Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's sole provider capable of delivering a complete end-to-end Chip-on-Wafer-on-Substrate (CoWoS) packaging solution...
Rumors from various sources said Huawei is partnering with Wuhan XMC to develop high bandwidth memory (HBM) to meet the robust demand for Artificial Intelligence (AI).
Following a two-day annual strategy meeting, SK Hynix has announced plans to invest a hefty KRW$103 trillion (USD$74.6 billion) in its chip business for the next 3 years. SK Group,...
SK Hynix's performance outlook in the High Bandwidth Memory (HBM) market has garnered optimism from South Korea's securities industry, driven by major customer orders from NVIDIA,...
To address the rising memory demand of the AI boom, Samsung is resuming the construction of its new Pyeongtaek plant 5 (P5), with construction beginning as early as the third quarter...
Micron is expanding its HBM production capacity in the United States and exploring the possibility of manufacturing the product in Malaysia, which is driven by soaring global demand...
IC equipment and materials suppliers have seen a surge in demand from China's semiconductor industry, where companies are rushing to adopt HBM memory and CoWoS-like technology, according...
The global semiconductor manufacturing industry is anticipated to increase capacity by 6% in 2024 and 7% in 2025 to accommodate the unrelenting growth in chip demand.
SK Group, the parent company of SK Hynix, has had its chairman, Chey Tae-won, face a historic divorce ruling. This circumstance raises concerns about potential hostile acquisitions...
