SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute...
SK Hynix plans to reduce its legacy DRAM production to 20% by the fourth quarter of 2024, responding to increased supply and pricing pressure from Chinese memory manufacturers. The...
Nvidia CEO Jensen Huang emphasized during a video call at the SK AI Summit in Seoul's Coex that he aims to strengthen collaboration with SK Hynix in the high bandwidth memory (HBM)...
SK Hynix plans to provide samples of its 48GB, 16-layer HBM product—the industry's largest capacity and highest layer count—in the first quarter of 2025. CEO Noh-Jung...
Samsung Electronics and SK Hynix are advancing next-generation memory technology with "ultra-low-temperature" etching, a technique initially applied to high-density, multi-layer NAND...
October 27 marked the second anniversary of Jae-yong Lee's tenure as Samsung Electronics' (Samsung) executive chairman. However, both Lee and Samsung are facing unprecedented chall...
As artificial intelligence (AI) applications expand, the demand for high-bandwidth memory (HBM) has surged. South Korean memory maker SK Hynix is set to establish a dedicated HBM...
Despite achieving record revenue in the third quarter of 2024, Samsung has reported a significant decline in its semiconductor operating profit, which fell by 40% compared to the...
Samsung Electronics achieved a historic high in revenue for the third quarter of 2024. Yet, overall operating profit fell short of market expectations, primarily due to one-time expenses...
SK Hynix has demonstrated impressive performance, attracting former employees who had moved to Samsung Electronics (Samsung) back to its ranks. South Korean media analysis indicates...
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
Powertech Technology (PTI), a backend service provider, anticipates that orders for AI device applications will constitute a larger portion of the company's revenue. This is attributed...
With the demand for memory driven by AI servers, the industry initially expected contract prices to ease and decline in the fourth quarter. However, sources within the supply chain...
The new generation memory technology, Compute Express Link (CXL), is poised to become the next high-bandwidth memory (HBM), with Samsung Electronics actively collaborating with customers...
Samsung Electronics is reportedly progressing its 1c-nanometer DRAM, regarded as a crucial potential for the company to contend with high bandwidth memory (HBM) competitors.
