Samsung Electronics has ntroduced a 0.7-micrometer-pixel image sensor, the 43.7-megapixel...

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AUO's 6-inch full HD LTPS in-cell touch panel integrates the display driver IC and touch...

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Huawei has launched the Kirin 970 at IFA 2017 in Berlin, a chip that combines the power of...

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Silego Technology, a developer of configurable and mixed signal products, has introduction...

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Bosch Sensortec has announced a new family of MEMS acceleration sensors for wearable devices:...

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Toshiba has launched a new line-up of NAND flash memory products for embedded applications...

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Intel announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel...

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Intel has introduced the Atom x3 processor series (formerly codenamed SoFIA), the company's...

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Qualcomm Technologies has introduced its next-generation mobile processors for the Qualcomm...

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Nvidia has introduced its first fully integrated 4G LTE mobile processor, the Tegra 4i. Previously...

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Intel has announced a range of new products for the mobile market, including a dual-core...

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Intel has unveiled a new low-power Atom processor-based platform (Lexington) and smartphone...

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Samsung Electronics has begun mass producing 2GB and low power double-data-rate 3 (LPDDR3)...

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Samsung Electronics has started sampling what it claims is the industry's first monolithic...

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Hynix Semiconductor has developed 2-gigabit (2Gb) low-power DDR2 DRAM for mobile applications...

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