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NEWS TAGGED HBM
Tuesday 16 July 2024
Samsung and SK Hynix stack LPDDR DRAMs to cut AI power consumption
South Korean memory giants Samsung Electronics and SK Hynix, in addition to High Bandwidth Memory (HBM), will also start the competition in smartphone LPDDR DRAM stacking.
Tuesday 16 July 2024
SK Hynix reportedly partners with Amkor in supplying interposers
Amid the competition among SK Hynix and Samsung Electronics regarding HBMs, SK Hynix reportedly plans to team with Amkor to enter the interposer market to alleviate the interposer...
Tuesday 16 July 2024
Samsung subsidiary Semes eyes HBM market with advanced TCB amid competition
As the market for Thermo Compression Bonding (TCB) equipment diversifies, Semes, a subsidiary of Samsung Electronics and South Korea's leading semiconductor equipment manufacturer,...
Tuesday 16 July 2024
Server HBM, DDR5 demand to stay high until 2025, says distributor Supreme Electronics
Demand for High-Bandwidth Memory (HBM) and DDR5 RAM for servers has steadily risen as Cloud Service Providers (CSP) in North America continue building data centers, with IC distributor...
Tuesday 16 July 2024
Samsung HBM3E to obtain verification for volume shipments, say sources
Samsung Electronics' HBM3E memory will soon obtain verification for volume shipments, potentially limiting the vendor's supply of DDR5 and other memory chips, according to industry...
Monday 15 July 2024
JEDEC nears HBM4 standard finalization
The JEDEC Solid State Technology Association has announced that it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard.
Monday 15 July 2024
Samsung leverages IDM status to differentiate HBM4 with optimal customization and performance gains
Samsung is set to launch its sixth generation of High-Bandwidth Memory (HBM), HBM4, in 2025 and will differentiate its HBM technology through customized optimization services by leveraging...
Monday 15 July 2024
Micron CEO meets Taiwan President, secures government support for local operations
Sanjay Mehrotra, CEO of US memory chip vendor Micron Technology, recently visited Taiwan accompanied by other senior executives from the company. During the tour, Mehrotra and Taiwan's...
Friday 12 July 2024
SK Hynix ramps up talent recruitment to strengthen HBM4 competitiveness
SK Hynix, the South Korean memory giant, is ramping up its recruitment of system semiconductor experts, especially targeting staff from Samsung Foundry and IC design, according to...
Wednesday 10 July 2024
Samsung and SK Hynix set to introduce new HBM wafer debonding technology
Samsung Electronics and SK Hynix are investing in R&D of new process technologies to prevent warpage in next-generation high-bandwidth memory (HBM). This move is anticipated to...
Wednesday 10 July 2024
Rising HBM demand to benefit SK Hynix supplier in China
Yoke Technology, a China-based semiconductor and chemical material supplier, has disclosed its preliminary financial results for the first half of 2024. The company expects a net...
Monday 8 July 2024
Samsung establishes HBM development team as first major change under new DS division head
Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics' Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth...
Friday 5 July 2024
SK Hynix converts part of M10 production lines to produce HBM products
SK Hynix is reportedly converting part of its production line at its Icheon semiconductor plant in South Korea to manufacture high bandwidth memory (HBM) in response to rapidly increasing...
Friday 5 July 2024
Samsung expected to achieve 14-fold surge in operating income amid memory business recovery
Samsung Electronics is poised to report impressive results for the second quarter of 2024, driven by a recovery in the semiconductor industry. The company's operating profit surpassed...
Wednesday 3 July 2024
China tech firms adopt 'multi-chip hybrid' strategy to enhance AI capabilities amid US curbs, diversifying beyond Huawei
Chinese tech companies are embracing a 'multi-chip hybrid' strategy to enhance their ultimate AI computing power. This approach supplements foreign offerings while avoiding sole reliance...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research