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    NEWS TAGGED HBM
    Friday 23 October 2026
    SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production

    SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a...

    Thursday 22 October 2026
    PSMC raises mature-node prices again, targets 20% increase in 2027
    Powerchip Semiconductor Manufacturing (PSMC) reported third-quarter 2026 revenue of NT$21.3 billion (US$654.3 million), up 23% quarter-over-quarter, as higher foundry prices, a stronger...
    Thursday 22 October 2026
    Samsung's Nvidia HBM bid raises four strategic concerns
    Samsung Electronics is reportedly turning to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration...
    Wednesday 21 October 2026
    Samsung shifts M2800 modem to 2nm, frees 4nm capacity for HBM base dies
    Samsung Electronics is transitioning its 4nm production capacity to HBM, with its next-generation mobile modem, the M2800, set to move to a 2nm process. The freed 4nm capacity will...
    Wednesday 21 October 2026
    Breaking AI's memory wall: former TSMC VP charts a path with HBM, optical links and 3D stacking
    AI processor performance continues to improve, but memory bandwidth is growing more slowly, making data supply a major constraint on AI chip performance and energy efficiency. Efforts...
    Tuesday 20 October 2026
    Unimicron chairman sees substrate sizes reaching 14x current scale by 2030
    TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance...
    Tuesday 20 October 2026
    Hanmi Semiconductor establishes US hub to support AI packaging customers

    Hanmi Semiconductor has established a US subsidiary in Silicon Valley as it seeks to capitalize on growing demand for advanced semiconductor packaging...

    Monday 19 October 2026
    Shipments of high-end cloud AI accelerators, 2027

    Introduction

    Monday 19 October 2026
    Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup
    South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for...
    Monday 19 October 2026
    Nvidia's custom HBM pulls Samsung onto TSMC's 3nm process, report says
    Nvidia's custom memory design is shifting control of how high-bandwidth memory (HBM) is built from memory makers to its largest customer, and steering a key part of that work to TSMC...
    Friday 16 October 2026
    Samsung, SK Hynix aim to ease AI memory bottlenecks with zHBM, HBF
    Samsung Electronics and SK Hynix are developing new memory technologies to address growing bottlenecks in AI systems, with Samsung exploring a design that stacks high-bandwidth memory...
    Friday 16 October 2026
    Cloud AI absorbs resources as non-AI semiconductors face prolonged downturn
    Investment in AI data centers remains strong, but semiconductor growth is becoming increasingly concentrated in cloud AI, while the long-running decline in consumer technology prices...
    Thursday 15 October 2026
    Samsung reportedly completes 4F² DRAM development as China's CXMT targets year-end launch
    Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin...
    Thursday 15 October 2026
    SK Hynix targets January 2027 for HBF standard, eyes DRAM stacked on AI chips
    SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference...
    Thursday 15 October 2026
    Micron opens second Taiwan advanced packaging plant as HBM supply tightens
    Micron Technology on October 15 opened Micron Advanced Assembly and Test Taiwan 2 (AATT2) in Taichung, its second advanced assembly and test facility in Taiwan. The plant expands the...
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    Thursday 22 October 2026
    HOYA BIT Explores AI Data Analysis Solutions for Smarter Trading
    Wednesday 21 October 2026
    Starting with Data Challenges: TS Holdings Explores AI Through Hackathon
    Tuesday 20 October 2026
    Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency