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NEWS TAGGED HBM
Wednesday 15 July 2026
Samsung has yet to receive HBM4 volume-production order from Nvidia, dealsite reports
Samsung Electronics has yet to receive a volume-production order from Nvidia for HBM4 chips, with its HBM revenue from the AI chipmaker so far limited to paid evaluation samples, Dealsite...
Wednesday 15 July 2026
Global semiconductor equipment sales set to hit record US$165.9B in 2026
Global sales of semiconductor manufacturing equipment are on pace to reach an unprecedented US$165.9 billion in 2026, a 23.2% jump from the previous year, according to industry association...
Wednesday 15 July 2026
South Korean court bars former Samsung NAND designers from working for SK Hynix
A South Korean court has partially granted Samsung Electronics' request to prevent two former NAND flash design employees from working for rival SK Hynix or its affiliates until April...
Wednesday 15 July 2026
China's Orient Computing unveils 14nm AI chip designed to bypass HBM constraints

Shanghai Orient Computing Core Technology has launched the DF1000, a 14-nanometre AI accelerator that uses software-defined computing...

Wednesday 15 July 2026
CXMT's US$4.3B IPO powers China's HBM challenge to global memory giants

CXMT is preparing China's largest chip-sector IPO of 2026, seeking up to US$4.3 billion to expand DRAM and HBM capacity, deepen vertical...

Tuesday 14 July 2026
Intel challenges HBM leaders with XBM and ZAM in a bid to reshape AI memory

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization...

Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising...
Monday 13 July 2026
SK Hynix shares plunge after blockbuster Nasdaq ADR debut

SK hynix shares suffered their steepest-ever decline on Monday, just one trading day after the memory chipmaker made a strong debut...

Monday 13 July 2026
SK Hynix reportedly starts Nvidia HBM4 shipments ahead of September ramp

SK Hynix began mass-production shipments of 12-layer HBM4 to Nvidia at the end of June and is increasing output ahead of a broader...

Monday 13 July 2026
Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

Monday 13 July 2026
SK Hynix hybrid bonding push signals next phase of HBM packaging race
SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...
Saturday 11 July 2026
Samsung's CXL 3.1 memory delay lays bare Intel, AMD server platform lag

Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from...

Friday 10 July 2026
SK Hynix breaks Alibaba's US listing record — but HBM customers will wait until 2028 for the capacity it funds
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging...
Friday 10 July 2026
Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Friday 10 July 2026
Micron's US$250 billion memory push sharpens three-way race with Korean and Chinese rivals
Micron Technology's decision to lift its planned US investment to more than US$ 250 billion through 2035, unveiled July 9 alongside the first concrete pour at its Clay, New York, site,...