Samsung Electronics' HBM3E memory is in the final stages of its qualification test for a significant client, and shipments are expected to commence as early as August, according to...
SK Hynix has announced board approval for a KRW9.4 trillion (approximately US$6.77 billion) investment to construct its first plant and related operational facilities at the Yongin...
China is ramping up its efforts to produce High-Bandwidth Memory (HBM), crucial for advancing AI technology, as part of its supply chain indigenization strategy.
Benefiting from its High Bandwidth Memory (HBM) business, SK Hynix has experienced substantial revenue growth and forecasts a doubling of shipments in 2024. Regarding recent concerns...
The world's top-3 memory chipmakers are likely to reduce their NAND flash memory capex in 2024, following two years of robust spending, according to industry sources.
Samsung Electronics is aggressively targeting Compute Express Link (CXL), a highly anticipated next-generation memory technology. The CXL market is expected to take off in the second...
As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...
Due to the AI-driven surge in demand for semiconductor equipment, KLA reported better-than-expected financial results. The company expects to benefit from investments in advanced...
SK Hynix has reported revenue hit an all-time high of KRW16.42 trillion (US$11.8 billion) in the second quarter of 2024, when operating profits topped KRW5 trillion for the first...
Korean media reports said Samsung Electronics's 4-generation high bandwidth memory product (HBM3) has been validated and has started mass production. However, industry sources only...
OpenAI has reportedly engaged in talks with Broadcom to develop chips that could compete with Nvidia for AI chips and HBM supply, according to The Information. This move...
In vying for Nvidia's next-generation memory orders, SK Hynix is prioritizing cost reduction through a more radical approach: eliminating silicon interposers entirely from HBM4 production,...
The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...
While SK Hynix, Samsung Electronics, and Micron Technology are locked in an intense technology race for the sixth-generation High Bandwidth Memory (HBM), HBM4, foundry giant TSMC...
Chip guru Jim Keller has expressed confidence that more companies will emerge to fill gaps in the AI market, as even Nvidia cannot meet all the demand.
