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Thursday 24 July 2025
Samsung delays HBM4 rollout to 2026 due to yield challenges, all while SK Hynix strengthens lead in AI memory

Samsung Electronics is reportedly pushing back the mass production of its next-gen high-bandwidth memory (HBM) chips to 2026, signaling...

Thursday 24 July 2025
SK Hynix reassures on China fabs with stable VEU status amid US AI chip export easing
SK Hynix addressed concerns about the potential impacts of tightening US export controls on its fabrication operations in China, adding no change in the company's validated end user...
Thursday 24 July 2025
SK Hynix optimistic on HBM demand amid AI growth, highlights next-gen DRAMs
In SK Hynix's second-quarter earnings call, the company emphasized strong confidence in the sustained growth of HBM, driven by increasing AI workloads and emerging applications like...
Thursday 24 July 2025
SK Hynix rides DRAM wave, doubles down on HBM with capex boost
SK Hynix reported second-quarter 2025 revenue of KRW22.23 trillion (US$16.17 billion), up 35% year-over-year, driven by surging demand for AI and high-performance DRAM. The company...
Thursday 24 July 2025
Samsung plans HBM4 comeback with advanced chip technology
Samsung Electronics is preparing a strategic challenge to SK Hynix's dominance in sixth-generation high-bandwidth memory with an ambitious technological leap that could reshape the...
Wednesday 23 July 2025
SK Group chairman meets OpenAI CEO Sam Altman to deepen AI, HBM ties
SK Group chairman Chey Tae-won recently visited OpenAI's headquarters in San Francisco for a private meeting with CEO Sam Altman, according to reports from South Korean outlets Maeil...
Wednesday 23 July 2025
Samsung starts hybrid bonding shift with HBM4E; will it stick before HBM5?
Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...
Wednesday 23 July 2025
Samsung bets on GAA and HBM4 to retake AI crown
The second half of 2025 is shaping up to be a pivotal period in the global semiconductor industry, as the race for technological supremacy intensifies. At the forefront are Samsung...
Tuesday 22 July 2025
HBM equipment race intensifies as newcomers battle for market entry
Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current...
Tuesday 22 July 2025
China's emerging memory titan duo disrupts DRAM's current big three
China's top memory chipmakers, ChangXin Memory Technologies (CXMT) and Yangtze Memory Technology Corp. (YMTC), have nearly doubled their output in just over a year. Their rapid expansion...
Monday 21 July 2025
Weekly news roundup: Nvidia partners with Micron, Huawei's 'Little HiSilicon' launches, GB300 production begins
Below are the top DIGITIMES Asia stories from July 14 to 20, 2025. The top three topics include Nvidia teams up with Micron for a major SOCAMM rollout, aiming to challenge high-bandwidth...
Monday 21 July 2025
Samsung reportedly cracks 1c DRAM yield hurdle, positions HBM4 for AI rebound
Samsung Electronics is preparing a major push to reclaim ground in the high-bandwidth memory (HBM) market, where it has lagged behind SK Hynix and Micron. Its sixth-generation 1c...
Monday 21 July 2025
Amazon, Google drive HBM memory boom as custom AI chips threaten Nvidia’s lead
As demand for artificial intelligence (AI) accelerates, tech giants like Amazon, Google, and Meta are emerging as major players in the high-bandwidth memory (HBM) market. These companies...
Saturday 19 July 2025
Nvidia explores SOCAMM deployment for next-gen AI systems
Nvidia is reportedly preparing to enter a new phase in the memory market by planning to deploy between 600,000 and 800,000 SOCAMM modules in 2025. This initiative positions SOCAMM...
Saturday 19 July 2025
SK Hynix retreats from China, pivots to homegrown DRAM growth
SK Hynix is ramping up domestic semiconductor production as US export controls and geopolitical tensions prompt a broader reshuffling of the global memory supply chain. The company...