Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
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Samsung 128GB TSV DDR4 RDIMM
Samsung Electronics has announced that it is mass producing what it calls the industry's...
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Elpida Wide IO Mobile RAM
Elpida Memory has developed 4Gb next-generation mobile memory chips for smartphones, tablet...
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Samsung 30nm 32GB RDIMM
Samsung Electronics has announced the development of 32GB DDR3 registered dual Inline memory...
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Samsung 8GB RDIMM utilizing 3D TSV technology
Samsung Electronics has announced its new 8GB DDR3 module was developed using 3D chip stacking...
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Applied Producer InVia dielectric deposition system
Applied Materials has added to its line of 3D chip packaging solutions with the launch of...
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Applied Materials to accelerate TSV adoption in 3-dimensional ICs
Applied Materials has announced that it is leading a major effort to enable the widespread...
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