry faces physical limitations in the post-Moore's...
On September 15, Morgan Stanley issued a report dramatically reducing SK Hynix's target stock price by 54%, cutting it from KRW260,000 (approx. US$200) to KRW120,000. Simultaneously,...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, is pleased to announce that its 3nm HBM3E Controller and PHY IP have been adopted by a leading Cloud Service Provider (CSP) and...
Data from the South Korean Ministry of Trade, Industry, and Energy indicates that computer exports surged by 183.2% in August 2024, while maritime vessel exports rose by 80%. Additionally,...
With strong backing from the Chinese government, Changxin Memory Technologies (CXMT) is aggressively expanding its DRAM production capacity, potentially challenging the triopoly led...
There are reports of Samsung Electronics (Samsung) delaying the R&D of the automotive chip Exynos Auto and instead focusing on the development and mass-production of items including...
Samsung Electronics (Samsung) is not only lagging in the HBM area, but its large lead in universal DRAM also shows signs of erosion, intensifying its internal sense of crisis. There...
The surging momentum of generative AI has placed Taiwan's semiconductor supply chain at the center of the AI stage. As the industry leader, TSMC showcased its influence at SEMICON...
Taiwan-based memory chipmakers Nanya Technology, Winbond Electronics, and Macronix International, as well as fabless firms Etron Technology and Elite Semiconductor Memory Technology...
As SK Hynix and Samsung Electronics compete for dominance in high bandwidth memory (HBM), each is championing different technical solutions. Meanwhile, Samsung continues to address...
HBM4 memory will move toward integrating logic and memory processes to address greater power consumption issues and break performance constraints. Samsung Electronics and SK Hynix...
Key AI chipmaking and high-bandwidth memory (HBM) technologies will be highlighted at SEMICON Taiwan 2024, where major manufacturers will gather to present their most recent develo...
