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    Nanoimprint tools see a shift from round to square substrates
    8h 3min ago
    Taiwanese chipmakers step up visual sensing and motor drive for future robot market
    8h 3min ago
    Shenzhen Huacheng XinGuang sees microLED optical interconnect is viable for data centers
    8h 3min ago
    Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans
    8h 3min ago
    Analysis: Is China's ASML gambit worth the cost as rivals pull ahead on EUV?
    8h 4min ago
    NEWS TAGGED HBM
    Wednesday 9 September 2026
    Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

    Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...

    Wednesday 9 September 2026
    Backed by Nanya partnership, PieceMakers eyes AI memory upgrade boom
    As AI compute requirements scale, memory bandwidth has become a primary bottleneck governing system performance. PieceMakers Technology, which maintains a strategic partnership with...
    Tuesday 8 September 2026
    US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans
    South Korea and the US are discussing semiconductor investments in the US as part of broader bilateral negotiations, bringing US chip tariff policy closer to the investment decisions...
    Tuesday 8 September 2026
    Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise

    Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from...

    Tuesday 8 September 2026
    Samsung allocates more than half of 4nm foundry capacity to HBM4
    Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI...
    Tuesday 8 September 2026
    ViTrox rides AI demand, expands Taiwan push as Malaysia semiconductor base grows
    After several years away from SEMICON Taiwan, Malaysia-based inspection equipment maker ViTrox returned to the show this year and has already confirmed plans to exhibit again next...
    Monday 7 September 2026
    HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days
    Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply as AI infrastructure spending drives simultaneous demand for HBM, server DRAM and enterprise...
    Monday 7 September 2026
    SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
    SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
    Monday 7 September 2026
    Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens
    AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion,...
    Friday 4 September 2026
    TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
    TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
    Friday 4 September 2026
    Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
    Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...
    Friday 4 September 2026
    AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

    The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

    Thursday 3 September 2026
    SanDisk pushes HBF ecosystem as AI inference reshapes token economics
    The rapid rise of AI inference, multimodal inputs, and AI agents is giving NAND flash a new strategic role.
    Thursday 3 September 2026
    China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration
    Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser...
    Wednesday 2 September 2026
    Sandisk says HBF can match HBM bandwidth with up to 16x the capacity
    Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
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    BIZ FOCUS
    Sep 9, 08:00
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
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