Samsung Electronics' third-quarter profit came almost entirely from charging more for memory chips, not from selling more of them. On its earnings call, the company also told investors...
Nvidia is reportedly adjusting the fourth-generation high-bandwidth memory (HBM4) specification for its Vera Rubin NVL72 platform, cutting bandwidth per GPU from the previously announced...
Google is now supplying its tensor processing units (TPUs) to companies it competes with, including Anthropic and Apple. On Alphabet's third-quarter earnings call, management gave...
Samsung Electronics' latest results show AI infrastructure demand increasingly determining the group's earnings, with soaring semiconductor profit offsetting continued losses in its...
SK Hynix said customers are seeking more than twice the high-bandwidth memory (HBM) volume it can currently supply, as moves toward shorter memory stacks reflect supply shortages rather...
SK Hynix is looking beyond its position as a leading supplier of high-bandwidth memory (HBM), using venture investments to gain a greater say in how next-generation AI infrastructure...
SK Hynix is turning to high-bandwidth flash (HBF) to address growing memory bottlenecks in AI inference, as increasingly complex AI agents generate more data than can be economically...
Samsung Electronics and SK Hynix are targeting the second quarter of 2027 to begin volume shipments of eight-layer HBM4 memory to Nvidia, ZDNet Korea reported on October 26,...
Following TSMC's third-quarter 2026 earnings call, DIGITIMES analyst Luke Lin provided in a podcast additional analysis of several details that received limited attention in market...
Nvidia CEO Jensen Huang said the company did not expect memory supply to exceed demand in the coming years and remained open to working with China's ChangXin Memory Technologies (CXMT)...
Samsung Electronics is reportedly turning to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration...
Samsung Electronics is transitioning its 4nm production capacity to HBM, with its next-generation mobile modem, the M2800, set to move to a 2nm process. The freed 4nm capacity will...
AI processor performance continues to improve, but memory bandwidth is growing more slowly, making data supply a major constraint on AI chip performance and energy efficiency. Efforts...
