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    Resonac develops 12-inch SiC substrate to target AI and EV demand
    9h 22min ago
    High-end GPUs may be slowing China’s AI compute expansion
    9h 22min ago
    2026 smartphone SoC battle centers on NPU as vendors boost cores and memory for agentic AI
    9h 23min ago
    LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity
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    Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling
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    NEWS TAGGED HBM
    Thursday 17 September 2026
    SK Hynix looks beyond HBM as inference workloads diversify
    SK Hynix is expanding its memory strategy beyond the conventional GPU-HBM pairing as inference workloads split between latency-sensitive services and capacity-heavy, long-context a...
    Thursday 17 September 2026
    Samsung bets on zHBM as 2.5D memory nears its limits
    Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising...
    Thursday 17 September 2026
    CXMT cashes in on the DRAM shortage — and takes aim at HBM
    ChangXin Memory Technologies (CXMT) is emerging from the memory shortage with sharply higher profits and greater pricing power, giving China's largest DRAM maker more resources to...
    Thursday 17 September 2026
    SK Hynix weighs US memory options as buyers lock in 2027 supply
    SK Hynix is keeping its US memory options open as customers move earlier to secure 2027 supply, with tightening availability raising pressure on memory makers to consider additional...
    Thursday 17 September 2026
    Samsung looks to outside suppliers as HBM boom shifts priorities
    Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and...
    Wednesday 16 September 2026
    SK Hynix, Intel in talks on US production to ease memory crunch
    SK Hynix is in talks with Intel about a potential deal that could give the South Korean company its first memory chip manufacturing operation in the US, as tight supply pushes customers...
    Wednesday 16 September 2026
    Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end
    Samsung Electronics is reportedly handing the growth in its commodity memory module business to outside assemblers in Vietnam, India, and the Philippines, a sign of how completely...
    Wednesday 16 September 2026
    Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
    Hanmi Semiconductor has reportedly secured an order to supply advanced packaging equipment to Elon Musk's Terafab, marking the first known entry by a South Korean back-end equipment...
    Wednesday 16 September 2026
    Kepler bets HBM can scale without EUV — chip giants are buying in

    US memory chip startup Kepler Computing has emerged from stealth after seven years, disclosing US$468 million in total funding and a...

    Wednesday 16 September 2026
    Astera says customers are rethinking HBM needs for AI accelerators

    AI infrastructure customers are starting to reconsider how much high-bandwidth memory (HBM) needs to be placed alongside accelerators...

    Wednesday 16 September 2026
    AI efficiency fuels Jevons Paradox debate over HBM demand
    As artificial intelligence (AI) models move from answering questions to autonomously completing multi-step tasks, OpenAI's new model GPT-6 Astra, or Astra, is drawing fresh market...
    Wednesday 16 September 2026
    Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

    The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory...

    Wednesday 16 September 2026
    DIGITIMES Insight: NVHBM is not a memory revolution; Nvidia seeks to platformize cHBM, dominate custom AI architectures

    DIGITIMES observed that Nvidia's newly announced NVHBM is not a brand-new memory technology, but rather an extension of existing custom...

    Wednesday 16 September 2026
    Chip revenue heads to US$2.4 trillion on price, not volume, Yole says
    The semiconductor industry is on track to nearly quadruple in revenue by 2031 while shipping barely more silicon than it does today, a divergence that makes pricing power, not capacity,...
    Wednesday 16 September 2026
    DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

    SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...

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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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