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NEWS TAGGED HBM
Thursday 8 August 2024
Advanced packaging market sees rapid growth fueled by AI and global expansion
As AI applications proliferate, global tech giants are ramping up investments in data centers worldwide. While traditional hubs like the US, Europe, Japan, and China remain pivotal,...
Thursday 8 August 2024
SEMI Japan urges unified advanced chips packaging standards to ease capacity crunch
SEMI Japan president Masayuki Hamajima recently called for the semiconductor industry to unify packaging technology standards as soon as possible, particularly in the advanced packaging...
Thursday 8 August 2024
China rushing into chiplet and HBM fab tool development
China-based semiconductor equipment manufacturers have expedited their domestic development efforts, foraying into the chiplet and HBM memory sectors, according to industry sources...
Wednesday 7 August 2024
CXMT's initial HBM capacity in Hefei reaches one-third of Korean manufacturers
Reports indicate that China's DRAM leader ChangXin Memory Technologies (CXMT) is actively investing in high bandwidth memory (HBM) production capacity. Currently, CXMT is establishing...
Tuesday 6 August 2024
SK Hynix secures US$450 million in US CHIPS Act funding for HBM memory fab
The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS...
Tuesday 6 August 2024
SEMICON Taiwan 2024 to spotlight AI chain, advanced processes, heterogeneous integration, and more
SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes,...
Monday 5 August 2024
US plans to heighten controls on Chinese AI; South Korean and Chinese HBM manufacturers will be directly impacted
The US government is considering imposing restrictions as early as August to restrict China's access to crucial High Bandwidth Memory (HBM) chips and related manufacturing equipment...
Monday 5 August 2024
Weekly news roundup: CXMT begins mass-producing HBM2; Micron intros new data center SSD
These are the most-read DIGITIMES Asia stories in the week of July 29 – August 2.
Friday 2 August 2024
CXMT begins mass producing HBM2: China aims to reclaim AI dominance?
China is attempting to produce High-Bandwidth Memory (HBM) in hopes of regaining control over AI, according to South Korean industry insiders.
Friday 2 August 2024
Samsung HBM3E soon to be qualified with shipments kicking off as early as August
Samsung Electronics' HBM3E memory is in the final stages of its qualification test for a significant client, and shipments are expected to commence as early as August, according to...
Tuesday 30 July 2024
SK Hynix invests US$6.77 billion in Yongin Semiconductor Cluster, to prioritize DRAM production
SK Hynix has announced board approval for a KRW9.4 trillion (approximately US$6.77 billion) investment to construct its first plant and related operational facilities at the Yongin...
Tuesday 30 July 2024
China accelerates HBM production for AI, CXMT expands for self-sufficiency amid sanctions
China is ramping up its efforts to produce High-Bandwidth Memory (HBM), crucial for advancing AI technology, as part of its supply chain indigenization strategy.
Friday 26 July 2024
SK Hynix not concerned about HBM oversupply; optimistic that 2024 shipments will double
Benefiting from its High Bandwidth Memory (HBM) business, SK Hynix has experienced substantial revenue growth and forecasts a doubling of shipments in 2024. Regarding recent concerns...
Friday 26 July 2024
NAND flash capex to slow in 2024
The world's top-3 memory chipmakers are likely to reduce their NAND flash memory capex in 2024, following two years of robust spending, according to industry sources.
Friday 26 July 2024
Samsung bets big on CXL for next-gen memory leadership
Samsung Electronics is aggressively targeting Compute Express Link (CXL), a highly anticipated next-generation memory technology. The CXL market is expected to take off in the second...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research