The US government's move to add Chinese panel makers BOE and Tianma to a military-related list is raising concerns that Washington's...
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic...
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...
Qualcomm has unveiled its latest AI data center platform, Dragonfly, at its annual investor day, highlighting a new technology it calls...
Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations,...
SK Hynix said on June 24 its board approved a plan to issue new shares backing American Depositary Receipts on the Nasdaq Global Select...
SK Hynix is reportedly easing the pace of some HBM4 production conversions and redirecting more attention toward commodity DRAM, as a...
Samsung Electronics is putting long-term memory supply agreements higher on its second-half agenda as demand from data centers broadens...
SK Hynix's semiconductor production base in Cheongju, South Korea, has seen a string of accidents since 2026, prompting questions over...
SK Hynix briefly overtook Samsung Electronics on June 22 to claim the top spot by common-share market capitalization on South Korea's...
In an exclusive interview with The Wall Street Journal, Apple CEO Tim Cook made an unusually blunt admission. The company is...
