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NEWS TAGGED HBM
Saturday 6 June 2026
AI demand squeezes mainstream DRAM supply as DDR5, DDR4 prices rise

DRAM prices are climbing as Samsung Electronics, SK Hynix, and Micron Technology prioritize high-bandwidth memory, or HBM, for AI applications,...

Saturday 6 June 2026
Jensen Huang shouts 'Everyone loves HBM' at Seoul barbecue as Nvidia announces Korea R&D center and previews four new products
Nvidia CEO Jensen Huang dined with the heads of South Korea's largest technology conglomerates in Hongdae on June 5, turning a barbecue dinner into one of the most theatrical corporate...
Friday 5 June 2026
Nvidia's Jensen Huang to meet South Korean business leaders beyond HBM sector

Nvidia CEO Jensen Huang is visiting South Korea on June 5 for meetings with major Korean business leaders, as the company's cooperation...

Friday 5 June 2026
HBM is too expensive, DRAM can't scale — Kioxia tells Computex SSDs are the answer for agentic AI
Koichi Fukuda, technology executive for applied SSD technology at Kioxia, used a Computex 2026 forum session on June 4 to argue that as enterprise AI shifts toward agentic systems,...
Friday 5 June 2026
CXMT's South Korean hiring spree puts Samsung, SK Hynix memory lead on alert
More than 200 South Korean engineers are conservatively estimated to be working at CXMT, China's leading DRAM maker, according to industry sources. Chinese semiconductor companies...
Friday 5 June 2026
Commentary: Memory boom driven by DRAM now, but HBM will decide future
AI demand is fueling a broad semiconductor upswing and pushing the memory industry into what many see as a long-awaited super-cycle. Samsung Electronics and SK Hynix have both reported...
Friday 5 June 2026
Hanmi Semiconductor eyes record sales in Computex debut as HBM4 demand grows
Hanmi Semiconductor is projecting record annual revenue this year, as rising demand for high-bandwidth memory equipment lifts prospects for the South Korean chip-equipment maker and...
Thursday 4 June 2026
HBM4 supply in focus as SK's Chey meets TSMC's Wei
SK Group chairman Chey Tae-won met TSMC chairman C.C. Wei in Taiwan on June 3, as SK Hynix and TSMC map out future cooperation in HBM4 base dies, advanced logic processes, and custom...
Thursday 4 June 2026
SK and TSMC deepen HBM, advanced packaging tie-up
SK Group Chairman Chey Tae-won met TSMC Chairman C.C. Wei in Taiwan on June 3, as the two sides exchanged views on the latest trends in next-generation AI technologies and discussed...
Wednesday 3 June 2026
Micron's HBM4 push signals bigger Nvidia supply role
Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment...
Wednesday 3 June 2026
Commentary: Why the world's memory giants are betting on Anthropic
The latest funding round for Anthropic produced a headline-grabbing figure: a US$65 billion capital raise that pushed the artificial intelligence (AI) startup's valuation to $965 billion,...
Tuesday 2 June 2026
DeepSeek's pricing move could redistribute value across AI hardware market
Chinese AI startup DeepSeek said it will permanently cut the API price of its flagship model by 75% from June 1, prompting debate across the global AI industry. Amazon AWS said the...
Friday 29 May 2026
Samsung begins shipment of HBM4E samples as AI memory competition intensifies
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI...
Thursday 28 May 2026
Nvidia's Rubin CPX plans clouded as Groq gains bigger inference role
Nvidia's plan to launch Rubin CPX, an inference-focused graphics processing unit for its Vera Rubin platform, has become increasingly uncertain as supply-chain activity around the...