SK Hynix's strategic focus on high-end NAND memory, coupled with rising AI-driven demand, is expected to push its annual market share above 20% in 2024, bringing it closer to industry...
Samsung Electronics is bolstering its HBM competitiveness through significant investments in advanced packaging. Upgrades are underway at its Cheonan facility in South Korea, and...
Despite making progress in DDR5 power management IC (PMIC) development over the past two years, Taiwanese suppliers have seen limited revenue growth in this sector. This limitation...
SK Hynix has revealed plans to establish a new company in Indiana through its third quarter 2024 business report, marking a significant step toward building a semiconductor packaging...
Taiwan continues to capitalize on opportunities for contract manufacturing of cutting-edge technology products as the trade disputes between the US and China intensify. The unrestricted...
South Korea's thriving AI industry has catalyzed growth across its materials, components, and equipment sectors, particularly within the AI memory supply chain. South Korean manufacturer...
Maeil Business Newspaper reports that Samsung Electronics (Samsung) is set to finish the development of its sixth-generation high bandwidth memory (HBM4) by 2025 to secure...
Nvidia is gearing up to debut its next-gen "Rubin" GPU in 2025, featuring eight HBM4 chips, with a Rubin Ultra version to follow, packing twelve. In a strategic bid to reclaim HBM...
Adata reported October 2024 revenue of NT$34.1 billion (approx. US$1.06 billion), driven by increased DRAM shipments. The company is nearing its 2023 revenue performance and targets...
The competition in the high bandwidth memory (HBM) market intensifies between South Korea's two major DRAM giants, Samsung Electronics (Samsung) and SK Hynix. Meanwhile, US manufacturer...
SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute...
SK Hynix plans to reduce its legacy DRAM production to 20% by the fourth quarter of 2024, responding to increased supply and pricing pressure from Chinese memory manufacturers. The...
Nvidia CEO Jensen Huang emphasized during a video call at the SK AI Summit in Seoul's Coex that he aims to strengthen collaboration with SK Hynix in the high bandwidth memory (HBM)...
SK Hynix plans to provide samples of its 48GB, 16-layer HBM product—the industry's largest capacity and highest layer count—in the first quarter of 2025. CEO Noh-Jung...
Samsung Electronics and SK Hynix are advancing next-generation memory technology with "ultra-low-temperature" etching, a technique initially applied to high-density, multi-layer NAND...
