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    AI memory shortage may lift smartphone prices in 2H26
    4h 6min ago
    Zeiss claims China cannot bypass EUV with advanced packaging
    4h 6min ago
    Samsung reportedly bets on Wide Fold as Apple’s foldable iPhone nears
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    Taiwan PCB makers expand into Southeast Asia on supply chain shifts and AI demand
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    China's solar industry has posted losses for three straight years amid excess capacity
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    NEWS TAGGED HBM
    Monday 20 July 2026
    HBM4 battle shifts to cooling as hybrid bonding slips
    Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major...
    Monday 20 July 2026
    Commentary: China's DRAM comes of age with CXMT's IPO — but a trio of hurdles remains

    CXMT's STAR Market IPO marks a coming-of-age moment for China's DRAM industry, but the listing is only the beginning. Having proved...

    Monday 20 July 2026
    Samsung preps multi-billion-dollar P5 orders as AI boom speeds up memory demand

    Samsung Electronics' latest multi-billion-dollar equipment procurement reflects the company's accelerating investment in AI memory...

    Monday 20 July 2026
    Weekly news roundup: AI chip race widens across silicon photonics, HBM, memory fabs, and frontier models

    AI competition is widening from chips to connectivity, memory, talent, patents, and model access,...

    Monday 20 July 2026
    Nvidia shrugs off HBM shortage, bets on AI infrastructure to sustain explosive growth
    Nvidia CEO Jensen Huang has delivered a clear message ahead of his trip to Japan: the chipmaker's growth is still accelerating, even with quarterly revenue approaching US$100 billi...
    Monday 20 July 2026
    Micron's 10-year deal with GlobalWafers signals tighter 12-inch supply

    Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon...

    Monday 20 July 2026
    Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms
    South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that...
    Saturday 18 July 2026
    JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift
    As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...
    Friday 17 July 2026
    China's DRAM milestone arrives with CXMT IPO; HBM now separates contenders from leaders

    ChangXin Memory Technologies (CXMT) opened subscriptions for its STAR Market IPO on July 16, launching one of China's largest A-share listings...

    Friday 17 July 2026
    South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
    As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
    Thursday 16 July 2026
    As Trump pushes chips onshore, Netlist's ITC memory bid could keep Samsung, Nvidia offshore

    A US trade agency has opened an investigation that could block imports of the DDR5 server memory and high-bandwidth memory (HBM) feeding...

    Thursday 16 July 2026
    CXMT's US$8.5 billion IPO signals China's accelerating challenge to global memory leaders
    CXMT's Shanghai debut could reshape global memory markets by speeding China's push into advanced DRAM and HBM, while highlighting how US export controls are altering the industry's...
    Wednesday 15 July 2026
    Samsung has yet to receive HBM4 volume-production order from Nvidia, dealsite reports
    Samsung Electronics has yet to receive a volume-production order from Nvidia for HBM4 chips, with its HBM revenue from the AI chipmaker so far limited to paid evaluation samples, Dealsite...
    Wednesday 15 July 2026
    Global semiconductor equipment sales set to hit record US$165.9B in 2026
    Global sales of semiconductor manufacturing equipment are on pace to reach an unprecedented US$165.9 billion in 2026, a 23.2% jump from the previous year, according to industry association...
    Wednesday 15 July 2026
    South Korean court bars former Samsung NAND designers from working for SK Hynix
    A South Korean court has partially granted Samsung Electronics' request to prevent two former NAND flash design employees from working for rival SK Hynix or its affiliates until April...
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    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
    AI Summit Seoul