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    China silicon wafer makers expand 12-inch capacity and consolidate mature-node operations
    11h 16min ago
    Cambricon and Moore Threads post strong 1H26 growth as China AI chips move to deployment
    11h 16min ago
    Google readies Pixel 11 lineup, market breakthrough still under question
    11h 16min ago
    Interview: Nvidia says networking is the core of AI computing as AI factories scale
    11h 17min ago
    China auto brand slump pushes parts makers toward North America, Japan
    11h 17min ago
    Taiwan producer prices surge as non-China supply chains face rising pressure
    11h 17min ago
    NEWS TAGGED HBM
    Monday 10 August 2026
    Samsung HBM4 yield nears 80% as production race with SK Hynix heats up

    Samsung Electronics has reportedly pushed the production yield of its sixth-generation high-bandwidth memory (HBM4) close to 80%, marking...

    Monday 10 August 2026
    SK Hynix faces US patent fight over HBM, 3D NAND

    SK Hynix is facing an expanding US patent dispute with MonolithIC 3D. A second US International Trade Commission (USITC) investigation...

    Monday 10 August 2026
    Semiconductor material prices surge across silicon wafers, specialty gases and advanced packaging
    Demand for advanced processes and packaging continues to rise, while the Middle East conflict is lifting energy and raw-material costs and tighter Chinese controls on strategic-mineral...
    Monday 10 August 2026
    Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography
    AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week...
    Friday 7 August 2026
    Interview: Nvidia exec on progress of CPO production and pluggable optics
    Nvidia Senior Vice President of Networking Gilad Shainer said the company is building the key network architecture and optical interconnect technologies needed for AI factory deployments...
    Friday 7 August 2026
    Nvidia tests leaner Rubin Ultra memory designs with 2027 HBM supply in question
    Nvidia is testing sharply lower-memory versions of its next-generation Rubin Ultra GPU, a sign that the worsening high-bandwidth memory (HBM) shortage is beginning to reshape the specifications...
    Friday 7 August 2026
    Huawei's Richard Yu warns of smartphone price hikes as memory costs soar
    Huawei executive director and Consumer Business Group chairman Richard Yu warned on August 5 that sharply rising memory costs could trigger widespread smartphone price increases, saying...
    Thursday 6 August 2026
    Samsung to pay Netlist up to US$897 million to settle memory patent dispute

    Samsung Electronics will pay Netlist up to US$897 million in gross licensing fees over five years under a series of agreements that settle...

    Thursday 6 August 2026
    NEO Semiconductor unveils AI memory platform aimed at easing global bottlenecks
    NEO Semiconductor has launched NEO.AI, a memory platform it says could help address one of the biggest constraints on artificial intelligence (AI) systems worldwide: limited memory...
    Thursday 6 August 2026
    DRAM price surge lifts Samsung and Micron as SK Hynix loses share
    Samsung Electronics and Micron Technology are benefiting more strongly from rising conventional DRAM and NAND prices than SK Hynix, whose focus on high-bandwidth memory (HBM) has slowed...
    Wednesday 5 August 2026
    SK Hynix to hold late-August groundbreaking for US$3.9 billion Indiana chip packaging plant
    SK Hynix plans to hold a formal groundbreaking ceremony in late August for its US$3.9 billion advanced chip packaging facility in West Lafayette, Indiana, as the memory maker expands...
    Wednesday 5 August 2026
    FMS 2026 opens with major memory makers present, but CXMT missing from exhibitor list
    FMS 2026 opened in Santa Clara with Samsung, SK Hynix, and Micron highlighting AI memory plans, while China's CXMT was absent from the official roster. The omission is drawing attention...
    Wednesday 5 August 2026
    Samsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026
    Samsung Electronics used the Future of Memory and Storage (FMS) 2026 conference to lay out an AI memory roadmap built around 3D architecture, previewing two concept models —...
    Wednesday 5 August 2026
    Research Insight: Samsung indicates diversification in AI memory demand, LTA reshapes supply
    Samsung Electronics' memory business was the clear focus of its second quarter 2026 earnings call, accounting for about one-third of the Q&A session. DIGITIMES Intelligence said...
    Wednesday 5 August 2026
    Hanwha Semitech expands packaging tools as TCB turns profitable

    South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging...

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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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