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NEWS TAGGED HBM
Tuesday 15 September 2026
Astera Labs targets the KV cache bottleneck as agentic AI outgrows GPU memory
Astera Labs has added three products to its Leo memory controller line, aimed at a problem that arises as AI inference shifts from single queries to agents that run continuous loops:...
Tuesday 15 September 2026
China elevates HBM and HBF in five-year plan, opening a new front in AI memory
China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have jointly released the 15th Five-Year Plan for the Development...
Tuesday 15 September 2026
Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM
Samsung Electronics is accelerating the restructuring of its semiconductor packaging footprint. Its Cheonan facility is gradually phasing out packaging operations for the Exynos mobile...
Tuesday 15 September 2026
CXMT rides AI boom to 80% operating margin

China's leading DRAM maker, CXMT Corporation (CXMT), formerly known as ChangXin Memory Technologies, is reaping a windfall from price...

Monday 14 September 2026
Sandisk recruits engineers in Korea as memory talent race heats up

Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND...

Friday 11 September 2026
Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says
Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and...
Thursday 10 September 2026
China's Nvidia rivals raise prices as HBM shortage bites
Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding...
Thursday 10 September 2026
CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...

Wednesday 9 September 2026
Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...

Wednesday 9 September 2026
Backed by Nanya partnership, PieceMakers eyes AI memory upgrade boom
As AI compute requirements scale, memory bandwidth has become a primary bottleneck governing system performance. PieceMakers Technology, which maintains a strategic partnership with...
Tuesday 8 September 2026
US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans
South Korea and the US are discussing semiconductor investments in the US as part of broader bilateral negotiations, bringing US chip tariff policy closer to the investment decisions...
Tuesday 8 September 2026
Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise

Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from...

Tuesday 8 September 2026
Samsung allocates more than half of 4nm foundry capacity to HBM4
Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI...
Tuesday 8 September 2026
ViTrox rides AI demand, expands Taiwan push as Malaysia semiconductor base grows
After several years away from SEMICON Taiwan, Malaysia-based inspection equipment maker ViTrox returned to the show this year and has already confirmed plans to exhibit again next...