News tagged HBM at DIGITIMES

NEWS TAGGED HBM

Thursday 31 July 2025

Hanmi reportedly planning US$71 million hybrid bonding investment amid HBM surge

South Korea's Hanmi Semiconductor is reportedly planning to invest KRW100 billion (US$71.4 million) in hybrid bonding technology, with commercial equipment targeted for release by...

Thursday 31 July 2025

Samsung's Lee Jae-yong visits DC with US tariff negotiations ongoing, eyes further Texas investment

Samsung Electronics Chairman Lee Jae-yong recently made a spontaneous trip to Washington, DC, to assist South Korea in ongoing reciprocal tariff negotiations with the US. As AI semiconductors...

Thursday 31 July 2025

SK Hynix secures top spot as competition heats up in DRAM market

SK Hynix has solidified its position as the global market leader after achieving record performance in the High Bandwidth Memory (HBM) market. However, China's leading memory chipmaker,...

Wednesday 30 July 2025

Samsung accelerates Pyeongtaek P4 to boost 1c DRAM mass production

Samsung Electronics is accelerating the resumption of construction at the fourth phase (PH4) of its Pyeongtaek Campus Line 4 (P4) in South Korea, where construction was halted last...

Wednesday 30 July 2025

SK Hynix rewards generous bonuses, silence from Samsung

Thanks to AI in generating robust revenues, SK Hynix has announced it would issue performance bonuses equivalent to 1.5 months' salary, but many employees are still pushing for more...

Tuesday 29 July 2025

LG makes semiconductor comeback with HBM Bet

More than two decades after being pushed out of the chip industry, LG Electronics is making a surprise return—this time with its...

Sunday 27 July 2025

Missed connection with Nvidia haunts Samsung as Lee Jae-yong marks 1000 days of leadership

Samsung Electronics Chairman Lee Jae-yong recently marked his 1,000th day in office, a tenure that Korean media describes as filled with challenges and crises. Even though Lee officially...

Friday 25 July 2025

SK Hynix accelerates investment for 2025 HBM boom as Samsung targets Nvidia certification in third quarter

The surge in demand for high-bandwidth memory (HBM) driven by AI servers has positioned SK Hynix as the clear leader in the HBM market, with Micron also posting strong operational...

Thursday 24 July 2025

Samsung delays HBM4 rollout to 2026 due to yield challenges, all while SK Hynix strengthens lead in AI memory

Samsung Electronics is reportedly pushing back the mass production of its next-gen high-bandwidth memory (HBM) chips to 2026, signaling...

Thursday 24 July 2025

SK Hynix reassures on China fabs with stable VEU status amid US AI chip export easing

SK Hynix addressed concerns about the potential impacts of tightening US export controls on its fabrication operations in China, adding no change in the company's validated end user...

Thursday 24 July 2025

SK Hynix optimistic on HBM demand amid AI growth, highlights next-gen DRAMs

In SK Hynix's second-quarter earnings call, the company emphasized strong confidence in the sustained growth of HBM, driven by increasing AI workloads and emerging applications like...

Thursday 24 July 2025

SK Hynix rides DRAM wave, doubles down on HBM with capex boost

SK Hynix reported second-quarter 2025 revenue of KRW22.23 trillion (US$16.17 billion), up 35% year-over-year, driven by surging demand for AI and high-performance DRAM. The company...

Thursday 24 July 2025

Samsung plans HBM4 comeback with advanced chip technology

Samsung Electronics is preparing a strategic challenge to SK Hynix's dominance in sixth-generation high-bandwidth memory with an ambitious technological leap that could reshape the...

Wednesday 23 July 2025

SK Group chairman meets OpenAI CEO Sam Altman to deepen AI, HBM ties

SK Group chairman Chey Tae-won recently visited OpenAI's headquarters in San Francisco for a private meeting with CEO Sam Altman, according to reports from South Korean outlets Maeil...

Wednesday 23 July 2025

Samsung starts hybrid bonding shift with HBM4E; will it stick before HBM5?

Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...

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