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NEWS TAGGED HBM
Monday 3 November 2025
Nvidia expands partnership with Samsung and SK Hynix in AI memory technology development
Nvidia CEO Jensen Huang has confirmed continued collaboration with South Korean memory giants Samsung Electronics and SK Hynix, highlighting their crucial role in the next wave of...
Monday 3 November 2025
Weekly news roundup: Samsung launches aggressive price-cut strategy to catch up in HBM; Intel shifts assembly and testing to Vietnam
Below are the top DIGITIMES Asia stories from October 27 to November 2, 2025.
Monday 3 November 2025
MaxEpic: Leading AI Power Delivery with Revolutionary Chiplet Technology
MaxEpic, a nascent but rapidly advancing chiplet semiconductor startup based in Canada, is spearheading the development of next-generation fully-integrated power delivery and power...
Friday 31 October 2025
Why SK Hynix skipped the fried chicken and beer summit

When Nvidia CEO Jensen Huang arrived in South Korea, global attention turned to a viral "chimaek" (fried chicken and beer) dinner on...

Friday 31 October 2025
SK Hynix dominates DRAM market in 3Q25 for third consecutive quarter
SK Hynix has taken the top spot of the global DRAM market for the third quarter of 2025 with a 35% market share, with Samsung just behind at 34%. This marks SK Hynix's third consecutive...
Thursday 30 October 2025
Samsung 3Q25 marks the reset of the global memory hierarchy
Samsung Electronics staged a strong rebound in the third quarter of 2025 and set the tone for the next phase of the memory cycle, where AI infrastructure, premium product mix, and...
Thursday 30 October 2025
Hanwha Semitech and Hanmi Semiconductor escalate HBM equipment patent dispute
Korean media have confirmed that Hanwha Semitech, previously sued by Hanmi Semiconductor for patent infringement, has now filed a counter-lawsuit against Hanmi, accusing Hanmi's HBM...
Thursday 30 October 2025
Samsung 3Q25 profit surges on AI chip demand, beats estimates
Samsung reported consolidated revenue of KRW86.1 trillion (US$59.8 billion) and operating profit of KRW12.2 trillion for the quarter ended September 30, 2025, beating both its own...
Wednesday 29 October 2025
Powertech secures full FOPLP bookings ahead of US$1B expansion
Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
Wednesday 29 October 2025
Hanmi eyes AI chip packaging amid HBM market challenges
Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
Wednesday 29 October 2025
Samsung reorganizes memory line by accelerating HBM4 production at P4 plant
Samsung Electronics is transforming its Pyeongtaek Campus Line 4 (P4) in South Korea into a manufacturing base focusing on HBM4 production. Analysts indicate that Samsung is increasing...
Wednesday 29 October 2025
Samsung rides AI memory wave to record valuation
Samsung Electronics reached a historic milestone as its market value exceeded KRW600 trillion (US$420 billion) for the first time, driven by a sharp rebound in the global memory market...
Tuesday 28 October 2025
SK Hynix M15X completion expected by end of 2025
To meet the growing demand for HBM, SK Hynix is accelerating the construction of its DRAM production base, M15X plant in Cheongju, South Korea. According to Yonhap News and...
Tuesday 28 October 2025
HBM boom tightens DRAM supply as Samsung, SK Hynix secure long-term deals
As demand for memory surges alongside the build-out of AI infrastructure and soaring data volumes from AI agents developed by OpenAI, Google, and others, consumption has spiked not...
Monday 27 October 2025
LG Electronics advances HBM and glass substrate equipment for advanced packaging
LG Electronics is aggressively entering the advanced semiconductor packaging equipment market to meet the surging demand driven by AI. The company plans to gradually localize production...