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NEWS TAGGED HBM
Thursday 4 June 2026
SK and TSMC deepen HBM, advanced packaging tie-up
SK Group Chairman Chey Tae-won met TSMC Chairman C.C. Wei in Taiwan on June 3, as the two sides exchanged views on the latest trends in next-generation AI technologies and discussed...
Wednesday 3 June 2026
Micron's HBM4 push signals bigger Nvidia supply role
Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment...
Wednesday 3 June 2026
Commentary: Why the world's memory giants are betting on Anthropic
The latest funding round for Anthropic produced a headline-grabbing figure: a US$65 billion capital raise that pushed the artificial intelligence (AI) startup's valuation to $965 billion,...
Tuesday 2 June 2026
DeepSeek's pricing move could redistribute value across AI hardware market
Chinese AI startup DeepSeek said it will permanently cut the API price of its flagship model by 75% from June 1, prompting debate across the global AI industry. Amazon AWS said the...
Friday 29 May 2026
Samsung begins shipment of HBM4E samples as AI memory competition intensifies
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI...
Thursday 28 May 2026
Nvidia's Rubin CPX plans clouded as Groq gains bigger inference role
Nvidia's plan to launch Rubin CPX, an inference-focused graphics processing unit for its Vera Rubin platform, has become increasingly uncertain as supply-chain activity around the...
Wednesday 27 May 2026
Samsung reportedly to expand Vietnam footprint with new memory chip testing plant

Samsung Electronics plans to invest VND39 trillion (approx. US$1.5 billion) in a new semiconductor testing facility in northern Vietnam,...

Wednesday 27 May 2026
From boom-bust to structural growth? Memory's US$1 trillion moment puts AI thesis to the test
First Micron, then SK Hynix, join the trillion-dollar club, capping an extraordinary repricing of an industry once dismissed as a commodity play. The milestone is more than a valuation...
Wednesday 27 May 2026
Global DRAM revenue surges toward US$100 billion in 1Q26 on AI-driven demand
Global DRAM revenue climbed sharply in the first quarter of 2026, approaching the US$100 billion threshold as artificial intelligence demand and tight supply conditions pushed prices...
Wednesday 27 May 2026
SK Hynix seeks to embed cooling inside HBM to beat the heat
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into...
Tuesday 26 May 2026
Samsung's P4 HBM push could worsen DRAM crunch in 2027

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth...

Tuesday 26 May 2026
Intel's Rio Rancho fab becomes test case for AI-era chip packaging
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...
Tuesday 26 May 2026
SK hynix unveils 'iHBM' thermal solution to boost AI performance

SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs) within the high-bandwidth...

Monday 25 May 2026
Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...
Monday 25 May 2026
Samsung Electro-Mechanics secures large silicon capacitor supply contract
Samsung Electro-Mechanics (Semco)'s KRW1.5 trillion (approx. US$990 million) silicon capacitor supply contract with a major global company could reshape component supply for AI servers,...