中文網
  • 繁體
  • 简体
    •
  • My account
  • Sign in
  • Sign up
    •
    Trending
    CONNECT WITH US
    NEWS TAGGED HBM
    Thursday 5 June 2025
    CXMT's surprise HBM3 sprint puts Samsung, SK Hynix on alert
    China's CXMT is accelerating its development of high-bandwidth memory (HBM) and DDR5 chips, mounting a direct challenge to the global DRAM dominance of Samsung Electronics and SK...
    Wednesday 4 June 2025
    Samsung's DRAM yield jumps following bold redesign under new chief Jun Young-Hyun
    Samsung Electronics is accelerating its push to reclaim semiconductor leadership, spotlighting its latest breakthrough in sixth-generation DRAM (1c node) yields. The development is...
    Wednesday 4 June 2025
    South Korea maintains HBM chip lead while China faces tech and trade hurdles
    The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics...
    Wednesday 4 June 2025
    Samsung executives visit Nvidia headquarters to secure HBM supply deal
    Samsung Electronics memory division executives traveled to Nvidia's US headquarters in late May to advance large-scale high-bandwidth memory (HBM) supply arrangements, according to...
    Tuesday 3 June 2025
    Samsung rides GDDR7 wave as Nvidia, AMD shift to comply with US export curbs
    In response to intensified US export controls on advanced semiconductor shipments to China, major chipmakers Nvidia and AMD are reportedly adopting Samsung Electronics' GDDR7 graphics...
    Tuesday 3 June 2025
    SoftBank and Intel forge AI memory venture to challenge HBM dominance
    Japan's SoftBank has partnered with Intel to co-develop cutting-edge DRAM tailored for AI applications, aiming to challenge the incumbent High Bandwidth Memory (HBM) technology. The...
    Tuesday 3 June 2025
    South Korea's chip crown becomes a strategic burden

    South Korea's leadership in DRAM, NAND, and high-bandwidth memory (HBM) is becoming a strategic liability amid rising US-China friction. With...

    Wednesday 28 May 2025
    Samsung races to deliver HBM3E memory to Nvidia but faces certification hurdles
    In the high-stakes race to supply memory for the next generation of artificial intelligence, Samsung Electronics is under mounting pressure to deliver its 12-layer HBM3E chips to...
    Wednesday 28 May 2025
    Hanmi engineers return to SK Hynix after US$30.7 million TCB order resolves dispute
    The protracted dispute between Hanmi Semiconductor and SK Hynix regarding the supply of Thermo Compression Bonding (TCB) equipment has reached a resolution, with Hanmi Semiconductor...
    Tuesday 27 May 2025
    CXMT to scrap DDR4 in policy-fueled pivot—DDR5 deluge may follow
    ChangXin Memory Technologies (CXMT), China's top DRAM supplier, is reportedly preparing to phase out DDR4 products for server and PC use by mid-2026. As the company pivots to DDR5...
    Monday 26 May 2025
    Samsung edges toward Nvidia HBM3E approval, but SK Hynix remains dominant

    Samsung Electronics may clear Nvidia's certification for its 12-layer HBM3E memory, but industry sources say the achievement is unlikely...

    Thursday 22 May 2025
    Trump's Middle East trip spurs major AI infrastructure deals, highlights energy and chip synergies
    US President Donald Trump's recent visit to the Middle East has emerged as a significant catalyst for the global AI industry, sparking new partnerships and investments aimed at addressing...
    Thursday 22 May 2025
    Nvidia CEO shows support for SK Hynix, praises 'beautiful' HBM4 at Computex 2025
    Nvidia CEO Jensen Huang made a special visit to the SK Hynix booth at Computex 2025, leaving messages of support and showing the close cooperative relationship between the two comp...
    Thursday 22 May 2025
    From volume to value: Samsung retreats from legacy DRAM facing Chinese price war
    Samsung Electronics has sharply reduced its memory chip production—by more than 100 billion units in a year—raising eyebrows across South Korea's tech industry. The unexpected...
    Tuesday 20 May 2025
    SK Hynix places orders for HBM equipment with Hanwha Semitech and Hanmi Semiconductor amid patent disputes
    South Korean chip giant SK Hynix has placed significant orders for thermal compression bonding (TCB) equipment with two domestic suppliers, Hanwha Semitech and Hanmi Semiconductor,...
    1/33 pages
    Research Report Database
    BIZ FOCUS
    Jun 4, 13:39
    "Alpha Three" team optimizes data pre-processing to significantly improve AI assistant question-answering accuracy
    Wednesday 4 June 2025
    "Revenge Seekers" team develops AI-powered emergency assistant to improve disaster response efficiency.
    Wednesday 4 June 2025
    Bidirectional engagement meets fans' emotional needs: "Disheveled in the Wind" presents Aidol
    Thursday 29 May 2025
    Pegatron unveiled Verge: Cutting-edge AI hardware-ready AR smart glasses reference design at COMPUTEX 2025
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES