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    Google to launch AI-powered smart glasses in 2026 as competition in wearable AI intensifies
    3min ago
    Jahwa to expand actuator factory to meet Apple orders
    Dec 8, 16:27
    China's AI chip market nears RMB 2 trillion with Cambrian and Hygon leading
    Dec 8, 16:27
    Google TPU demand remains strong with 2026 production capped by CoWoS and memory bottlenecks
    Dec 8, 16:27
    Commentary: How rising East Asia geopolitical tensions impact supply chains?
    Dec 8, 16:27
    Chinese native GPU firms accelerate capital market entries amid AI chip race
    Dec 8, 16:27
    SK Hynix to adopt hybrid bonding for 300-layer V10 NAND in 2027
    Dec 8, 16:27
    NEWS TAGGED HBM
    Monday 8 December 2025
    SK Hynix restructures global operations amid reported HBM4 production delay
    SK Hynix announced a comprehensive organizational restructuring to expand its global research network and reinforce its leadership in the high-bandwidth memory sector. The strategic...
    Monday 8 December 2025
    Samsung shifts focus from HBM to DDR5 modules for higher profits
    Samsung Electronics has shifted its internal strategy in response to intensified HBM market competition**,** reallocating capacity toward DDR5 RDIMM modules and freeing up around...
    Monday 8 December 2025
    Huawei's Peter Zhou says China's storage stack is stressed yet still primed for global standing
    China's storage industry is at a critical juncture. Surging AI workloads have fuelled a global shortage of high-bandwidth memory (HBM) and pushed storage to the forefront of the semiconductor...
    Monday 8 December 2025
    SK hynix Honored with Two Major Titles at GSA Awards 2025

    SK hynix Inc. (or "the company", www.skhynix.com) announced on December 7, 2025, that it has been named the winner of the Best Financially Managed Semiconductor Company...

    Friday 5 December 2025
    Broadcom CEO visits South Korea as Samsung HBM4 reportedly obtains Google TPU certification
    Update: Samsung has since reached out to DIGITIMES and denied this report. The company also declined to provide more details.
    Friday 5 December 2025
    Micron exits consumer market with Crucial phase-out amid shift to AI-driven memory demand
    Micron announced it will phase out its Crucial brand's consumer memory and SSD products by February 2026, marking its exit from the nearly 30-year-old consumer market. This move reflects...
    Thursday 4 December 2025
    Samsung reportedly wins majority of Nvidia's 2026 SOCAMM2 supply

    Samsung Electronics is reportedly on track to supply more than half of Nvidia's next-generation System on CAMM (SOCAMM2) memory modules...

    Thursday 4 December 2025
    Samsung and SK Hynix align 2026 DRAM strategies
    Samsung Electronics and SK Hynix reportedly both plan to raise their DRAM production growth targets for 2026. Samsung is focusing on standard DRAM such as DDR5, LPDDR5X, and GDDR7,...
    Thursday 4 December 2025
    Micron to exit consumer business as AI reshapes global memory demand
    Micron Technology has announced plans to exit its consumer business, marking one of its most significant strategic shifts in years as the company prioritizes advanced memory chips...
    Wednesday 3 December 2025
    Samsung sixth-gen HBM reportedly cleared for production readiness, targets Nvidia supply chain
    Samsung Electronics has reportedly completed the Production Readiness Approval (PRA) for its sixth-generation high-bandwidth memory (HBM), officially entering the production preparation...
    Tuesday 2 December 2025
    Samsung, SK Hynix lead HBM market, capitalize on Google's TPU push
    Google's expanding investment in custom AI accelerators is reshaping the high-bandwidth memory market and lifting Samsung Electronics and SK Hynix as demand for tensor processing...
    Tuesday 2 December 2025
    Samsung restructures research and memory teams to reclaim HBM market share
    Samsung Electronics is undertaking one of its most significant internal restructurings in years as the company pushes to strengthen its artificial intelligence (AI) capabilities and...
    Monday 1 December 2025
    Micron reportedly plans new Hiroshima fab to reduce reliance on Taiwan production
    Micron Technology is reportedly planning to invest JPY1.5 trillion(US$9.6 billion) to establish a new high-bandwidth memory (HBM) manufacturing facility at its Hiroshima campus, according...
    Monday 1 December 2025
    Samsung's HBM3E performance leap propels it to become primary supplier of Google's Ironwood TPU
    Media reports show that Google's Ironwood TPU is equipped with HBM3E from Samsung Electronics and SK Hynix. According to the Korea Economic Daily, Samsung supplied over 60%...
    Monday 1 December 2025
    TSMC reportedly set to take over base-die production in HBM4E generation

    Micron said in its latest quarterly results that it will work with TSMC to produce base logic dies for both standard and custom HBM4E...

    1/50 pages
    Research Report Database
    BIZ FOCUS
    Nov 26, 08:00
    Facing the rise of AI, how does Global Instrument Technology leverage Chunghwa Telecom's IDC for the manufacturing industry's AI-driven transformation
    Wednesday 26 November 2025
    GaNrich Delivers Portfolio from 40V to 1200V For the Data Center HVDC Architecture
    Wednesday 26 November 2025
    Smart dining transformation accelerates: ASUS IoT IoRT solutions enhance operational efficiency in chain restaurants
    Tuesday 25 November 2025
    ASUS IoT AISEHS raises intelligent security standards, helping semiconductor industry move from passive to active protection
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