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NEWS TAGGED HBM
Monday 20 July 2026
HBM4 battle shifts to cooling as hybrid bonding slips
Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major...
Monday 20 July 2026
Commentary: China's DRAM comes of age with CXMT's IPO — but a trio of hurdles remains

CXMT's STAR Market IPO marks a coming-of-age moment for China's DRAM industry, but the listing is only the beginning. Having proved...

Monday 20 July 2026
Samsung preps multi-billion-dollar P5 orders as AI boom speeds up memory demand

Samsung Electronics' latest multi-billion-dollar equipment procurement reflects the company's accelerating investment in AI memory...

Monday 20 July 2026
Weekly news roundup: AI chip race widens across silicon photonics, HBM, memory fabs, and frontier models

AI competition is widening from chips to connectivity, memory, talent, patents, and model access,...

Monday 20 July 2026
Nvidia shrugs off HBM shortage, bets on AI infrastructure to sustain explosive growth
Nvidia CEO Jensen Huang has delivered a clear message ahead of his trip to Japan: the chipmaker's growth is still accelerating, even with quarterly revenue approaching US$100 billi...
Monday 20 July 2026
Micron's 10-year deal with GlobalWafers signals tighter 12-inch supply

Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon...

Monday 20 July 2026
Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms
South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that...
Saturday 18 July 2026
JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift
As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...
Friday 17 July 2026
China's DRAM milestone arrives with CXMT IPO; HBM now separates contenders from leaders

ChangXin Memory Technologies (CXMT) opened subscriptions for its STAR Market IPO on July 16, launching one of China's largest A-share listings...

Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
Thursday 16 July 2026
As Trump pushes chips onshore, Netlist's ITC memory bid could keep Samsung, Nvidia offshore

A US trade agency has opened an investigation that could block imports of the DDR5 server memory and high-bandwidth memory (HBM) feeding...

Thursday 16 July 2026
CXMT's US$8.5 billion IPO signals China's accelerating challenge to global memory leaders
CXMT's Shanghai debut could reshape global memory markets by speeding China's push into advanced DRAM and HBM, while highlighting how US export controls are altering the industry's...
Wednesday 15 July 2026
Samsung has yet to receive HBM4 volume-production order from Nvidia, dealsite reports
Samsung Electronics has yet to receive a volume-production order from Nvidia for HBM4 chips, with its HBM revenue from the AI chipmaker so far limited to paid evaluation samples, Dealsite...
Wednesday 15 July 2026
Global semiconductor equipment sales set to hit record US$165.9B in 2026
Global sales of semiconductor manufacturing equipment are on pace to reach an unprecedented US$165.9 billion in 2026, a 23.2% jump from the previous year, according to industry association...
Wednesday 15 July 2026
South Korean court bars former Samsung NAND designers from working for SK Hynix
A South Korean court has partially granted Samsung Electronics' request to prevent two former NAND flash design employees from working for rival SK Hynix or its affiliates until April...