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NEWS TAGGED HBM
Monday 7 October 2024
Samsung's HBM3E reportedly clears Nvidia's on-site inspection; mass production still pending
Samsung Electronics and Nvidia have reportedly completed the on-site inspection of the fifth-generation high bandwidth memory (HBM3E). Despite delays in mass production and supply,...
Monday 7 October 2024
China's restrictions on Nvidia chips drag Samsung's HBM into muddy water
Reports suggest that the Chinese government is discouraging local companies from purchasing Nvidia's AI chips, which may affect Samsung Electronics' High Bandwidth Memory (HBM) sales...
Monday 7 October 2024
Weekly news roundup: Samsung delays fabs construction amid semiconductor slowdown
These are the most-read DIGITIMES Asia stories in the week of September 30 - October 6.
Friday 4 October 2024
Micron expands hiring in Taiwan, Japan amidst HBM production demand
In anticipation of favorable market conditions, Micron Technology will implement extensive talent recruitment initiatives in Taiwan and Japan, according to the US memory chip vendo...
Tuesday 1 October 2024
SK Hynix's debut at TSMC OIP forum showcases HBM3E, H200 breakthrough, boosts Nvidia partnership
SK Hynix recently spotlighted its high-bandwidth memory (HBM) technologies with great emphasis on its collaboration with Nvidia during its participation in TSMC's Open Innovation...
Tuesday 1 October 2024
How China is accelerating advanced packaging with HBM and CoWoS amid tightening US restrictions
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
Tuesday 1 October 2024
SK Hynix advances 16-layer HBM3E to maintain market lead
SK Hynix is expediting the development of 16-layer HBM3E (High Bandwidth Memory) to reinforce its leading position in the competitive HBM market, as challenges from rivals like Samsung...
Monday 30 September 2024
Micron's HBM capacity full until 2025, poised for multi-billion dollar revenue boost
The explosive growth of artificial intelligence (AI) has fueled a surge in demand for data centers, with Micron projecting the high-bandwidth memory (HBM) market to surpass US$25...
Monday 30 September 2024
HBM oversupply looms as Samsung seeks Nvidia validation for HBM3E
Recent debates in the semiconductor industry have raised concerns about a potential oversupply of high bandwidth memory (HBM). Analysts believe a key factor will be whether Samsung...
Thursday 26 September 2024
SK Hynix begins volume production of 12-layer HBM3E
K Hynix has commenced mass production of the world's first 12-layer HBM3E product, boasting a 36GB capacity, the highest of any current HBM available, according to the memory chip...
Thursday 26 September 2024
Micron eyes production boost amid Samsung's HBM entry and Chinese rivalry
Despite a positive outlook for the memory market, driven largely by data centers, Micron anticipates Samsung Electronics' entry into the HBM market and is shifting toward higher-value...
Wednesday 25 September 2024
JCET expands HBM packaging and testing as China accelerates domestic production
The Biden administration is considering imposing restrictions on the import of high-bandwidth memory (HBM) and related equipment into China, fueling growing demand for domestic substitutes...
Wednesday 25 September 2024
China leverages compute-in-memory technology to overtake HBM in AI chip development
The explosive growth of artificial intelligence (AI) has created an unprecedented demand for computational power. As the chip industry faces physical limitations in the post-Moore's...
Tuesday 24 September 2024
Morgan Stanley warns of memory market winter; sparks criticism from South Korean semiconductor industry
On September 15, Morgan Stanley issued a report dramatically reducing SK Hynix's target stock price by 54%, cutting it from KRW260,000 (approx. US$200) to KRW120,000. Simultaneously,...
Tuesday 24 September 2024
GUC announces adoption of HBM3E IP by CSP data center
Global Unichip Corp. (GUC), the Advanced ASIC Leader, is pleased to announce that its 3nm HBM3E Controller and PHY IP have been adopted by a leading Cloud Service Provider (CSP) and...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research