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    Gogoro scales energy network, plans battery retirements and US$32M expansion
    7min ago
    US imports from Taiwan surpass China amid AI-driven supply chain shift
    Feb 25, 18:26
    Nvidia CEO hinted at 3D IC chip stacking memory atop GPU for GTC
    Feb 25, 18:26
    Japanese automakers shift to NACS charging standard, pressuring CHAdeMO's future
    Feb 25, 18:26
    Chinese automakers capture Europe's electrification gap with PHEV sales and carbon credit gains
    Feb 25, 18:26
    Japan's PC shipments plunged in January amid consumer memory price concerns
    Feb 25, 18:25
    NEWS TAGGED HBM
    Wednesday 28 January 2026
    SK hynix Announces FY25 Financial Results

    SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has achieved record financial results in 2025 – 97.1467 trillion won in revenue, 47.2063...

    Wednesday 28 January 2026
    Analysis: SK Hynix's exclusive supply to Microsoft reflects HBM3E market consolidation
    Recent reports indicate that SK Hynix has become the exclusive HBM supplier for Microsoft's next-generation AI accelerator, Maia 200, underscoring its competitiveness in the HBM3E...
    Wednesday 28 January 2026
    China's conditional H200 approval rewire Samsung-SK Hynix rivalry
    China has reportedly been conditionally approving corporate purchases of Nvidia's H200, reshaping HBM supply-demand dynamics. According to Seoul Economic Daily and G-enews,...
    Tuesday 27 January 2026
    Micron breaks ground on US$24 billion advanced NAND fab in Singapore
    Micron has started construction on an advanced wafer fabrication facility at its existing NAND manufacturing complex in Singapore, marking a planned investment of approximately US$24...
    Monday 26 January 2026
    Samsung expected to start HBM4 shipments to Nvidia, AMD in February
    Samsung Electronics is expected to begin shipping its sixth-generation high-bandwidth memory chips, known as HBM4, to Nvidia as early as February, Reuters reported, while...
    Friday 23 January 2026
    ASML leads chip equipment charge into advanced packaging
    Global semiconductor equipment suppliers are accelerating their push into advanced packaging. They are positioning back-end processes as a new growth engine as artificial intelligence...
    Friday 23 January 2026
    HBF likely overtaking HBM market by 2038 as commercialization speeds up

    High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting...

    Wednesday 21 January 2026
    Research Insight: High-end fiberglass cloth supply tightens as server demand spotlights Nittobo

    As next-generation AI server platforms enter volume deployment, supply chain constraints are extending beyond high-bandwidth memory (HBM)...

    Wednesday 21 January 2026
    Samsung reportedly exploring ASMPT for TCB supply
    Samsung Electronics is reportedly diversifying its supply chain for thermal compression bonders (TCB), a critical tool in high-bandwidth memory (HBM) production, by engaging Singapore-based...
    Wednesday 21 January 2026
    China's semiconductor equipment leaders push HBM autonomy as US tightens restrictions
    US export restrictions on advanced semiconductor equipment to China have become the biggest obstacle to China's domestic production of high-bandwidth memory (HBM). It has been reported...
    Tuesday 20 January 2026
    Samsung Device Solutions eyes 47% bonuses after profit surge

    Samsung Electronics on January 16 announced payout ratios for its 2025 excess profit performance incentive, with the Device Solutions...

    Monday 19 January 2026
    Micron sets 1γ as mainstream node for 2026 as HBM and SOCAMM2 ramp
    With shipments of application-specific integrated circuits (ASICs) and XPUs expected to rise sharply in 2026, AI accelerators are set to continue relying on fifth-generation high-bandwidth...
    Monday 19 January 2026
    Advantest ATE lead times remain tight as AI and memory markets expand
    As demand strengthens in markets such as GPUs and high-bandwidth memory (HBM), Japan-based Advantest said orders for semiconductor automated test equipment (ATE) remain stable, with...
    Sunday 18 January 2026
    SK Hynix accelerates advanced packaging from Korea to Indiana
    SK Hynix plans to invest KRW19 trillion, about US$12.9 billion, to build an advanced semiconductor packaging plant in Cheongju, South Korea, as it moves to secure capacity for AI-driven...
    Saturday 17 January 2026
    Internal memo reveals Micron has locked in PSMC HBM capacity through prepayment

    Powerchip Semiconductor Manufacturing Corporation (PSMC) has provided new details on its planned sale of the Tongluo P5 fabrication plant...

    4/59 pages
    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    Special Report
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook