News tagged HBM at DIGITIMES

NEWS TAGGED HBM

Thursday 6 August 2026

DRAM price surge lifts Samsung and Micron as SK Hynix loses share

Samsung Electronics and Micron Technology are benefiting more strongly from rising conventional DRAM and NAND prices than SK Hynix, whose focus on high-bandwidth memory (HBM) has slowed...

Wednesday 5 August 2026

SK Hynix to hold late-August groundbreaking for US$3.9 billion Indiana chip packaging plant

SK Hynix plans to hold a formal groundbreaking ceremony in late August for its US$3.9 billion advanced chip packaging facility in West Lafayette, Indiana, as the memory maker expands...

Wednesday 5 August 2026

FMS 2026 opens with major memory makers present, but CXMT missing from exhibitor list

FMS 2026 opened in Santa Clara with Samsung, SK Hynix, and Micron highlighting AI memory plans, while China's CXMT was absent from the official roster. The omission is drawing attention...

Wednesday 5 August 2026

Samsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026

Samsung Electronics used the Future of Memory and Storage (FMS) 2026 conference to lay out an AI memory roadmap built around 3D architecture, previewing two concept models —...

Wednesday 5 August 2026

Research Insight: Samsung indicates diversification in AI memory demand, LTA reshapes supply

Samsung Electronics' memory business was the clear focus of its second quarter 2026 earnings call, accounting for about one-third of the Q&A session. DIGITIMES Intelligence said...

Wednesday 5 August 2026

Hanwha Semitech expands packaging tools as TCB turns profitable

South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging...

Tuesday 4 August 2026

SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth

SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...

Tuesday 4 August 2026

2027 memory capacity reportedly sold out as buyers quietly lock in supply

Tight memory supply is expected to persist into 2027, with industry sources saying manufacturers have already completed much of their...

Tuesday 4 August 2026

CXMT listing fuels concerns over DRAM prices and global memory competition

China's CXMT drew fresh attention after its parent ChangXin Memory Technology (CXMT) went public, with market estimates of the firm's future valuation ranging from US$160 billion to...

Friday 31 July 2026

Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war

Nvidia CEO Jensen Huang recently appeared alongside SK Group Chairman Chey Tae-won and Samsung Electronics Executive Chairman Lee Jae-yong at a high-profile AI gathering in San Francisco,...

Thursday 30 July 2026

Samsung signs five-year memory deals as chip shortage stretches to 2028

Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing...

Thursday 30 July 2026

South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...

Thursday 30 July 2026

South Korean suppliers win HBM4 tester orders from SK Hynix

South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...

Thursday 30 July 2026

Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand

Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...

Thursday 30 July 2026

Samsung sees tripled HBM4 sales in 3Q26; HBM share to reach parity with DRAM position

Samsung Electronics expects HBM4 sales to increase more than threefold sequentially in the third quarter of 2026, the company said...

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Aug 27, 08:00

ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

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