Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering...
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Samsung eUFS solution for auto apps
Samsung Electronics has introduced the industry's first embedded Universal Flash Storage...
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Samsung 256GB UFS card
Samsung Electronics has unveiled removable memory cards based on the JEDEC Universal Flash...
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Samsung 128Mb eMMC devices
Samsung Electronics has begun volume production of 128GB embedded memory for next-generation...
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ADATA XPG Gaming DDR3L 1333G
Adata Technology has launched the single 8GB XPG gaming series DDR3L 1333G desktop overclocking...
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Samsung 30nm DDR4 DRAM
Samsung Electronics has completed development of what it calls the industry's first DDR4...
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Samsung moviNAND using 20nm-class technology
Samsung Electronics has introduced its 8GB and 16GB moviNAND embedded memory chips for use...
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Toshiba 128GB embedded NAND flash modules
Toshiba has announced the launch of a 128GB embedded NAND flash memory module, which it claims...
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Transcend 4GB aXeRam DDR3 modules
Transcend Information has launched 4GB (2GBx2) aXeRam DDR3-2000 memory kits for use with...
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Transcend DDR3 1333MHz memory kit for Intel Core i5
Transcend Information has announced a new DDR3 1333MHz memory module kit designed for Intel's...
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Hynix 4Gb mobile DRAM for MIDs
Hynix Semiconductor has introduced its 4Gb mobile DDR SDRAM supported on Intel's Moorestown...
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Transcend thermal sensor-equipped DDR3 modules
Transcend Information has launched its server-grade DDR3 ECC DIMM and RDIMM (registered DIMM)...
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Desi Phoden, Inphi's executive vice president and chairman of JEDEC's JC-42 Memory Committee
"I have learned that 'never' is a dangerous word and I try to avoid it."
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