Samsung Electronics is aggressively targeting Compute Express Link (CXL), a highly anticipated next-generation memory technology. The CXL market is expected to take off in the second...
As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...
Due to the AI-driven surge in demand for semiconductor equipment, KLA reported better-than-expected financial results. The company expects to benefit from investments in advanced...
SK Hynix has reported revenue hit an all-time high of KRW16.42 trillion (US$11.8 billion) in the second quarter of 2024, when operating profits topped KRW5 trillion for the first...
Korean media reports said Samsung Electronics's 4-generation high bandwidth memory product (HBM3) has been validated and has started mass production. However, industry sources only...
OpenAI has reportedly engaged in talks with Broadcom to develop chips that could compete with Nvidia for AI chips and HBM supply, according to The Information. This move...
In vying for Nvidia's next-generation memory orders, SK Hynix is prioritizing cost reduction through a more radical approach: eliminating silicon interposers entirely from HBM4 production,...
The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...
While SK Hynix, Samsung Electronics, and Micron Technology are locked in an intense technology race for the sixth-generation High Bandwidth Memory (HBM), HBM4, foundry giant TSMC...
Chip guru Jim Keller has expressed confidence that more companies will emerge to fill gaps in the AI market, as even Nvidia cannot meet all the demand.
South Korean memory giants Samsung Electronics and SK Hynix, in addition to High Bandwidth Memory (HBM), will also start the competition in smartphone LPDDR DRAM stacking.
Amid the competition among SK Hynix and Samsung Electronics regarding HBMs, SK Hynix reportedly plans to team with Amkor to enter the interposer market to alleviate the interposer...
As the market for Thermo Compression Bonding (TCB) equipment diversifies, Semes, a subsidiary of Samsung Electronics and South Korea's leading semiconductor equipment manufacturer,...
Demand for High-Bandwidth Memory (HBM) and DDR5 RAM for servers has steadily risen as Cloud Service Providers (CSP) in North America continue building data centers, with IC distributor...
Samsung Electronics' HBM3E memory will soon obtain verification for volume shipments, potentially limiting the vendor's supply of DDR5 and other memory chips, according to industry...
