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12-inch fabs racing to bring in new process technologies

Compiled from outside sources by Iliad Kang, Research Center; Liu Yi-fang, DIGITIMES Asia Monday 16 October 2000 0

International semiconductor companies, including Samsung, Hyundai, Intel, and IBM, have all announced plans to apply copper interconnect and sub-0.13-micron process technologies to their 12-inch wafer production lines. Large-capacity, high-speed semiconductors...

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