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    NEWS TAGGED HBM
    Friday 4 September 2026
    TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
    TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
    Friday 4 September 2026
    Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
    Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...
    Friday 4 September 2026
    AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

    The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

    Thursday 3 September 2026
    SanDisk pushes HBF ecosystem as AI inference reshapes token economics
    The rapid rise of AI inference, multimodal inputs, and AI agents is giving NAND flash a new strategic role.
    Thursday 3 September 2026
    China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration
    Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser...
    Wednesday 2 September 2026
    Sandisk says HBF can match HBM bandwidth with up to 16x the capacity
    Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
    Wednesday 2 September 2026
    Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth
    Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
    Wednesday 2 September 2026
    DRAM giants target 3D stacking to break memory wall and power bottlenecks
    At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
    Wednesday 2 September 2026
    Indium CEO: packaging, cooling and power are next AI bottlenecks
    As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
    Wednesday 2 September 2026
    TSMC reportedly asks suppliers to develop 5μm HBM microbumps
    TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...
    Wednesday 2 September 2026
    Chinese MRAM chipmaker ICY Tech rethinks HBM for rack-scale AI inference
    China-based ICY Tech has introduced its uHBM and uLPU AI inference architectures, extending persistent MRAM computing from validation silicon into a product roadmap spanning compute-memory...
    Wednesday 2 September 2026
    Nvidia pushes into HBM base dies as NVHBM battle heats up
    The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
    Tuesday 1 September 2026
    SK Hynix touts up to 5.15x inference gains with custom HBM

    SK Hynix is pushing computation deeper into high-bandwidth memory (HBM), saying a custom HBM architecture that places compute functions...

    Tuesday 1 September 2026
    Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain
    Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...
    Tuesday 1 September 2026
    Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
    China's leading DRAM maker CXMT has gone from years of accumulated losses to one of the most profitable companies on the mainland market, propelled by an extraordinary memory upcycle...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
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